The present invention relates to a shrinkage-free sealing method and structure of a heat pipe, and more particular, to a method and a structure which seals one open end of a heat pipe without performing shrinkage process thereof, so that the sealed open end can still assemble with heat-dissipation fins.
As shown in
However, the objective for shrinking the end portion 10a into the shrunk end portion 100a is to decrease the volume and area of the sealing structure, such that it is advantageous for the subsequent soldering process. However, the shape of the shrunk end portion 10a will make the heat pipe 1a with one open end useless to connect the heat-dissipation fins. Therefore, the shrunk end portion 10a has to protrude out of fins to occupy space.
To resolve the problems caused by the conventional heat pipe structure as described above, the Applicant, with many years of experience in this field, has developed a shrinkage-free sealing method and structure of heat pipe as described as follows.
The present invention provides a shrinkage-free sealing method and structure of a heat pipe to resolve the problems of the conventional sealing structure, so that the sealed open end of the heat pipe can still connect with heat-dissipation fins. As a result, the heat pipe can be assembled with more heat-dissipation fins to prevent conventional useless shrunk end portion protruding therefrom.
The method of forming a sealing structure at an open end of a heat pipe includes pressing one side of the open end towards the other side of the open end until the sidewall of the open end contact with each other so that a double-layered recess is formed with a cross-sectional length larger than a semicircumference of the outer circular wall of the heat pipe.
The shrinkage-free sealing structure of a heat pipe includes a double-layered recess formed at an open end of the heat pipe with the sidewall of the open end contacting with each other, wherein a cross-sectional length of the recess is larger than a semicircumference of the outer circular wall of the heat pipe.
These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
These, as well as other features of the present invention, will become apparent upon reference to the drawings wherein:
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Referring to
To prepare the sealing structure, the open end 10 of the heat pipe 1 is processed as follows.
As shown in
Furthermore, a soldering process can be performed at the edge of open end 10 to obtain a more reliable sealing structure. Otherwise, a supersonic welding can be used to press the open end 10 to form the recess portion 100.
As shown in
Furthermore, if no soldering process is performed before, it still has chance to do at this time to solder the end of the recess portion 100 with the better sealing structure.
Accordingly, a shrinkage-free sealing structure of the present invention can be obtained for use to connect with the heat-dissipation fins as shown in
Furthermore, as shown in
This disclosure provides exemplary embodiments of the present invention. The scope of this disclosure is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in shape, structure, dimension, type of material or manufacturing process may be implemented by one of skill in the art in view of this disclosure.
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