Patent Application
20140249257
The invention relates to silicone resins comprising metallosiloxane which contains Si—O-Metal bonds or borosiloxane containing Si—O—B bonds and potentially Si—O—Si and/or B—O—B bonds and containing sulfur. It also relates to the preparation of such silicone resins and to their use in thermoplastic or thermosetting organic polymer or rubber or thermoplastic/rubber blends compositions to reduce the flammability or enhanced scratch and/or abrasion resistance of the organic polymer compositions. It further relates to coatings made of such silicone resins for scratch resistance enhancement or flame retardant properties.
Development of efficient halogen-free flame retardant additives for thermoplastics and thermosets is still a great need for many industrial applications. New upcoming regulation such as European harmonized EN45545 norm as well as growing green pressure are pushing the market to develop new effective halogen-free solutions. In the recent years, many researches were made in the field of halogen-free flame retardant. Silicone-based materials are of particular interest in this field.
Even if the synthesis of borosiloxane structures are known in the literature, the obtention of sulfurilated boro-metallo- or borometallosiloxanes presenting unexpected higher fire retardant efficiency and outstanding thermal stability compared to their “pure” silicone based and non sulfurilated counterparts were not reported.
WO2008/018981 discloses silicone polymers containing boron, aluminum and/or titanium, and having silicon-bonded branched alkoxy groups.
US2010/0191001 discloses a process for performing hydrolysis and condensation of an epoxy-functional silane with boric acid, the condensate formed in the reaction being based on Si—O—B and/or Si—O—Si bonds.
U.S. Pat. No. 6,716,952 discloses flame retardant compositions containing a polymer comprising silicon, boron and oxygen and having a skeleton substantially formed by a silicon-oxygen bond and a boron-oxygen bond.
JP 57-076039 discloses flame retardant polyolefin composition that is made by adding a borosiloxane resin to a polyolefin.
U.S. Pat. No. 4,152,509 discloses borosiloxane polymers produced by heating at least one of boric acid compound with phenylsilane to effect polycondensation reaction.
US 20100316876 describes a borosiloxane adhesive which is said to have high resistance to moisture, high transparency, and excellent adhesion to various substrates. Moreover, the borosiloxane adhesive has high adhesion during and after exposure to temperatures above the decomposition temperature of the adhesive, low flammability (as evidenced by low heat release rate), and high char yield.
U.S. Pat. No. 7,208,536 discloses a polyolefin resin composition comprising a high crystalline polypropylene resin, a rubber component, an inorganic filler and an aluminosiloxane masterbatch, with excellent damage resistance such as anti-scratch characteristic thereby giving very low surface damage, excellent heat resistance, good rigidity and impact properties and injection moldability, for car interior or exterior parts.
US2009/0226609 describes aluminosiloxanes, titanosiloxanes, and (poly)stannosiloxanes and methods for preparing these siloxanes.
US2005/0033002 describes silicone resins containing structural units comprising sulfur.
US2006/0189736 describes a cold-setting adhesive comprising a curable resin and a Lewis acid. The curable resin comprises silicon-containing functional groups. The Lewis acid is selected from metal halide and boron halide.
U.S. Pat. No. 6,602,938 describes a flame resistant polycarbonate resin composition containing a silicone compound with an alkali metal salt of an aromatic sulfonic acid.
However, even if some of the before mentioned patents describe halogen-free borosiloxane, they show only limited flame retardant performances narrowed down to anti-dripping effect following UL-94 test. In view of the state of the art, it is the object of the present invention to provide a flame retardant additive system based on strong synergy based on sulfurilated boro-metalo- or borometalosilicones technology which is cheap, easy to process and with high thermal and moisture stability making them suitable for applications where high processing temperature are required. Moreover, it was demonstrated that the additives presented in the following patent were suitable to reach new norms requirements and particularly efficient at reducing fumes emission of the final compound.
The invention provides a silicone resin comprising
Metals M as defined herein encompass transition metals (containing Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Rf, Db, Sg, Bh, Hs, Mt, Ds, Rg, Cn) and all elements from Group IIIA (i.e. B, Al, Ga, In and Tl), Sn and Zr. Group IIIa comprises boron, the first element of Group IIIA which is in fact a metalloid instead of a metal. Nevertheless for the sake of convenience boron is considered to be a Metal M in the rest of the present specification. Preferably the Metal M is chosen from Period 4 of the transition metals (Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn). Preferably the Metal M is chosen from nickel, copper and zinc. In other preferred embodiments, the Metal M is chosen from boron, titanium and aluminum. In still other preferred embodiments, the Metal is free of Ti, Zr and of Group III elements.
Preferably, the silicone resin contains both boron and metal atom from group IIIa and/or transition metals. For example, the silicone resin contains both boron and aluminum elements.
While borosiloxane structures or other Metal containing structures are known, no prior art suggests a silicone structure containing sulfur in addition to B or M and demonstrating unexpected flame retardant performances synergism compared to their non sulfur containing counterpart. We have found that such structures may form resins having a high degree of flame retardancy. We have also found that such structures were of particular heat stability compared to their non sulfur containing counterparts, making them suitable for applications where very high processing temperatures are required such as in polycarbonate or polyamide.
Preferably, the silicone resin of the invention contains also at least one organic group containing phosphorus and/or nitrogen.
Preferably the silicone resin of the invention comprises at least one P-containing organic group. The presence of a P-containing organic group is particularly efficient to provide flame retardancy properties to the resin and P-containing compounds are readily available to being used as raw materials able to form the resin.
The silicone resin preferably contains T units; D; M′ and/or Q units. The resin is characterized by a majority of successive Si—O-M units where the Si is selected from R3SiO1/2 (M′ units), R2SiO2/2 (D units), RSiO3/2 (T units) and SiO4/2 (Q units). The resin further contains polyorganosiloxanes, also known as silicones, generally comprising repeating siloxane units selected from R3SiO1/2 (M′ units), R2SiO2/2 (D units), RSiO3/2 (T units) and SiO4/2 (Q units), in which each R represents an organic group or hydrogen or a hydroxyl group. Branched silicone resins contain T and/or Q units, optionally in combination with M′ and/or D units, are preferred. In the branched silicone resins of the invention, at least 25% of the siloxane units are preferably T and/or Q units. More preferably, at least 75% of the siloxane units in the branched silicone resin are T and/or Q units.
The silicone resin of the invention contains Sulfur. Sulfur can be in the form of S at oxidation state of −2 to +6, i.e. −2, −1, 1, 2, 3, 4, 5, 6. It is preferably integrated into T units.
Preferably, the resin contains at least one phosphorus containing group present in a M′ unit of the formula RPR2SiO1/2 and/or D unit of the formula RPRSiO2/2 and/or a T unit of the formula RPSiO3/2, where RP is an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms containing a phosphorus substituent. This phosphorus substituent can be at an oxidation state of −3, −1, +1, +3 or +5, preferably −3, +3 or +5. It can be phosphine and/or phosphine oxide and/or phosphinate and/or phosphinite and/or phosphonite and/or phosphite, and/or phosphonate and/or phosphate substituent, and each group R is independently an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms.
More preferably, the phosphorus containing group is present in a T unit of the formula RPSiO3/2.
Preferably, the group RP has the formula
where A is a divalent hydrocarbon group having 1 to 20 carbon atoms or an —OR* group, R* is a hydrogen, alkyl or aryl group having 1 to 12 carbon atoms, and Z is a group of the formula —OR* or an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms. When 2 —OR* groups are present on the P group, they can be different.
The phosphinate substituent can comprise a 9,10 dihydro-9-oxa-10-phosphaphenanthrene-10-oxide group, sometimes known as DOPO group. Therefore, preferably the group RP has the formula
where A is a divalent group having 1 to 20 carbon atoms, for example a hydrocarbon group forming 2-DOPO-ethyl or 3-DOPO-propyl. The divalent group can also be an aryl containing group for example forming DOPO-Hydroquinone.
Alternatively, the P-organic group can be
where A is the linking group to the silicon part. A can be rather a simple or branched alkyl, alkenyl (unsaturated), simple or substituted arylalkyl or aryl group.
In some preferred embodiments, the branched silicone resin of the invention preferably contains at least one organic nitrogen-containing group present in a T unit of the formula RNSiO3/2, where RN is an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms containing a organic nitrogen substituent.
In one preferred type of resin according to the invention the organic group containing nitrogen is a heterocyclic group present as a group of the formula
where X1, X2, X3 and X4 independently represent a CH group or a N atom and form a benzene, pyridine, pyridazine, pyrazine, pyrimidine or triazine aromatic ring; Ht represents a heterocyclic ring fused to the aromatic ring and comprising 2 to 8 carbon atoms, 1 to 4 nitrogen atoms and optionally 1 or 2 oxygen and/or sulphur atoms; A represents a divalent organic linkage having 1 to 20 carbon atoms bonded to a nitrogen atom of the heterocyclic ring; the heterocyclic ring can optionally have one or more substituent groups selected from alkyl, substituted alkyl, cycloalkyl, alkenyl, alkynyl, aryl and substituted aryl groups having 1 to 12 carbon atoms and amino, nitrile, amido and imido groups; and R3n, with n=0-4, represents an alkyl, substituted alkyl, cycloalkyl, alkenyl, alkynyl, aryl or substituted aryl group having 1 to 40 carbon atoms, or an amino, nitrile, amido or imido group or a carboxylate —C(═O)—O—R4, oxycarbonyl —O—(C═O)—R4, carbonyl —C(═O)—R4, or an oxy —O—R4 substituted group with R4 representing hydrogen or an alkyl, cycloalkyl, alkenyl, alkynyl, aryl, or substituted aryl groups having 1 to 40 carbon atoms, substituted on one or more positions of the aromatic ring, or two groups R3 can be joined to form a ring system comprising at least one carbocyclic or heterocyclic ring fused to the aromatic ring.
The heterocyclic ring Ht is preferably not a fully aromatic ring, i.e. it is preferably not a pyridine, pyridazine, pyrazine, pyrimidine or triazine aromatic ring. The heterocyclic ring Ht can for example be an oxazine, pyrrole, pyrroline, imidazole, imidazoline, thiazole, thiazoline, oxazole, oxazoline, isoxazole or pyrazole ring. Examples of preferred heterocyclic ring systems include benzoxazine, indole, benzimidazole, benzothiazole and benzoxazole. In some preferred resins the heterocyclic ring is an oxazine ring so that RN is a group of the formula
where X1, X2, X3 and X4, A, R3 and n are defined as above and R5 and R6 each represent hydrogen, an alkyl, substituted alkyl, cycloalkyl, alkenyl, alkynyl, aryl or substituted aryl group having 1 to 12 carbon atoms, or an amino or nitrile group. The group can for example be a benzoxazine group of the formula
where R7, R8, R9 and R10 each represent hydrogen, an alkyl, substituted alkyl, cycloalkyl, alkenyl, alkynyl, aryl or substituted aryl group having 1 to 40 carbon atoms, or an amino, nitrile, amido or imido group or a carboxylate —C(═O)—O—R4, oxycarbonyl —O—(C═O)—R4, carbonyl —C(═O)—R4, or an oxy —O—R4 substituted group with R4 representing hydrogen or an alkyl, cycloalkyl, alkenyl, alkynyl, aryl, or substituted aryl groups having 1 to 40 carbon atoms, or R7 and R8, R8 and R9 or R9 and R10 can each be joined to form a ring system comprising at least one carbocyclic or heterocyclic ring fused to the benzene ring.
The oxazine or other heterocyclic ring Ht can alternatively be bonded to a pyridine ring to form a heterocyclic group of the formula
The benzene, pyridine, pyridazine, pyrazine or triazine aromatic ring can be annelated to a ring system comprising at least one carbocyclic or heterocyclic ring to form an extended ring system enlarging the pi-electron conjugation. A benzene ring can for example be annelated to another benzene ring to form a ring system containing a naphthanene moiety
such as a naphthoxazine group, or can be annelated to a pyridine ring to form a ring system containing a quinoline moiety.
A pyridine ring can for example be annelated to a benzene ring to form a ring system containing a quinoline moiety in which the heterocyclic ring Ht, for example an oxazine ring, is fused to the pyridine ring
The aromatic ring can be annelated to a quinone ring to form a naphthoquinoid or anthraquinoid structure. In an alkoxysilane of the formula
the groups R8 and R9, R7 and R8, or R9 and R10 can form an annelated ring of naphthoquinoid or anthraquinoid structure. Such ring systems containing carbonyl groups may form resins having improved solubility in organic solvents, allowing easier application to polymer compositions.
The organic group RN containing nitrogen can alternatively comprise an aminoalkyl or aminoaryl group containing 1 to 20 carbon atoms and 1 to 3 nitrogen atoms bonded to a silicon atom of the silicone resin, for example —(CH2)3NH2, —(CH2)4NH2, —(CH2)3NH(CH2)2NH2, —CH2CH(CH3)CH2NH2, —CH2CH(CH3)CH2NH(CH2)2NH2, —(CH2)3NHCH2CH2NH(CH2)2NH2, —CH2CH(CH3)CH2NH(CH2)3NH2, —(CH2)3NH(CH2)4NH2 or —(CH2)3O(CH2)2NH2, or —(CH2)3NHC6H4, —(CH2)3NH(CH2)2NHC6H4, —(CH2)3NHCH3, —(CH2)3N(C6H4)2. Optionally, the resin contains both phosphorus and nitrogen. Preferably, the molar ratio of Metal atom to Si atom of the silicone resin ranges from 0.01:1 to 2:1.
The invention further provides a method for the preparation of a silicone resin, wherein
In a possible synthesis approach, alkoxypolysiloxane or hydroxypolysiloxane resins can be used as raw material. Preferably, the sulfur containing material is chosen from thiosilane, thiourea, TESPT, thionyl chloride, SO2Cl2. The Sulfur containing material used as Sulfur reactant can be for example thiourea or a thiol. It can be a Sulfur containing silane like thiopropylsilane, TESPT (bis-[3-(Triethoxysilyl)propyl]-tetrasulphide) or 2-(4-Chlorosulfonylphenyl)ethyltrimethoxysilane. It can be sulfuric acid which can be later mixed with a phosphorylated silicone resin. In another embodiment, the sulfur reactant is Cl2SO2, Cl2SO, ammonium sulfamate, the family of mercaptosilanes or silthianes (linear or cyclic).
Production of sulfonylated resin can be obtained through reaction of aminated alkoxysilane like gamma aminopropyltriethoxysilane and sulfonyl reactant like paratoluenesulfonyl chloride for example in the presence of CaCO3 in ethanol. The corresponding sulfonylated silane could be used as it is or introduced in a resin. This molecule would also bring nitrogen in the material, which is a foaming source. The phenyl ring increases compatibility to the polymer matrix wherein the silicone resin is put.
A useful sulfonylated salt can be produced by reacting phenylsilane with H2SO4 followed by water washings and K2CO3 treatment. The reaction is then:
In some preferred embodiments, the silicone resin contains together phosphorus, nitrogen and sulfur. A branched silicone resin of the invention containing at least one phosphonate or phosphinate moiety present in a T unit of the formula RPSiO3/2 can for example be prepared by a process in which a trialkoxysilane of the formula RPSi(OR′)3 is hydrolysed and condensed with Metal M containing compound to form metallosiloxane bonds. Examples of useful trialkoxysilanes containing a RP group are 2-(diethylphosphonato)ethyltriethoxysilane, 3-(diethylphosphonato)propyltriethoxysilane and 2-(DOPO)ethyltriethoxysilane.
A silicone resin of the invention containing at least one organic nitrogen-containing group present in a T unit of the formula RNSiO3/2 can for example be prepared by a process in which a trialkoxysilane of the formula RNSi(OR′)3 is hydrolysed and condensed with Metal M containing compound to form metallosiloxane bonds. Examples of useful trialkoxysilanes containing a RN group are 3-(3-benzoxazinyl)propyltriethoxysilane
and the corresponding naphthoxazinetriethoxysilane,
3-(6-cyanobenzoxazinyl-3)propyltriethoxysilane,
3-(2-phenylbenzoxazinyl-3)propyltriethoxysilane
and 3-aminopropyltrimethoxysilane.
The branched silicone resin containing at least one organic nitrogen-containing group can be formed from a bis(alkoxysilane), for example a bis(trialkoxysilane), containing two heterocyclic rings each having an alkoxysilane substituent, such as 1,3-bis(3-(3-trimethoxysilylpropyl)benzoxazinyl-6)-2,2-dimethylpropane
The silicone resin can in one preferred embodiment comprises mainly T units, that is at least 50 mole % T units, and more preferably at least 80 or 90% T units. It can for example comprise substantially all T units.
The trialkoxysilanes or trihydroxysilane of the formulae RPSi(OR′)3 and RNSi(OR′)3 can be hydrolysed and condensed in the presence of a Metal M containing material, optionally with an hydroxysilane or alkoxysilane of the formula R4Si(OR′)3, in which each R′ is an hydrogen, alkyl group having 1 to 4 carbon atoms and R4 represents a hydrogen, alkyl, cycloalkyl, aminoalkyl, alkenyl, alkynyl, aryl or aminoaryl group having 1 to 20 carbon atoms. Examples of useful alkoxysilanes of the formula R4Si(OR′)3 are alkyltrialkoxysilanes such as methyltriethoxysilane, ethyltriethoxysilane, methyltrimethoxysilane, aryltrialkoxysilanes such as phenyltriethoxysilane and alkenyltrialkoxysilanes such as vinyltrimethoxysilane.
Alternative alkoxysilanes or hydroxysilane containing a phosphonate or phosphinate group are monoalkoxysilanes for example of the formula RPR112SiOR′ and dialkoxysilanes for example of the formula RPR11Si(OR′)2, where each R′ is a hydrogen, alkyl group having 1 to 4 carbon atoms; each RP is an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms containing a phosphonate or phosphinate substituent; and each R11 which can be the same or different is an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms or an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms containing a phosphonate or phosphinate substituent. Examples of suitable monoalkoxysilanes containing a phosphonate or phosphinate group are 2-(DOPO)ethyldimethylethoxysilane and 3-(diethylphosphonato)propyldimethylethoxysilane. Examples of suitable dialkoxysilanes containing a phosphonate or phosphinate group are 2-(DOPO)ethylmethyldiethoxysilane and 3-(diethylphosphonato)propylmethyldiethoxysilane.
Alternative alkoxysilanes or hydroxysilanes containing an organic nitrogen-containing group are monoalkoxysilanes for example of the formula RNR122SiOR′ and dialkoxysilanes for example of the formula RNR12Si(OR′)2 where each RN is an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms containing an organic nitrogen substituent; and each R12 which can be the same or different is an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms or an alkyl, cycloalkyl, alkenyl, alkynyl or aryl group having 1 to 20 carbon atoms containing an organic nitrogen substituent. Examples of suitable monoalkoxysilanes containing an organic nitrogen substituent are 3-(3-benzoxazinyl)propyldimethylethoxysilane and 3-aminopropyldimethylethoxysilane. Examples of suitable dialkoxysilanes containing an organic nitrogen substituent are 3-(3-benzoxazinyl)propylmethyldiethoxysilane and 3-aminopropylmethyldimethoxysilane.
Monoalkoxysilanes or hydroxysilanes when hydrolysed and condensed will form M′ groups in the silicone resin and dialkoxysilanes when hydrolysed and condensed will form D groups in the silicone resin. A monoalkoxysilane or dialkoxysilane containing a RP group can be reacted with trialkoxysilanes and/or tetraalkoxysilanes to form a branched silicone resin.
In preferred embodiment, the reactant is alkoxysiloxane or hydroxysilane or hydroxysiloxane.
In another preferred embodiment, the reactant is selected from alkoxysilane.
In a preferred embodiment where borosiloxane is formed, the Metal containing material is at least one boron containing material selected from (i) boric acid of the formula B(OH)3, any of its salts or boric anhydride, (ii) boronic acid of the formula R1B(OH)2, (iii) alkoxyborate of formula B(OR2)3 or R1B(OR2)2, a mixture containing at least two or more of (i), (ii) or (iii), where R1 and R2 are independently alkyl, alkenyl, aryl or arylakyl substituents.
Preferably, the Metal containing material has the general formula M(R3)m where m=1 to 7 depending on the oxidation state of the considered Metal, selected from alkoxymetals where R3=OR′ and R′ is an alkyl group, and metal hydroxyl where R3=OH. Metal chlorides where R3=Cl are to be avoided so as to guarantee that the product of the reaction is halogen free.
When M is Al, the alkoxymetal can be for example (Al(OEt)3, Al(OiPr)3 or Al(OPr)3). Chlorine containing derivatives such as AlCl3 are to be avoided. The alkoxysilane or hydroxysilane is preferably selected from i) tetra(alkoxysilane) Si(OR3)4, (ii) trialkoxysilane R6Si(OR3)3, (iii) dialkoxysilane R6R7Si(OR3)2 or (iv) monoalkoxysilane R6R7R8SiOR3, a mixture containing two or more of (i), (ii), (iii) or (iv), where R3 is a C1 to C10 alkyl group and R6, R7 and R8 are independently alkyl, alkenyl, aryl, arylalkyl, bearing or not organic functionalities such as but not limited to glycidoxy, methacryloxy, acryloxy, and R is an alkyl group. Example of suitable hydroxysilane is diphenyl(dihydroxy)silane.
Addition of water during the synthesis is possible but not required. Water loading are calculated minimum to consume partially the alkoxies and preferably the whole alkoxies present in the system. Preferably, the whole mixture is refluxed at a temperature preferably ranging from 50 to 160° C. in the presence or not of an organic solvent. Then the alcohol and organic solvent are stripped and possible remaining water are distilled off from the resin through, for example, azeotropic mixture water/alcohol.
These new sulfurilated metallosiloxanes don't systematically require any condensation catalyst to condense, which represent an advantage in terms of processing as no filtration step is required to remove possible condensation catalyst from the media. In some preferred embodiments, a condensation catalyst is used during the synthesis to force/increase conversion. For example, HCl or Sn or Ti based catalytic systems can be used.
The obtained product can be further dried under vacuum at high temperature (ranging from 50 to 100° C.) to remove remaining traces of solvents, alcohols or water.
These sulfurilated metallosiloxanes demonstrate better heat stability compared to their non-metallised or non-phosphorylated or non-nitrogenated resins counterparts. These resins can be used as additives in polymers or coatings formulations to improve, for example, flame retardancy and/or scratch and/or abrasion resistance. These new resins can be further blended with various thermoplastics or thermosets to make them flame retardant. The invention therefore extends to the use of the silicone resin in a thermoplastic or thermosetting organic polymer composition to reduce the flammability of the organic polymer composition.
The invention extends to a process of reducing the flammability or enhance scratch and/or abrasion resistance of a polymeric matrix (matrice) characterised in that a silicone resin as defined above is added to a polymer composition.
The fire resistance of the polymeric matrice can be improved by increasing the flame resistance of the matrice, for example by providing flame retardancy properties to the matrice.
The polymer matrix composition can be an already polymerised composition or a monomer composition wherein the resin is added. In the latter case, the resin can be if needed modified beforehand to become reactive with the monomer composition so as to form a copolymer. For example a silicone resin according to the invention can be reacted with eugenol to provide terminal —OH bonds. The modified resin can then be reacted with bisphenol-A and phosgene to provide a Si—O-M-polycarbonate copolymer.
The invention allows a reduction of the emitted fumes upon burning compared to their non phosphorylated and/or non metalized counterparts. The invention keeps to a certain extent the transparency of the host matrix, i.e. the new resin allows to keep the transparency of the polymer it is blended with or the coating made up with the resin is transparent. The silicone resins of the invention have a high thermal stability which is higher than that of their non-sulfurilated counterparts and higher than that of linear silicone polymers. This higher thermal stability is due to the presence of the metal and sulfur atom that leads to the formation of highly stable ceramic structures. Such silicone resins additionally undergo an intumescent effect on intense heating, forming a flame resistant insulating char.
The branched silicone resins of the invention can be blended with a wide range of thermoplastic resins, for example polycarbonates, ABS (acrylonitrile butadiene styrene) resins, polycarbonate/ABS blends, polyesters, polystyrene, Polybutylene terephtalate (PBT) or polyolefins such as polypropylene or polyethylene or polyethylene terephtalate. The silicone resins of the invention can also be blended with thermosetting resins, for example epoxy resins of the type used in electronics applications, which are subsequently thermoset, or unsaturated polyester resin. The silicone resins of the invention can be blended with blends of thermoplastic resins or blends of thermosetting resins. The mixtures of thermoplastics or thermosets with the silicone resins of the invention as additives have been proved to have a low impact on Tg value and thermal stability, as shown by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), and better flammability properties, as shown by UL-94 test, and/or other flammability tests such as the glow wire test or cone calorimetry, compared to their non phosphorylated counterparts. The branched silicone resins of the invention are particularly effective in increasing the fire resistance of polycarbonates and blends of polycarbonate with other resins such as polycarbonate/ABS blends.
The thermoplastic matrice can be chosen from the carbonate family (e.g. Polycarbonate PC), polyamides (e.g. Polyamide 6 and 6.6), polyester (e.g. polyethyleneterephtalate). The thermoplastic matrice can be chosen from the polyolefin family (e.g. polypropylene PP or polyethylene PE).The thermoplastic matrice can be a bio-sourced thermoplastic matrice such as polylactic acid (PLA) or polyhydroxybutadiene (PHB) or bio-sourced PP/PE. The matrice can be chosen from thermoplastic/rubbers blends from the family of PC/Acrylonitrile/styrene/butadiene ABS. The matrice can be chosen from rubber made of a diene, preferably natural rubber. The matrice can be chosen from thermoset from the Novolac family (phenol-formol) or epoxy. These above polymers can optionally be reinforced with, for example, glass fibres.
Applications include but are not limited to transportation vehicles, construction, electrical application, printed circuits boards and textiles. Unsaturated polyester resins, or epoxy are moulded for use in, for example, the nacelle of wind turbine devices. Normally, they are reinforced with glass (or carbon) fibre cloth; however, the use of a flame retardant additive is important for avoiding fire propagation.
The silicone resins of the invention frequently have further advantages including but not limited to transparency, higher impact strength, toughness, increased adhesion between two surfaces, increased surface adhesion, scratch and/or abrasion resistance and improved tensile and flexural mechanical properties. The resins can be added to polymer compositions to improve mechanical properties such as impact strength, toughness and tensile, flexural mechanical properties and scratch and/or abrasion resistance. The resins can be used to treat reinforcing fibres used in polymer matrices to improve adhesion at the fibre polymer interface. The resins can be used at the surface of polymer compositions to improve adhesion to paints. The resins can be used to form coatings on a substrate.
The silicone resins of the invention can for example be present in thermoplastic or thermoset or rubber or thermoplastic/rubber blends organic polymer compositions in amounts ranging from 0.1 or 0.5% by weight up to 50 or 75%. Preferred amounts may range from 0.1 to 25% by weight silicone resin in thermoplastic compositions such as polycarbonates, and from 0.2 to 75% by weight in thermosetting compositions such as epoxy resins.
The invention also provides the use of a silicone resin as defined herein above as a fire- or scratch- and/or abrasion resistant coating on a substrate.
The invention further provides a thermoplastic or thermoset or rubber or thermoplastic/rubber blends organic polymer composition comprising a thermoplastic or thermoset organic polymer and a silicone resin as defined herein above.
The invention also provides a fire- or scratch and/or abrasion resistant coating on a substrate wherein the coating comprises a silicone resin as defined hereinabove.
In certain preferred embodiments, the silicone resin disclosed in the present patent can be used in conjunction with another flame retardant compound. Among the halogen-free flame retardants one can find the metal hydroxides, such as magnesium hydroxide (Mg(OH)2) or aluminium hydroxide (Al(OH)3), which act by heat absorbance, i.e. endothermic decomposition into the respective oxides and water when heated, however they present low flame retardancy efficiency, low thermal stability and significant deterioration of the physical/chemical properties of the matrices due to high loadings. Other compounds act mostly on the condensed phase, such as expandable graphite, organic phosphorous (e.g. phosphate, phosphonates, phosphine, phosphine oxide, phosphonium compounds, phosphites, etc.), ammonium polyphosphate, polyols, etc. Zinc borate, nanoclays and red phosphorous are other examples of halogen-free flame retardants synergists that can be combined with the silicone material disclosed in this patent. Silicon-containing additives such as silica, aluminosilicate or magnesium silicate (talc) are known to significantly improve the flame retardancy, acting mainly through char stabilization in the condensed phase. Silicone-based additives such as silicone gums are known to significantly improve the flame retardancy, acting mainly through char stabilization in the condensed phase. Sulfur-containing additives, such as potassium diphenyl sulfone sulfonate (known as KSS), are well known flame retardant additives for thermoplastics, in particular for polycarbonate but are only of high efficiency at reducing the dripping effect. In a preferred embodiment, the resin is used in conjunction with Zinc-Borate additive.
Either the halogenated, or the halogen-free compounds can act by themselves, or as synergetic agent together with the compositions claimed in the present patent to render the desired flame retardance performance to many polymer or rubber matrices. For instance, phosphonate, phosphine or phosphine oxide have been referred in the literature as being anti-dripping agents and can be used in synergy with the flame retardant additives disclosed in the present patent. The paper “Flame-retardant and anti-dripping effects of a novel char-forming flame retardant for the treatment of poly(ethylene terephthalate) fabrics” presented by Dai Qi Chen et al. at 2005 Polymer Degradation and Stability describes the application of a phosphonate, namely poly(2-hydroxy propylene spirocyclic pentaerythritol bisphosphonate) to impart flame retardance and dripping resistance to poly(ethylene terephthalate) (PET) fabrics. Benzoguanamine has been applied to PET fabrics to reach anti-dripping performance as reported by Hong-yan Tang et al. at 2010 in “A novel process for preparing anti-dripping polyethylene terephthalate fibres”, Materials & Design. The paper “Novel Flame-Retardant and Anti-dripping Branched Polyesters Prepared via Phosphorus-Containing Ionic Monomer as End-Capping Agent” by Jun-Sheng Wang et al. at 2010 reports on a series of novel branched polyester-based ionomers which were synthesized with trihydroxy ethyl esters of trimethyl-1,3,5-benzentricarboxylate (as branching agent) and sodium salt of 2-hydroxyethyl 3-(phenylphosphinyl)propionate (as end-capping agent) by melt polycondensation. These flame retardant additives dedicated to anti-dripping performance can be used in synergy with the flame retardant additives disclosed in this patent. Additionally, the flame retardant additives disclosed in the present patent have demonstrated synergy with other well-known halogen-free additives, such as Zinc Borates and Metal Hydroxydes (aluminium trihydroxyde or magnesium dihydroxyde) or polyols (pentaerythritol). When used as synergists, classical flame retardants such as Zinc Borates or Metal Hydroxydes (aluminium trihydroxyde or Magnesium dihydroxyde) can be either physically blended or surface pre-treated with the silicon based additives disclosed in this patent prior to compounding.
Therefore, preferably the thermoplastic or thermoset organic polymer composition according to the invention further comprises classical flame retardant additive such as but not limited to inorganic flame retardants such as metal hydrates or zinc borates, magnesium hydroxide, aluminum hydroxide, phosphorus and/or nitrogen containing additives such as ammonium polyphosphate, boron phosphate, carbon based additives such as expandable graphite or carbon nanotubes, nanoclays, red phosphorous, silica, aluminosilicates or magnesium silicate (talc), silicone gum, sulfur based additives such as sulfonate, ammonium sulfamate, potassium diphenyl sulfone sulfonate (KSS) or thiourea derivatives, polyols like pentaerythritol, dipentaerythritol, tripentaerythritol or polyvinylalcohol.
In addition, the resin of the present invention can be used with other additives commonly used as polymer fillers such as but not limited to talc, calcium carbonate. They can be powerful synergists when mixed with the additive described in the present patent. Examples of mineral fillers or pigments which can be incorporated in the polymer include titanium dioxide, aluminium trihydroxide, magnesium dihydroxide, mica, kaolin, calcium carbonate, non-hydrated, partially hydrated, or hydrated fluorides, chlorides, bromides, iodides, chromates, carbonates, hydroxides, phosphates, hydrogen phosphates, nitrates, oxides, and sulphates of sodium, potassium, magnesium, calcium, and barium; zinc oxide, aluminium oxide, antimony pentoxide, antimony trioxide, beryllium oxide, chromium oxide, iron oxide, lithopone, boric acid or a borate salt such as zinc borate, barium metaborate or aluminium borate, mixed metal oxides such as aluminosilicate, vermiculite, silica including fumed silica, fused silica, precipitated silica, quartz, sand, and silica gel; rice hull ash, ceramic and glass beads, zeolites, metals such as aluminium flakes or powder, bronze powder, copper, gold, molybdenum, nickel, silver powder or flakes, stainless steel powder, tungsten, hydrous calcium silicate, barium titanate, silica-carbon black composite, functionalized carbon nanotubes, cement, fly ash, slate flour, bentonite, clay, talc, anthracite, apatite, attapulgite, boron nitride, cristobalite, diatomaceous earth, dolomite, ferrite, feldspar, graphite, calcined kaolin, molybdenum disulfide, perlite, pumice, pyrophyllite, sepiolite, zinc stannate, zinc sulfide or wollastonite. Examples of fibres include natural fibres such as wood flour, wood fibres, cotton fibres, cellulosic fibres or agricultural fibres such as wheat straw, hemp, flax, kenaf, kapok, jute, ramie, sisal, henequen, corn fibre or coir, or nut shells or rice hulls, or synthetic fibres such as polyester fibres, aramid fibres, nylon fibres, or glass fibres. Examples of organic fillers include lignin, starch or cellulose and cellulose-containing products, or plastic microspheres of polytetrafluoroethylene or polyethylene. The filler can be a solid organic pigment such as those incorporating azo, indigoid, triphenylmethane, anthraquinone, hydroquinone or xanthine dyes.
In a round bottomed reactor equipped with a vapor condenser system, a double jacketing heat control system and flushed with N2 blanketing, 30.92 gr of boric acid (0.5 mol), 99.15 gr of phenyl trimethoxysilane (0.5 mol) and 98.17 gr of 3-mercapto trimethoxysilane will be mixed. The whitish suspension (due to no dissolved boric acid) will be gently stirred and the system heated-up to 100° C. and refluxed at 100° C. for 3 hours. The reaction evolution will be followed through a quick disappearance of the boric acid to give a transparent, homogenous media. After 3 hours heating, the reactor will be cooled down to 50° C. to cut down the refluxing and the reactor will be equipped with a stripping system. The formed alcohol (Methanol and ethanol) will be removed under vacuum at 50° C. to afford a viscous concentrated resin which will be discharged in a container. The container will be placed a vacuum oven and residual solvent will be stripped at 100° C. to afford T(Ph)25T(S)25B50 resin as a whitish solid powder.
The obtained powder will be processed as follows:
Material will be compression moulded into 100×100×3 mm plates. These plates will be used to run thermal characterization as cone calorimeter test.
| Number | Date | Country | Kind |
|---|---|---|---|
| GB 1119824.9 | Nov 2011 | GB | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/EP2012/072628 | 11/14/2012 | WO | 00 | 5/15/2014 |
