Claims
- 1. A process for making polycarbosilane comprising reacting chloromethyltrichlorosilane with magnesium in a non cyclic aliphatic ether at temperatures from 20.degree. C. to reflux of said non cyclic aliphatic ether and reacting the polychlorocarbosilane with a reduction agent at -10.degree. C. to 25.degree. C.
- 2. A process of claim 1 wherein said non cyclic aliphatic ether is diethyl ether.
- 3. A process for making polycarbosilane comprising reacting chloromethyltrichlorosilane with magnesium in a cyclic aliphatic ether, excluding 1,4-dioxane, at temperatures from 20.degree. C. to 40.degree. C. and reacting the polychlorocarbosilane with a reduction agent at -10.degree. C. to 25.degree. C.
- 4. A process of claim 3 wherein said cyclic aliphatic ether is tetrahydrofuran.
- 5. A polycarbosilane prepared by a process comprising:
- (a) reacting chloromethyltrichlorosilane with magnesium in a non cyclic aliphatic ether at temperatures from 20.degree. C. to reflux of the non cyclic aliphatic ether to produce a polychlorocarbosilane; and
- (b) reacting the polychlorocarbosilane with a reduction agent at from bout -10.degree. C. to about 25.degree. C.
- 6. The polycarbosilane of claim 5 wherein the non cyclic aliphatic either is diethyl ether.
- 7. A polycarbosilane prepared by a process comprising:
- (a) reacting chloromethyltrichlorosilane with magnesium in a cyclic aliphatic ether, excluding 1,4-dioxane, at temperatures from 20.degree. C. to 40.degree. C. to produce a polychlorocarbosilane; and
- (b) reacting the polychlorocarbosilane with a reduction agent at from about -10.degree. C. to about 25.degree. C.
- 8. The polycarbosilane of claim 7 wherein the cyclic aliphatic ether is tetrahydrofuran.
- 9. A polycarbosilane of claim 5 or 7 which exhibits in its NMR spectrum 38-57% SiH.sub.3 groups, 28-43% SiH.sub.2 groups, and 7-19% SiH groups.
- 10. A polycarbosilane of claim 5 which cures at room temperature, with or without the need of oxygen, allowing retention of shape upon firing to 1000.degree. C.
- 11. A polycarbosilane of claim 7 which slowly air cures at temperatures 20.degree. C. or above which can be used in molding applications.
- 12. The polycarbosilane of claim 5 or 7 wherein the reaction with the reduction agent is carried out at about 0.degree. C.
- 13. The polycarbosilane of the formula [H.sub.2 SiCH.sub.2 ]n wherein n is 3 to 11.
Parent Case Info
This application is a division of application Ser. No. 07/751,520 filed Aug. 29, 1991, now U.S. Pat. No. 5,202,405, which is a continuation-in-part of U.S. Ser. No. 07/573,419 filed Aug. 27, 1990, abandoned.
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
4472591 |
Schilling, Jr. et al. |
Sep 1984 |
|
4631179 |
Smith, Jr. |
Dec 1986 |
|
4761458 |
Burns et al. |
Aug 1988 |
|
5004610 |
Osborne et al. |
Apr 1991 |
|
5202405 |
Michalczyk |
Apr 1993 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
139257 |
May 1985 |
EPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
751520 |
Aug 1991 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
573419 |
Aug 1990 |
|