Patent Application
20210322585
In the following description, reference is made to the accompanying drawings that form a part hereof and in which is shown by way of illustration specific embodiments that may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that structural, logical, and electrical changes may be made without departing from the scope of the present invention. The following description of example embodiments is, therefore, not to be taken in a limited sense, and the scope of the present invention is defined by the appended claims. The present application describes embodiments of light emitting diode light fixtures.
In various embodiments, a light emitting diode light fixture can produce light for indoor areas and may also produce a large volume of light for lighting large areas, such as parking lots, parking ramps, highways, streets, stores, warehouses, gas station canopies, and other locations. One or more light emitting diodes may be encapsulated into a substrate, such as a circuit board. The light emitting diodes may emit light of a specific color (e.g., wavelength) or specific color temperature (e.g., hue). For example, a light emitting diode may be red, green, yellowish white (2,700 K. color temperature), bluish white (5,700 K color temperature), or other colors or color temperatures. In some embodiments, the substrate may be mounted on a cylindrical body portion to facilitate an electronic connection with an electronics module. The substrate and cylindrical body portion may be included within a cartridge. The cartridge may be mounted on or within a heat sink cooling structure. Some embodiments will mount the substrate at or near the end of the cartridge, where the end of the cartridge may be at or near the end of the heat sink to facilitate access to the substrate. To improve thermal diffusion, other embodiments may mount the cartridge near the center of mass of the heat sink, and use one or more lenses to focus light as described below. To improve light dispersion, one or more optical components may be mounted to surround the lens.
In some embodiments Silver Titanium Dioxide is added to a material to provide multiple characteristics. Silver Titanium Dioxide is photocatalytic such that it is activated by light. The material may be a fibrous material to which the silver titanium dioxide may be applied to. The Silver Titanium Dioxide may be added to a material during formation of the material and may also be added to an outside of the material following material formation into a desired shape such as a mask.
Silver Titanium Dioxide may operate as a catalyst on the outer material or light bulb shell made out of glass, now pmma, or poly carbonate, but not limited to, the outer shell of different shapes for bulbs, tubes, flat shapes, bell shape, cover, enclosing, encasing shapes and others. In still further embodiments, Silver Titanium Dioxide may be inhaled by fine mist or vapor in the air, or maybe added to materials such as fixtures holding light emitting diodes.
In portions of the material exposed to the emitted visible light in the 400 nm range or higher, the Silver Titanium Dioxide acts as a photo catalyst for degradation of organic molecule pollutants, and microbes with or without light. In one embodiment, the Silver Titanium Dioxide may be in the form of nanoparticles or crystals, which may be pressure released into the air in a mist or aerosol and may be inhaled to remove virus and bacteria and any organic contaminates from the lungs, or maybe used to coat any surface in a room. The nanoparticles may be formed by extracting Ag TiO2 from peroxides and heating the particles to 250-260° C. The use of crystalline particles, including nanometer sized crystalline particles may both increase the surface area and hence photocatalytic efficiency of the silver (Ag) Titanium oxide and enable activation with visible light. In one embodiment, the crystalline particles are on average, less than 20 nm in diameter.
In one set of embodiments involving light emitting diodes with interchangeable components, the cartridges, heat sinks, lenses, or optical component may be individually replaceable. Individually replaceable components may avoid the need to replace an entire fixture. For example, if the light emitting diode or electronics within the cartridge fails, the cartridge may be replaced without requiring replacement of the lens. Additionally, the cartridges, heat sinks, lenses, or optical components may be manufactured to facilitate replacement by a user. For example, the lens may slide within the cartridge, the cartridge and lens may slide within the heat sink, and the lens may be mounted on the heat sink. The components may be mounted using a friction fit, where the friction fit enables user replacement of components, but is also secure enough to maintain the fixture structure.
The heat sink 120 in one example has a plurality of fins 125 extending laterally from a depression 130 to dissipate heat away from the substrate or light emitting diodes. Because the light fixture 100 may be used for indoor or outdoor applications, some embodiments are able to withstand a large ambient temperature range and inclement weather conditions while still efficiently emitting light. The heat dissipating fins 125 draw heat away from the light emitting diode to prevent damage to the light emitting diode or the surrounding components. In one embodiment, the heat dissipating fins 125 may be reflective to improve light dispersal. The heat dissipating fins 125 may be manufactured using a reflective material, or may be coated with a reflective material. The reflective surfaces may also reduce the amount of light absorbed by the surface of the heat dissipating fins 125, thereby improving the heat dissipating properties of the heat sink 120.
Further embodiments of the heat sink are illustrated at 150, 160, 170, and 180 in
The base 105 or heat sink 120 may be manufactured using aluminum or copper to provide both strength and heat dissipation to moderate the substrate temperature. The base 105 or heat sink 120 may be manufactured using a reflective material such as a polished metal, or may be coated with a reflective material such as zinc, tin, copper, silver, or other materials. The reflective material may be used to improve light dispersion and heat dissipation. The substrate may be integrated with the heat sink 120 and provide teed through electrical conductors to the light emitting diodes.
In one embodiment, heat sink 120 may be designed to accommodate a removable and replaceable light emitting diode substrate. The heat sink 120 may itself have one of several different light fixture connector types, including but not limited to Edison type connections, bayonet-type connections, or snap-in or friction connections.
The heat sink depression 130 may extend to the middle of the heat sink in some embodiments to facilitate heat dissipation. The depression 130 may hold the substrate, light emitting diodes, and optical component 135 at the bottom of the depression. In some embodiments, the depression 130 may extend only marginally into the heat sink, since much of the heat generated by the LEDs is radiated from a bottom of the substrate, opposite the direction of light emission. The optical component 135 focuses light away from the substrate and directly out of the heat sink 120. The substrate is thermally coupled to the walls of the depression 130 within the heat sink 120. The light emitting diodes are electrically coupled to the substrate, and the substrate is electrically coupled to the electronics within the base 105.
The optical component 135 coupled to the light emitting diode may provide a protective seal. The optical component 135 may be placed on and adhered to a filling material surrounding the actual light emitting diode. As the filling material solidifies, the optical component 135 may be securely fastened to the filling material.
In one example embodiment, the depression 130 may be cylindrical, and extends a sufficient distance into the heat sink to support a lens 140. The lens 140 is optically coupled to the optical component 135. In some embodiments, a gel may be disposed between the lens 140 and the optical component 135 to facilitate transfer of light from the optical component 135 to the lens 140. The gel may provide a watertight seal and protect the electrical connections from moisture or dirt that might degrade the electrical contact formed by such connections. In further embodiments, the gel operates to provide a seal over a wide depth of compression.
In one embodiment, the lens 140 may be cylindrical or have a polygonal cross section, fits within the depression 130, which may also have a cylindrical or polygonal cross section. The lens 140 may be adhered by a sealant between the lens 140 and the depression 130. The lens 140 may be a plastic rod, a glass rod, or a cylinder of another transparent or translucent material suitable for transmission and focusing of light. The lens 140 has a divot 145 on the end opposite from the optical component 135, and the divot is used to disperse light omnidirectionally. The divot 145 may be a conical shaped bore, and the walls of the bore may reflect light from within the lens in a 360-degree dispersal pattern about the lens. The divot 145 may have a pointed or rounded tip. The lens 140 or divot 145 may be substantially transparent, or may be coated with a translucent or colored material to soften the light emitted from the fixture. The lens 140 has a divot 145 may be formed using injection molding, or may be formed using precision glass molding or glass grinding and polishing.
In some embodiments, the divot may have an angulated point, and may have many facets, such as a four or more to obtain a desired pattern of light reflection. In some cases, the divot 145 may provide for reflection about a selected angle such as between 90 to 360 degrees. In one embodiment, the divot 145 may provide for a reflection that directs a portion of the light toward the reflective heat sink 120, where the reflective heat sink surface disperses light. To improve dispersal of light from the divot, the reflective heat sink core may have a greater diameter at the base than at the end away from the base. In further embodiments, a multifaceted divot may be used to obtain selected light patterns.
Many different types and shapes of lenses may be used. For large area high intensity lighting applications, the lens may be shaped to provide directional lighting, or a widely dispersed beam of light such that when all the modules in an array are properly oriented, a desired pattern of light is provided to light a large area, such as a parking lots, parking ramps, highways, streets, stores, warehouses, gas station canopies. Similarly, different lenses may be used for many different applications, such as for forming spotlights, narrow beams from each module may be desired.
In further embodiments, the substrate may be a simple circuit board or other suitable material for supporting light emitting diodes. The substrate may be fixed into the heat sink with adhesive or mechanical means of securing the substrate and thermally coupling it to the heat sink. Wires may be provided to couple the light emitting diodes to the driver circuitry in the base 105. In this embodiment, the light emitting diode portion of the light fixture is not easily removable by a consumer.
In still further embodiments, the light emitting diodes may be formed in, or coupled directly into the lens 140, such that light is directly coupled to the lens, with a back side of the light emitting diodes positioned when assembled to conduct heat directly to the heat sink. The rod at the end proximate the light emitting diodes may also be shaped to facilitate light transmission from the light emitting diodes directly into the rod without the need for further optical components.
In some embodiments, a light emitting diode module may be utilized with a desired number of light emitting diodes. The module may be mounted on a substrate with an integrated heat sink, such as a plate that may be thermally coupled to the heat sink 130. The light emitting diode module may also contain an integrated lens to direct light away from the light emitting diode. This module may be embedded directly into the end of the lens, which may be formed by injection molding, or cut from rod stock in various embodiments. Further methods of forming the lens may be used, as well as different methods of optically coupling the light emitting diode or light emitting diode module to the lens and to the heat sink.
Standardizing the position of the rod 140 with respect to the light emitting diode module 182 allows the elimination of additional optical elements and optical gel to capture light from the light emitting diode module 182 into the rod 140. In one embodiment, the ledge 181 along with the curvature of the convex end 183 of the rod 140 is selected to provide consistent spacing from light emitting diode module 182 to capture the light from the light emitting diodes.
Many different length rods 140, and rods 140 with many different light dispersal mechanisms, may be used. The end of the rod 140 distal to the light emitting diode module 182 may include a dimple in some embodiments to provide light like a standard incandescent light bulb, with a center of light consistent with current standard 40, 60, and 100 watt bulbs if desired. The rod may also be shaped with a concave or convex surface to provide an emitted light dispersal pattern consistent with spot or floodlights in further embodiments. Simply utilizing a different rod for a different light dispersal pattern provides a simple, flexible way to adapt the light fixture to many different applications currently done with other types of lighting. For example, shorter rods with selected end characteristics may be used for streetlight or flood light applications. In some embodiments, the rods may be interchangeable, either by the consumer or during manufacture with little process change. An interchangeable rod may be replaced with a rod that provides a different light dispersion pattern. An interchangeable rod also enables a user to access other components, thereby facilitating replacement of the electronics package, the heat sink, or the optical component. Simply using the existing heat sink with ledge and electronics package provides great flexibility in solving many different lighting needs.
In one embodiment, the rod may be about 22 mm in diameter, and the ledge 181 may be approximately ½ mm. Other dimensions may be utilized in different embodiments. The curvature of the convex end 183 of the rod 140 may be approximately 3/16ths to ⅛ inches in one embodiment, and may vary significantly in further embodiments. The curvature and length between the end 183 and the light emitting diode module 182 may be selected to optimize optical coupling of the rod 140 and light emitting diode module 182. In further embodiments, the light emitting diode module 182 may also include one or more lenses.
A second end of the substrate body portion 200 may include a foot 225 spaced apart from the body portion and at least partially formed of an electrically insulating material. Foot 225 is formed in an oval shape in one embodiment, with contacts 230 positioned at both ends of the oval shape. In one embodiment, the contacts extend to the side of the foot that is not shown, but is facing the body portion 210. When the foot 225 is inserted through the heat sink depression 130 into the base socket 115 (shown in MG. 2B as a plane 245) and twisted into position, it brings the contacts 230 into good electrical connection with power contacts 240 to supply power to the module 200 from the driver electronic in base 105. Conductors 235 may be coupled to contacts 240 and fed through an opening in the foot 225 back through the body portion to supply power to the LED.
In further embodiments, as shown in
The substrate is inserted in the socket 115 on the base 105, then turned into position as to align the contact points 230 with power contacts 240 to couple to the driver electronics. The pressure on the contact points 230 may be developed from a compression fit against spring-loaded contacts, or via compression of washer or other feature in various example embodiments. The inside of the base 245 creates extensive pressure between contact points 230 and power contacts 240, ensuring reliable electrical contact through a wide range of expansion or contraction of the fixture.
In various embodiments, one or more light emitting diodes may be positioned on the substrate with one or more cones 310 corresponding to each light emitting diode, or a single cone 310 may be formed over more than one light emitting diode to help couple light into the rod 145.
In one embodiment, the base, heat sink, substrate, light emitting diodes, optical component, and lens may be replaced as a single unit. In another embodiment, the base, including driver electronics and heat sink may form one component, and the substrate, light emitting diodes, optical component, and lens may form a second component. In other embodiments, each of the heat sink, substrate, light emitting diodes, optical component, and lens may be replaced separately. The ability to replace components separately can be desirable, such as if the mean time between failures for one component is significantly shorter than for another component. The ability to select different lenses can also be beneficial for different lighting needs of a consumer. In some embodiments, the components may be assembled using a friction fit that renders them easily replaceable by a consumer. In further embodiments, all the components may be assembled in a manner that renders them not easily replaceable by a consumer, such as in industrial lighting applications.
In one embodiment, the cooling structures 420 and modules 410 are supported by the LED matrix 405, which may be formed of aluminum in one embodiment to provide both strength and heat conduction to help keep the modules 410 cool. In one embodiment, the LED matrix 405 may be formed of glass to provide strength, heat conduction to help keep the modules 410 cool, and low thermal expansion. A board 430, such as a circuit board, may be placed integrated with the cooling structures 420 and provides appropriate feed through electrical conductors between the modules 410. In one embodiment, board 430 may be a standard circuit board with metallization for forming the conductors. In one embodiment, a frame 440 may be formed around the matrix and be integrated with the matrix.
The matrix and cooling structures 420 may be formed of aluminum, copper, or other material that provides adequate structural support, is lightweight, and conducts heat well. The matrix and cooling structures 420 may be formed of a reflective material such as a polished metal, or may be coated with a reflective material such as zinc, tin, copper, silver, or other materials. The reflective material may be used to improve light dispersion and heat dissipation. In one embodiment, the matrix and cooling structures 420 may be formed of glass to provide strength, heat conduction, and low thermal expansion. A plurality of electrical sockets 450 may be formed on the matrix between the cooling structures and are secured to the board 430 in one embodiment, forming a matrix of electrical sockets 450 that may be electrically interconnected in two dimensions by the board 430. One or more light emitting diode modules 410 may be individually removable and replaceable within any individual electrical socket within the matrix, and one or more lenses may be mounted to each of the light emitting diode modules 410. In one embodiment, a combination of light emitting diode modules 410 of different color temperatures may be chosen to provide a desired color combination. For example, a combination of yellowish white (2,700 K color temperature) and bluish white (5,700 K color temperature) light emitting diode modules 410 may be used in a matrix to provide a white (e.g., 4,300 K color temperature) light. During replacement of light emitting diode modules 420, the lens may be removed from a failed light emitting diode module and mounted to a replacement light emitting diode module. One or more light emitting diode modules 410 may be rigid in one embodiment and may be secured within the matrix 405 by an epoxy or other filler material having suitable heat conducting and retentive properties to ensure the board 430 is securely held in place over the sockets 450.
As may be seen in
Each individual light emitting diode module as shown in further detail at 600 in
The base 610 of the light emitting diode module 600 may include heat dissipating radial fins 630 to dissipate heat away from the electrical socket 450 and leads or contacts 640 for coupling to connectors on board 430 for providing power to the light emitting diode 620. Because the light emitting diode module 600 may be used for both inside and outside applications, some embodiments are able to withstand a large ambient temperature range provided it is not too warm for proper operation, and may also withstand inclement weather conditions including rain, snow, ice, dust, winds, while still efficiently emitting light. The heat dissipating fins 630 may extend radially from a top of the base 610, drawing heat away from the light emitting diode 620, and acting as a heat sink to prevent damage to the light emitting diode or the surrounding components.
If a different supply level is provided, and/or different light emitting diodes are used with different voltage drops, it is a simple matter to divide the supply by the voltage drop to determine how many sockets should be connected serially. The board may then be reconfigured consistent with the number of sockets needed. As shown in
In still further embodiments, adaptive power supplies may be used, and the number of modules in series may be varied with the supply adapting to the proper output required to drive the modules. All sockets may be active with such drivers and modules plugged in as desired. In some embodiments, modules may be removed or added in series if needed to be compatible with the supply and driver circuitry. All the sockets may be wired in series in one embodiment. Plugs to short circuit open sockets may be used to maintain the series connection, or suitable bypass circuitry may be used to maintain a series connection if modules in sockets have malfunctioned, or sockets are not used in some lighting applications.
In one embodiment, the current sockets are arranged in an oval shape, but many other shapes may be easily used. The board 710 may be suitably shaped to conform to the sockets to provide a shape suitable for aesthetic design purposes. Similarly, the matrix 405 as shown in
The matrix 405 and board 430 in some embodiments may be made of any weather resistant metal such as aluminum, copper, or other material suitable for dissipating heat. In one embodiment, the electrical sockets are in a uniformly disbursed triangular matrix in relation to each other and may be part of a cast matrix 405.
In one embodiment, the electrical sockets 450 may be designed to accommodate a removable and replaceable light emitting diode module with different connection types including, but not limited to, screw-in or Edison type connections, a bayonet-type connection, and snap-in or friction connection as illustrated at 800 in
In
In one embodiment, a sealing member such as a ring, disk or washer 840 is positioned between the module 805 and a surface of the socket 835. The sealing member 840 is compressed when the module 805 is fully secured by the pins and mating connectors to provide a watertight seal and protect the electrical connections from elements which might degrade the electrical contact formed by such connections. In various embodiments, the sealing member may be formed of rubber, latex, Teflon, silicon rubber or like compressible material. To provide for larger tolerances with respect to the thickness of the board 830 and the distance of the connectors 820, 825 from the module when seated in the socket, the compressible sealing member may be formed with a hollow center in some embodiments. In further embodiments, the sealing member operates to provide a seal over a wide depth of compression.
In a further embodiment, plugs may be formed in the same shape as module 805, having pins that mate with the mating connectors 820, 825 to provide a seal around sockets that are not used for operational modules. The pins of such plugs may be electrically isolated from each other to ensure that no short circuits occur, or may provide a short circuit to maintain a series connection in a pre-wired string of sockets. Such plugs ensure integrity of all electrical connections in the board when properly used in all sockets not containing modules 805.
The ability to easily remove and replace modules in a sealing manner facilitates maintenance and repair of high intensity large volume matrix lighting solutions. Each individual light emitting diode module may be removed from an individual socket within the matrix. Because the individual light emitting diode modules are individually replaceable, if one module fails there is no need to replace an entire bundle or group of electrical sockets or modules. Simple removal and replacement of the failed module may be quickly performed. Furthermore, light emitting diode modules emitting different colors may be rearranged within the matrix to produce different color arrangements without replacement of the entire bundle of electrical sockets or modules.
Module 805 also illustrates a lens 850 coupled to the light emitting diode within module 805 and providing a protective seal. The lens 850 may be placed on and adhered to a filling material surrounding the actual light emitting diode. As the filling material solidifies, the lens may be securely fastened to the filling material. Many different types and shapes of lenses may be used. For large area high intensity lighting applications, the lens may be shaped to provide directional lighting, or a widely dispersed beam of light such that when all the modules in an array are properly oriented, a desired pattern of light is provided to light a large area, such as a parking lots, parking ramps, highways, streets, stores, warehouses, gas station canopies. Similarly, different lenses may be used for many different applications, such as for forming spotlights, narrow beams from each module may be desired.
Module 805 may also be provided with guides 845, which along with mating guides in a socket, ensure that the module is inserted into the socket in a desired orientation. In one embodiment, the guides 845 may be ridges extending outward from the module and mating with grooves in the module to provide a guide. In further embodiments, the grooves may be on the module with mating ridges on the socket. Many different shapes and combinations of grooves and ridges may be provided in various embodiments.
In yet a further embodiment, board 830 may be formed with a filling material 5860, and a further board 865. Such a combination provides a seal for the conductors on the board and protects them from the elements.
In one embodiment, a circuit board may have 240 available sockets for modules, to allow flexibility in positioning modules. In some embodiments, different types of modules, such as different color modules may be interspersed throughout the board. In one example, 90 white light modules, and 30 yellow light modules may be properly inserted into sockets and independently controllable, either by separate circuits, or by predetermined wiring. Many other different combinations and total numbers of sockets per circuit board may be used in further embodiments, including boards that support 60 to 90 sockets, 90 to 120 sockets, and 120-160 sockets for example.
In one embodiment, both sides of the fins 1620 are reflective to light generated by the light emitting diode. The inside of tube 1610 is also reflective in one embodiment to facilitate reflection of light, and to minimize absorption of heat from the light. Still further, the outside of tube 1610 may also be reflective, as is a top surface 1625 of an electronics module 1630. Making one or more surfaces proximate the light emitting diode reflective of light generated by the light emitting diode can provide the benefit of further light dispersal and less heat being absorbed by the light bulb 1600, as less of the generated light is absorbed by non-reflective surfaces. In still further embodiments, a PCB board on which the light emitting diodes are supported may also be reflective.
In one embodiment, the fins 1620 may be formed by folding a material that is reflective on at least one side and crimp fitting the folded material between slots formed in the outside of the tube 1610. In other embodiments, a fin may be formed that is reflective on both sides, and need not be folded. While 24 fins are shown, fewer or more fins may be used in further embodiments. The number of fins may vary based on aesthetic design desires, reflective properties, and thermal dispersion properties.
As indicated in one example embodiment, the fins extend further from the top of the tube, and then taper down to extend a similar radius out from the tube as the radius of the electronics module, creating a lean shape, similar to that of a common incandescent light bulb, albeit slight wider than the normal connector to a standard Edison socket. The width of the electronics module may be larger than a standard Edison socket in order to accommodate circuitry utilized to drive the led package. In some embodiments, larger capacitors may be used that take up space. Some electronic elements may extend into the tube and even into the male Edison connector portion of the light bulb.
Bulb 1820 is shown with a short lens 1825 that may have a flat top surface for emitting light in a pattern similar to that of a spot light or flood light. The lens 1825 includes a reflective collar 1827 extending from the top of the tube a distance along a length of the lens to facilitate projection of the light out the top of the lens 1825. In various embodiments, the side of the collar adjacent the lens is reflective to light emitted from the light emitting diode. The outside of the collar may also be reflective. The collar may extend the full length of the lens in some embodiments, or only a portion of the length of the lens depending on the dispersal pattern of light that is desired.
Bulb 1830 is shown with a similar collar 1833 and a lens 1835 with a tapered edge indicated at 1837. The tapered edge 1837 provides for more light dispersion directed out from the flat surface of the lens created by the taper than dispersed from other sides of the lens.
Bulb 1840 is shown with a clouded plastic dome shaped cover 1845 that creates a software light bulb like dispersion from a lens inside the cover. As previously indicated, the bulb 1840 appearance is more like that of a standard incandescent soft light bulb except for a wider base where it contacts the Edison style connector portion of the bulb.
Many different types of lenses may be used, with the base becoming a standard part that can be used for many different types of light bulbs suitable for different applications, such as in a lamp shade, a street light using an array of light bulbs, a trouble light, spot light, flood light, etc. It should also be noted that in some embodiments none or only some of the components are reflective. The rod lens can formed of plastic, glass, or other transparent or semi-transparent material. In further embodiments, the rod cross section may take many different shapes, such as round, star shaped, square shaped, triangular shaped, etc. It may also be multi-faceted to produce different types of effects. Where a divot is used in the end of the rod, the divot may be cone shaped or even multifaceted in some embodiments to produce a cut gemstone-like appearance.
As indicated, a portion of the rod extends out the other side of the plate to couple the plate and dome to a tube 2120 portion of the light bulb 2100 that contains one or more light emitting diodes recessed into the tube. The rod 2105, when assembled, extends into the tube in a manner that securely retains the top portion of the light bulb 2100. This may be accomplished via a friction fit, a snap fit where a portion of the rod may have a recession or protuberance that makes with a corresponding protuberance or recession in the tube, or even via matting threaded portions on the rod and tube to hold the rod in the tube a selected distance from the light emitting diodes. The distance may be obtained by positioning of the snap fit features, threads, one or more ledges within the tube or on the lens, or by any other means. The tube is also coupled to heat sink fins as illustrated, and to an electronics base 2125 and Edison connector as shown in previous figures.
In one embodiment, the light emitting portion of the light emitting diode package may extend to or beyond the end of the tube in order to allow for broad dispersal of emitted light. The heat sink 2420, when assembled with the tube may extend beyond the light emitting diode, creating a cylindrical opening in which the lens 2425 may be supported and optionally fixed adjacent the light emitting diode in a secure manner, such as by use of silicon or other suitable adhesive. The depth of the cylindrical opening may be selected to enable insertion and retention of one of many different rods to disperse light in different patterns for different applications. The depth may further be selected to facilitate heat transfer by the heat sink, which includes multiple fins.
In one embodiment, the heat sink 2420, including the fins may be a single part of clear glass, plastic, or Plexiglas to increase the number of lumens per watt emitted to ambient from the light bulb. The clear heat sink embodiment may allow a light having an 8-13 watt LED to emit light equivalent to a 100 watt incandescent bulb. The transparent fins also reflect light from the light emitting diode, further enhancing the number of lumen per watt. Making one or more surfaces proximate the light emitting diode reflective of light generated by the light emitting diode can provide the benefit of further light dispersal and less heat being absorbed by the light bulb, as less of the generated light is absorbed by non-reflective or opaque surfaces. In still further embodiments, a PCB board on which the light emitting diodes are supported may be reflective.
In various embodiments, the number of fins may vary based on aesthetic design desires, reflective properties, and thermal dispersion properties.
As indicated in one example embodiment, the fins extend further from the top of the tube, and then taper down to extend a similar radius out from the tube as the radius of the electronics module, creating a lean shape, similar to that of a common incandescent light bulb, albeit slight wider than the normal connector to a standard Edison socket. The width of the electronics module in one embodiment is the same as or less than a standard Edison socket in order to accommodate circuitry utilized to drive the led package. In some embodiments, the circuitry includes sensors to sense temperature, and circuitry to reduce a duty cycle to ensure that the electronics are not subjected to excess heat that may decrease the mean time between failure of the electronics, allowing the electronics to function for the same amount of time as the projected lifetime of the light emitting diode. While this may result in periods of fewer lumens during times of high ambient temperatures, the effect should be well worth the tradeoff of a longer light bulb life. In addition, the feature may also aid utility companies in reducing peak demand during periods of high ambient temperatures. Some electronic elements may extend into the tube and even into the male Edison connector portion of the light bulb.
In one embodiment, a dome cover 2430 may be adapted to snap fit to and over the tops of the fins of the heat sink. In this embodiment, the dome cover 2430 is not supported by the lens, but rather by the fins, with the lens 2425 supported in the cavity formed by the combination of the central tube and heat sink. This results in a very easy to assemble LED based light bulb, with various power ranges, currently from 8 or less to 15 or more watts, producing lumens equivalent to 100 watt to 250 watt incandescent light bulbs. In still further embodiments, the dome 2430 may be shaped to connect to the fins or central tube at or near the central tube. In one embodiment, the dome 2430 then extends out from at or near the central tube to the exterior of the fins prior to extending upwards, such that the light bulb still has a shape similar to a standard 100 watt incandescent bulb, or other bulb, such as a flood light shape, candelabra shape, or other shape.
Using glass to form the heat sink, fins 2610, and dome 2615 may increase the number of lumens per watt emitted to ambient from the light bulb. The transparent glass fins 2610 also reflect light from the light emitting diode, further enhancing the number of lumen per watt. Making one or more glass surfaces proximate the light emitting diode reflective of light generated by the light emitting diode can provide the benefit of further light dispersal and less heat being absorbed by the light bulb.
In one embodiment, a lens, and/or fins may or may not be included in the light bulb. Dome 2910 in this embodiment, as seen in
Silver Titanium Dioxide, when exposed to UV or visual light, will act as a catalyst to react with air to create a hydroxyl, OH, radical or hydroxy group (—OH) that attacks microbes, bacteria, viruses, allergens and pollutants, which are decomposed producing by products that are less harmful, such as water, and CO2. LED's emit a visual light photons in the 400-500+nm range. As such, the Silver Photocatalytic Titanium Dioxide operates more efficiently as a photo catalyst to create OH, —OH, and O2 from ambient air as photons of visual light passes through the Titanium Dioxide. OH, —OH, and O2 are lethal to bacteria, viruses and other microbes, mold and organic pollutants. Silver continues virus and bacteria degradation or breaking down with or without light effectively removing the virus and/or bacteria. Ambient refers to an operating environment, which may be outdoors, indoors, in a controlled environment, or other area where the LED based light bulb may operate that has suitable air contact for photocatalytic reaction which may occur when the light bulb is operating, Nano size Silver continues to operate to remove viruses and bacteria and all organic microbes inside the lungs of humans, and all animals.
One or more dopants may be included in the Silver Titanium Dioxide, such as C, Cu, N, Sulfides and other metals and non-metals. In one embodiment, the Silver Titanium Dioxide particles may be nano in size, or crystalline size, which is 0.1 microns or smaller. Small nano particles, and crystals of Silver Titanium Dioxide by volume have a larger surface area and are more efficient than larger particles as a photocatalyst. When sprayed on an outside, dipped, flowed on or infused into the bulb during manufacture of the bulb, nano particles, and crystals of Silver Titanium Dioxide optimize the effectiveness of photocatalytic activity. The concentration of Silver Titanium Dioxide particles may be adjusted based on the LED wattage, lumens produced, and other LED characteristics, and distance from the LED light source.
In one embodiment, the Silver Titanium Dioxide may be formed in a Silver peroxo titanic acid (PTA) solution by mixing titanic acid wet gel and hydrogen peroxide solution. The PTA solution may be a neutral, transparent, stable liquid that crystalizes to form an anatase phase after calcination at a temperature 250° C.-600C in a crystalized form. When autoclaved at a temperature above 100° C. for 6 hours, the solution changes to a solution containing anatase crystals less than 20 nm in diameter. Aggregation of the crystals may occur after autoclaving at a temperature above 120° C. When heated to 100° C., the solution may be translucent and stable, containing anatase crystals approximate 9 nm in diameter.
Dip coating, spraying, flowing, over the LED diffuser and/or fixtures which will be proximate that LEDs in the solution may provide enhanced photocatalytic effect from light emitted in the visible spectrum, such as at least 400 nm to 500 nm or higher wavelength light. In further embodiments, a spray induction coupled plasma techniques or a spray combustion flame technique. The solution sprayed may be derived from TiCl4 solution and transformed to a neutral translucent solution containing peroxo-modified anatase crystals by heating. Other known or yet to be discovered methods of creating stable Silver Titanium oxide nanoparticles that may be applied in various ways to diffusers and fixtures and all surfaces may be used in further embodiments, such as inhaling the Silver for its Virus, and Bacteria killing natural abilities in human lungs, using the Titanium Dioxide as a harmless vehicle to carry a precise amount, such as 0.01% by weight of Silver in to the lungs when inhaled.
In one embodiment, the Silver Titanium Dioxide coating may be formed using a method described in U.S. Pat. No. 6,602,918 (hereby incorporated by reference at least for it teaching of forming a Silver Titanium Dioxide coating) by producing a silver titanium oxide-forming solution, wherein a hydrogen peroxide solution is added to a silver titanium-containing starting aqueous solution to form a silver peroxotitanium complex, a basic substance is then added to the peroxotitanium complex to obtain a solution which is in turn let stand or heated, thereby forming a precipitate of a silver peroxotitanium hydrate polymer, at least a dissolved component derived from the titanium-containing starting aqueous solution, except water, is then removed from the precipitate, and a hydroxide peroxide solution is finally allowed to act on a dissolved component-free precipitate. A dispersion with Silver Titanium Dioxide may be dispersed therein to keep the Silver Titanium Dioxide in suspension. The resulting nano sized crystalline structure may make the commercially available coating more photocatalytic such that the crystals stay in solution/suspension. In one embodiment the solution is TPX 220 available from Green Millennium in LA CA. This solution has a higher parts-per-million of crystals than other solutions, which appear to have a higher photocatalytic reaction rate than lower concentration solutions, such as TPX HL 85 or TPX AG 85 or TPX 85. Note that lower concentration solutions will also work in other special applications. The solutions may also be applied by waterfall (pouring it over the surface). A surfactant may be added to the solution to act as a wetting agent reduce surface tension allowing the coating to be uniform and avoid puddling.
In some embodiments, higher photocatalytic activity occurs where electron-hole recombination becomes difficult. The following two graphs describe and equation for determining electron-hold recombination rate and a comparison of different solutions.
[e]0=electron concentration at time zero
kr=second order rate constant for electron-hold recombination
BL baseline
The smaller of rate constant (k r), the more difficult for electron-hole recombination to occur, therefore higher photocatalytic activity is observed.
One example method of producing the Silver Titanium Dioxide includes:
A 30% solution of hydrogen peroxide (20 ml) was added to and stirred with a solution (500 ml) of a 60% aqueous solution of titanium tetrachloride (5 ml) diluted with distilled water to prepare a transparent, brown solution. Ammonia water (1:9) was added dropwise to the solution to regulate the pH of the solution to 7, thereby preparing a transparent, yellow solution. The obtained solution was let stand at 25. degree. C. for a whole day and night to obtain yellow precipitates.
Distilled water was added to the precipitates after filtered and washed to prepare a solution (about 150 ml), and a cation exchange resin and an anion exchange resin, each in an amount of 25 g, were charged into the solution, which was then let stand for 30 minutes for removal of cationic and anionic substances.
An H+′ substituted type resin obtained by treating Amberite IR120B (Na+ substituted type, and made by Organo Co., Ltd.) with 2N hydrochloric acid for 1 hour was used for the cation ion exchange resin, and an OH− substituted type resin obtained by treating Amberite 1RA410 (Cl− substituted type, and made by Organo Co., Ltd.) with IN sodium hydroxide for 1 hour was used for the anion exchange resin.
Powders obtained by drying the resultant yellow precipitates at 25° C. were measured with an X-ray diffactometer (RAD-B made by Rigaku Denki Co., Ltd.) using a copper target while it was operated at an acceleration voltage of 30 kV and with a current of 15 mA. The obtained precipitates were found to be in an amorphous state.
On the other hand, the powders obtained by drying at 25° C. were mixed with potassium bromide to prepare a tablet. According to the potassium bromide tablet method, the tablet was then measured using a Fourier transform infrared absorption spectrometer (FT/IR-5300 made by Nippon Bunko Co., Ltd.) in combination with a transmission technique. Absorption was found in the vicinity of 900 cm−1, indicating the presence of peroxo groups.
Then, the ion exchange resins were removed by filtration, and distilled water was added to prepare a solution (about 180 ml), which was in turn cooled with ice water. Thereafter, a 30% solution of hydrogen peroxide (20 ml) was added to the solution, followed by cooling. After the lapse of 1 hour, a transparent, yellow solution (200 ml) containing titanium was obtained.
After a one-month or longer storage in a refrigerator at 7° C., the solution remained unchanged. Five days after preparation, the pH of the transparent, yellow solution was 5.1. Powders obtained by drying this solution at normal temperature, too, were similarly measured by X-ray diffraction. From the results of X-ray diffraction, it was found that the powders were in a non-crystalline state having no peak indicative of crystallinity. Results of a Fourier transform infrared spectroscopy resulted in absorption being found in the vicinity of 900 cm indicating the presence of a number of peroxo groups.
In one embodiment, the material is a mask, such as a fibrous material designed to filter air being breathed by a person. Cloth may be used as a fibrous material in some embodiments. Both breathing in and breathing out may subject pathogens in the air to the coating, thus potentially protecting the wearer and others around the wearer. The material may also take many different shapes such as a fibrous dome or a plastic dome. The dome may also serve as a face mask or a diffuser for a light bulb.
In one embodiment, air can pass through the material, as in the case of the material being formed as a mask. The mask may be a homemade mask made from various fibrous materials such as cloth, furnace filter material, or may be purchased dust mask or surgical mask such as an N95 or N99 mask. The SilverTitaniurn Dioxide coating may be applied to the inside of the mask in addition to or alternatively to coating the outside of the mask. By coating the mask, the mask may be useable for longer periods of time as microbes may be destroyed by the coating, especially when exposed to a source of light, such as UV light. The UV light may be provided by a light emitting diode package that includes an electronics module to control the light emitting diodes. Various masks may have one or more layers which may or may not be individually coated.
The coated material may be in the shape of a dome or any shape or any material surface coated or embedded with Silver Titanium DioxideTiO2 particles. Optical coupling of the material to the light emitting diode package or even various forms of visible light may cause the material infused with Titanium oxideTiO2 acts as a photo-catalyst producing a bacteria stat, fungus stat, virus stat, and removing all organic molecules and microbes. The silver particles may operation similarly without the need for exposure to light.
In a further embodiment, a visible organic material may be applied to the coated diffuser to demonstrate the photocatalytic operation of the coating. India ink, which is an organic ink, may be used in one embodiment and may be applied as visible spot on the diffuser. Any visible color of ink may be used, such as red, black, blue, or other color. With the coated bulb producing light, an observer can watch as the visible spot disappears. The spot may also take the shape of a design, such as a logo, or letters, or even the shape of a magnified bacteria, or a tattoo on human skin.
In various embodiments, a solution containing photocatalytic titanium dioxide particles may be used to help remove tattoos. Tattoos may be formed using India ink, an organic form of ink. The solution may be applied to the skin of the person having one or more tattoos and exposed to light to help remove the tattoo. Some tattoos may be fairly deeply embedded in the skin, and skin density may vary from person to person, Various methods of applying the solution in one or multiple treatments may be used, and various methods of exposing the treated skin to light may also be used.
In one embodiment, a method of treating tattoos includes obtaining a solution containing titanium dioxide particles and applying the solution to a material imbedded with organic India ink. The material may be human body skin. The tattoo may be formed of organic India ink. The solution may be applied with air pressure greater than atmospheric pressure.
The coating may be applied with an air brush in one embodiment or applied by soaking or submerging the material in the solution. The material comprises human skin and the solution may be applied through the skin by including a skin absorbing vehicle such as Dimethyl Sulfoxide (DMSO) increasing the permeability of the stratum corneum (outer layer of the human skin.)
The solution may alternatively be applied through the skin along with a surfactant to increase skin penetration of water-soluble substances, by increasing skin permeability of water. Surfactants that may be used include sodium laural sulfate.
The solution is applied to the skin in any of the above means for a sufficient time to penetrate the material to affect the India ink. Multiple different applications of the solution using one or more of the above methods to significantly reduce or remove the tattoo. The exposure of the material, skin, to light may be performed using any type of light source that activates the photocatalytic titanium dioxide, such as a tanning booth, natural sunlight, LED lights for various lengths of time, such as 5 to 20 minutes or longer for each application.
1. A device includes a diffuser and a silver photocatalytic titanium dioxide coating supported by the diffuser.
2, The device of example 1 wherein the diffusers formed in the shape of a face mask adapted to be worn by a user.
3. The device of example 2 wherein the mask comprises an N95 mask.
4, The device of example 2 wherein the mask comprises a cloth mask.
5. The device of any of examples 1-4 wherein the coating comprises crystallized Silver doped Titanium Dioxide.
6, The device of any of examples 1-5 wherein the coating is applied as a suspension to a surface of the diffuser.
7. The device of example 2 wherein the coated surface comprises an inside of the face mask.
8. The device of any of examples 1-7 where in the Silver photocatalytic Titanium Dioxide is photocatalytic at at least 400 nm wavelength light.
9. The device of any of examples 1-7 where in the Silver photocatalytic Titanium Dioxide is photocatalytic at at least 500 nm wavelength light.
10. The device of any of examples 1-7 where in the silver Titanium Dioxide is photocatalytic at human visible wavelength light.
11. A method includes obtaining a solution containing silver titanium dioxide and atomizing the solution in proximity to an animal for inhalation.
12. The method of example 11 wherein the atomimzed Silver Titanium Dioxide is a Bacteria stat, fungus stat, virus stat, and remove organic molecules, and microbes with no light.
13. A method comprising obtaining a solution containing titanium dioxide particles and applying the solution to a material imbedded with organic India ink.
14. The method of example 13 wherein the material comprises human body skin and the organic India ink comprises a tattoo.
15. The method of any of examples 13-14 wherein the solution is applied with air pressure greater than atmospheric pressure.
16. The method of any of examples 13-14 wherein the coating is applied with an air brush.
17. The method of any of examples 13-14 wherein the solution is applied by soaking or submerging the material in the solution.
18. The method of any of examples 13-17 wherein the material comprises human skin and wherein solution is applied through the skin, along with a skin absorbing vehicle such as Dimethyl Sulfoxide (DMSO) increasing the permeability of the stratum corneum (outer layer of the human skin.)
19. The method of any of examples 13-18 wherein the material comprises human skin and wherein the solution is applied through the skin along with a surfactant to increase skin penetration of water-soluble substances, by, increasing skin permeability of water. Surfactants that may used in sodium laural sulfate.
20. The method of any of examples 13-19 wherein the solution is applied to the material a sufficient time to penetrate the material to affect the India ink.
More examples:
1. A device comprising: a material and a silver photocatalytic titanium dioxide coating supported by the material.
2. The device of example 1 wherein the material is formed in the shape of a face mask adapted to be worn by a user.
3. The device of example 2 wherein the mask comprises an N95 mask.
4. The device of example 2 wherein the mask comprises a cloth mask.
5. The device of example 1 wherein the coating comprises crystallized Silver doped Titanium Dioxide.
6. The device of example 1 wherein the coating is applied as a suspension to a surface of the material.
7, The device of example 2 wherein the coated surface comprises an inside of the face mask.
8. The device of example 1 where in the Silver photocatalytic Titanium Dioxide is photocatalytic at at least 400 nm wavelength light.
9. The device of example 1 where in the Silver photocatalytic Titanium Dioxide is photocatalytic at at least 500 nm wavelength light.
10. The device of example 1 where in the Silver photocatalytic Titanium Dioxide is photocatalytic at human visible wavelength light.
11. The device of example 1 wherein the material is formed in the shape of a dome.
12. The device of example 11 wherein the dome comprises a plastic dome.
13. A device including a fibrous material formed in the shape of a face mask and a silver photocatalytic titanium dioxide layer supported by the face mask.
14. The device of example 13 wherein the coating is on an outside of the face mask, wherein exposing the face mask to light activates the photocatalytic titanium dioxide layer to break down organic particles, and microbes.
15. The device of any of examples 1314 wherein the coating comprises crystallized Silver doped Titanium Dioxide.
16. The device of example 15 wherein the crystallized silver doped titanium dioxide crystals detach in response to a wearer of the mask breathing in such that crystals are inhaled.
17. A method includes obtaining a solution containing silver titanium dioxide and atomizing the solution in proximity to an animal for inhalation.
18. The method of example 17 wherein the atomized Silver Titanium Dioxide is a Bacteria stat, fungus stat, virus stat, and removes organic molecules, and microbes with no light.
19. A method includes obtaining a solution containing silver titanium dioxide and applying the solution to human hands.
20. The method of example 19 and further comprising applying the solution to a human face.
21. The method of any of examples 19-20 and further comprising exposing the human hands to light to activate the silver titanium dioxide.
22. The method of any of examples 19-20 and further comprising exposing the human face to light to activate the silver titanium dioxide.
23. The method of any of examples 20-22 wherein residue of the solution persists on the face and hands and is active to degrade organic molecules and organisms both in the presence of light and without light during such persistence.
24. A method includes obtaining a solution containing titanium dioxide crystals, applying the solution to skin imbedded with organic India ink, and exposing the skin to light to activate the titanium dioxide crystals.
25. The method of example 24 wherein the skin comprises human body skin and the organic India ink comprises a tattoo.
26. The method of any of examples 24-25 wherein the solution is applied with air pressure greater than atmospheric pressure such that the solution is imbibed by the material.
27. The method of any of examples 24-25 wherein the solution is applied with an air brush.
28. The method of any of examples 24-25 wherein the solution is applied by soaking or submerging the skin in the solution such that the solution penetrates an outer membrane of the skin by osmosis.
29. The method of any of examples 24-28 wherein the skin comprises human skin and wherein solution is applied through the skin, along with a skin absorbing vehicle.
30. The method of example 29 wherein the skin absorbing vehicle comprises Dimethyl Sulfoxide (DMSO) to increase the permeability of the stratum corneum of the skin.
31. The method of any of examples 24-30 wherein the skin comprises human skin and wherein the solution is applied through the skin along with a surfactant to increase skin penetration of water-soluble substances, by increasing skin permeability of water.
32. The method of example 31 wherein the surfactant comprises sodium laural sulfate.
33. The method of any of examples 24-32 wherein the solution is applied to the skin a sufficient time to penetrate the skin to affect the India ink.
34. The method of any of examples 24-33 and further comprising exposing the solution embedded skin comprising to UV or visible light or both UV and visible light.
35. The method of example 34 wherein the light is provided by a tanning bed.
36. The method of example 34 wherein the light comprises LED light.
37. The method of example 34 wherein the light comprises sunlight.
38. The method of example 34 wherein the skin is exposed to light for a duration determined as a function of concentration of ink and thickness of the material to degrade the organic India ink.
This application claims priority to U.S. Provisional Application Ser. No. 63/013,181 (entitled SILVER TITANIUM DIOXIDE COATING MATERIAL, ATOMIZED SILVER TITANIUM DIOXIDE SOLUTION FOR INHALING, ANI) PHOTOCATALYTIc, TITANIUM DIOXIDE SOLUTION FOR TATTOO REMOVAL, filed Apr. 21, 2020) which is incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 63013181 | Apr 2020 | US |
