Patent Grant
9804426
The present disclosure relates to the field of optical interconnection, and in particular, to a silicon-germanium electro-absorption modulator.
As a conventional material in the microelectronics field, a silicon material has absolute advantages for a processing technology and manufacturing costs. However, a conventional interconnection solution based on a metallic wire and a dielectric is limited by a delay, power consumption, bandwidth, and the like, and it is difficult to meet a global requirement of a future many-core system on chip. Compared with electrical interconnection, optical interconnection has advantages such as high bandwidth, low power consumption, and a short delay, and is expected to comprehensively resolve a current problem faced by the electrical interconnection. In recent years, silicon-based optical interconnection has received extensive attention from researchers, and develops rapidly. A silicon-based modulator is one of basic components in a silicon-based optical interconnection technology, and is an important research topic in recent years. Common silicon-based modulators include a modulator based on a free-carrier dispersion effect and a modulator based on electro-absorption.
The modulator based on the free-carrier dispersion effect means that a voltage is applied to a silicon modulation area to cause a distribution change of carriers inside silicon. Due to the free-carrier dispersion effect, a refractive index of light in the silicon also changes, such that an optical signal is modulated. Currently, the modulator based on the free-carrier dispersion effect mainly falls into two types: a silicon Mach-Zehnder interferometer (MZI) modulator, which has advantages such as a higher modulation rate and higher optical bandwidth and disadvantages such as a large size, large power consumption, and a required traveling wave; and a silicon microring modulator, which has advantages such as a small size and a high modulation rate and disadvantages such as extremely sensitivity to temperature, low modulation bandwidth, a small technology tolerance, and poor applicability.
The modulator based on electro-absorption refers to an optical signal modulation component that is manufactured using an electro-optic effect (Franz-Keldysh effect) in a semiconductor, which has advantages such as high modulation bandwidth, low power consumption, practical optical bandwidth, and an acceptable extinction ratio. However, because silicon has a poor electro-optic effect, a second material needs to be introduced and doped into silicon for improvement. A germanium material has a significant electro-optic effect in a C band (1550 nm), and is fully compatible with a conventional complementary metal-oxide-semiconductor (CMOS) technology. Therefore, one promising alternative solution is to use germanium as the second material to manufacture a germanium or silicon-germanium electro-absorption modulator.
The germanium or silicon-germanium modulator has advantages such as a small size, low power consumption, and a high modulation rate. A main topic of this type of modulator is coupling between a germanium or silicon-germanium modulation area and a silicon-based waveguide. Currently, there are mainly two coupling manners. One manner is that the germanium or silicon-germanium modulation area is directly coupled to the silicon-based waveguide by means of alignment. However, because silicon and germanium have different refractive indexes, the manner of direct coupling by means of alignment has end surface reflection, which causes a coupling loss. Further, in a current manufacturing method, a PIN junction is manufactured on the germanium modulation area, which causes light absorption in a doping area, and causes an absorption loss. In addition, the manner of direct coupling by means of alignment has a complex manufacturing technology, and is difficult to implement. The other manner is to perform coupling using an evanescent wave. This type of coupling structure includes a structure of a horizontal PIN junction proposed by the IME in Singapore and a structure of a vertical PIN junction proposed by the Institute of Semiconductors, Chinese Academy of Sciences. For the structure of the horizontal PIN junction proposed by the IME, because a propagation length required for mode field stability is not considered, a propagation loss is large; and because the PIN junction is manufactured on the germanium modulation area, an absorption loss exists. The structure of the vertical PIN junction proposed by the Institute of Semiconductors, Chinese Academy of Sciences has a complex manufacturing technology, and requires technologies such as multiple times of growing, etching, and doping. In addition, to easily manufacture a structure of n++ Si, the silicon-germanium modulation area is wide, and the modulation area has multiple modes, which affects a communication capacity and a transmission distance.
In view of this, an objective of the present disclosure is to provide a silicon-germanium electro-absorption modulator. A modulation layer is grown by means of selective epitaxy, and a structure design of a parallel connection between the modulation layer and a PIN junction is used, such that a technological process is simplified and manufacturing difficulty is reduced. The electro-absorption modulator has advantages such as a small size, high 3 dB bandwidth, low power consumption, and a small insertion loss.
According to a first aspect, an electro-absorption modulator is provided, including:
a substrate layer, including a silicon substrate and an oxide layer disposed on the silicon substrate;
top-layer silicon, disposed on the oxide layer, where a waveguide layer is formed on the top-layer silicon;
a doping layer, formed on the top-layer silicon, where the doping layer includes a first doping panel and a second doping panel, a first-type light doping area is formed on the first doping panel, a second-type light doping area is formed on the second doping panel, the first-type light doping area and the second-type light doping area are located on two sides of the waveguide layer and closely abut against the waveguide layer, and the first-type light doping area, the waveguide layer, and the second-type light doping area form a PIN junction; and
a modulation layer, disposed on the waveguide layer and connected in parallel to the PIN junction, where
a beam with a specific wavelength propagates along the waveguide layer, enters a modulation area formed by the modulation layer and the waveguide layer, and then propagates between the modulation layer and the waveguide layer in an oscillation manner; and when a modulating electrical signal is reversely applied to the first-type light doping area and the second-type light doping area, a light absorption coefficient of the modulation layer for the beam changes with the modulating electrical signal, and after the beam passes through the modulation area, optical power of the beam also correspondingly changes, such that electro-optic modulation is implemented for the beam.
In a first possible implementation manner of the first aspect, a silicon dioxide layer is grown and formed on the waveguide layer and the doping layer, a selective epitaxial area is obtained by etching on the silicon dioxide layer, the selective epitaxial area is used to grow the modulation layer, an opening width of the selective epitaxial area in a first direction is selected, and a thickness and a shape of the grown modulation layer is controlled, such that a size of the modulation layer meets a mode matching requirement required when the beam propagates at the waveguide layer and the modulation layer.
With reference to the first possible implementation manner of the first aspect, in a second possible implementation manner, a length of the selective epitaxial area in a second direction is a length of the grown modulation layer; and when the beam propagates in the modulation area, the optical power is oscillated between the modulation layer and the waveguide layer in an oscillation period of λ/(n1eff−n2eff), and the length of the modulation layer is an integer multiple of the oscillation period, where λ is the wavelength of the beam, n1eff is an effective refractive index of the beam at the modulation layer, and n2eff is an effective refractive index of the beam at the waveguide layer.
With reference to the second possible implementation manner of the first aspect, in a third possible implementation manner, the first direction is a direction in which the modulating electrical signal is applied, the second direction is a direction in which the beam propagates, and the first direction is perpendicular to the second direction.
In a fourth possible implementation manner of the first aspect, the doping layer further includes:
a first-type heavy doping area, formed on the first doping panel, where the first-type light doping area is located between the first-type heavy doping area and the waveguide layer, and a doping density of the first-type heavy doping area is greater than a doping density of the first-type light doping area; and
a second-type heavy doping area, formed on the second doping panel, where the second-type light doping area is located between the second-type heavy doping area and the waveguide layer, and a doping density of the second-type heavy doping area is greater than the doping density of the second-type light doping area.
With reference to the fourth possible implementation manner of the first aspect, in a fifth possible implementation manner, when the first-type is N-type, and the second-type is P-type, that a modulating electrical signal is reversely applied to the first-type light doping area and the second-type light doping area is that a positive electrode of the modulating electrical signal is electrically connected to the first-type light doping area, and a negative electrode of the modulating electrical signal is electrically connected to the second-type light doping area; or
when the first-type is P-type, and the second-type is N-type, that a modulating electrical signal is reversely applied to the first-type light doping area and the second-type light doping area is that a negative electrode of the modulating electrical signal is connected to the first-type light doping area, and a positive electrode of the modulating electrical signal is connected to the second-type light doping area.
With reference to the fourth possible implementation manner of the first aspect, in a sixth possible implementation manner, the electro-absorption modulator further includes:
a metal layer, including a first metal electrode layer and a second metal electrode layer, where the first metal electrode layer is formed on the first-type heavy doping area, and the second metal electrode layer is formed on the second-type heavy doping area.
With reference to the sixth possible implementation manner of the first aspect, in a seventh possible implementation manner, the electro-absorption modulator further includes:
a cover layer, formed on the top-layer silicon and covering the top-layer silicon, the doping layer, the waveguide layer, and the modulation layer.
With reference to the seventh possible implementation manner of the first aspect, in an eighth possible implementation manner, a first via and a second via are disposed on the cover layer, the first via is communicated with the first metal electrode layer, and the second via is communicated with the second metal electrode layer, such that the modulating electrical signal is applied to the first metal electrode layer and the second metal electrode layer through the first via and the second via.
In a ninth possible implementation manner of the first aspect, the waveguide layer is a ridge waveguide, and the waveguide layer is made of silicon.
In a tenth possible implementation manner of the first aspect, the modulation layer is made by mixing germanium with silicon according to a pre-determined proportion.
In an eleventh possible implementation manner of the first aspect, the electro-absorption modulator further includes:
a modulation buffer layer, disposed between the waveguide layer and the modulation layer.
In a twelfth possible implementation manner of the first aspect, a built-in electric field caused by the PIN junction exists in the modulation area, and when a modulating electrical signal is reversely applied to the PIN junction, the built-in electric field at the modulation layer changes with the modulating electrical signal, where when the modulating electrical signal is strengthened, the built-in electric field is increased, and the modulation layer absorbs more light of the light wave; or when the modulating electrical signal is weakened, the built-in electric field is decreased, and the modulation layer absorbs less light of the light wave.
According to the electro-absorption modulator provided in the present disclosure, a horizontal PIN junction is formed by design; a selective epitaxial area is obtained by means of etching, to grow a modulation layer; and a length and a thickness of the modulation layer are determined by the selective epitaxial area, such that the length and a width of the modulation layer meet two waveguide modes: a horizontal single mode and a vertical single mode. The modulation layer is connected in parallel to the PIN junction, and when a modulating electrical signal is reversely applied to the PIN junction, a built-in electric field determined by the modulating electrical signal exists at the modulation layer. Due to a Franz-Keldysh effect, a light absorption coefficient of the modulation layer for an incident beam changes with the built-in electric field, such that electro-optic modulation is implemented for the incident beam. The electro-absorption modulator provided in the present disclosure has advantages such as a simple technological process, low manufacturing difficulty, a small size, high 3 dB bandwidth, low power consumption, and a small insertion loss.
To describe the technical solutions in the present disclosure more clearly, the following briefly introduces the accompanying drawings required for describing the implementation manners. Apparently, the accompanying drawings in the following description show merely some implementation manners of the present disclosure, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.
The following clearly and describes the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are merely some but not all of the embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.
Referring to
In this embodiment of the present disclosure, the substrate layer 110 includes a silicon substrate 112 and an oxide layer 114. The oxide layer 114 is formed on the silicon substrate 112, the silicon substrate 112 may be made of silicon, and the oxide layer 114 may be made of silicon dioxide. The top-layer silicon 120 is disposed on the oxide layer 114, such that the silicon substrate 112, the oxide layer 114, and the top-layer silicon 120 form silicon on insulator (SOI).
In this embodiment of the present disclosure, the waveguide layer 122 and the doping layer may be obtained by performing etching and doping on the top-layer silicon 120. The waveguide layer 122 may be a ridge waveguide. Preferably, the waveguide layer 122 meets a single mode condition. The first doping panel 132 and the second doping panel 133 of the doping layer are respectively located on the two sides of the waveguide layer 122, and closely abut against the waveguide layer 122. Preferably, tops of the waveguide layer 122, the first doping panel 132, and the second doping panel 133 maintain parallel and are on a same horizontal plane.
In this embodiment of the present disclosure, a first light ion implantation area may be formed on the first doped panel 132 using a photoetching method, and a second light ion implantation area may be formed on the second doping panel 133 using a photoetching method. The first light ion implantation area and the second light ion implantation area are located on the two sides of the waveguide layer 122, and closely abut against the waveguide layer 122. N-type ions such as a phosphorus ion and an arsenic ion are implanted into the first light ion implantation area, to form a first-type light doping area 134. P-type ions such as a boron ion and a gallium ion are implanted into the second light ion implantation area, to form a second-type light doping area 135. In this case, the first-type is N-type, and the second-type is P-type. An ion implantation concentration may be selected according to an actual requirement, for example, an implantation concentration of 4×1017/cm3 may be selected. The first-type light doping area 134, the waveguide layer 122, and the second-type light doping area 135 form a PIN junction. A first space charge area is formed on an intersection surface of the waveguide layer 122 and the first-type light doping area 134. The first space charge area includes a free electron. A second space charge area is formed on an intersection surface of the waveguide layer 122 and the second-type light doping area 135. The second space charge area includes a free electron hole. A built-in electric field is formed between the first space charge area and the second space charge area. A power line direction of the built-in electric field starts from the second-type light doping area 135, and points to the first-type light doping area 134, and passes through the waveguide layer 122. It can be understood that, in another embodiment of the present disclosure, P-type ions may be implanted into the first light ion implantation area, to form the first-type light doping area 134, and N-type ions may be implanted into the second light ion implantation area, to form the second-type light doping area 135. In this case, the first-type is P-type, and the second-type is N-type. A power line direction of the built-in electric field starts from the first-type light doping area 134, and points to the second-type light doping area 135, and passes through the waveguide layer 122.
In this embodiment of the present disclosure, using a photoetching method at the doping layer, a first heavy ion implantation area may be further formed on the first doping panel 132, and a second heavy ion implantation area may be further formed on the second doping panel 133. Ions (for example, the same N-type ions or the same P-type ions) of a same type as those implanted into the first-type light doping area 134 are implanted into the first heavy ion implantation area, to form a first-type heavy doping area 136. The first-type light doping area 134 is located between the first-type heavy doping area 136 and the waveguide layer 122. Ions (for example, the same P-type ions or the same N-type ions) of a same type as those implanted into the second-type light doping area 135 are implanted into the second heavy ion implantation area, to form a second-type heavy doping area 137. The second-type light doping area 135 is located between the second-type heavy doping area 137 and the waveguide layer 122. Ion implantation concentrations of the first-type heavy doping area 136 and the second-type heavy doping area 137 may be selected according to an actual requirement, for example, may be 1×1020/cm3. Due to an ion diffusion effect, the ions in the first-type heavy doping area 136 diffuse to the first-type light doping area 134, and the ions in the second-type heavy doping area 137 diffuse to the second-type light doping area 135. Therefore, two overlapping areas are generated in diffusion areas. An ion concentration of the overlapping area is between 4×1017/cm3 and 1×1020/cm3, and descends in a direction from the first-type heavy doping area to the first-type light doping area or in a direction from the second-type heavy doping area to the second-type light doping area. The first-type heavy doping area 136 and the second-type heavy doping area 137 are used to apply a modulating electrical signal, such that the modulating electrical signal is applied to the first-type light doping area 134 and the second-type light doping area 135. In addition, because the first-type heavy doping area 136 and the second-type heavy doping area 137 are far from the modulation layer 140, a loss generated when the first-type heavy doping area 136 and the second-type heavy doping area 137 absorb the incident beam may be ignored.
It should be noted that, in this embodiment of the present disclosure, the electro-absorption modulator 100 further includes a metal layer. The metal layer includes a first metal electrode layer 138 and a second metal electrode layer 139. The first metal electrode layer 138 is formed on the first-type heavy doping area 136, and the second metal electrode layer 139 is formed on the second-type heavy doping area 137. A positive electrode and a negative electrode of the modulating electrical signal are electrically connected to the first metal electrode layer 138 and the second metal electrode layer 139, to apply the modulating electrical signal to the first-type heavy doping area 136 and the second-type heavy doping area 137, which reduces contact resistance during applying.
Referring to
In this embodiment of the present disclosure, a silicon dioxide layer may be grown on the waveguide layer 122 and the doping layer using a plasma enhanced chemical vapor deposition (PECVD) method, and a selective epitaxial area is obtained by etching on the silicon dioxide layer using a photoetching method. Preferably, a length of the selective epitaxial area in the y direction is equal to a length of the doping layer in the y direction. Next, an opening width w of the selective epitaxial area in the x direction is selected. During growth of the modulation layer 140, because a horizontal growth speed and a vertical growth speed are different, a crystal surface {311} is formed on a side surface of the modulation layer 140, and the grown modulation layer 140 is not a cuboid. A shape of the modulation layer 140 is determined by the opening width w.
It should be noted that, the electro-absorption modulator 140 further includes a modulation buffer layer 150. In a growth process of the modulation layer 140, during transition from silicon to silicon-germanium, a silicon-germanium concentration needs to be gradually increased, to prevent dislocation due to different material crystal lattice constants. The modulation buffer layer 150 is grown when the material concentration is gradually increased. The modulation buffer layer 150 may be used to reduce dislocation of the subsequently grown modulation layer 140.
It should be noted that, in this embodiment of the present disclosure, the electro-absorption modulator 100 further includes a cover layer 160. The cover layer 160 may be silicon dioxide, and covers the top-layer silicon 120, the doping layer, the waveguide layer 122, and the modulation layer 140 using a deposition method, to protect the electro-absorption modulator 100 from pollution of an external object, damage of an external force, or the like. A first via and a second via are further disposed on the cover layer 160, the first via is communicated with the first metal electrode layer 138, and the second via is communicated with the second metal electrode layer 139, such that the modulating electrical signal is applied to the first metal electrode layer 138 and the second metal electrode layer 139 through the first via and the second via. It should be noted that, because light intensity in areas on two sides of the modulation layer 140 is weak, in a preferred solution, the first via and the second via should be disposed in the areas on the two sides of the modulation layer 140, to ensure small metal-induced light absorption.
The following describes a modulation principle and a modulation process of the electro-absorption modulator 100 provided in this embodiment of the present disclosure.
Referring to
In this embodiment of the present disclosure, when incident light with a specific wavelength (for example, around a wavelength of 1550 nm) is incident into the waveguide layer 122 in they direction, and enters the modulation area formed by the waveguide layer 122 and the modulation layer 140, the incident beam propagates between the waveguide layer 122 and the modulation layer 140 in the oscillation manner. After a modulating electrical signal is reversely applied to the first metal electrode layer 138 and the second metal electrode layer 139, due to the Franz-Keldysh effect, a light absorption coefficient of the modulation layer 140 for the beam propagating at the modulation layer 140 is increased. The incident beam is absorbed each time the incident beam enters the modulation layer 140, such that optical power is decreased. A degree to which the optical power of the incident light is decreased is related to field strength of the modulating electrical signal. When the modulating electrical signal is at a low level V1, the light absorption coefficient of the modulation layer 140 for the incident light is small, and most of the incident light is not absorbed, and continues to propagate at the waveguide layer 122 in the y direction after passing through the modulation area. In this case, the electro-absorption modulator 100 is in an “on” state. When the modulating electrical signal is at a high level V2, the light absorption coefficient of the modulation layer 140 for the incident light is large, and most of the incident beam is absorbed by the modulation layer 140. In this case, the electro-absorption modulator 100 is in an “off” state. According to a level change of the input modulating electrical signal, the light absorption coefficient of the modulation layer 140 correspondingly changes, and output optical power correspondingly changes, such that electro-optic modulation is implemented.
It should be noted that, in this embodiment of the present disclosure, when the incident beam propagates in the modulation area in which the modulation layer 140 and the waveguide layer 122 are located, there are two conduction modes (that is, a conduction mode at the modulation layer 140 and a conduction mode at the waveguide layer 122). Due to interference between the two conduction modes, the optical power of the incident beam is oscillated between the modulation layer 140 and the waveguide layer 122 under the modulation layer 140. An oscillation period T is equal to λ/(n1eff−n2eff), where λ is the wavelength of the beam, n1eff is an effective refractive index of the beam at the modulation layer 140, and n2eff is an effective refractive index of the beam at the waveguide layer 122. To ensure a small insertion loss in an “on” state, the length of the modulation layer 140 in the y direction should be an integer multiple of the oscillation period T, such that the incident beam is right routed to the waveguide layer 122 after leaving the modulation area. When the length of the modulation layer 140 in the y direction is not an integer multiple of the oscillation period T, if the incident beam is coupled to the modulation layer 140 in the oscillation manner after leaving the modulation area, the beam is scattered regardless of an “on” state or an “off” state. Consequently, there is an extremely large insertion loss, an extinction ratio is even close to zero, and electro-optic modulation cannot be implemented.
Referring to
In conclusion, according to the electro-absorption modulator provided in this embodiment of the present disclosure, a horizontal PIN junction is formed by design; the selective epitaxial area is obtained by means of etching, to grow a modulation layer 140; and a length and a thickness of the modulation layer 140 are determined by the selective epitaxial area, such that the length and a width of the modulation layer 140 meet two waveguide modes: a horizontal single mode and a vertical single mode. The modulation layer 140 is connected in parallel to the PIN junction, and when a modulating electrical signal is reversely applied to the PIN junction, a built-in electric field determined by the modulating electrical signal exists at the modulation layer 140. Due to a Franz-Keldysh effect, a light absorption coefficient of the modulation layer 140 for an incident beam changes with the built-in electric field, such that electro-optic modulation is implemented for the incident beam. The electro-absorption modulator 100 provided in the present disclosure has advantages such as a simple technological process, low manufacturing difficulty, a small size, high 3 dB bandwidth, low power consumption, and a small insertion loss.
The foregoing descriptions are exemplary implementation manners of the present disclosure. It should be noted that a person of ordinary skill in the art may make certain improvements and polishing without departing from the principle of the present disclosure and the improvements and polishing shall fall within the protection scope of the present disclosure.
This application is a continuation of International Application No. PCT/CN2014/083472, filed on Jul. 31, 2014, the disclosure of which is hereby incorporated by reference in its entirety.
| Number | Name | Date | Kind |
|---|---|---|---|
| 20070116398 | Pan et al. | May 2007 | A1 |
| 20120003767 | Fujikata et al. | Jan 2012 | A1 |
| 20120057815 | Ezaki et al. | Mar 2012 | A1 |
| 20120177318 | Zheng et al. | Jul 2012 | A1 |
| 20150316793 | Ayazi | Nov 2015 | A1 |
| 20160313577 | Sun | Oct 2016 | A1 |
| 20170168326 | Ogawa | Jun 2017 | A1 |
| 20170184883 | Sun | Jun 2017 | A1 |
| Number | Date | Country |
|---|---|---|
| 101222121 | Jul 2008 | CN |
| 101939689 | Jan 2011 | CN |
| 102067284 | May 2011 | CN |
| 103094835 | May 2013 | CN |
| Entry |
|---|
| Li Ya-Ming, et al., “Design of an evanescent-coupled GeSi electro-absorption modulator based on Franz-Keldysh effect,” Acta Phys. Sin., vol. 62, No. 11 (2013), 1Chinese Physical Society, http://wulixb.iphy.ac.cn, 17 pages. |
| Number | Date | Country | |
|---|---|---|---|
| 20170139239 A1 | May 2017 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2014/083472 | Jul 2014 | US |
| Child | 15417822 | US |
