Claims
- 1. A silicone-containing resin comprising:a) a polyolefin selected from (i) an unfunctionalized polyolefin homopolymer or copolymer of unsaturated hydrocarbons having 2-20 carbon atoms or mixtures thereof or from (ii) a functionalized polyolefin selected from a direct copolymer of ethylene and a polar monomer or from (iii) an ionomeric copolymer or blends thereof or from (iv) a graft copolymer or blends of graft copolymers or mixture of (i), (ii), (iii) or (iv), b) a dimethyl polysiloxane having functional end-groups, c) a vinyl silane compound, and d) an ultra-high molecular weight silicone polymer having a number average molecular weight range from about 350,000 to 1 million wherein components b) and d) are different from each other.
- 2. The resin of claim 1 further comprising:e) organic peroxide grafting agent to graft a portion of the vinyl silane onto the polyolefin; and f) organo-metallic moisture curing agent.
- 3. The resin of claim 1 or 2 wherein the polyolefin is a homopolymer of ethylene or propylene or copolymer of ethylene with alpha-olefin hydrocarbons having 3-10 carbon atoms or mixture thereof.
- 4. The resin of claim 3 wherein the polyolefin is a copolymer of ethylene with a hydrocarbon alpha-olefin having from 4-8 carbon atoms and a density of about 0.850 to about 0.970 grams per cubic centimeter (g/cm3).
- 5. The resin of claim 4 wherein the polyolefin has a density of 0.920 to 0.930 g/cm3.
- 6. The resin of claim 2 wherein the polyolefin has a melt index (MI) of 0.05 to 120 dg/min (as measured per ASTM D-1238, condition E).
- 7. The resin of claim 6 wherein the polyolefin has an MI of 1 to 10 dg/min.
- 8. The resin of claim 2 wherein:the polysiloxane has the formula, where Me=methyl and n is the range of 200 to 2,300, the vinyl silane is one selected from the group consisting of vinyl trimethoxy silane, vinyl triethoxy silane, vinyl triacetoxy silane, trisbutanoxime vinyl silane, divinyl tetramethoxy disiloxane, and hexamethyl bisdimethylaminoxy cyclotetrasiloxane and mixtures thereof, the ultra-high molecular weight silicone polymer has a viscosity in the range of about 10 million to about 50 million centistokes, the organic peroxide is selected from the group consisting of ditertiary alkyl peroxides, peroxyesters, peroxydicarbonates, acylperoxides, and acetylenic diperoxy compounds, and the moisture curing agent is an organo-tin or organo-titanium compound.
- 9. The resin of claim 2 comprising, based on total weight of polymer components:a) about 85 to about 98.89% polyolefin homo or copolymer, b) about 1 to about 10% dimethyl polysiloxane having functional end groups, c) about 0.01 to about 1.0% vinyl silane compound, and d) about 0.1 to about 5% ultra-high molecular weight silicone polymer, plus e) about 1 to about 100 parts per million of organic peroxide grafting agent, and f) about 1 to about 100 parts per million of organo-metallic moisture curing agent.
- 10. The resin of claim 9 comprising, based on total weight of polymer components:a) about 91.0 to about 95.9 % polyolefin homo or copolymer, b) about 3 to about 7 % dimethyl polysiloxane having functional end groups, c) about 0.01 to about 0.5 % vinyl silane compound, and d) about 0.25 to about 3 % ultra-high molecular weight silicone polymer, plus e) about 5 to about 75 parts per million of organic peroxide grafting agent, and f) about 3 to about 50 parts per million of organo-metallic moisture curing agent.
- 11. The resin of claim 8 wherein the vinyl silane is present in an amount sufficient that only a portion of the vinyl silane is grafted to the polyolefin leaving some free vinyl silane after grafting.
- 12. A silicone-containing film comprising the resin of claim 1 or 2.
- 13. The film of claim 12 wherein the film is surface treated.
- 14. The film of claim 13 wherein the film is surface treated by corona discharge.
- 15. A multi-layer structure comprisinglayer (A) a subweb, and layer (B) the silicone-containing film of claim 12 wherein layer (B) is substantially uniform in thickness.
- 16. The multi-layer structure of claim 15 whereinlayer (A) has a thickness of about 10 to about 100 microns (micrometers), and layer (B) has a thickness of about 1 to about 10 microns.
- 17. The multi-layer structure of claim 16 whereinlayer (A) has a thickness of about 15 to about 25 microns, and layer (B) has a thickness of about 2 to about 6 microns.
- 18. The multi-layer structure of claim 17 whereinlayer (A) has a thickness of about 15 to about 25 microns, and layer (B) has a thickness of about 2 to about 4 microns.
- 19. The multi-layer structure of claim 18 wherein the subweb is paper.
- 20. The multi-layer structure of claim 15 wherein the subweb is polyolefin homopolymer or copolymer of unsaturated hydrocarbons having 2-20 carbon atoms or mixtures thereof.
- 21. The multi-layer structure of claim 20 that has been perforated.
- 22. A composite structure comprising the multi-layer structure of claim 21 and, adjacent to layer (a), an absorbent material.
- 23. A resin formulation, consisting essentially of:a) a functionalised polyolefin, b) a dimethyl polysiloxane having functional end-groups, c) an ultra-high molecular weight silicone polymer having a number average molecular weight range from about 350,000 to 1 million and wherein the functionalised polyolefin reacts with the dimethyl polysiloxane, and d) an organo-metallic moisture curing agent wherein components b) and c) are different from each other.
- 24. The formulation according to claim 23 wherein the functionalized polyolefin is selected from(i) a copolymer of blends of copolymers of ethylene directly copolymerized with a polar monomer selected from an alpha, beta-ethylenically unsaturated C3-C8 carboxylic acid or ester thereof or an ethylenically unsaturated ester of a carboxylic acid, (ii) an ionomeric copolymer where the ionomeric copolymer is derived from direct copolymers of ethylene and acid copolymers by neutralization of the acid groups with metal ions, (iii) a graft copolymer wherein the graft monomers are selected from the group consisting of ethylenically unsaturated acid and their derivatives, or from the group consisting of ethylenically unsaturated anhydrides and their derivatives, or from the group consisting of ethylenically unsaturated monomers containing amino or hydroxy functional groups, or (iv) a blend of one or more copolymers selected from (i), (ii), (iii) or from a polyolefin homopolymer or copolymer of unsaturated hydrocarbons having 2-20 carbon atoms or mixtures thereof.
- 25. The formulation according to claim 24 wherein the direct copolymer is selected from an ethylene vinyl silane copolymer.
- 26. The formulation according to claim 23, comprising less than about 2% by weight of vinyl silane in the copolymer.
- 27. The formulation according to claim 23 comprising, based on total weight of polymer components:a) about 85 to about 98.89% polyolefin/vinyl silane copolymer; b) about 1 to about 10% dimethyl polysiloxane having functional end groups; c) about 0.1 to about 5% ultra-high molecular weight silicone polymer; and d) about 1 to about 100 parts per million of organo-metallic moisture curing agent.
- 28. A silicone-containing film comprising the resin of claim 23.
- 29. A multi-layer structure comprising:layer (A) in the form of a subweb having a thickness of about 10 to about 100 microns, and layer (B) in the form of the silicone-containing polyolefin film of claim 28 having a thickness of about 1 to about 10 microns.
- 30. A multi-layer structure comprisinga first layer selected from a polymeric layer or a non-polymeric layer; a pressure sensitive adhesive layer; and a release film silicone containing layer having the composition according to claims 1, 2, 23 or 24 wherein reduced migration of silicone occurs into the pressure sensitive adhesive layer.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 09/042,546, filed Mar. 17, 1998, now abandoned, which is a continuation-in-part of U.S. patent application Ser. No. 08/926,221 filed Sep. 9, 1997, now abandoned which claims priority from U.S. Provisional Application No. 60/025,251, filed Sep. 13, 1996.
US Referenced Citations (12)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0484093 |
Mar 1996 |
EP |
08302305 |
Mar 1996 |
JP |
WO9621567 |
Jul 1996 |
WO |
WO9700665 |
Jan 1997 |
WO |
Non-Patent Literature Citations (2)
Entry |
Derwent Abstract of JP 05039423 A, Feb. 1993, assigned to Tokuyama Soda.* |
Machine translation of JP-05-039423, Hidecki et al., Feb. 1993. |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/025251 |
Sep 1996 |
US |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
09/042546 |
Mar 1998 |
US |
Child |
09/671275 |
|
US |
Parent |
08/926221 |
Sep 1997 |
US |
Child |
09/042546 |
|
US |