The invention relates to a mold, more particularly to a shoe mold structure for footwear components.
The invention further relates to a method of using the above-mentioned shoe mold structure.
General shoe components, such as shoe midsole or shoe outsole, can be bonded together with adhesives. The conventional method is to raise the temperature of the components by means of an oven, etc., so that the adhesive can obtain a sufficient temperature. However, the method of using conventional heat sources has drawbacks such as low efficiency.
In view of the above drawback, microwave heating has emerged in the industry, and the shoe parts to be processed are made of foamed materials, such as EVA (ethylene-vinyl acetate copolymer), etc. The conventional microwave heating method makes microwaves penetrate the mold and directly heat the shoe parts, although microwaves penetrating the mold to directly heat the shoe parts is helpful for combination of the shoe components, it is still prone to the problem of uneven heating. In addition, microwaves will cause qualitative change and deterioration to the shoe vamp or the shoe outsole, which will affect the quality of the shoe body. Therefore, a shoe mold structure and a method of using the shoe mold structure capable of overcoming the above problems are required.
The invention provides a shoe mold structure with a main object of effectively combining a shoe outsole with a shoe vamp, and avoiding qualitative change and deterioration of the shoe outsole and the shoe vamp.
The invention further provides a method of using the above-mentioned shoe mold structure.
In order to achieve the foregoing object, the shoe mold structure of the invention comprises:
The invention further provides a method of using the shoe mold structure comprising:
It can be known from the foregoing that, the shoe mold structure of the invention mainly defines each of the side walls as the first side section, the second side section and the third side section, so that a position of the second side section corresponds to the foams, the accommodating groove is opened in the second side section, the heating unit is disposed in the accommodating groove, and the heating unit heats the foams separately to avoid qualitative change and deterioration of the shoe outsole and the shoe vamp.
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The mold 10 is made of a metal material, the mold 10 has a first end 10A and a second end 10B opposite to each other, an extending direction between the first end 10A and the second end 10B is a longitudinal direction X. The mold 10 further has a mold cavity 11, the mold cavity 11 is provided for accommodating a shoe vamp A1, a plurality of foams A2, and a shoe outsole A3. The foams A2 can be ETPU foam material or ETPU foam material mixed with TPU material or ETPE material mixed with TPE material, and the foams A2 are in granular form. The shoe outsole A3 can be made of rubber material or ETPU foam material or ETPU foam material mixed with TPU material or ETPE material mixed with TPE material. The mold cavity 11 is recessed inward from the second end 10B. The mold 10 is composed of a bottom wall 12 and a plurality of side walls 13, each of the side walls 13 further defines a first side section 131, a second side section 132 and a third side section 133 connected with one another in sequence along the longitudinal direction X, the second side section 132 is located between the first side section 131 and the third side section 133, the first side section 131 is closer to the first end 10A than the third side section 133, the third side section 133 is closer to the second end 10B than the first side section 131, and the second side section 132 has an accommodating groove 14.
Lengths of the first side section 131, the second side section 132 and the third side section 133 along the longitudinal direction X are respectively a first length D1, a second length D2 and a third length D3. A ratio of the first length D1, the second length D2 and the third length D3 is between 2:1:1 and 3:1:1.
In this embodiment, when the shoe vamp A1, the foams A2, and the shoe outsole A3 are placed in the mold cavity 11, a position of the first side section 131 corresponds to the shoe vamp A1, a position of the second side section 132 corresponds to the foams A2, and a position of the third side section 133 corresponds to the shoe outsole A3, but are not limited thereto, in other embodiments, a position of the second side section 132 corresponds to the foams A2 and a part of the shoe vamp Al and a part of the shoe outsole A3 as shown in
In this embodiment, each of the side walls 13 has an inner side surface 13A and an outer side surface 13B facing oppositely, the inner side surface 13A faces the mold cavity 11, the accommodating groove 14 is recessed from the outer side surface 13B, but is not limited thereto, in other embodiments, the accommodating groove 14 is recessed from the inner side surface 13A.
The heating unit 20 is disposed in the accommodating groove 14, the heating unit 20 provides heat energy. The heating unit 20 can be a heating coil, and the heating coil is capable of providing heat energy after being energized.
It can be known from the foregoing that, the shoe mold structure of the invention mainly defines each of the side walls 13 as the first side section 131, the second side section 132 and the third side section 133, so that a position of the second side section 132 corresponds to the foams A2, the accommodating groove 14 is opened in the second side section 132, the heating unit 20 is disposed in the accommodating groove 14, and the heating unit 20 heats the foams A2 separately to avoid qualitative change and deterioration of the shoe outsole A3 and the shoe vamp A1.
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Although the specific embodiments of the invention are disclosed in the above implementation modes, they are not intended to limit the invention. The specification relating to the above embodiments should be construed as exemplary rather than as limitative of the invention, with many variations and modifications being readily attainable by a person having ordinary skill in the art to which the invention pertains without departing from the principles and spirit thereof as defined by the appended claims and their legal equivalents.