Patent Application
20190319173
The subject matter herein generally relates to light emitting diode (LED) package structure, and particularly relates to a side-view LED package structure.
Side-view LED package structures are used in backlight modules of display devices. For such a display device, the side-view LED package structure is positioned at a side of the light guide plate to provide light which is parallel to the light guide plate. However, the display device may have a large size due to the side-view LED package structure.
Therefore, there is room for improvement within the art.
Implementations of the present disclosure will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
The first electrodes 10 are electrically isolated from each other, and are substantially on the same plane. The first electrodes 10 define a mounting area of the LED chip 20. In an embodiment, the first electrodes 10 are made of highly conductive metal, for example, gold, silver, copper, platinum, aluminum, tin, or nickel.
The LED chip 20 is mounted on the first electrodes 10. The LED chip comprises a bottom surface 21 that is substantially parallel to the first electrodes 10. The bottom surface 21 comprises two bumps 210. The bumps 210 are electrically connected to the first electrodes 10. In an embodiment, the bumps 210 are solder bumps. The LED chip 20 further comprises a light emitting surface 22 facing away from and parallel to the bottom surface 21. The LED chip 20 can emit light through the light emitting surface 22.
The package body 30 encapsulates the first electrodes 10 and surrounds the LED chip 20. In an embodiment, the first electrodes 10 are embedded in the package body 30 by insert molding. The package body 30 comprises an upper package portion 31 positioned on the first electrodes 10, and a lower package portion 32 positioned under the first electrodes 10. The upper package portion 31 defines a receiving groove 310 that passes through the upper package portion 31, to expose a portion of each first electrode 10. A width of the receiving groove 310 is gradually decreased towards the first electrodes 10. The LED chip 20 is received in the receiving groove 310, thereby allowing the receiving groove 310 to define a light emitting region 311 of the LED chip 20. The inner surface of the receiving groove 310 is reflective as to light from the LED chip 20. In an embodiment, a cross section of the package body 30 parallel to the first electrodes 10 comprises two longer sides L and two shorter sides S connected to each other, wherein L>S (see
The cover layer 40 fills in the receiving groove 310 and covers the LED chip 20. The cover layer 40 can convert the light from the LED chip 20 to light having a desired wavelength. The converted light can then be emitted out through an opening of the receiving groove 310 facing away from the first electrodes 10. The cover layer 40 prevents the LED chip 20 from being polluted by dust and water. In an embodiment, the cover layer 40 comprises a material selected from a group consisting of pomegranate-based phosphor, silicate-based phosphor, sulfide-based phosphor, nitride-based phosphor, and any combination thereof.
The second electrodes 50 are positioned outside the package body 30, and are electrically connected to the first electrodes 10. The side-view LED package structure 100 can be electrically connected to a peripheral device (not shown) through the second electrodes 50. Along a plane parallel to the first electrodes 10, a surface area B of the second electrodes 50 is greater than a surface area A of the portion of the first electrodes 10 positioned in the light emitting region 311 (that is, B>A). In an embodiment, a ratio of the surface area B and the surface area A is about 3:2. The second electrodes 50 are made of highly conductive metal, for example, gold, silver, copper, platinum, aluminum, tin, or nickel.
In an embodiment, the second electrodes 50 and the first electrodes 10 are substantially on the same plane. Each second electrode 50 comprises a connecting portion 51 and an extension portion 52. Each connecting portion 51 is connected to the one first electrode 10. The connecting portion 51 extends from one shorter side S of the package body 30 towards a direction away from the package body 30. Each extension portion 52 comprises a first extension section 521 and a second extension section 522. The first extension section 521 extends from an end of the connecting portion 51 facing away from the package body 30 along a direction parallel to the shorter side S. The second extension section 522 extends from an end of the first extension section 521 facing away from the connecting portion 51 along a direction parallel to the longer side L, and towards the package body 30.
Along the plane parallel to the first electrodes 10, the surface area B of the second electrodes 50 is greater than the surface area A of the portion of the first electrodes 10 positioned in the light emitting region 311. Thus, the side-view LED package structures 100, 200 have a smaller light emitting region 311. Then, the size of the package body 30 and the cover layer 40 are decreased, thereby decreasing the overall size of the side-view LED package structures 100, 200.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201810345578.9 | Apr 2018 | CN | national |
