Claims
- 1. A silicone composition for preparing a cured silicone product, the composition prepared by mixing:
(A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, wherein the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition.
- 2. The silicone composition according to claim 1, wherein the organopolysiloxane has the formula R2R12SiO(R1R2SiO)m(R1R2SiO)nSiR12R2 wherein each R1 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups; each R2 is independently an epoxy-functional organic group or R1; m is 0 or a positive integer; n is 0 or a positive integer; the sum of m and n is such that the organopolysiloxane has a viscosity of from 0.05 to 200 Pa·s at 25° C.; and the organopolysiloxane contains an average of at least two epoxy-functional organic groups per molecule.
- 3. The silicone composition according to claim 1, wherein the filler comprises particles consisting of silver, gold, platinum, palladium, or alloys thereof.
- 4. The silicone composition according to claim 1, wherein the filler comprises particles consisting of silver.
- 5. The silicone composition according to claim 1, wherein the filler has a concentration from about 20 to about 50 percent by volume, based on the total volume of the composition.
- 6. The silicone composition according to claim 1, wherein the composition cures at a temperature of from about room temperature to about 150° C.
- 7. The silicone composition according to claim 1, wherein the hydroxy-functional organic compound has a normal boiling point greater than the cure temperature of the composition.
- 8. The silicone composition according to claim 1, wherein the hydroxy-functional organic compound is selected from at least one monohydric alcohol, at least one dihydric alcohol, at least one polyhydric alcohol, at least one phenol, at least one sugar, at least one hydroxy aldehyde, at least one hydroxy ketone, at least one hydroxy acid, at least one hydroxy ester, and a mixture comprising at least two of the aforementioned compounds.
- 9. The silicone composition according to claim 1, wherein the hydroxy-functional organic compound is selected from at least one monohydric alcohol, at least one dihydric alcohol, at least one polyhydric alcohol, and a mixture comprising at least two of the aforementioned compounds.
- 10. The silicone composition according to claim 1, wherein the concentration of component (D) is from 0.5 to 1.5 percent by weight, based on the total weight of the composition.
- 11. The silicone composition according to claim 1, further comprising a solvent having a normal boiling point greater than the cure temperature of the composition.
- 12. A cured silicone product comprising a reaction product of the composition of claim 1.
- 14. The composition of claim 1, further comprising an accelerator.
- 15. The composition of claim 14, wherein the accelerator comprises a tertiary amine.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of U.S. patent application Ser. No. 09/633,997 filed on Aug. 8, 2000, now allowed. This application claims priority under 35 U.S.C. 120 to U.S. patent application Ser. No. 09/633,997.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09633997 |
Aug 2000 |
US |
Child |
10226396 |
Aug 2002 |
US |