Patent Application
20110230097
The subject matter described and/or illustrated herein relates generally to electrical connector assemblies, and more particularly, to shielded integrated connector modules (ICMs) that mate with a plurality of modular plugs.
Modular plugs and modular jacks, including ICMs, are widely used to provide electrical connections between devices. For example, modular plugs and modular jacks are sometimes used to connect computer equipment together. However, computer connections may generate or be susceptible to noise due to the high frequency signals which are transmitted along the communication lines between the computer and other devices. Susceptibility to noise is a particular concern in high density applications, such as in communication modules, where numerous ports must be provided for the connection of communication lines between a computer and other devices. For example, commercial network providers to the Internet typically require hundreds of communications channels. Because of the noise that may be present or generated at the interface between the modular plug and the modular jack, there may be a failure to meet system electromagnetic interference (EMI) performance requirements. Furthermore, noise may also result in system current injection (CI) failures. It is for this reason that ICMs are constructed with shielding or isolation provided between the modular jacks within the ICM. Moreover, ICMs typically include an outer shield surrounding the housing thereof to shield the ICM from electromagnetic interference (EMI) emitted by other devices, such as computers, communication lines, and/or other modular jack assemblies.
Reducing cross talk and providing higher levels of shielding have become more important because of increasing data rates, switching speeds, increasing routing complexity, decreasing space on the host circuit board, and/or lower voltage thresholds. For example, ICMs sometimes include an array of signal pins that engage the host circuit board on which the assembly is mounted. The signal pins electrically connect the host circuit board to the mating contacts of each modular jack of the ICM. However, as the density of electrical connections to the host circuit board and the speed of the signals increases, the signal pins may experience cross talk and/or receive EMI from neighboring connections on the host circuit board.
There is a need for an ICM having an increased amount of EMI shielding, a reduced amount of crosstalk and/or noise, enhanced signal pin isolation, and/or a reduced amount of radiated energy from the signal pin array.
In one embodiment, an electrical connector assembly is provided for mating with electrical plugs. The electrical connector assembly includes a housing having a top wall and a bottom wall that is opposite the top wall. The housing includes a mating face having ports that are configured to receive the electrical plugs therein. A jack sub-assembly is held by the housing. The jack sub-assembly includes jacks having electrical contacts held within the ports for engagement with the electrical plugs. The jack sub-assembly includes a signal pin array having signal pins for connection to a host circuit board. The signal pin array includes a front side extending along the bottom wall of the housing. An electrically conductive outer shield covers the top wall of the housing. The outer shield includes a bottom flap covering an end of the bottom wall of the housing. An electrically conductive bottom shield covers the bottom wall of the housing between the bottom flap of the outer shield and the front side of the signal pin array.
In another embodiment, an electrical connector assembly is provided for mating with electrical plugs. The electrical connector assembly includes a housing having a top wall and a bottom wall that is opposite the top wall. The housing includes a mating face having ports that are configured to receive the electrical plugs therein. A jack sub-assembly held by the housing. The jack sub-assembly includes jacks having electrical contacts held within the ports for engagement with the electrical plugs. The jack sub-assembly includes a signal pin array having signal pins for connection to a host circuit board. The signal pin array includes a front side extending along the bottom wall of the housing. An electrically conductive bottom shield at least partially covers the bottom wall of the housing. The bottom shield includes a row of ground tabs that flanks the front side of the signal pin array.
In another embodiment, an electrical connector assembly is provided for mating with electrical plugs. The electrical connector assembly includes a housing having a top wall and a bottom wall that is opposite the top wall. The housing includes a mating face having ports that are configured to receive the electrical plugs therein. A jack sub-assembly is held by the housing. The jack sub-assembly includes jacks having electrical contacts held within the ports for engagement with the electrical plugs. The jack sub-assembly includes a signal pin array having signal pins for connection to a host circuit board. An electrically conductive outer shield at least partially covers the top wall of the housing. An electrically conductive bottom shield at least partially covers the bottom wall of the housing. The outer shield and the bottom shield cooperate to define a faraday shield around the signal pin array.
Referring now to
The housing body 28 includes a plurality of light pipe channels 50. In the exemplary embodiment, each light pipe channel 50 extends completely through the top wall of the housing body 28 from the front end 30 to the rear end 32. Accordingly, each light pipe channel 50 extends through the mating face 42 of the housing body 28. Each light pipe channel 50 receives a light pipe 52 of a corresponding one of the light pipe members 20 therein such that an end 54 of the corresponding light pipe 52 is held within the light pipe channel 50 adjacent the mating face 42 of the housing body 28. The ends 54 of the light pipes 52 are thereby visible when facing the mating face 42 of the housing body 28.
Although one row of four ports 22 is shown, the housing 12 may include any number of ports 22 for receiving any number of modular plugs. Moreover, the housing 12 may include any number of rows and/or columns of ports 22. In the exemplary embodiment, the housing body 28 includes eight light pipe channels 50, wherein each port 22 has two of the light pipe channels 50 associated therewith. However, the housing body 28 may include any number of the light pipe channels 50 for receiving any number of light pipes 52. Moreover, each port 22 may have any number of light pipe channels 50 associated therewith. Furthermore, in addition or alternative to extending through the top wall 34 of the housing body 28, one or more of the light pipe channels 50 may extend through the bottom wall 40, the side wall 36, and/or the side wall 38.
The jack sub-assembly 14 includes a circuit board 56, a signal pin array 58 mounted on the circuit board 56 for connecting the circuit board 56 to the host circuit board, the plurality of jacks 24, a plurality of electrically conductive inner shields 60, and a plurality of optional light emitting diodes (LEDs) 61. The circuit board 56 includes a top surface 62 and a bottom surface 64 that is opposite the top surface 62. The signal pin array 58 includes a holder 66 and a plurality of signal pins 68 held by the holder 66. Specifically, the holder 66 includes a mounting side 70 and an opposite side 72. The mounting side 70 is mounted on the bottom surface 64 of the circuit board.
Each contact sub-assembly 80 includes a base 90 that holds the array of electrical contacts 26. Each electrical contact 26 includes a mating interface 92 for engagement with the corresponding electrical contact of the modular plug. Specifically, when the jack sub-assembly 14 is held by the housing 12, the mating interfaces 92 extend within the corresponding port 22. The base 90 of each contact sub-assembly 80 is mounted on the circuit board 56 such that the contact sub-assemblies 80 extend outwardly from a front edge 94 of the circuit board 56. Referring again to
Referring again to
Referring again to
The outer shield 16 includes an electrically conductive body 116 extending a length from a front end 118 to a rear end 120. The outer shield body 116 includes a top wall 122, a pair of opposite side walls 124 and 126, and the rear wall 112. Each of the side walls 124 and 126 extends from the front end 118 to the rear end 120 of the outer shield body 116. The outer shield body 116 also includes a bottom flap 128 that extends from the front end 118 toward the rear end 120. Specifically, the bottom flap 128 extends from the front end 118 to a rear edge 127 of the bottom flap 128. The outer shield body 116 includes a front face 129 at the front end 118 thereof. An internal cavity 130 is defined by the flap 128 and the walls 122, 124, 126, and 112. When the ICM 10 is assembled, the housing 12 is held within the internal cavity 130 such that the top wall 122 of the outer shield body 116 covers at least a portion of the top wall 34 of the housing 12. Moreover, the side walls 124 and 126 each cover at least a portion of the side walls 36 and 38, respectively, of the housing 12. The rear wall 112 covers a rear end 132 of the jack sub-assembly 14, while the bottom flap 128 covers a front end 134 (
The outer shield body 116 includes a plurality of port openings 136 within the front face 129. Each port opening 136 exposes a corresponding one of the ports 22 through the front face 129 to enable the modular plug to be received through the front face 129 and into the corresponding port 22. In the exemplary embodiment, each port opening 136 includes one or more optional recesses 138 that expose a corresponding one of the light pipe channels 50 of the housing 12 to enable the end 54 of the corresponding light pipe 52 to be visible through the front face 129 of the outer shield body 116. The outer shield 16 may include any number of the port openings 136 for exposing any number of the ports 22. Moreover, the outer shield 16 may include any number of recesses 138 for exposing any number of light pipe channels 50.
A plurality of ground fingers 140 extend outwardly from a bottom edge 142 of the rear wall 112 and from bottom edges 144 (
In the exemplary embodiment, a latch extension 166 and a plurality of ground extensions 168 extend outwardly from each of the side edges 158 and 160. The latch extension 166 and each ground extension 168 extending from the side edge 158 engages the side wall 124 (
A plurality of ground extensions 174 extend outwardly from the front edge 154. The ground extensions 174 engage the bottom flap 128 (
Referring now to
The ground tabs 164 of the bottom shield 18 and the ground fingers 140 of the outer shield 16 cooperate to define a faraday shield 182 around the signal pin array 58. Specifically, the ground tabs 164 of the bottom shield 18 form a row 184 that flanks the front side 186 of the signal pin array 58. The row 184 of the ground tabs 164 may reduce or eliminate noise coupled by stray capacitance as electrical coupling. The ground fingers 140 extending from the rear wall 112 of the outer shield 16 form a row 188 that flanks a rear side 190 of the signal pin array 58. A ground finger 140a that extends from the side wall 124 of the outer shield 16 forms a row 192 that flanks a side 194 of the signal pin array 58, while a ground finger 140b that extends from the side wall 126 of the outer shield 16 forms a row 196 that flanks a side 198 of the signal pin array 58. In the exemplary embodiment, when connected to a source of electrical ground, the grounds tabs 164, the ground fingers 140, the ground finger 140a, and the ground finger 140b each form a portion of a faraday shield that extends around the entire periphery of the signal pin array 58. For example, the row 184 of ground tabs 164 forms a faraday shield that extends along, and thereby flanks, the front side 186 of the signal pin array 58. Moreover, the row 188 of the ground fingers 140 forms a faraday shield that extends along, and thereby flanks, the rear side 190 of the signal pin array 58. The row 192 of the ground finger 140a extends along, and thereby flanks, the side 194 of the signal pin array 58, while the row 196 of the ground finger 140b extends along, and thereby flanks, the side 198 of the signal pin array 58. The flanking rows 184, 188, 192, and 196 thereby surround the signal pin array 58.
Although each of the rows 192 and 196 includes only a single ground finger 140 in the exemplary embodiment, each of the rows 184, 188, 192, and 196 may be formed by any number of the respective ground tabs 164 and ground fingers 140. In the exemplary embodiment, the ground tabs 164 within the row 184 are spaced apart from each other along the front side 186 of the signal pin array 58. Similarly, the ground fingers 140 within the row 188 are spaced apart from each other along the rear side 190 of the signal pin array 58. The number of ground tabs 164 within the row 184 and/or the spacing between adjacent ground tabs 164 within the row 184 may be selected to provide shielding for a predetermined wavelength of electromagnetic interference (EMI). The spacing between adjacent ground tabs 164 within the row 184 may or may not be consistent within the row 184. Similarly, the number of ground fingers 140 within each of the rows 188, 192, and 196 and/or the spacing between adjacent ground fingers 140 within the rows 188, 192, and 196 may be selected to provide shielding for a predetermined wavelength of electromagnetic interference (EMI). The spacing between adjacent ground fingers 140 within each of the rows 188, 192, and 196 may or may not be consistent within the row.
In the exemplary embodiment, each of the ground tabs 164 and each of the ground fingers 140 extends approximately parallel, and thus in a common direction, to each of the signal pins 68. Alternatively, one or more of the grounds tabs 164 and/or one or more of the ground fingers 140 may extend at any other angle relative to one or more of the signal pins 68, such as, but not limited to, approximately perpendicular, an oblique angle, and/or the like.
The embodiments described and/or illustrated herein provide a modular jack assembly that may have an increased amount of EMI shielding, a reduced amount of crosstalk, and/or a reduced amount of noise. For example, the embodiments described and/or illustrated may reduce cross talk, may reduce noise, and/or may increase EMI shielding by providing a faraday shield around at least a portion of a signal pin array of the modular jack assembly. Moreover, and for example, the embodiments described and/or illustrated herein may reduce crosstalk, may reduce noise, and/or may increase EMI shielding by providing an increased number of ground connections to inner shields that separate adjacent jacks of the modular jack assembly. The embodiments described and/or illustrated herein may provide a modular jack assembly that has a desired, acceptable, and/or required level of EMI shielding, noise levels, and/or crosstalk amounts for a system operating at speeds up to 10 gigabits. The embodiments described and/or illustrated herein may reduce or eliminate noise coupled by stray capacitance as electrical coupling.
Exemplary embodiments are described and/or illustrated herein in detail. The embodiments are not limited to the specific embodiments described herein, but rather, components and/or steps of each embodiment may be utilized independently and separately from other components and/or steps described herein. Each component, and/or each step of one embodiment, can also be used in combination with other components and/or steps of other embodiments. When introducing elements/components/etc. described and/or illustrated herein, the articles “a”, “an”, “the”, “said”, and “at least one” are intended to mean that there are one or more of the element(s)/component(s)/etc. The terms “comprising”, “including” and “having” are intended to be inclusive and mean that there may be additional element(s)/component(s)/etc. other than the listed element(s)/component(s)/etc. Moreover, the terms “first,” “second,” and “third,” etc. in the claims are used merely as labels, and are not intended to impose numerical requirements on their objects. Similarly, the terms “front”, “rear”, “top”, “bottom”, and “side” etc. in the claims are used merely as labels, and are not intended to impose orientational requirements on their objects. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described and/or illustrated herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the description and illustrations. The scope of the subject matter described and/or illustrated herein should therefore be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
While the subject matter described and/or illustrated herein has been described in terms of various specific embodiments, those skilled in the art will recognize that the subject matter described and/or illustrated herein can be practiced with modification within the spirit and scope of the claims.
