Patent Application
20110211310
Various embodiments of the present invention are generally directed to an apparatus associated with forming a signal path in a data storage device.
In accordance with various embodiments, a controller printed circuit board (PCB) supports a controller integrated circuit (IC) and a support bracket. A memory PCB is supported by the support bracket in a spaced apart, parallel relation to the controller PCB. The memory PCB supports at least one memory IC and has an edge connector which engages the support bracket. A flex circuit is provided that interconnects the edge connector to an interposer positioned on the controller PCB between the respective areal extent of the controller PCB and the memory PCB to form a data signal path between the memory IC and the controller IC.
These and various other features and advantages which characterize the various embodiments of the present invention can be understood in view of the following detailed discussion and the accompanying drawings.
A continuing trend in modern electronics devices and especially in data storage devices is increasing data capacity and transmission rates while reducing component size. Such trend has made enhancing signal transmission strength increasingly burdensome due to the intricate structure of the electrical connectors and the magnetic nature of electrical signals. As such, data transmitting components have been configured for reliability at the expense of transmission speed.
Accordingly, a need exists for data transmitting structure that can support both small form factors as well as high data throughput. A controller printed circuit board (PCB) that includes at least a controller integrated circuit (IC) and a support bracket can provide such high data throughput by connecting the controller PCB to at least one memory PCB via a flex circuit. Use of the support bracket can provide a small form factor in part due to the ability to maintain the memory PCB in a parallel relation to the controller PCB while engaging an edge connector of the memory PCB. Interconnecting the edge connector with an interposer positioned between the areal extent of the controller PCB and the memory PCB can further provide a robust and reliable signal path capable of high data transfer rates.
In
The device 100 includes a top level controller 102, an interface (I/F) circuit 104 and a non-volatile data storage array 106. The I/F circuit 104 operates under the direction of the controller 102 to transfer user data between the array 106 and a host device (not shown). In some embodiments, the controller 102 is a programmable microcontroller, while in other embodiments, data can be buffered in the I/F circuit 104 pending a transfer of the data between the array 106 and the host device
The PCBA 112 can further include one or more volatile or non-volatile memory chips 126 that connect to the overall controller 114 via chip receivers 128. The device 110 can provide various data operations while maintaining a small size. However, high data capacity and transmission rates become increasing difficult to attain as aspects of the PCBA reduce in size.
One such operational component can be a memory region 140 that encompasses one or more memory chips. It is contemplated that the memory chips are non-volatile solid state devices (SSD), such as Flash memory, but such configuration is not required or limited. The memory PCB 136 can connect to the controller PCB 132 via connection pads 142 that correspond to the various operational components 138 and a translating board edge connector 144. The controller PCB 132 can then transfer signals to another structure, such as the PCBA of
As shown, the flex circuit 158 forms a data signal path that connects the operational components 162 and memory portion 164 of each memory PCB 152 and 154 to the controller PCB 156 via a translating board edge connector 166, such as an SATA/SAS connector. While not limiting, the flex circuit 158 can be coupled to the board edge connector 166 in a variety of ways that include spring contacts, solder, and tension mounts. Furthermore, the flex circuit 158 can engage one or more sides of the memory PCB 152 to enable a stable interconnection of the connection pads, such as the pads 142 of
While the interconnection of the memory PCB and the flex circuit 158 can be made through a translating connector 166, such configuration is not required as any connection means can be used to allow communication between the memory PCB and the controller PCB. Likewise, the use of an interposer 160 is not limited and can be modified or changed as desired. For example, the flex circuit may be connected to the memory PCB through a slot receiver and to the controller PCB via a soldered connection. In some embodiments, the flex circuit 158 comprises signal transmission paths capable of data input and output of at least 12 Gigabits per second.
An exemplary embodiment of a controller PCBA 170 is illustrated in
As displayed in
In
For illustrative purposes, the translating board edge connectors 212 are shown disconnected from any flex circuit to display the connecting wires 214 that correspond to portions of the memory IC. As shown in
It should be noted that the translating board edge connector 212 may include a variety of different connecting mechanisms that provide interconnection between a flex circuit and the components of the memory PCB. In various embodiments, the memory PCB's can be selectively engaged and disengaged by one or more flex circuits with board edge connectors, as desired, to allow a variety of interconnection possibilities between the memory PCBs and the controller PCB. However, as can be appreciated, the flex circuit 202 and board edge connector 212 cannot sustain one or more memory PCBs in a spaced apart, parallel relationship with the controller PCB.
The spaced apart, parallel relationship between the memory PCB 228 and the controller PCB 222 can be facilitated by features in the support bracket 224 that engage localized areas of the memory PCB 228. That is, top retention features 230 can be configured to engage a specified region of the memory PCB 228 that is less than the length of the memory PCB. For example, the top retention features 230 can engage the memory PCB 228 exclusively on one side and an area that is less than the available surface area of the memory PCB 228. In addition, side retention features 232 can be included in the support bracket 224 to engage localized areas of the side of a memory PCB 228 to maintain the memory PCB's position despite vibration, heat, and abuse imposed on the controller PCB 222.
In the exemplary embodiment shown in
It should be noted that the connection assembly 226 is not limited to a certain number, type, or configuration, but form the interconnection between the memory IC and the controller IC. The assembly 226 can include one or more board edge connectors 234 that are affixed to a flex circuit 236 that is subsequently connected to an interposer 238 that is resident on the controller PCB 222. Engagement of the connection assembly 226 with the support bracket 224 can reliably provide a physically and electrically secure engagement of the memory PCB 228 while allowing for selective disengagement for various purposes, such as repair, reworking, and replacement of the memory PCB.
As displayed in
Additionally, the top and side retention features 230 and 232 are illustrated engaging multiple memory PCBs 228. As can be appreciated, the support bracket 224 can be configured so that several individual top retention features 230 engage portions of the top of a memory PCB 228. Furthermore, separate top retention features 230 that are oriented on the bottom of a memory PCB 228 can further provide support to the memory PCB 228 while engaging only a localized portion of surface area of the length of the memory PCB 228. Meanwhile, a number of side retention features 232 can be included in the support bracket 224 to engage a localized portion of the side of the memory PCB 228 that is less than the overall surface area of a length of the memory PCB 228.
The configuration of the support bracket 224 with a series of alternating top and side retention features 230 and 232 can allow for absorption of turbulence and movement of the memory PCBs 228. Such energy absorption can provide a more secure data signal path from each memory PCB 228 to the controller PCB 222 through the connection assembly 226. That is, the electrical connection between each memory PCB 228 and the respective board edge connectors 234 can be reliably maintained despite motion, vibration, and abuse experienced.
In various embodiments, the support bracket 244 can be configured to affix to the connection assembly 248 so that the board edge connector 254 is positioned towards the memory PCB 246 while the flex circuit 256 remains external to the confines of the support bracket 244. Such external configuration can be further facilitated by the inclusion of an interposer shield 258 to the support bracket 244 that creates a barrier between the interposer and the board edge connectors 254 and memory PCB 246.
The shielding of the flex circuit 256 and the external interconnecting route can provide added magnetic and electrical shielding that corresponds with a more secure data signal pathway and higher efficiency data throughput. However, such external configuration is not limited or required, and can be modified or reversed so the flex circuit 256 is completely within the bounds of the support bracket 244 without deterring from the spirit of the present invention.
With one or more memory PCB being supported by the support bracket, the board edge connector does not require an expansive scope to provide support and maintain the memory PCB in a parallel relationship with respect to the controller PCB.
In some embodiments, the board edge connector 270 only extends to the areal extent of the connection region 274 without extending into the surface area of the memory PCB 276 that is available to support components such as memory and operational components. That is, when the board edge connector 270 engages the connection region 274, no portion of the surface area of the memory PCB 276 other than the connection region 274 is occupied. Therefore, the maximum amount of surface area on the memory PCB 276 is available to support greater amounts of memory and operational components.
While the board edge connector 270 can be sized to occupy only the connection region 274, a number of individual pin connections 280 can be present to provide a connection path for each memory IC present on the memory PCB 276 as well as a number of operational connections such as, but not limited to, power and ground pathways. As such, a reduction in size of the board edge connector 270 does not limit the operational capabilities of the connector. In fact, the board edge connector 270 can have multiple sets of connection pins that correspond to different and potentially independent memory ICs.
In the exemplary embodiments shown in
The exemplary embodiment of
Furthermore, the support bracket 296 can be oriented to support multiple flex circuits 304 so that the circuits can traverse from a memory PCB 292 to an interposer 306 with a predetermined shape. Such predetermined shape can have an absence of right angles and a minimum amount of bends to provide a high data transfer rate between the controller PCB 294 and the memory PCB 292. It should be noted that the position and orientation of the flex circuits can be different and have various unique features, such as angles and length.
The support bracket 310 can also provide support for a connection assembly with a cross-beam 316 that can engage a flex circuit, board edge connector, and controller PCB. The cross-beam can further include at least a lower section 318 that is adjacent the controller PCB and connects opposite sides of the support bracket 310. In some embodiments, the lower section 318 can be configured to provide an interposer region between the bracket 310 and the controller PCB that can shield the memory PCBs from the interposers.
While the support bracket 310 can provide a path for a flex circuit to connect the memory PCB to the controller PCB that is internal to the areal extent of the bracket 310, such configuration is not required or limited. For example, the cross-beam 316 can be oriented to support the connection assembly and provide an external pathway for a flex circuit. As such, a majority of a flex circuit can be shielded from the memory PCBs while providing a signal path capable of efficient data transfer rates. It can be appreciated that the support bracket 310 can be affixed to a controller PCB in a variety of manners. As shown, a positioning feature 320 can be present to provide a predetermined affixation site that can facilitate a variety of coupling means including, but not limited to, fasteners and epoxy.
Other advantages of the various embodiments presented herein will readily occur to the skilled artisan in view of the present disclosure. For example a variety of configurations of memory and controller PCBs can be constructed and controlled to efficiently manage data. Moreover, data storage devices can provide larger data capacities with improved data transfer rates with the use of more robust data signal pathways.
It is to be understood that even though numerous characteristics and advantages of various embodiments of the present invention have been set forth in the foregoing description, together with details of the structure and function of various embodiments of the invention, this detailed description is illustrative only, and changes may be made in detail, especially in matters of structure and arrangements of parts within the principles of the present invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
