Patent Application
20110266641
The present invention relates to a silicon condenser microphone and a method of fabricating the same, and more particularly, to a silicon condenser microphone having an additional back chamber and a method of fabricating the same.
Generally, a condenser microphone widely used in mobile communication terminals or mobile audio devices includes a voltage bias component, a pair of diaphragm/back plate for forming a capacitance C that changes in correspondence with sound pressures, and a field effect transistor (JFET) for buffering output signals. Such is a traditional type condenser microphone is completely formed as a single assembly by inserting a diaphragm, a spacer ring, an insulation ring, a back plate, and an electric current application ring into a single case in the stated order, inserting a PCB, on which circuit devices are mounted, into the case, and bending an end of the case toward the PCB.
Recently, a semiconductor fabrication technique using micromachining methods has been used for improving the integration of fine devices. By using this technique, a so-called micro electro mechanical system (MEMS), μm-sized ultra-small sensors, actuators, and electro-mechanical structures may be fabricated by using micromachining methods, and more particularly, integrated circuit methods, in a semiconductor fabrication process. In a MEMS chip microphone fabricated by using such micromachining methods, traditional microphone components, such as a diaphragm, a spacer ring, an insulation ring, a back plate, and an electric current application ring may be miniaturized, multi-functionalized, and densely integrated via ultra-high precision fabrication methods for improved stability and reliability.
As shown in
The present invention provides a silicon condenser microphone having an additional back chamber and a method of fabricating the same.
According to an aspect of the present invention, there is provided a method of fabricating a silicon condenser microphone having an additional back chamber, the method including applying an adhesive on a substrate and mounting a chamber container thereon by using a mounter; curing the adhesive holding the chamber container; applying an adhesive on the chamber container and mounting a micro electro mechanical system (MEMS) chip thereon by using a mounter; curing the adhesive holding the MEMS chip; and attaching the substrate on which devices are mounted to a case, wherein a back chamber formed by the chamber container is added to a back chamber of the MEMS chip.
The substrate is a printed circuit board (PCB), a glass substrate, a ceramic substrate, a plastic-based substrate, or a resin substrate. The adhesive is any one of a non-conductive adhesive and a conductive adhesive. The adhesive is any one of a silicon-based adhesive, an epoxy-based adhesive, and a metal solder.
The chamber container has a cuboidal shape or a cylindrical shape with one opne surface, and wherein a penetration hole is formed in a surface opposite to the open surface. A wing may be formed at the open surface of the chamber container.
According to another aspect of the present invention, there is provided a silicon condenser microphone having an additional back chamber, the silicon condenser microphone including a substrate; a chamber container, which has a cuboidal shape or a cylindrical shape with one open surface, forms an additional back chamber space as the open surface is adhered to the substrate via an adhesive, and has a penetration hole formed in a surface opposite to the open surface; a MEMS chip, which is attached to the surface of the chamber container opposite to the open surface and converts externally introduced sound pressures to electric signals; an application specific integrated circuit (ASIC) chip, which is mounted on the substrate, supplies power to the MEMS chip, amplifies electric signals from the MEMS chip, and outputs the amplified signals via a connection terminal of the substrate; and a case, which has a cylindrical shape with one open surface, forms a space for accommodating the chamber container, the MEMS chip, and the ASIC chip as the open surface is attached to the substrate, and shields external noise.
Sound holes are formed in one of or both of the substrate and the case. The chamber container has a cuboidal shape or a cylindrical shape, and wherein a wing is formed outwardly on the open surface.
A silicon condenser microphone fabricated according to the present invention can have improved sensitivity by increasing the small back chamber space of the MEMS chip itself and reduced noise including THD (Total Harmonic Distortion).
The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein.
As shown in
As shown in
The chamber container 104 is provided to improve the sensitivity of the silicon condenser microphone 100 by increasing the small back chamber 15 space of the MEMS chip itself and reduce noise including total harmonic distortion (THD) and has a cuboidal or cylindrical shape with one open surface. A penetration hole 104a for connecting the back chamber 15 to the additional back chamber 104c is formed in a surface opposite to the open surface. Furthermore, although not shown, an electric wiring is formed in the chamber container 104 for transmitting electric signals from the MEMS chip 10 to the ASIC chip 20. Therefore, the increased back chamber space, which is formed by adding the additional back chamber 104c to the back chamber 15 of the MEMS chip 10, may improve the low sensitivity due to a deteriorated vibrating force of a diaphragm caused by air resistance that is formed by a significant back stream due to insufficient back chamber space of the MEMS chip 10.
The MEMS chip 10 is adhered onto the chamber container 104 by using the adhesive 108, the ASIC chip 20 is mounted on the PCB 102, and the case 106 is adhered to the PCB 102 by using the adhesive 110. Accordingly, the assembly of the silicon condenser microphone is completed.
The case 106 has a cylindrical shape, which has an inner space for accommodating components and one open surface. A sound hole 106a for introducing external sounds is formed in a surface opposite to the open surface, and the case 106 is attached to the PCB 102 by aligning the case 106 formed of a metal material to a conductive pattern formed on the PCB 102 and welding the case 106 to the PCB 102 or adhering the case 106 to the PCB 102 by using the adhesive 110, such as an epoxy.
As shown in
A silicon condenser microphone of any of various shapes may be fabricated by attaching the case 106 of any of various shapes onto the PCB 102, on which the MEMS chip 10 having the additional back chamber 104c formed by the chamber container 104 and the ASIC chip 20 are mounted.
Referring to
A silicon condenser microphone of any of various shapes may be fabricated by attaching the case 106 of any of various shapes onto the PCB 102, on which the MEMS chip 10 having the additional back chamber 104c formed by the chamber container 104 with the wing and the ASIC chip 20 are mounted.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
A silicon condenser microphone fabricated according to the present invention can have improved sensitivity by increasing the small back chamber space of the MEMS chip itself and reduced noise including THD (Total Harmonic Distortion). Thus, the silicon condenser microphone may be highly industrially applicable.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2009-0099222 | Oct 2009 | KR | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/KR2010/000873 | 2/11/2010 | WO | 00 | 7/7/2011 |
