Claims
- 1. A method comprising:depositing a layer of silicon nitride on each of two faces of a first silicon substrate; etching a cavity through the first silicon substrate and one of the silicon nitride layers to form a transmission window comprising silicon nitride; forming a hole in a second silicon substrate; depositing leads on either side of the hole; positioning a filament comprising tungsten and having a spiral geometry across said hole; connecting each of two ends of the filament to an associated one of the leads; depositing a reflective film on one face of a third silicon substrate; stacking the first, second, and third silicon substrates, in that order, and orienting said substrates such that the transmission window is positioned over the filament and the reflective film faces the filament; and bonding the first, second, and third silicon substrates together.
- 2. The method of claim 1, further comprising:depositing a bonding ring on a face of the first silicon substrate opposite the transmission window; depositing a bonding ring on each of two faces of the second silicon substrate; and depositing a bonding ring on the reflective film of the third silicon substrate.
- 3. The method of claim 2, further comprising providing an insulating layer between the leads on the second silicon substrate and the bonding ring on that face of said second substrate.
- 4. The method of claim 1, wherein the silicon nitride layers on the first silicon substrate are about 1000 Å thick.
- 5. The method of claim 1, further comprising depositing a 1000 Å layer of silicon nitride on each of two faces of the second silicon substrate.
- 6. The method of claim 1, wherein the filament has a thickness of at least about 10 μm.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional of U.S. application Ser. No. 09/613,818, filed Jul. 10, 2000, (abandoned) which claims priority to U.S. provisional applications serial No. 60/142,989, filed Jul. 8, 1999, and serial No. 60/190,702, filed Mar. 17, 2000.
ORIGIN OF INVENTION
The invention described herein was made in the performance of work under a NASA contract, and is subject to the provisions of Public Law 96-517 (35 U.S.C. 202) in which the Contractor has elected to retain title.
US Referenced Citations (15)
Provisional Applications (2)
|
Number |
Date |
Country |
|
60/190702 |
Mar 2000 |
US |
|
60/142989 |
Jul 1999 |
US |