| Shoten, Asakura, “Electroless Plating,” 3rd ed., Apr. 25, 1971, p. 64, (with translation). |
| de Minger, C.H., et al., “The Nucleation with SnCL2—PdCL2 Solutions of Glass Before Electroless Plating”, J. Electrochem Soc., Electrochemical Science and Technology, vol. 120, No. 12, Dec., 1973, pps. 1644-1650. |
| Database WPI, Week 28, Derwent Publications Ltd., London, Great Britain, AN 85-167819 and JP-A-60 096 548 (Nippon Chem Ind KK), May 30, 1985. |
| “New Engineering Review of Coating,” New Surface Treatment Technology Review, Published by T. Hirano at K.K. Industrial Technology Service Centre, Tokyo-to, Japan, Oct. 10, 1989, pp. 225-226. |
| Kuznetsov, A. Ya et al., “Methods of Improving the Adhesion of Metallic Silver Films to the Surface of Glass and Quartz,” Sov. J. Opt. Technol., vol. 42, No. 10, pps. 604-605. |
| Charles Davidoff, “Metallizing Nonconductors”, Metal Finishing, 61st Guidebook and Director Issue, vol. 91, No. 1A, pp. 322-328, Jan., 1993. |
| ASTM Designation: B 368-85, “Standard Method for Copper-Accelerated Acetic Acid-Salt Spray (Fog) Testing (CASS Test),” pp: 136-139, (1990). |
| ISO 9227:1990(E), “Corrosion tests in artificial atmospheres—Salt spray tests,” pp: ii-iii and pp: 1-9, (1990). |
| Ullmann's Encyklopädie dir technischen Chemie, 4ed., vol. 21, pp: 633-636, 1982. |
| Lind et al., Heliostate Mirror Survey and Analysis, Sep., 1979. |
| Goldie, Electroless Copper Disposition, Plating (Journal of the American Electroplating Society), Nov., 1964, vol. 51, No. 11, pp: 1069-1074. |