Electrical connectors provide signal connections between electronic devices using electrically-conductive contacts. In some applications, an electrical connector provides a connectable interface between one or more substrates, e.g., printed circuit boards. Such an electrical connector may include a header connector mounted to a first substrate and a complementary receptacle connector mounted to a second substrate. Typically, a first plurality of contacts in the header connector are adapted to mate with a corresponding plurality of contacts in a receptacle connector.
Undesirable electrical signal interference between differential signal pairs of electrical contacts increases as signal density increases, particularly in electrical connectors that are devoid of metallic crosstalk shields. Signal density is important because silicon chips are subject to heat constraints as clock speeds increase. One way to achieve more signal throughput, despite the limitations of silicon-based chips, is to operate several chips and their respective transmission paths in parallel at the same time. This solution requires more backpanel, midplane, and daughter card space allocated to electrical connectors.
Therefore, there is a need for an orthogonal differential signal electrical connector with balanced mating characteristics that occupies a minimum amount of substrate space yet still operates above four Gigabits/sec with six percent or less of worst case, multi-active crosstalk in the absence of metallic crosstalk shields.
An electrical connector may include a plurality of electrically isolated electrical contacts arranged at least partially coincident along a common centerline, wherein at least two of the plurality of electrically isolated electrical contacts each define a mating end that deflects in a first direction transverse to the common centerline by corresponding blade contacts of a mating connector. At least one of the plurality of electrically isolated electrical contacts is adjacent to one of the at least two of the plurality of electrically isolated electrical contacts and defines a respective mating end that deflects in a second direction transverse to the common centerline and opposite to the first direction by a corresponding blade contact of the mating connector. At least one of the plurality of electrically isolated electrical contacts may include two adjacent electrically isolated electrical contacts. At least two of the plurality of electrically isolated electrical contacts may be adjacent to each other and the at least two of the plurality of electrically isolated electrical contacts may each deflect in the first direction. The at least one of the plurality of electrically isolated electrical contacts may include two adjacent electrically isolated electrical contacts. The at least two of the plurality of electrically isolated electrical contacts may include at least three electrically isolated electrical contacts that are adjacent to each other and that each define a mating end that deflects in a first direction transverse to the common centerline by corresponding blade contacts of a mating connector. The at least one of the plurality of electrically isolated electrical contacts could also include three adjacent electrically isolated electrical contacts. The at least two of the plurality of electrically isolated electrical contacts may include at least four electrically isolated electrical contacts that are adjacent to each other and that each define a mating end that deflects in a first direction transverse to the common centerline by corresponding blade contacts of a mating connector. The at least one of the plurality of electrically isolated electrical contacts may include four adjacent electrically isolated electrical contacts.
An electrical connector may also include an array of electrical contacts with adjacent electrical contacts in the array paired into differential signal pairs along respective centerlines. The differential signal pairs may be separated from each other along the respective centerlines by a ground contact, wherein the electrical connector is devoid of metallic plates and comprises more than eighty-two differential signal pairs per inch of card edge, one of the more than eighty-two differential signal pairs is a victim differential signal pair, and differential signals with rise times of 70 picoseconds in eight aggressor differential signal pairs closest in distance to the victim differential signal pair produce no more than six percent worst-case, multi-active cross talk on the victim differential signal pair. The adjacent electrical contacts that define a differential signal pair may be separated by a first distance and the differential signal pair may be separated from the ground contact by a second distance that is greater than the first distance. The second distance may be approximately 1.5 times greater than the first distance, two times greater than the first distance, or greater than two times greater than the first distance. Each electrical contact in the array of electrical contacts may include a receptacle mating portion. The receptacle mating portions in the array of electrical contacts may be circumscribed within an imaginary perimeter of about 400 square millimeters or less. Each electrical contact in the array of electrical contacts may include a receptacle compliant portion and the receptacle compliant portions in the array of electrical contacts may be circumscribed within an imaginary perimeter of about 400 square millimeters or less. The electrical connector may extend no more than 20 mm from a mounting surface of a substrate. A pitch may be defined between each of the centerlines of the contacts arranged in the first direction. The pitch between each of the centerlines may be approximately 1.2 mm to 1.8 mm.
An electrical connector may include a first electrical contact and a second electrical contact positioned at least partially along a first centerline. The first electrical contact may be adjacent to the second electrical contact, wherein the first electrical contact defines a tail end that jogs in a first direction away from the first centerline. The second electrical contact defines a tail end that jogs in a second direction opposite the first direction. A third electrical contact and a fourth electrical contact may be positioned at least partially along a second centerline that is adjacent to the first centerline. The third electrical contact may be adjacent to the fourth electrical contact, wherein the third electrical contact defines a tail end that jogs in a second direction and the fourth electrical contact defines a tail end that jogs in the first direction. The tail ends of the first and second electrical contacts may be in an orientation that is the mirror image of the tail ends of the third and fourth electrical contacts. The first and second electrical contacts may form a differential signal pair, and the third and fourth electrical contacts may form a differential signal pair. The electrical connector may further comprise a ground contact adjacent to the second electrical contact along the first centerline.
A substrate may include a first electrical via and a second electrical via positioned at least partially along a first centerline. The first electrical via may be adjacent to the second electrical via. The first electrical via may jog in a first direction away from the first centerline and the second electrical via may jog in a second direction opposite the first direction. A third electrical via and a fourth electrical via may be positioned at least partially along a second centerline that is adjacent to the first centerline. The third electrical via may be adjacent to the fourth electrical via. The third electrical via may jog in a second direction and the fourth electrical via may jog in the first direction. The first and second electrical vias are preferably in an orientation that is a mirror image of third and fourth electrical vias.
An electrical connector may comprise a differential signal pair comprising a first electrical contact retained in a dielectric housing and a second electrical contact retained in the housing adjacent to the first signal contact, wherein the first electrical contact has a first length in the first direction, the second signal contact has a second length in the first direction, the first length being less than the second length, and an electrical signal in the second signal contact propagates through the second length longer than the electrical signal in the first signal contact propagates through the first length to correct skew from a mating differential signal pair in a mating right angle connector.
An electrical connector may include an array of right-angle electrical contacts with adjacent electrical contacts in the array paired into differential signal pairs along respective centerlines. The differential signal pairs may be separated from each other along the respective centerlines by a ground contact. The electrical connector may be devoid of metallic plates and may comprise a differential signal pair density that can be calculated by varying the disclosed X and Y direction spacings. For example, in the disclosed 1 mm Y direction pitch, 25.4 contacts fit in a one inch Y direction. In a signal-signal-ground configuration, this yields eight differential signal pairs in the Y direction. At a corresponding 1 mm X direction pitch, 25.4 centerlines fit within a one inch X direction. Eight differential pairs times 25.4 contact centerlines equals 203 differential signal pairs. Other differential signal pair densities can be calculated in the same way be substituting the disclosed X and Y dimensions.
The first and second electrical connectors 110 and 210 may be shieldless high-speed electrical connectors, i.e., connectors that operate without metallic crosstalk plates at data transfer rates at or above four Gigabits/sec, and typically anywhere at or between 6.25 through 12.5 Gigabits/sec or more (about 80 through 35 picosecond rise times) with acceptable worst-case, multi-active crosstalk on a victim pair of no more than six percent. Worst case, multi-active crosstalk may be determined by the sum of the absolute values of six or eight aggressor differential signal pairs (
Referring again to
With continuing reference to
The first and second electrical connectors 110, 210 in
With continuing reference to
As shown in
In general, the card pitch increases by about 3 mm for each differential signal pair and adjacent ground contact added along a respective centerline in the Y direction and decreases by roughly the same amount when a differential signal pair and adjacent ground contact are omitted. Differential signal pairs per inch of card edge increases by about fourteen to seventeen differential signal pairs for every differential signal pair added to the centerline or omitted from the centerline, assuming the centerline spacing and the number of centerlines remain constant.
With continuing reference to
More specifically, the tail portions 265 of the differential signal pairs 275 positioned along centerline CL1 may have a tail and corresponding via orientation that is reversed from the tail and corresponding via orientation of tail portions 265 of differential signal pairs 285 positioned along an adjacent centerline CL2. Thus, the tail portion 265 and corresponding via of a first contact of a first differential signal pair 275 positioned along first centerline CL1 may jog in the X-direction. A tail portion 265 and corresponding via of a corresponding first contact of a second differential signal pair 285 in a second centerline CL2 may jog in the X direction. Further, the tail portion 265 and corresponding via of a second contact of the first differential signal pair 275 positioned along the first centerline CL1 may jog in the X direction, and a tail portion 265 and corresponding via of a second contact of the second differential signal pair 285 in the second centerline may jog in the X-direction. Thus, the tail portions 265 and respective vias positioned along a first centerline CL1 may jog in a pattern reverse to the pattern of the tail portions 265 and respective vias of the terminal ends of contacts positioned along centerline CL2. This pattern can repeat for the remaining centerlines.
The substrate via footprint and corresponding first electrical connector 110A shown in
As shown in
Referring again to
A plurality of IMLAs 220 may be arranged in the receptacle housing 240 such that each of the IMLAs 220 is adjacent to another IMLA 220 on at least one side. For example, the mating portions 270 of the right angle electrical contacts 250 may be received into the mating cavities 370. The IMLAs 220 may be received into the mating cavities 370 until each of the respective protrusions 320 is inserted into a corresponding cavity 380. The IMLA organizer 230 (
As shown in
It should be understood that although
Portion 460 is shown in greater detail in
The ground contact 450 may be similar in dimensions to the first and second signal contacts 430, 440 to optimize spacing between signals contacts and grounds to produce an electrical connector with a differential signal pair density greater than eighty-two differential signal pairs per inch of card edge, and a stacked card pitch distance of less than about 35 mm or 31 mm (about 25 mm preferred), and a back panel to rear connector length of less than about 37 mm (about 35 mm preferred). In addition, a second electrical connector with right angle electrical contacts and more than eighty-two differential pairs per inch of card edge and the associated interleaved ground contacts 450 rises less than 20 mm from a daughter card mounting surface and only occupies about 400 square millimeters of daughter card surface area.
For example, third electrical contact 490 may have a third physical and electrical length L3 and a fourth electrical contact 500 adjacent to the third electrical contact 490 may have a fourth physical and electrical length. In an example embodiment, the fourth physical and electrical length may be less than the third length. The third electrical contact 490 may be mated to the first electrical contact 470 and the fourth electrical contact 500 may be mated with the second electrical contact 480 such that the summation of the first physical and electrical length and the third physical and electrical length may be approximately equal to the summation of the second physical and electrical length and the fourth physical and electrical length. That is, the total electrical length between two contacts in a differential signal pair may be corrected for skew.
This application is a continuation application of U.S. patent application Ser. No. 13/310,970, filed Dec. 5, 2011, now issued as U.S. Pat. No. 8,382,521, which is a continuation application of U.S. patent application Ser. No. 12/843,735, filed Jul. 26, 2010, now U.S. Pat. No. 8,096,832, which is a continuation application of U.S. patent application Ser. No. 12/396,086, filed Mar. 2, 2009, now U.S. Pat. No. 7,762,843, which is a divisional application of U.S. patent application Ser. No. 11/958,098, filed Dec. 17, 2007, now U.S. Pat. No. 7,497,736, which is a continuation-in-part of U.S. patent application Ser. No. 11/726,936, filed Mar. 23, 2007, now U.S. Pat. No. 7,503,804, and which also claims the benefit under 35 U.S.C. §119(e) of provisional U.S. patent application Nos. 60/870,791, filed Dec. 19, 2006, 60/870,793, filed Dec. 19, 2006, 60/870,796, filed Dec. 19, 2006, 60/887,081, filed Jan. 29, 2007, and 60/917,491, filed May 11, 2007. The disclosure of each of the above-referenced U.S. patent applications is incorporated by reference as if set forth in its entirety herein. This application is related to U.S. patent application Ser. No. 10/953,749 filed Sep. 29, 2004, now issued as U.S. Pat. No. 7,281,950; U.S. patent application Ser. No. 11/388,549 filed Mar. 24, 2006, now published as U.S. Publication No. 2006/0228912; U.S. patent application Ser. No. 11/855,339 filed Sep. 14, 2007, now issued as U.S. Pat. No. 7,497,735; U.S. patent application Ser. No. 11/837,847 filed Aug. 13, 2007, now issued as U.S. Pat. No. 7,500,871; and U.S. patent application Ser. No. 11/450,606 filed Jun. 9, 2006, now issued as U.S. Pat. No. 7,553,182.
Number | Name | Date | Kind |
---|---|---|---|
2664552 | Ericsson et al. | Dec 1953 | A |
2849700 | Perkin | Apr 1958 | A |
2858372 | Kaufman | Oct 1958 | A |
3115379 | McKee | Dec 1963 | A |
3286220 | Marley et al. | Nov 1966 | A |
3343120 | Whiting | Sep 1967 | A |
3482201 | Schneck | Dec 1969 | A |
3538486 | Shlesinger, Jr. | Nov 1970 | A |
3591834 | Kolias | Jul 1971 | A |
3641475 | Irish et al. | Feb 1972 | A |
3663925 | Proctor | May 1972 | A |
3669054 | Desso et al. | Jun 1972 | A |
3701076 | Irish | Oct 1972 | A |
3748633 | Lundergan | Jul 1973 | A |
3827005 | Friend | Jul 1974 | A |
3867008 | Gartland, Jr. | Feb 1975 | A |
4030792 | Fuerst | Jun 1977 | A |
4076362 | Ichimura | Feb 1978 | A |
4159861 | Anhalt | Jul 1979 | A |
4232924 | Kline et al. | Nov 1980 | A |
4260212 | Ritchie et al. | Apr 1981 | A |
4288139 | Cobaugh et al. | Sep 1981 | A |
4383724 | Verhoeven | May 1983 | A |
4402563 | Sinclair | Sep 1983 | A |
4482937 | Berg | Nov 1984 | A |
4523296 | Healy, Jr. | Jun 1985 | A |
4560222 | Dambach | Dec 1985 | A |
4664456 | Blair et al. | May 1987 | A |
4664458 | Worth | May 1987 | A |
4717360 | Czaja | Jan 1988 | A |
4762500 | Dola et al. | Aug 1988 | A |
4776803 | Pretchel et al. | Oct 1988 | A |
4815987 | Kawano et al. | Mar 1989 | A |
4850887 | Sugawara | Jul 1989 | A |
4867713 | Ozu et al. | Sep 1989 | A |
4898539 | Glover et al. | Feb 1990 | A |
4900271 | Colleran et al. | Feb 1990 | A |
4907990 | Bertho et al. | Mar 1990 | A |
4913664 | Dixon et al. | Apr 1990 | A |
4917616 | Demler, Jr. et al. | Apr 1990 | A |
4973271 | Ishizuka et al. | Nov 1990 | A |
4997390 | Scholz et al. | Mar 1991 | A |
5004426 | Barnett | Apr 1991 | A |
5046960 | Fedder | Sep 1991 | A |
5055054 | Doutrich | Oct 1991 | A |
5065282 | Polonio | Nov 1991 | A |
5066236 | Broeksteeg | Nov 1991 | A |
5077893 | Mosquera et al. | Jan 1992 | A |
5094623 | Scharf et al. | Mar 1992 | A |
5098311 | Roath et al. | Mar 1992 | A |
5127839 | Korsunsky et al. | Jul 1992 | A |
5161987 | Sinisi | Nov 1992 | A |
5163337 | Herron et al. | Nov 1992 | A |
5163849 | Fogg et al. | Nov 1992 | A |
5167528 | Nishiyama et al. | Dec 1992 | A |
5169337 | Ortega et al. | Dec 1992 | A |
5174770 | Sasaki et al. | Dec 1992 | A |
5181855 | Mosquera et al. | Jan 1993 | A |
5238414 | Yaegashi et al. | Aug 1993 | A |
5254012 | Wang | Oct 1993 | A |
5257941 | Lwee et al. | Nov 1993 | A |
5274918 | Reed | Jan 1994 | A |
5277624 | Champion et al. | Jan 1994 | A |
5286212 | Broeksteeg | Feb 1994 | A |
5288949 | Crafts | Feb 1994 | A |
5302135 | Lee | Apr 1994 | A |
5342211 | Broeksteeg | Aug 1994 | A |
5356300 | Costello et al. | Oct 1994 | A |
5356301 | Champion et al. | Oct 1994 | A |
5357050 | Baran et al. | Oct 1994 | A |
5382168 | Azuma et al. | Jan 1995 | A |
5387111 | DeSantis et al. | Feb 1995 | A |
5395250 | Englert, Jr. et al. | Mar 1995 | A |
5429520 | Morlion et al. | Jul 1995 | A |
5431578 | Wayne | Jul 1995 | A |
5474472 | Niwa et al. | Dec 1995 | A |
5475922 | Tamura et al. | Dec 1995 | A |
5522727 | Saito et al. | Jun 1996 | A |
5558542 | O'Sullivan et al. | Sep 1996 | A |
5575688 | Crane, Jr. | Nov 1996 | A |
5586908 | Lorrain | Dec 1996 | A |
5586914 | Foster, Jr. et al. | Dec 1996 | A |
5590463 | Feldman et al. | Jan 1997 | A |
5609502 | Thumma | Mar 1997 | A |
5634821 | Crane, Jr. | Jun 1997 | A |
5637019 | Crane, Jr. et al. | Jun 1997 | A |
5672064 | Provencher et al. | Sep 1997 | A |
5697799 | Consoli et al. | Dec 1997 | A |
5713746 | Olson et al. | Feb 1998 | A |
5730609 | Harwath | Mar 1998 | A |
5741144 | Elco et al. | Apr 1998 | A |
5741161 | Cahaly et al. | Apr 1998 | A |
5766023 | Noschese et al. | Jun 1998 | A |
5795191 | Preputnick et al. | Aug 1998 | A |
5817973 | Elco | Oct 1998 | A |
5833475 | Mitra | Nov 1998 | A |
5853797 | Fuchs et al. | Dec 1998 | A |
5860816 | Provencher et al. | Jan 1999 | A |
5871362 | Campbell et al. | Feb 1999 | A |
5876222 | Gardner et al. | Mar 1999 | A |
5887158 | Sample | Mar 1999 | A |
5892791 | Moon | Apr 1999 | A |
5893761 | Longueville | Apr 1999 | A |
5902136 | Lemke et al. | May 1999 | A |
5904581 | Pope et al. | May 1999 | A |
5908333 | Perino et al. | Jun 1999 | A |
5938479 | Paulson et al. | Aug 1999 | A |
5961355 | Morlion et al. | Oct 1999 | A |
5967844 | Doutrich et al. | Oct 1999 | A |
5971817 | Longueville | Oct 1999 | A |
5975921 | Shuey | Nov 1999 | A |
5980321 | Cohen et al. | Nov 1999 | A |
5984690 | Riechelmann et al. | Nov 1999 | A |
5992953 | Rabinovitz | Nov 1999 | A |
5993259 | Stokoe et al. | Nov 1999 | A |
6022227 | Huang | Feb 2000 | A |
6042427 | Adriaenssens et al. | Mar 2000 | A |
6050862 | Ishii | Apr 2000 | A |
6053751 | Humphrey | Apr 2000 | A |
6068520 | Winings et al. | May 2000 | A |
6086386 | Fjelstad et al. | Jul 2000 | A |
6116926 | Ortega et al. | Sep 2000 | A |
6116965 | Arnett et al. | Sep 2000 | A |
6123554 | Ortega et al. | Sep 2000 | A |
6125535 | Chiou et al. | Oct 2000 | A |
6129592 | Mickievicz et al. | Oct 2000 | A |
6132255 | Verhoeven | Oct 2000 | A |
6139336 | Olson | Oct 2000 | A |
6146157 | Lenoir et al. | Nov 2000 | A |
6146203 | Elco et al. | Nov 2000 | A |
6152747 | McNamara | Nov 2000 | A |
6154742 | Herriot | Nov 2000 | A |
6171115 | Mickievicz et al. | Jan 2001 | B1 |
6171149 | Van Zanten | Jan 2001 | B1 |
6179663 | Bradley et al. | Jan 2001 | B1 |
6190213 | Reichart et al. | Feb 2001 | B1 |
6212755 | Shimada et al. | Apr 2001 | B1 |
6219913 | Uchiyama | Apr 2001 | B1 |
6220896 | Bertoncini et al. | Apr 2001 | B1 |
6227882 | Ortega et al. | May 2001 | B1 |
6241535 | Lemke et al. | Jun 2001 | B1 |
6267604 | Mickievicz et al. | Jul 2001 | B1 |
6269539 | Takahashi et al. | Aug 2001 | B1 |
6280209 | Bassler et al. | Aug 2001 | B1 |
6280809 | Wang et al. | Aug 2001 | B1 |
6293827 | Stokoe | Sep 2001 | B1 |
6299483 | Cohen et al. | Oct 2001 | B1 |
6302711 | Ito | Oct 2001 | B1 |
6319075 | Clark et al. | Nov 2001 | B1 |
6322379 | Ortega et al. | Nov 2001 | B1 |
6322393 | Doutrich et al. | Nov 2001 | B1 |
6328602 | Yamasaki et al. | Dec 2001 | B1 |
6343955 | Billman et al. | Feb 2002 | B2 |
6347952 | Hasegawa et al. | Feb 2002 | B1 |
6347962 | Kline | Feb 2002 | B1 |
6350134 | Fogg et al. | Feb 2002 | B1 |
6354877 | Shuey et al. | Mar 2002 | B1 |
6358061 | Regnier | Mar 2002 | B1 |
6361366 | Shuey et al. | Mar 2002 | B1 |
6363607 | Chen et al. | Apr 2002 | B1 |
6364710 | Billman et al. | Apr 2002 | B1 |
6371773 | Crofoot et al. | Apr 2002 | B1 |
6375478 | Kikuchi | Apr 2002 | B1 |
6379188 | Cohen et al. | Apr 2002 | B1 |
6386914 | Collins et al. | May 2002 | B1 |
6386924 | Long | May 2002 | B2 |
6390826 | Affolter et al. | May 2002 | B1 |
6409543 | Astbury, Jr. et al. | Jun 2002 | B1 |
6414248 | Sundstrom | Jul 2002 | B1 |
6420778 | Sinyansky | Jul 2002 | B1 |
6431914 | Billman | Aug 2002 | B1 |
6435914 | Billman | Aug 2002 | B1 |
6457983 | Bassler et al. | Oct 2002 | B1 |
6461202 | Kline | Oct 2002 | B2 |
6464529 | Jensen et al. | Oct 2002 | B1 |
6471548 | Bertoncini et al. | Oct 2002 | B2 |
6482038 | Olson | Nov 2002 | B2 |
6485330 | Doutrich | Nov 2002 | B1 |
6494734 | Shuey | Dec 2002 | B1 |
6503103 | Cohen et al. | Jan 2003 | B1 |
6506076 | Cohen et al. | Jan 2003 | B2 |
6506081 | Blanchfield et al. | Jan 2003 | B2 |
6520803 | Dunn | Feb 2003 | B1 |
6526519 | Cuthbert | Feb 2003 | B1 |
6527587 | Ortega et al. | Mar 2003 | B1 |
6528737 | Kwong et al. | Mar 2003 | B1 |
6530134 | Laphan et al. | Mar 2003 | B1 |
6537086 | MacMullin | Mar 2003 | B1 |
6537111 | Brammer et al. | Mar 2003 | B2 |
6540522 | Sipe | Apr 2003 | B2 |
6540558 | Paagman | Apr 2003 | B1 |
6540559 | Kemmick et al. | Apr 2003 | B1 |
6547066 | Koch | Apr 2003 | B2 |
6551140 | Billman et al. | Apr 2003 | B2 |
6554647 | Cohen et al. | Apr 2003 | B1 |
6565388 | Van Woensel et al. | May 2003 | B1 |
6572409 | Nitta et al. | Jun 2003 | B2 |
6572410 | Volstorf et al. | Jun 2003 | B1 |
6589071 | Lias et al. | Jul 2003 | B1 |
6592381 | Cohen et al. | Jul 2003 | B2 |
6607402 | Cohen et al. | Aug 2003 | B2 |
6633490 | Centola et al. | Oct 2003 | B2 |
6641411 | Stoddard et al. | Nov 2003 | B1 |
6641825 | Scholz et al. | Nov 2003 | B2 |
6652318 | Winings et al. | Nov 2003 | B1 |
6655922 | Flek | Dec 2003 | B1 |
6672907 | Azuma | Jan 2004 | B2 |
6692272 | Lemke et al. | Feb 2004 | B2 |
6695627 | Ortega et al. | Feb 2004 | B2 |
6712646 | Shindo | Mar 2004 | B2 |
6717825 | Volstorf | Apr 2004 | B2 |
6736664 | Ueda et al. | May 2004 | B2 |
6746278 | Nelson et al. | Jun 2004 | B2 |
6749439 | Potter et al. | Jun 2004 | B1 |
6762067 | Quinones et al. | Jul 2004 | B1 |
6764341 | Lappoehn | Jul 2004 | B2 |
6776649 | Pape et al. | Aug 2004 | B2 |
6786771 | Gailus | Sep 2004 | B2 |
6799215 | Giroir et al. | Sep 2004 | B1 |
6805278 | Olson et al. | Oct 2004 | B1 |
6808399 | Rothermel et al. | Oct 2004 | B2 |
6808420 | Whiteman, Jr. et al. | Oct 2004 | B2 |
6824391 | Mickiewvicz et al. | Nov 2004 | B2 |
6835072 | Simons et al. | Dec 2004 | B2 |
6843686 | Ohnishi et al. | Jan 2005 | B2 |
6848944 | Evans | Feb 2005 | B2 |
6851974 | Doutrich | Feb 2005 | B2 |
6851980 | Nelson et al. | Feb 2005 | B2 |
6852567 | Lee et al. | Feb 2005 | B1 |
6869292 | Johnescu et al. | Mar 2005 | B2 |
6872085 | Cohen et al. | Mar 2005 | B1 |
6884117 | Korsunsky et al. | Apr 2005 | B2 |
6890214 | Brown et al. | May 2005 | B2 |
6893300 | Zhou et al. | May 2005 | B2 |
6893686 | Egan | May 2005 | B2 |
6902411 | Kubo | Jun 2005 | B2 |
6913490 | Whiteman, Jr. et al. | Jul 2005 | B2 |
6918776 | Spink, Jr. | Jul 2005 | B2 |
6918789 | Lang et al. | Jul 2005 | B2 |
6932649 | Rothermel et al. | Aug 2005 | B1 |
6939173 | Elco et al. | Sep 2005 | B1 |
6945796 | Bassler et al. | Sep 2005 | B2 |
6951466 | Sandoval et al. | Oct 2005 | B2 |
6953351 | Fromm et al. | Oct 2005 | B2 |
6969280 | Chien et al. | Nov 2005 | B2 |
6976886 | Winings et al. | Dec 2005 | B2 |
6979215 | Avery et al. | Dec 2005 | B2 |
6981883 | Raistrick et al. | Jan 2006 | B2 |
6988902 | Winings et al. | Jan 2006 | B2 |
6994569 | Minich et al. | Feb 2006 | B2 |
7021975 | Lappohn | Apr 2006 | B2 |
7044794 | Consoli et al. | May 2006 | B2 |
7090501 | Scherer et al. | Aug 2006 | B1 |
7094102 | Cohen et al. | Aug 2006 | B2 |
7097506 | Nakada | Aug 2006 | B2 |
7101191 | Benham et al. | Sep 2006 | B2 |
7108556 | Cohen et al. | Sep 2006 | B2 |
7114964 | Winings et al. | Oct 2006 | B2 |
7118391 | Minich et al. | Oct 2006 | B2 |
7131870 | Whiteman, Jr. et al. | Nov 2006 | B2 |
7172461 | Davis et al. | Feb 2007 | B2 |
7207807 | Fogg | Apr 2007 | B2 |
7229318 | Winings et al. | Jun 2007 | B2 |
7239526 | Bibee | Jul 2007 | B1 |
7241168 | Sakurai et al. | Jul 2007 | B2 |
7270574 | Ngo | Sep 2007 | B1 |
7281950 | Belopolsky | Oct 2007 | B2 |
7292055 | Egitto | Nov 2007 | B2 |
7322855 | Mongold et al. | Jan 2008 | B2 |
7331802 | Rothermel et al. | Feb 2008 | B2 |
7407387 | Johnescu | Aug 2008 | B2 |
7429176 | Johnescu | Sep 2008 | B2 |
7497735 | Belopolsky | Mar 2009 | B2 |
7497736 | Minich et al. | Mar 2009 | B2 |
7500871 | Minich et al. | Mar 2009 | B2 |
7503804 | Minich et al. | Mar 2009 | B2 |
7553182 | Buck et al. | Jun 2009 | B2 |
7621781 | Rothermel et al. | Nov 2009 | B2 |
7762843 | Minich et al. | Jul 2010 | B2 |
8062046 | Daily et al. | Nov 2011 | B2 |
8096832 | Minich et al. | Jan 2012 | B2 |
8382521 | Minich et al. | Feb 2013 | B2 |
20010012729 | Van Woensel | Aug 2001 | A1 |
20010046810 | Cohen et al. | Nov 2001 | A1 |
20020039857 | Naito et al. | Apr 2002 | A1 |
20020084105 | Geng | Jul 2002 | A1 |
20020098727 | McNamara et al. | Jul 2002 | A1 |
20020106930 | Pape et al. | Aug 2002 | A1 |
20020111068 | Cohen et al. | Aug 2002 | A1 |
20020127903 | Billman et al. | Sep 2002 | A1 |
20030116857 | Taniguchi et al. | Jun 2003 | A1 |
20030143894 | Kline et al. | Jul 2003 | A1 |
20030171010 | Winings et al. | Sep 2003 | A1 |
20030203665 | Ohnishi et al. | Oct 2003 | A1 |
20030220021 | Whiteman, Jr. et al. | Nov 2003 | A1 |
20040157477 | Johnson et al. | Aug 2004 | A1 |
20040161954 | Johnescu et al. | Aug 2004 | A1 |
20040224559 | Nelson et al. | Nov 2004 | A1 |
20040235321 | Mizumura et al. | Nov 2004 | A1 |
20050009402 | Chien et al. | Jan 2005 | A1 |
20050032401 | Kobayashi | Feb 2005 | A1 |
20050032437 | Johnescu et al. | Feb 2005 | A1 |
20050048838 | Korsunsky et al. | Mar 2005 | A1 |
20050079763 | Lemke et al. | Apr 2005 | A1 |
20050101188 | Benham et al. | May 2005 | A1 |
20050118869 | Evans | Jun 2005 | A1 |
20050148239 | Hull et al. | Jul 2005 | A1 |
20050164555 | Winings et al. | Jul 2005 | A1 |
20050170700 | Shuey et al. | Aug 2005 | A1 |
20050196987 | Shuey et al. | Sep 2005 | A1 |
20050202722 | Regnier et al. | Sep 2005 | A1 |
20050215121 | Tokunaga | Sep 2005 | A1 |
20050227552 | Yamashita et al. | Oct 2005 | A1 |
20050277315 | Mongold et al. | Dec 2005 | A1 |
20050287869 | Kenny et al. | Dec 2005 | A1 |
20060014433 | Consoli et al. | Jan 2006 | A1 |
20060024983 | Cohen et al. | Feb 2006 | A1 |
20060024984 | Winings et al. | Feb 2006 | A1 |
20060046526 | Minich | Mar 2006 | A1 |
20060051987 | Goodman et al. | Mar 2006 | A1 |
20060068610 | Belopolsky | Mar 2006 | A1 |
20060068641 | Hull et al. | Mar 2006 | A1 |
20060073709 | Reid | Apr 2006 | A1 |
20060116857 | Sevic | Jun 2006 | A1 |
20060121749 | Fogg | Jun 2006 | A1 |
20060192274 | Lee et al. | Aug 2006 | A1 |
20060216969 | Bright et al. | Sep 2006 | A1 |
20060228912 | Morlion et al. | Oct 2006 | A1 |
20060232301 | Morlion et al. | Oct 2006 | A1 |
20070004287 | Marshall | Jan 2007 | A1 |
20070042639 | Manter et al. | Feb 2007 | A1 |
20070099455 | Rothermel et al. | May 2007 | A1 |
20070205774 | Minich | Sep 2007 | A1 |
20070207641 | Minich | Sep 2007 | A1 |
20070287336 | Buck et al. | Dec 2007 | A1 |
20080003880 | Belopolsky | Jan 2008 | A1 |
20080045079 | Minich et al. | Feb 2008 | A1 |
20080176453 | Minich et al. | Jul 2008 | A1 |
20090111292 | Brodsky et al. | Apr 2009 | A1 |
20090159314 | Minich et al. | Jun 2009 | A1 |
20100291806 | Minich et al. | Nov 2010 | A1 |
Number | Date | Country |
---|---|---|
0273683 | Jul 1988 | EP |
0635910 | Jan 1995 | EP |
0891016 | Jan 1999 | EP |
1193799 | Apr 2002 | EP |
1148587 | Apr 2005 | EP |
06-236788 | Aug 1994 | JP |
07-114958 | May 1995 | JP |
11-185886 | Jul 1999 | JP |
2000-003743 | Jan 2000 | JP |
2000-003744 | Jan 2000 | JP |
2000-003745 | Jan 2000 | JP |
2000-003746 | Jan 2000 | JP |
WO 9016093 | Dec 1990 | WO |
WO 0129931 | Apr 2001 | WO |
WO 0139332 | May 2001 | WO |
WO 02101882 | Dec 2002 | WO |
03043138 | May 2003 | WO |
WO 2006020378 | Feb 2006 | WO |
WO 2006031296 | Mar 2006 | WO |
WO 2006105535 | Oct 2006 | WO |
WO 2008082548 | Jul 2008 | WO |
WO 2012047619 | Apr 2012 | WO |
Entry |
---|
U.S. Appl. No. 60/870,791, filed Dec. 19, 2006, Minich. |
U.S. Appl. No. 60/870,793, filed Dec. 19, 2006, Minich. |
U.S. Appl. No. 60/870,796, filed Dec. 19, 2006, Minich. |
U.S. Appl. No. 60/887,081, filed Jan. 29, 2007, Johnescu. |
U.S. Appl. No. 60/917,491, filed May 11, 2007, Minich. |
U.S. Appl. No. 61/261,097, filed Nov. 13, 2009, Stoner. |
Supplemental European Search Report for EP 07863105, mailed Jun. 20, 2011. |
“B? Bandwidth and Rise Time Budgets” Module 1-8 Fiber Optic Telecommunications (E-XVI-2a), http://cord.org/step—online/st1-8/stl8exvi2a.htm, 3 pages, date unavailable. |
4.0 UHD Connector Differential Signal Crosstalk, Reflections, 1998, p. 8-9. |
Airmax VS® High Speed Connector System, Communications Data, Consumer Division, 2004, 16 pages. |
AMP Z-Pack 2mm HM Connector, 2 mm Centerline, Eight-Row, Right-Angle Applications, Electrical Performance Report, EPR 889065, Issued Sep. 1998, 59 pages. |
AMP Z-Pack 2mm HM Interconnection System, 1992 and 1994 by AMP Incorporated, 6 pages. |
AMP Z-Pack HM-ZD Performance at Gigabit Speeds, Tyco Electronics, Report #20GC014, Rev. B., May 4, 2001,30 pages. |
Amphenol TCS (ATCS) Backplane Connectors, 2002, www.amphenol-tcs.com, 3 pages. |
Amphenol TCS (ATCS): HDM® Stacker Signal Integrity, http://www.teradyne.com/prods/tcs/products/connectors/mezzanine/hdm—stacker/signintgr, 3 pages, date not available. |
Amphenol TCS (ATCS): VHDM Connector, http://www.teradyne.com/prods/tcs/products/connectors/backplane/vhdm/index.html, 2 pages, date not available. |
Amphenol TCS (ATCS): VHDM L-Series Connector, http://www.teradyne.com/prods/tcs/products/connectors/backplane/vhdm—1-series/index.html, 2006, 4 pages. |
Amphenol TCS (ATCS)-Ventura® High Performance, Highest Density Available, 2002, www.amphenol—tcs.com, 2 pages. |
Amphenol TCS (ATCS)-XCede® Connector, 2002, www.amphenol-tcs.com, 5 pages. |
Backplane Products Overview Page, http://www.molex.com/cgi-bin/bv/volex/super—family/super—family.jsp?BV—SessionID=© 2005-2006, Molex, 4 pages. |
Backplane Products, www.molex.com, 2007, 3 pages. |
Communications, Data, Consumer Division Mezzanine High-Speed High-Density Connectors GIG-ARRAY® and MEG-ARRAY® Electrical Performance Data, FCI Corporation, 10 pages, date unavailable. |
FCI's Airmax VS® Connector System Honored at DesignCon, 2005, Heilind Electronics, Inc., http://www.heilind.com/products/fci/airmax-vs-design.asp, 1 page. |
Framatone Connector Specification, 1 page. |
Fusi, M.A. et al., “Differential Signal transmission Through Backplanes and Connectors,” Electronic Packaging and Production. Mar. 27-31, 1996. |
GIG-Array® Connector System, Board to Board Connecctors, 2005, 4 pages. |
GIG-Array® High Speed Mezzanine Connectors 15-40 mm Board-to-Board, Jun 5, 2006, 1 page. |
Goel, R.P. et al., “AMP Z-Pack Interconnect System,” 1990, AMP Incorporated, 9 pages. |
HDM Separable Interface Detail, Molex®, 3 pages, date not available. |
HDM/HDM Plus, 2mm, Backplane Interconnection System, Teradyne Connection Systems, © 1993, 22 pages. |
HDM® HDM Plus® Connectors, http://www.teradyne.com/prods/tcs/products/connectors/backplane/hdm/index/html, 2006, 1 page. |
Honda Connectors,“Honda High-Speed Backplane Connector NSP Series, ” Honda Tsushin Kygoyo Co., Ltd., Development Engineering Division, Tokyo, Japan, Feb. 7, 2003, 25 pages. |
Hult, B., “FCI's Problem Solving Approach Changes Market, The FCI Electronics AirMax VS,” ConnecctorSupplier.com, http://www.connectorsupplier.com/tech—updates—FCI-Airmax—archive.htm, 2006, 4 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Notice of Abandonment dated Sep. 11, 2009, 2 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Advisory Action dated May 5, 2009, 3 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Final Office Action dated Feb. 27, 2009, 4 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Non-Final Office Action dated Nov. 6, 2008, 4 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Notice of Publication dated Sep. 4, 2008, 1 page. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Non-Final Office Action dated Jun. 20, 2008, 5 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Tyco Declaration under 37 1.132, 11 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Request for Consideration After Final dated Apr. 24, 2009, 5 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Response to Office Action dated Nov. 6, 2008, mailed Feb. 6, 2009, 5 pages. |
In the United States Patent and Trademark Office, In re U.S. Appl. No. 11/713,503, filed Mar. 2, 2007, Response to Office Action dated Jun. 20, 2008, mailed Sep. 22, 2008, 4 pages. |
International Search Report, International Application No. PCT/US2008/002569, Publication No. WO 2008/108951, International Filing Date: Feb. 27, 2008, 3 pages. |
Lucent Technologies Bell Labs and FCI Demonstrate 25 gb/Sdata Transmission over Electrical Backplane Connectors, Feb. 1, 2005, http://www.lucent.com/press/0205/050201.bla.html, 4 pages. |
Metral™ 2mm High-Speed Connectors, 1000, 2000, 3000 Series, Electrical Performance Data for Differential Applications, FCI Framatone Group, 2 pages, date unavailable. |
Metral™, “Speed & Density Extensions,” FCI, Jun. 3, 1999, 25 pages. |
Millipacs Connector Type A Specification, 1 page. |
Molex Features and Specifications, www.molex.com/link/Impact.html, May 2008, 5 pages. |
Molex Incorporated Drawings, 1.0 HDMI Right Angle Header Assembly (19 PIN) Lead Free, Jul. 20, 2004, 7 pages. |
Molex, GbXI-Trac™ Backplane Connector System, www.molex.com/cgi-bin, 2007, 3 pages. |
Molex, High Definition Multimedia Interface (HDMI) www.molex.com, 2 pages, date unavailable. |
Nadolny, J. et al., “Optimizing Connector Selection for Gigabit Signal Speeds,” ECN™, Sep. 1, 2000, http://www.ecnmag.com/article/CA45245, 6 pages. |
NSP Honda The World Famous Connectors, http://www.honda-connectros.co.ip, 6 pages,English Language translation attached, date unavailable. |
PCB-Mounted Receptacle Assemblies, 2.00 mm (0.079 In) Centerlines, Right-Angle Solder-to-Board Signal receptacle Metral™, Berg Electronics, 10-6-10-7, 2 pages. |
Provisional Patent Application, Cohen, U.S. Appl. No. 60/584,928, filed Jul. 1, 2004. |
Samtec, E.L.P. Extended Life Product, Open Pin Field Array Seaf Series, 2005, www.santec.com, 1 page. |
Samtec, High Speed Characterization Report, SEAM-30-02 0-S-10-2 Mates With SEAF-30-05.0-S-10-2, Open Pin Field Array, 1.27 mm×1.27 mm Pitch 7mm Stack Height 2005, www.samtec.com, 51 pages. |
TB-2127, “VENTURA™ Application Design,” Revision, General Release, Specification Revision Status-B, Hurisaker, Aug. 25, 2005, Amphenol corporation 2006, 1-13. |
Teradyne Connection Systems, Inc., Customer Use Drawing No. C-163-5101-500, Rev. 04, date not available. |
Tyco Electronics Z-Dok+ Connector, May 23, 2003, http://zdok.tycoelectronics.com, 15 pages. |
Tyco Electronics Engineering Drawing, Impact, 3 Pair 10 Column Signal Module, Mar. 25, 2008, 1 page. |
Tyco Electronics Engineering Drawing, Impact, 3 Pair Header Unguided Open Assembly, Apr. 11, 2008, 1 page. |
Tyco Electronics, High Speed Backplane Interconnect Solutions, Feb. 7, 2003, 6 pages. |
Tyco Electronics, Impact™ Connector Offered by Tyco Electronics, High Speed Backplane Connector System, Apr. 15, 2008, 12 pages. |
Tyco Electronics, Overview for High Density Backplane Connector (Z-Pack TinMan), 2005, 1 page. |
Tyco Electronics, Overview for High Density Backplane Connectors (Impact™) Offered by Tyco Electronics, www.tycoelectronics.com/catalog, 2007, 2 pages. |
Tyco Electronics, Two-Piece, High-Speed Connectors, www.tycocoelectronics.com/catalog, 2007, 3 pages. |
Tyco Electronics, Z-Dok and Connector, Tyco Electronics, Jun. 23, 2003, http://2dok.tyco.electronics.com, 15 pages. |
Tyco Electronics, Z-Pack Slim UHD, http:/ww.zpackuhd.com, 2005, 8 pages. |
Tyco Electronics, Z-Pack TinMan Prod Portfolio, 2005, 1 page. |
Tyco Electronics, Z-Pack TinMan, Product Portfolio Expanded to Include 6-Pair Module, 2005, 1 page. |
Tyco Electronics/AMP, “Champ Z-Dok Connector System,” Catalog #1309281, Issued Jan. 2002, 3 pages. |
Tyco Electronics/AMP, “Z-Dok and Z-Dok and Connectors,” Application Specification #114-13068, Aug. 30, 2005, Revision A, 16 pages. |
Tyco Unveils Z-Pack TinMan Orthogonal Connector System, http://www.epn-online.com/page/new59327/tyco-unveils-z-pack-orthogonal-conn, Oct. 13, 2009, 4 pages. |
VHDM Daughterboard Connectors Feature press-fit Terminations and a Non-Stubbing Separable Interface, ©Teradyne, Inc., Connections Systems Division, Oct. 8, 1997, 46 pages. |
VHDM High-Speed Differential (VHDM HSD), http://www.teradyne.com/prods/bps/vhdm/html, 6 pages. |
Z-Pack TinMan High Speed Orthogonal Connector Product Feature Selector, http://catalog.tycoelectronics.com/catalog/feat/en/s/24643?BML=10576.17560.17759, Oct. 13, 2009, 2 pages. |
International Patent Application No. PCT/US2011/053378: International Preliminary Report on Patentability dated Apr. 2, 2013, 5 pages. |
Amphenol TCS XCede® HD: Product Availability, www.amphenol-tcs.com, accessed Jan. 31, 2013, 1 page. |
Number | Date | Country | |
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20130183869 A1 | Jul 2013 | US |
Number | Date | Country | |
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60870791 | Dec 2006 | US | |
60870793 | Dec 2006 | US | |
60870796 | Dec 2006 | US | |
60887081 | Jan 2007 | US | |
60917491 | May 2007 | US |
Number | Date | Country | |
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Parent | 11958098 | Dec 2007 | US |
Child | 12396086 | US |
Number | Date | Country | |
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Parent | 13310970 | Dec 2011 | US |
Child | 13770425 | US | |
Parent | 12843735 | Jul 2010 | US |
Child | 13310970 | US | |
Parent | 12396086 | Mar 2009 | US |
Child | 12843735 | US |
Number | Date | Country | |
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Parent | 11726936 | Mar 2007 | US |
Child | 11958098 | US |