Single layer force sensor

Information

  • Patent Grant
  • 9696223
  • Patent Number
    9,696,223
  • Date Filed
    Tuesday, September 17, 2013
    10 years ago
  • Date Issued
    Tuesday, July 4, 2017
    6 years ago
Abstract
A sensor for sensing an application of pressure is disclosed. The sensor includes a substrate, conductive elements and an electroactive layer. First and second conductive elements are supported on the substrate and have elongate edges spaced apart from each other. The electroactive layer has a common surface adhered against the conductive elements. The electroactive layer defines at least one electrical property in a portion of the layer between the conductive elements. The electrical property is configured to vary in relation to a magnitude of the pressure.
Description
BACKGROUND

The present disclosure relates to pressure sensitive sensors. In particular, the disclosure relates to the use of electroactive materials to create single-layer pressure sensors.


Pressure sensors have been used in a wide range of applications. Most pressure sensors rely on deflection elements to span empty spaces or gaps between conductors. Such deflection elements have the advantage of avoiding inadvertent activation of the sensor through touching of the conducting elements during minor load application.


Pressure sensors relying on piezoelectric effects generate an electrical signal in response to mechanical placement or pressure. The piezoelectric materials, however, do not generate signals that are universally applicable to a full range of control algorithms.


A need remains for pressure sensors that are adaptable to different ranges of control algorithms.


SUMMARY

A sensor for sensing an application of pressure is disclosed. The sensor includes a substrate, conductive elements and an electroactive layer. First and second conductive elements are supported on the substrate and have elongate edges spaced apart from each other. The electroactive layer has a common surface adhered against the conductive elements. The electroactive layer defines at least one electrical property in a portion of the layer between the conductive elements. The electrical property is configured to vary in relation to a magnitude of the pressure.


The electrical property may be a resistance or a capacitance.


A logic device may be connected to the conductive elements and configured to determine the electrical property. The first and second conductive elements may be connected to a power source. The electrical property may be a resistance generating a voltage difference between the conductive elements. The voltage difference varies in proportion to the magnitude of the pressure.


The sensor may also include a calibrator configured to determine the magnitude of the pressure using the voltage difference.


The electroactive layer may comprise a quantum tunneling composite (QTC) or a nanotube doped ink or a doped carbon. The doped carbon may be an ink, for example, printed onto a second substrate and laminated on the substrate and conductive elements.


The conductive elements may have different patterns, such as a square or spiral pattern. The square pattern may include interdigitated fingers. The spiral pattern may include intertwined conductive elements. The first conductive element may include a plurality of first fingers. The second conductive element may include a plurality of second fingers. The fingers may extend between each other, such as in a parallel, spaced array. The fingers may alternate with each other across the common surface to form a plurality of adjacent edges spaced apart from each other. Also, the fingers may extend in different directions.


The first fingers may also extend from a first trunk trace and the second fingers extend from a second trunk trace. The first trunk trace may have a first concavity. The second trunk trace may have a second concavity. The first and second fingers may extend into the concavity in opposite directions from each other. The concavities may face each other to define a circular pressure sensitive region.


Also, the fingers may have varied spacing. One pair of first and second fingers may be more closely spaced than another pair of first and second fingers. Closer spacing may be used to provide greater sensitivity to pressure.


The electroactive layer may also be varied in its sensitivity. Some areas may have a greater resistance between fingers. Other areas may have lower resistance between fingers.


The electrical property of the electroactive layer may exhibit a characteristic curve, such as a relationship between pressure and resistance. This characteristic may be varied as a function of a distance between the elongate edges of the conductive elements. An increase in the distance may, for example, increase a threshold for detection of the application of pressure. Also, a width of the conductive elements may be varied to increase the threshold. Also, increases in the distance or width may increase a radius of curvature of the characteristic curve.


The width and/or spacing of the conductive elements or fingers may range from 10 microns to 500 microns. Lower ranges may be accomplished, for example, using printing, such as aerosol jet printing. Closer spacing and smaller widths may be facilitated by printing the conductive elements with carbon ink.


The electroactive layer may include a conductive carbon ink printed on a second substrate and adhered against the conductive elements using an adhesive layer. The adhesive layer may be, for example, 5 microns thick and comprised of liquid or pressure sensitive adhesive.


The sensor may include a coating deposited on the electroactive layer. The coating may protect against the environment, such as by being impermeable to water. Also, the coating may be configured to adjust a characteristic response curve of the sensor. For example, the coating may be configured to increase a radius of curvature of the characteristic curve of the sensor. The coating may have variations in hardness, stiffness, thickness, material composition or shape, for example, to modify the characteristic response curve of the sensor.


The coating may be applied by printing, chemical vapor deposition, atomic layer deposition, spraying or dipping, for example. Coating materials may include parylene, silicone and dielectric, for example. The coating may also be formed as a second substrate that is adhered over or to the electroactive layer. The coating may have a dome shape or be a separate single-thickness layer.


The electroactive layer may include a portion comprising a compliant molding. The compliant molding may include a conductive polymer, such as a phenolic resole or a conductive elastomer.


A top side of the electroactive layer may include a force-deflection element, such as a detent or secondary feature that decreases a contact area of the force-deflection element.


In another implementation, the first and second conductive elements may have a same length and width adhered against the electroactive layer. In addition, the conductive elements may extend in parallel in a same direction. They may also be equally spaced from each other. A plurality of first and second conductive elements may be employed as dedicated channels. The conductive elements, for example, may have a spacing and width in a range of 250 to 500 micrometers.





BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS


FIG. 1 is a schematic of a pressure sensor;



FIG. 2 is another schematic of the pressure sensor of FIG. 1;



FIG. 3 is a schematic showing application of a force to the pressure sensor of FIG. 1;



FIG. 4 is a schematic showing a conduction path of the pressure sensor of FIG. 1;



FIG. 5 is a schematic of a circular pressure sensor;



FIG. 6 is a force-resistance response curve of a pressure sensor;



FIG. 7 is a force-resistance response curve of another pressure sensor;



FIG. 8 shows several force-resistance response curves of several pressure sensors;



FIG. 9 shows migration of a force-resistance response curve in response to modified configuration of a pressure sensor;



FIG. 10 is a schematic showing recruitment of conductive finger elements under application of a pressure;



FIG. 11 is a schematic showing equispaced conductive finger elements;



FIGS. 12 and 13 are schematics showing selective spacing of conductive finger elements;



FIG. 14 is a schematic showing selective modification of an electroactive layer of a pressure sensor;



FIG. 15 is a force-displacement line graph of a pressure sensor with a mechanical feature;



FIG. 16 is a force-contact area line graph of the pressure sensor of FIG. 15;



FIGS. 17 and 18 are schematics of pressure sensors with protective coatings;



FIGS. 19-22 are schematics of pressure sensors with mechanical features to modify force response curves;



FIGS. 23 and 25 are schematics of a pressure sensor with dedicated signal lines and parallel conductive elements;



FIGS. 24 and 26 are schematics of a pressure sensor with dedicated signal lines and interdigitated conductive fingers;



FIGS. 27A and 27B are schematics of hybrid sensors combining single and multilayer architectures; and



FIG. 28 is a schematic of a pressure sensor system including hardware, software and other components.





DETAILED DESCRIPTION

The terminology used herein is for the purpose of describing particular implementations only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof


With reference now to FIGS. 1-4, implementations of the present invention include a pressure sensor 10 including a substrate 12, a plurality of first conductive elements 14, a plurality of second conductive elements 16 and an electroactive layer 18. The conductive elements 14, 16 are supported on the substrate 12 and have elongate edges 20 spaced apart from each other. The electroactive layer 18 has a common surface 22 adhered against the first and second conductive elements 14, 16. The electroactive layer 18 defines at least one electrical property, such as a resistance, between the first and second conductive elements. The electrical property is configured, such as through the use of a quantum tunneling composite or a doped material, to vary in relation to a magnitude of an applied pressure. The pressure sensor 10 provides advantages including a gapless construction for more compact, robust hardware. Also, the geometry and arrangement of the conductive elements 14, 16, the electroactive layer 18 and other components allows selective adjustment of the force-response curve of the sensor.


The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The implementation was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various implementations with various modifications as are suited to the particular use contemplated.


Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.


A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.


Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.


Computer program code for carrying out operations for aspects of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C++ or the like and conventional procedural programming languages, such as the “C” programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider).


Aspects of the present invention are described below with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to implementations of the invention. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.


These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.


The computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.


Referring again to FIGS. 1-4, the substrate 12 may be a foundational surface upon which the remaining components are supported. The substrate 12 may be comprised, for example, of a relatively rigid, flat, planar surface that is sized and shaped to match the peripheral shape of the electroactive layer 18. Such characteristics promote a predictable response to pressure by the intervening electroactive layer 18 and the conductive elements 14, 16.


Optionally, the compressibility of the substrate 12 may be adjusted to adjust recruitment of the electroactive layer 18 and conductive elements 14, 16. Increased compressibility may, for example, result in bending and deflection of the electroactive layer and modifying its response to the application of pressure. Also, additional adjacent conductive elements may be deflected to generate changes in conduction characteristics. A soft substrate may also have appealing soft-touch characteristics suitable for some surfaces, such as automotive interiors or textile supported controls.


The substrate 12 may have different surface contours than flat, such as curved, textured or angled. Surface variations may adapt the sensor 10 to fit contours of various controllers. For example, a rounded shape may be employed for a window control in an automobile interior to fit the rounded surface adjacent to the window. A cylindrical shape may be used to wrap around a steering wheel.


The substrate 12 may also be fashioned to have different perimeter shapes for fitting into controllers based on the desired control dynamic. For example, a strip shape may be used for long, gliding gestures or swipes applying pressure to the sensor 10. Expanded two dimensional shapes may facilitate sensing in two dimensions (X-Y) as well as the force (Z) dimension. Circular shapes may be employed for circumferential position detection or detection of circular or dial motions along with pressure.


Generally, the substrate 12 should have limited or no conductivity to prevent inadvertent communication between the adjacently arranged first and second conductive elements 14, 16. The substrate 12 may also be constructed from an electroactive material to facilitate electrical communication between conductive elements during application of a pressure to the pressure sensor 10.


As shown in FIGS. 2-4, the substrate may be positioned below the conductive elements 14, 16 and have a periphery that ends (as shown in FIG. 1) prior to the ends of the conductive elements 14, 16. This allows the ends to be attached to wires or other conductors for communication with a controller, amplifier or other logic or hardware.


The substrate 12 may have a range of thicknesses and may be a structure of an underlying surface of the object being controlled. For example, it may be a dash of an automotive interior with the conductive elements 14, 16 and electroactive layer 18 mounted thereon. The substrate 12 also has the advantage of not only supporting the conductive elements and electroactive layer, but also by “pushing back” at the applied force to facilitate compression of those components.


The first conductive elements 14, as shown in FIG. 1, extend over one edge of the substrate 12 and into the center of the substrate 12. The first conductive elements 14 have rectangular “finger” shapes that are relatively long and in a spaced, parallel arrangement on the substrate 12. The fingers can be manufactured down to 50 microns in width, with similar spacing, between the fingers. Smaller dimensions, such as 10 microns, may be accomplished using alternative manufacturing processes such as aerosol jet printing. Such printing may also include chemical deposition or atomic layer deposition. Printed circuit board etching may also be used. Smaller fingers may be comprised of conductive carbons and other materials less prone to migration than silver or gold.


The second conductive elements 16, as shown in FIG. 1, extend over the opposite edge of the substrate 12 and into the center of the substrate 12. The second conductive elements 16 also have finger shapes and may be constructed similar to the first conductive elements 14. Because of their opposite orientation and parallel construction, the first and second conductive elements 14, 16 may be interdigitated. In other words, the fingers alternate between first and second conductive elements across the middle portion of the substrate 12.


The first and second conductive elements 14, 16 connect respectively to first and second conductors that have attached thereto some form of power supply. This power supply generates a voltage difference between the conductive elements. As is described below, the amount and area of an application of pressure allows for current conduction between the conductive elements of the pressure sensor 10.


As shown in FIGS. 2-4, the electroactive layer 18 extends over the conductive elements 14, 16 and has a common (in the figures, a bottom) surface 22 positioned against or otherwise adhered to the conductive elements 14, 16. The electroactive layer 18 need not be of consistent geometry or thickness and instead merely needs to present some type of a surface for positioning on or proximal to the conductive elements 14, 16. In the illustrated implementation, the electroactive layer 18 is a relatively thin sheet having a rectangular shape that corresponds to the underlying substrate 12.


The electroactive layer 18 preferably has an electrical property which varies with an applied force. For example, the electroactive layer 18 may be comprised of a pressure sensitive material configured to change resistance or conductive/electrical characteristics in response to force or pressure acting thereupon. The pressure sensitive material can behave substantially as an isolator when no force or pressure is present and decreases in resistance as more force or pressure is present. Between low and high forces, the pressure sensitive material responds to force or pressure in a predictable manner, decreasing in resistance with increasing force.


The pressure sensitive material may, for example, be a carbon nanotube conductive polymer. The pressure sensitive material can be applied over the conductive elements 14, 16 by a printing process, such as two- or three-dimensional ink jet or screen printing, vapor deposition, or printed circuit techniques, such etching, photo-engraving, or milling. As pressure sensitive materials with smaller particle sizes are used, such as that of grapheme or a grapheme conductive polymer, the pressure sensitive material may also be applied through printed circuit techniques such as vapor deposition.


According to other implementations, the pressure sensitive material may be a silicene polymer material doped with a conductor, such as silver or copper. According to other examples, the pressure sensitive material can be a quantum tunneling composite (QTC), which is a variable resistance pressure sensitive material that employs Fowler-Nordheim tunneling. The QTC material in the sensors may act as an insulator when zero pressure or zero force is applied, since the conductive particles may be too far apart to conduct, but as pressure (or force) is applied, the conductive particles move closer to other conductive particles, so that electrons can pass through the insulator layer changing the insulator layer changing the resistance of the sensor. Thus, the resistance of the QTC in the sensors is a function of the force or pressure acting upon the sensor.


As shown in FIGS. 3 and 4, the application of a force (F) reduces the resistance of the underlying conduction path (dotted line) between one of the first conductive elements 14 and one of the second conductive elements 16 opposite the force. The voltage difference between the conductive fingers generates a signal in proportion to the drop in resistance which is proportional to the amount of force applied.


Advantageously, the size, positioning and other characteristics of the fingers may be employed to modify the characteristic response curve of the sensor beyond the response expected for an electroactive layer 18 interposed between two conductors. For example, as shown in FIG. 8, a characteristic curve of a two-layer sensor having an electroactive layer (comprised of QTC) intervening with a thickness between two conductors has a very small “elbow” between two relatively straight lines (i.e., the Non ID Finger Base Sensor). This is shown by curve 72. This elbow reflects a quick transition after application of a low threshold force.


This characteristic curve has its advantages, such as for deterministic on-off switch operation, although it may be less applicable to systems requiring more gradual response characteristics. For example, fuzzy logic systems may benefit from a gradual transition in the force-resistance response of the sensor. Such characteristics can be programmed or custom-crafted using the above-described finger configuration of conductive elements 14, 16 of a single-layer sensor 10. Variations of the finger size, length, and composition and other geometry, can modify and soften the characteristic response curve. For example, FIG. 8 shows the impact of using small ID fingers, such as 0.25 mm, with spacing the same as the finger width. This is shown by curve 74. (FIG. 6 is a dedicated line graph for the small fingers.) The sharp elbow of the two-layer sensor is smoothed out and shifted to the right, requiring higher force application for a drop in resistance. Even larger fingers, such as 0.35 mm finger width and spacing, further smooth and push the curve to the right. This is shown by curve 76. (FIG. 7 is a dedicated line graph for the medium fingers.)


Restated, by modifying one or more finger geometries, such as width or spacing, or finger material, the resultant force-response characteristic curve of the pressure sensor 10 may be changed. For the small and medium finger size and spacing, the curve moves higher on the resistive scale. This causes a greater drop in resistance by a force threshold “F” and therefore a greater force threshold.


The sensor 10 characteristic response curve may be modified by configurations of conductive elements other than finger geometry. For example, the fingers may be shaped in the form of intertwined traces, such as in a spiral pattern, on the substrate 12.



FIG. 5 shows another exemplary geometry of the conductive elements. As shown in FIG. 5, the first conductive elements 14 are on the left and the second conductive elements 16 are on the right. The conductive elements are in the form of fingers extending from arc-shaped traces 24. These traces form a “trunk” for the interdigitated conductive elements 14, 16. The traces 24 extend away from the curved portions to connect with power sources and controls. Advantageously, the overall circular shape of the pressure sensor 10 of FIG. 5 is well suited for a button-style control. The sensor 10 could also be larger for other purposes, rather than the size of a finger tip for a button.


Notably, the use of additional or smaller or more closely spaced conductive elements results in migration of the curve toward the characteristic curve of the substrate 12. For example, FIG. 9 shows this progression with an arrow. Another characteristic of smaller fingers is the recruitment of multiple fingers with the application of a pressure over a larger area, as shown in FIG. 10 for example. For example, an increase in applied force may increase the contact area.


Modifying the sensor 10 to use smaller, more closely spaced fingers may be used to expand the range of materials used for the electroactive layer 18 to include less sensitive materials. For example, a carbon ink electroactive layer 18 may be formed by printing carbon ink on a cover layer. The cover layer is then applied over the conductive elements 14, 16 on the substrate 12. Increased force or pressure coincides with increased contact area on the micro fingers, as shown in FIG. 10. The increased contact area results in increased conductivity through increased number of electrical conduction pathways.


One advantage of carbon ink is that it is less likely (generally) to migrate than silver or softer materials. Therefore, carbon ink may be employed for smaller width and spacing of conductive elements. The carbon ink electroactive layer 18 may also have the characteristic of higher resistance given the curve migration promoted by the use of the small and close elements 14, 16. In this implementation, it may be advantageous to have a small or thin layer between the conductive elements and the electroactive layer 18. This intervening layer could comprise, for example, a liquid adhesive or pressure sensitive adhesive, of 5 microns or more. FIG. 19 shows an adhesive separator layer 30 suspending the electroactive layer 18 above the conductive elements 14, 16.


The conductive elements 14, 16 may also be deposited on the substrate with printed circuit board etching, printing, chemical deposition, atomic layer deposition or aerosol jet, for example. The electroactive layer 18 may include a conductive plastic or elastomer in the form of semi-compliant molding. The molding may include a tolerancing feature 32, such as is shown in FIG. 20. The tolerancing feature suspends the upper electroactive layer 18 above the lower substrate and conductive elements 14, 16. Additional molded features 34 provide a geometry that facilitates consistent pressure application and touch location, such as is shown in FIG. 21. The molded feature 34 may include a curved molding with an increased central thickness and tapered ends to increase the sensitivity of the central touch zone with the application of a pressure. Molded features 34 may include several curved embossments, as shown in FIG. 22, for location specific displacement reductions and/or sensitivity increases.



FIGS. 11-15 show implementations that vary finger width, spacing and other geometry to affect the sensitivity of the sensor 10. For example, the spacing and number of conductive elements may be varied to vary the sensitivity within the sensor 10. FIG. 11 shows a regular spacing while FIG. 12 shows an implementation wherein the fingers are more closely spaced at the center of the sensing area. Further apart from the center the spacing is larger for reduced sensitivity.


The implementation of FIG. 13, on the other hand, has greater spacing at the center for reduced sensitivity at the center. The spacing and size, and other geometry, of the fingers may be varied across the sensor 10 to focus the sensitivity to specific forces. For example, the distance could be varied based on radial position of a spiral sensor. Or, for strips spacing and finger width can be increased and decreased along the strip. Selectively increased and decreased distances and widths and numbers of the conductive elements may be particularly useful for less sensitive electroactive layers 18.



FIG. 14 shows an implementation wherein the electroactive layer 18 may be modified to include higher or lower resistance areas for selective sensitivity of the sensor 10. For example, sensing areas 26 within the sensing zone of the sensor 10 could be doped with relatively lower or higher resistance materials. This deadens or accentuates the sensitivity within the sensing area 26. Another benefit may be repeatability of contact sensing within the given area. Increased sensitivity may be had by use of high sensing materials such as a quantum tunneling composite.


As another option, a hybrid sensor 10 may be created combining single and multi-layer architecture. Example hybrid sensors 10 are shown in FIGS. 27A and 27B. For example, portions of the sensing area may comprise a top electrode 42 and a spacing layer or gap 44 between the electroactive layer 18 and the conductive elements 14, 16 or between the top electrode 42 and the electroactive layer 18. As shown in FIG. 27A, the electroactive layer 18 can be adhered to the top electrode 42, and the gap can be provided between the electroactive layer 18 and the conductive elements 14, 16. Alternatively, as shown in FIG. 27B, the electroactive layer 18 can be adhered to the conductive elements 14, 16, and the gap 44 can be provided between the top electrode 42 and the electroactive layer 18.


The fingers 14, 16 could also be modified to configure the sensor 10's characteristic sensitivity. For example, the finger width may be increased for more robust measurements. Also, the finger material could change from higher to lower resistance materials along its length.


Mechanical adaptations may also be made to modify the response characteristics of the pressure sensor 10. For example, the characteristic curve shapes of FIGS. 15 and 16 show how a force-displacement element, such as plunger, may be used as an intermediate layer between the first electroactive layer 18 and the conductive elements 14, 16. The intermediate layer may include a deflection element with a physical detent, such as a silicone dome cap. The deflection element may include a secondary feature to engage the outer periphery of the sensing area 26 at higher forces. As shown in FIG. 15, a portion of the characteristic curve 1501A represents the response of the pressure sensor 10 when force is applied to a deflection element such as a dome cap, for example. At point 1501B, the dome cap reaches its design force, and the dome cap crushes at point 1501C. A portion of the characteristic curve 1501D represents the response of the pressure sensor 10 when additional force is applied (e.g., the response of the electroactive layer 18).


As shown in FIGS. 17 and 18, the pressure sensor 10 may include a coating layer 28 to protect the surface of the electroactive layer 18. The coating 28 may be an organic or inorganic material to provide a sealed, watertight barrier and protect against environmental conditions. Also, the coating 28 may be varied in geometry or composition to provide additional force response curve characteristics. For example, the hardness, stiffness, thickness, shape or material type of the coating 28 may be varied. The coating 28 may be applied by printing, chemical vapor deposition, atomic layer deposition, spraying or dipping. The coating 28 may comprise parylene, silicone, dielectrics, etc. As shown in FIG. 18, the coating may be a secondary substrate adhered on top of the electroactive layer 18.


As shown in FIGS. 23 and 24, the pressure sensor 10 a plurality of conductive elements may be employed each of which (or some of which) may include dedicated channels.


For example, as shown in FIGS. 23 and 25, dedicated ones of linear line traces 36 connect to their respective one of conductive elements 14, 16. The multiple conductive elements are closely spaced in an adjacent, parallel arrangement extending over one or two electroactive layer 18 portions. The line traces 36 may include a flare portion 38 configured for connection or crimping, such as to a 10 mm diameter sensor tail.


Portions of the line traces 36 and conductive elements 14, 16 may comprise different materials. For example, they may both be printed silver. Or, one may be printed silver and the other printed carbon. The line width and spacing may also be varied as described above, such as with 250, 350 or 500 micron widths and/or spacing.



FIGS. 24 and 26 show another example of a rectangular-shaped pressure sensor 10 having a rectangular electroactive layer 18 and interdigitated, equal-length fingers 14, 16. Each of the fingers has its own dedicated channel via adjacently stacked line traces 36 extending along lateral edges 40 of the fingers 14, 16. The line traces 36 and fingers 14, 16 may be comprised entirely of the same silver or carbon material. Or, the line trace connects may be comprised of a different material than the fingers, such as silver when the fingers are carbon. Additionally, the line traces 36 may be laid or printed outside of the electroactive layer 18 area. The pressure sensor 10 may have an overall size of about 10 or 15 mm with the finger and trace width and spacing in the 250 to 350 or 500 micron range.


The dedicated channels provide multiple output lines for readings from the sensor 10. These outputs from these lines can be compared to each other over varying distances. Multiple output lines may facilitate tracking moving along the length of the sensor since resistance increases with distance from the input (applied pressure). Also, multiple output lines allow for redundant self-checking or double parsing results. Sensor or computer logic can check adjacent or proximal lines bridged by an applied force or pressure. The multiple outputs may also be used to determine width-wise position or the area of the applied force.


Referring now to FIG. 28, a schematic diagram of a central server 500, or similar network entity, configured to implement a sensor system, according to one implementation of the invention, is provided. As used herein, the designation “central” merely serves to describe the common functionality the server provides for multiple clients or other computing devices and does not require or infer any centralized positioning of the server relative to other computing devices. As may be understood from FIG. 28, in this implementation, the central server 500 may include a processor 510 that communicates with other elements within the central server 500 via a system interface or bus 545. Also included in the central server 500 may be a display device/input device 520 for receiving and displaying data. This display device/input device 520 may be, for example, a keyboard or pointing device that is used in combination with a monitor. The central server 500 may further include memory 505, which may include both read only memory (ROM) 535 and random access memory (RAM) 530. The server's ROM 535 may be used to store a basic input/output system 540 (BIOS), containing the basic routines that help to transfer information across the one or more networks.


In addition, the central server 500 may include at least one storage device 515, such as a hard disk drive, a floppy disk drive, a CD Rom drive, or optical disk drive, for storing information on various computer-readable media, such as a hard disk, a removable magnetic disk, or a CD-ROM disk. As will be appreciated by one of ordinary skill in the art, each of these storage devices 515 may be connected to the system bus 545 by an appropriate interface. The storage devices 515 and their associated computer-readable media may provide nonvolatile storage for a central server. It is important to note that the computer-readable media described above could be replaced by any other type of computer-readable media known in the art. Such media include, for example, magnetic cassettes, flash memory cards and digital video disks.


A number of program modules may be stored by the various storage devices and within RAM 530. Such program modules may include an operating system 550 and a plurality of one or more (N) modules 560. The modules 560 may control certain aspects of the operation of the central server 500, with the assistance of the processor 510 and the operating system 550. For example, the modules may perform the functions described above and illustrated by the figures and other materials disclosed herein. The modules may include an electrical property determination module 562 that is configured to determine an electrical property of the electroactive layer based connection to the conductive elements. Further, the modules may include a calibrator module 564 configured to determine the magnitude of a pressure using a voltage difference between the conductive elements.


The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various implementations of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.


The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The implementation was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various implementations with various modifications as are suited to the particular use contemplated.

  • 10 pressure sensor
  • 12 substrate
  • 14 first conductive elements
  • 16 second conductive elements
  • 18 electroactive layer
  • 20 elongate edges
  • 22 common surface
  • 24 arc-shaped traces
  • 26 sensing area
  • 28 coating
  • 30 adhesive separator layer
  • 32 tolerancing feature
  • 34 molded feature
  • 36 line traces
  • 38 flare
  • 40 lateral edges
  • 42 top electrode
  • 44 gap
  • 72 Non-ID Finger Base Sensor curve
  • 74 Small ID Finger Sensor curve
  • 76 Medium ID Finger Sensor curve

Claims
  • 1. A sensor for sensing an application of pressure, the sensor comprising: a substrate;at least first and second conductive elements supported on the substrate and having elongate edges spaced apart from each other; anda single electroactive layer for electrically connecting the first and second conductive elements, the single electroactive layer being disposed on the first and second conductive elements and having a common surface adhered against the first and second conductive elements, the single electroactive layer defining at least one electrical property in a portion of the single electroactive layer between the first and second conductive elements, the electrical property configured to vary in relation to a magnitude of the pressure, wherein the electrical property exhibits a characteristic curve that at least partially varies as a function of a distance between the elongate edges, and wherein the single electroactive layer provides a conductive path between the first and second conductive elements.
  • 2. A sensor of claim 1, wherein the electrical property is a resistance.
  • 3. A sensor of claim 1, further comprising a logic device connected to the first and second conductive elements and configured to determine the electrical property.
  • 4. A sensor of claim 3, further comprising a power source connected to the first and second conductive elements and wherein the electrical property is a resistance generating a voltage difference between the first and second conductive elements and wherein the voltage difference varies in proportion to the magnitude of the pressure.
  • 5. A sensor of claim 4, wherein the logic device includes a calibrator configured to determine the magnitude of the pressure using the voltage difference.
  • 6. A sensor of claim 1, wherein the single electroactive layer comprises at least one of a quantum tunneling composite, a nanotube doped ink or a doped carbon ink.
  • 7. A sensor of claim 1, wherein the first and second conductive elements have a spiral pattern.
  • 8. A sensor of claim 1, wherein the first conductive element includes a plurality of first fingers and the second conductive element includes a plurality of second fingers.
  • 9. A sensor of claim 8, wherein the first fingers extend between the second fingers.
  • 10. A sensor of claim 9, wherein the first fingers are in a parallel spaced array and wherein the second fingers are in a parallel spaced array.
  • 11. A sensor of claim 10, wherein the first and second fingers alternate across the common surface to form a plurality of adjacent edges spaced apart from each other.
  • 12. A sensor of claim 11, wherein the first and second fingers extend in different directions.
  • 13. A sensor of claim 12, wherein the first fingers extend from a first trunk trace and wherein the second fingers extend from a second trunk trace.
  • 14. A sensor of claim 13, wherein the first trunk trace has a first concavity and the second trunk trace has a second concavity and wherein the first and second concavities face each other.
  • 15. A sensor of claim 14, wherein the first fingers extend into the first concavity in a direction opposite the second fingers extending into the second concavity.
  • 16. A sensor of claim 15, wherein the fingers and trunks define a circular pressure sensitive region.
  • 17. A sensor of claim 8, wherein at least one pair of first and second fingers has a closer spacing than another pair of first and second fingers.
  • 18. A sensor of claim 17, wherein the closer spacing defines an area of higher sensitivity to the pressure.
  • 19. A sensor of claim 8, wherein the single electroactive layer has a varied resistance between different pairs of first and second fingers.
  • 20. A sensor of claim 19, wherein the varied resistance is higher between at least one pair of first and second fingers or the varied resistance is lower between at least one pair of first and second fingers.
  • 21. A sensor of claim 1, wherein an increase of the distance increases a threshold for detection of the application of pressure.
  • 22. A sensor of claim 21, wherein an increase of a width of the first and second conductive elements increases the threshold for detection of the application of pressure.
  • 23. A sensor of claim 22, wherein the increase of at least one of the distance or the width increases a radius of curvature of the characteristic curve.
  • 24. A sensor of claim 1, wherein the single electroactive layer is adhered against the first and second conductive elements using an adhesive layer.
  • 25. A sensor of claim 1, further comprising a coating deposited on the single electroactive layer, wherein the coating is impermeable to water or the coating is configured to adjust the characteristic curve.
  • 26. A sensor of claim 25, wherein the coating adjusts the characteristic curve using at least one of a hardness, stiffness, thickness, material composition or shape.
  • 27. A sensor of claim 1, wherein a portion of the single electroactive layer includes an at least partially compliant molding, the compliant molding including a conductive polymer or a conductive elastomer.
  • 28. A sensor for sensing an application of pressure, the sensor comprising: a substrate;at least first and second conductive elements supported on the substrate and having elongate edges spaced apart from each other;a single electroactive layer for electrically connecting the first and second conductive elements, the single electroactive layer being disposed on the first and second conductive elements and having a common surface adhered against the first and second conductive elements, the single electroactive layer defining at least one electrical property in a portion of the single electroactive layer between the first and second conductive elements, the electrical property configured to vary in relation to a magnitude of the pressure, and wherein the single electroactive layer provides a conductive path between the first and second conductive elements; anda force-deflection element coupled to a side of the single electroactive layer opposite the substrate.
  • 29. A sensor of claim 28, wherein the force-deflection element includes a detent.
  • 30. A sensor of claim 29, wherein the force-deflection element includes a secondary feature that decreases a contact area of the force-deflection element.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Patent Application No. 61/701,884, filed on Sep. 17, 2012, entitled “SINGLE LAYER FORCE SENSOR,” the disclosure of which is expressly incorporated herein by reference in its entirety.

US Referenced Citations (471)
Number Name Date Kind
4268815 Eventoff et al. May 1981 A
4276538 Eventoff et al. Jun 1981 A
4301337 Eventoff Nov 1981 A
4314227 Eventoff Feb 1982 A
4314228 Eventoff Feb 1982 A
4315238 Eventoff Feb 1982 A
4451714 Eventoff May 1984 A
4484026 Thornburg Nov 1984 A
4489302 Eventoff Dec 1984 A
4540979 Gerger et al. Sep 1985 A
4739299 Eventoff et al. Apr 1988 A
4801771 Mizuguchi et al. Jan 1989 A
4810992 Eventoff Mar 1989 A
4929934 Ueda et al. May 1990 A
4963702 Yaniger et al. Oct 1990 A
5053585 Yaniger Oct 1991 A
5159159 Asher Oct 1992 A
5186055 Kovacich et al. Feb 1993 A
5209967 Wright et al. May 1993 A
5262778 Saunders Nov 1993 A
5296837 Yaniger Mar 1994 A
5302936 Yaniger Apr 1994 A
5365671 Yaniger Nov 1994 A
5398962 Kropp Mar 1995 A
5408873 Schmidt et al. Apr 1995 A
5423569 Reighard et al. Jun 1995 A
5453941 Yoshikawa Sep 1995 A
5463258 Filion et al. Oct 1995 A
5510783 Findlater et al. Apr 1996 A
5539259 Filion et al. Jul 1996 A
5659334 Yaniger et al. Aug 1997 A
5670988 Tickle Sep 1997 A
5793297 Takeuchi et al. Aug 1998 A
5828363 Yaniger et al. Oct 1998 A
5847639 Yaniger Dec 1998 A
5854625 Frisch et al. Dec 1998 A
5871063 Young Feb 1999 A
5907419 Martinelli et al. May 1999 A
5914658 Arakawa Jun 1999 A
5943044 Martinelli et al. Aug 1999 A
5965952 Podoloff et al. Oct 1999 A
5982519 Martinelli et al. Nov 1999 A
6084572 Yaniger Jul 2000 A
6239790 Martinelli et al. May 2001 B1
6291568 Lussey Sep 2001 B1
6333736 Sandbach Dec 2001 B1
6378384 Atkinson et al. Apr 2002 B1
6388556 Imai et al. May 2002 B1
6396523 Segal et al. May 2002 B1
6429846 Rosenberg et al. Aug 2002 B2
6437682 Vance Aug 2002 B1
6495069 Lussey et al. Dec 2002 B1
6501463 Dahley et al. Dec 2002 B1
6529122 Magnussen et al. Mar 2003 B1
6531951 Serban et al. Mar 2003 B2
6538643 Mori et al. Mar 2003 B2
6563415 Armstrong May 2003 B2
6646540 Lussey Nov 2003 B1
6690365 Hinckley et al. Feb 2004 B2
6750803 Yates et al. Jun 2004 B2
6758689 Bair et al. Jul 2004 B1
6765557 Segal et al. Jul 2004 B1
6791532 Hirano et al. Sep 2004 B2
6801191 Mukai et al. Oct 2004 B2
6809280 Divigalpitiya et al. Oct 2004 B2
6809462 Pelrine et al. Oct 2004 B2
6820804 Segal et al. Nov 2004 B2
6822640 Derocher Nov 2004 B2
6850221 Tickle Feb 2005 B1
6861961 Sandbach et al. Mar 2005 B2
6875938 Schmiz et al. Apr 2005 B2
6888537 Benson et al. May 2005 B2
6906700 Armstrong Jun 2005 B1
6909354 Baker et al. Jun 2005 B2
6947031 Sandbach et al. Sep 2005 B2
6995752 Lu Feb 2006 B2
7050045 Baker et al. May 2006 B2
7084859 Pryor Aug 2006 B1
7091436 Serban Aug 2006 B2
7091998 Miller-Smith Aug 2006 B2
7112755 Kitano et al. Sep 2006 B2
7113179 Baker et al. Sep 2006 B2
7126583 Breed Oct 2006 B1
7154484 Komata Dec 2006 B2
7158122 Roberts Jan 2007 B2
7161460 Federspiel Jan 2007 B2
7170428 Himberg et al. Jan 2007 B2
7176889 Baker et al. Feb 2007 B2
7190348 Kennedy et al. Mar 2007 B2
7213323 Baker et al. May 2007 B2
7215330 Rantet May 2007 B2
7250940 Jayanetti et al. Jul 2007 B2
7258026 Papakostas et al. Aug 2007 B2
7295904 Kanevsky et al. Nov 2007 B2
7301435 Lussey et al. Nov 2007 B2
7310089 Baker et al. Dec 2007 B2
7324095 Sharma Jan 2008 B2
7336260 Martin et al. Feb 2008 B2
7345675 Minakuchi Mar 2008 B1
7356769 Lehtonen Apr 2008 B2
7377133 Sandbach et al. May 2008 B2
7388571 Lowles et al. Jun 2008 B2
7432459 Stoschek et al. Oct 2008 B2
7468199 Divigalpitiya et al. Dec 2008 B2
7511702 Hotelling Mar 2009 B2
7554045 Sandbach et al. Jun 2009 B2
7554051 Crispin Jun 2009 B2
7554531 Baker et al. Jun 2009 B2
7573464 Baker et al. Aug 2009 B2
7576294 Clemens et al. Aug 2009 B2
7603917 Graham et al. Oct 2009 B2
7614008 Ording Nov 2009 B2
7619616 Rimas-Ribikauskas et al. Nov 2009 B2
7629966 Anson Dec 2009 B2
7649278 Yoshida et al. Jan 2010 B2
7683889 Rimas-Ribikauskas et al. Mar 2010 B2
7683890 Geaghan Mar 2010 B2
7693631 Yukawa et al. Apr 2010 B2
7721609 Wright May 2010 B2
7724242 Hillis et al. May 2010 B2
7733209 Kurtz Jun 2010 B2
7746327 Miyakoshi Jun 2010 B2
7772960 Baker Aug 2010 B2
7773075 Otsuka et al. Aug 2010 B2
7777730 Geurts et al. Aug 2010 B2
7791596 Errico et al. Sep 2010 B2
7808488 Martin et al. Oct 2010 B2
7813774 Perez-Noguera Oct 2010 B2
7822443 Kim et al. Oct 2010 B2
7863822 Stoschek et al. Jan 2011 B2
7898381 Hatsuda Mar 2011 B2
7903090 Soss et al. Mar 2011 B2
7952566 Poupyrev et al. May 2011 B2
7973773 Pryor Jul 2011 B2
8022933 Hardacker et al. Sep 2011 B2
8026902 Medler et al. Sep 2011 B2
8026906 Mölne Sep 2011 B2
8035535 Nousiainen Oct 2011 B2
8037770 Larson et al. Oct 2011 B2
8049730 Joguet et al. Nov 2011 B2
8049731 Baker et al. Nov 2011 B2
8049737 Cho et al. Nov 2011 B2
8052293 Hurwitz Nov 2011 B2
8059104 Shahoian et al. Nov 2011 B2
8063322 Katsurahira Nov 2011 B2
8063886 Serban et al. Nov 2011 B2
8072439 Hillis et al. Dec 2011 B2
8072440 Pryor Dec 2011 B2
8081165 Reiner Dec 2011 B2
8094130 Griffin et al. Jan 2012 B2
8095278 Schaaf et al. Jan 2012 B2
8098236 Klein et al. Jan 2012 B2
8113065 Ohsato et al. Feb 2012 B2
8120586 Hsu et al. Feb 2012 B2
8120588 Klinghult Feb 2012 B2
8130207 Nurmi et al. Mar 2012 B2
8134535 Choi et al. Mar 2012 B2
8139038 Chueh et al. Mar 2012 B2
8144133 Wang et al. Mar 2012 B2
8149211 Hayakawa et al. Apr 2012 B2
8151210 Nezu et al. Apr 2012 B2
8154528 Chen et al. Apr 2012 B2
8159473 Cheng et al. Apr 2012 B2
8169295 Walkington May 2012 B2
8171431 Grossman et al. May 2012 B2
8184093 Tsuiki May 2012 B2
8184106 Serban May 2012 B2
8188985 Hillis et al. May 2012 B2
8199116 Jeon et al. Jun 2012 B2
8203454 Knight et al. Jun 2012 B2
8212790 Rimas-Ribikauskas et al. Jul 2012 B2
8214105 Daly et al. Jul 2012 B2
8222799 Polyakov et al. Jul 2012 B2
8228305 Pryor Jul 2012 B2
8229603 Miyata et al. Jul 2012 B2
8237324 Pei et al. Aug 2012 B2
8237537 Kurtz Aug 2012 B2
8239784 Hotelling et al. Aug 2012 B2
8243035 Abe et al. Aug 2012 B2
8243039 Trachte Aug 2012 B2
8253699 Son Aug 2012 B2
8269731 Molne Sep 2012 B2
8368505 Deppiesse Feb 2013 B2
8698764 Karakotsios et al. Apr 2014 B1
9030419 Freed May 2015 B1
20010040551 Yates et al. Nov 2001 A1
20020041164 Kim Apr 2002 A1
20020054060 Schena May 2002 A1
20020097229 Rose et al. Jul 2002 A1
20020135457 Sandbach et al. Sep 2002 A1
20030011576 Sandbach et al. Jan 2003 A1
20030043014 Nakazawa et al. Mar 2003 A1
20030076968 Rast Apr 2003 A1
20030083131 Armstrong May 2003 A1
20030160808 Foote et al. Aug 2003 A1
20040071471 Baker et al. Apr 2004 A1
20040207605 MacKey et al. Oct 2004 A1
20040217331 Lussey et al. Nov 2004 A1
20040252007 Lussey et al. Dec 2004 A1
20050052426 Hagermoser et al. Mar 2005 A1
20050052427 Wu et al. Mar 2005 A1
20050067889 Chernoff Mar 2005 A1
20050110769 DaCosta et al. May 2005 A1
20050156705 Baker et al. Jul 2005 A1
20050273218 Breed et al. Dec 2005 A1
20060025897 Shostak et al. Feb 2006 A1
20060028454 Branton et al. Feb 2006 A1
20060054479 Iisaka Mar 2006 A1
20060113880 Pei et al. Jun 2006 A1
20060177212 Lamborghini et al. Aug 2006 A1
20060202954 Ho Sep 2006 A1
20060248478 Liau Nov 2006 A1
20060255903 Lussey et al. Nov 2006 A1
20070056493 Burkitt et al. Mar 2007 A1
20070062753 Yoshida et al. Mar 2007 A1
20070100523 Trachte May 2007 A1
20070132736 Crispin Jun 2007 A1
20070141939 Sandbach et al. Jun 2007 A1
20070146313 Newman et al. Jun 2007 A1
20070146342 Medler et al. Jun 2007 A1
20070152959 Peters Jul 2007 A1
20070176902 Newman et al. Aug 2007 A1
20070229478 Rosenberg et al. Oct 2007 A1
20070289859 Sandbach et al. Dec 2007 A1
20080024438 Collins et al. Jan 2008 A1
20080024454 Everest Jan 2008 A1
20080030479 Lowles et al. Feb 2008 A1
20080030482 Elwell et al. Feb 2008 A1
20080036743 Westerman et al. Feb 2008 A1
20080060854 Perlin Mar 2008 A1
20080062145 Shahoian et al. Mar 2008 A1
20080079604 Madonna et al. Apr 2008 A1
20080088577 Lenneman et al. Apr 2008 A1
20080088600 Prest et al. Apr 2008 A1
20080094367 Van De Ven et al. Apr 2008 A1
20080130126 Brooks et al. Jun 2008 A1
20080170043 Soss et al. Jul 2008 A1
20080202912 Boddie et al. Aug 2008 A1
20080211766 Westerman et al. Sep 2008 A1
20080230283 Yoon et al. Sep 2008 A1
20080264183 Graham et al. Oct 2008 A1
20080271933 Morimoto Nov 2008 A1
20080278455 Atkins et al. Nov 2008 A1
20080284743 Hsu et al. Nov 2008 A1
20080289886 Burkitt Nov 2008 A1
20080296073 McDermid Dec 2008 A1
20080296140 Yoshihara et al. Dec 2008 A1
20080302014 Szczerba et al. Dec 2008 A1
20080303799 Schwesig et al. Dec 2008 A1
20080303802 Destura et al. Dec 2008 A1
20080309624 Hotelling Dec 2008 A1
20080309626 Westerman et al. Dec 2008 A1
20080316181 Nurmi Dec 2008 A1
20090002325 Jha et al. Jan 2009 A1
20090009482 McDermid Jan 2009 A1
20090020343 Rothkopf et al. Jan 2009 A1
20090027353 Im et al. Jan 2009 A1
20090061823 Chu Mar 2009 A1
20090087655 Yamada et al. Apr 2009 A1
20090095541 Lee Apr 2009 A1
20090128507 Hoshino et al. May 2009 A1
20090140985 Liu Jun 2009 A1
20090140989 Ahlgren Jun 2009 A1
20090140994 Tanaka et al. Jun 2009 A1
20090140996 Takashima et al. Jun 2009 A1
20090151447 Jin et al. Jun 2009 A1
20090153522 Chou Jun 2009 A1
20090160529 Lamborghini Jun 2009 A1
20090160793 Rekimoto Jun 2009 A1
20090167722 Villain Jul 2009 A1
20090174674 Forutanpour Jul 2009 A1
20090184921 Scott et al. Jul 2009 A1
20090201261 Day Aug 2009 A1
20090237374 Li et al. Sep 2009 A1
20090241378 Ellis Oct 2009 A1
20090244017 Pala et al. Oct 2009 A1
20090249191 Leoutsarakos et al. Oct 2009 A1
20090256807 Nurmi Oct 2009 A1
20090256817 Perlin et al. Oct 2009 A1
20090258677 Ellis et al. Oct 2009 A1
20090265670 Kim et al. Oct 2009 A1
20090267921 Pryor Oct 2009 A1
20090273573 Hotelling Nov 2009 A1
20090279811 Kilburn et al. Nov 2009 A1
20090309616 Klinghult et al. Dec 2009 A1
20090322695 Cho et al. Dec 2009 A1
20090327977 Bachfischer et al. Dec 2009 A1
20100013774 Chen et al. Jan 2010 A1
20100020030 Kim et al. Jan 2010 A1
20100024573 Daverman et al. Feb 2010 A1
20100026640 Kim et al. Feb 2010 A1
20100039393 Pratt et al. Feb 2010 A1
20100045612 Molne Feb 2010 A1
20100045624 Hisatsugu et al. Feb 2010 A1
20100053078 Kim et al. Mar 2010 A1
20100053116 Daverman et al. Mar 2010 A1
20100062148 Lussey et al. Mar 2010 A1
20100066697 Jacomet et al. Mar 2010 A1
20100079391 Joung Apr 2010 A1
20100079395 Kim et al. Apr 2010 A1
20100085169 Poupyrev et al. Apr 2010 A1
20100090973 Algreatly Apr 2010 A1
20100097335 Jung et al. Apr 2010 A1
20100097336 Gomes et al. Apr 2010 A1
20100099394 Hainzl Apr 2010 A1
20100102922 Walkington Apr 2010 A1
20100110018 Faubert et al. May 2010 A1
20100110026 Kis et al. May 2010 A1
20100117978 Shirado May 2010 A1
20100123667 Kim et al. May 2010 A1
20100123678 Kim et al. May 2010 A1
20100123686 Klinghult et al. May 2010 A1
20100126840 Walkington May 2010 A1
20100127975 Jensen May 2010 A1
20100127983 Irani et al. May 2010 A1
20100141410 Aono et al. Jun 2010 A1
20100153879 Rimas-Ribikauskas et al. Jun 2010 A1
20100156818 Burrough et al. Jun 2010 A1
20100168998 Matsunaga Jul 2010 A1
20100171713 Kwok et al. Jul 2010 A1
20100214239 Wu Aug 2010 A1
20100222972 Hustyi Sep 2010 A1
20100231540 Cruz-Hernandez et al. Sep 2010 A1
20100250071 Pala et al. Sep 2010 A1
20100253645 Bolender Oct 2010 A1
20100265170 Norieda Oct 2010 A1
20100271325 Conte et al. Oct 2010 A1
20100277438 Kawashima et al. Nov 2010 A1
20100283749 Walkington Nov 2010 A1
20100308844 Day et al. Dec 2010 A1
20100315267 Chung et al. Dec 2010 A1
20100315349 Choi Dec 2010 A1
20100321310 Kim et al. Dec 2010 A1
20110006980 Taniguchi et al. Jan 2011 A1
20110007023 Abrahamsson et al. Jan 2011 A1
20110021251 Lindén Jan 2011 A1
20110022393 Wäller et al. Jan 2011 A1
20110030502 Lathrop Feb 2011 A1
20110032203 Pryor Feb 2011 A1
20110037721 Cranfill et al. Feb 2011 A1
20110043468 Lathrop et al. Feb 2011 A1
20110043491 Oh Feb 2011 A1
20110046788 Daly et al. Feb 2011 A1
20110050588 Li et al. Mar 2011 A1
20110050589 Yan et al. Mar 2011 A1
20110050591 Kim et al. Mar 2011 A1
20110050629 Homma et al. Mar 2011 A1
20110054359 Sazonov et al. Mar 2011 A1
20110057899 Sleeman et al. Mar 2011 A1
20110063248 Yoon Mar 2011 A1
20110069024 Kim Mar 2011 A1
20110074724 Pryor Mar 2011 A1
20110082627 Small et al. Apr 2011 A1
20110087983 Shim Apr 2011 A1
20110107272 Aguilar May 2011 A1
20110109578 Wäller et al. May 2011 A1
20110115736 Joguet et al. May 2011 A1
20110128164 Kang et al. Jun 2011 A1
20110128235 Rogers et al. Jun 2011 A1
20110128250 Murphy et al. Jun 2011 A1
20110141052 Bernstein et al. Jun 2011 A1
20110141053 Bulea et al. Jun 2011 A1
20110175754 Karpinsky Jul 2011 A1
20110175844 Berggren Jul 2011 A1
20110175845 Honda et al. Jul 2011 A1
20110181430 Hu et al. Jul 2011 A1
20110181546 Joguet et al. Jul 2011 A1
20110187674 Baker et al. Aug 2011 A1
20110193813 Gralewski et al. Aug 2011 A1
20110205151 Newton et al. Aug 2011 A1
20110205162 Wäller et al. Aug 2011 A1
20110205182 Miyazawa et al. Aug 2011 A1
20110210926 Pasquero et al. Sep 2011 A1
20110216015 Edwards Sep 2011 A1
20110221564 Deppiesse et al. Sep 2011 A1
20110221684 Rydenhag Sep 2011 A1
20110221693 Miyazaki Sep 2011 A1
20110221694 Karaoguz et al. Sep 2011 A1
20110227870 Kim Sep 2011 A1
20110227872 Huska et al. Sep 2011 A1
20110239110 Garrett et al. Sep 2011 A1
20110241850 Bosch et al. Oct 2011 A1
20110242029 Kasahara et al. Oct 2011 A1
20110245992 Stahlin et al. Oct 2011 A1
20110248728 Maruyama Oct 2011 A1
20110248942 Yana et al. Oct 2011 A1
20110248948 Griffin et al. Oct 2011 A1
20110253948 Lussey et al. Oct 2011 A1
20110260965 Kim et al. Oct 2011 A1
20110265002 Hong et al. Oct 2011 A1
20110267294 Kildal Nov 2011 A1
20110273394 Young et al. Nov 2011 A1
20110275412 Khawand Nov 2011 A1
20110278078 Schediwy et al. Nov 2011 A1
20110290038 Hoshino et al. Dec 2011 A1
20110304559 Pasquero Dec 2011 A1
20110304581 An et al. Dec 2011 A1
20110316811 Kitagawa Dec 2011 A1
20120001870 Lee et al. Jan 2012 A1
20120013573 Liu et al. Jan 2012 A1
20120019448 Pitkanen et al. Jan 2012 A1
20120019463 Ng et al. Jan 2012 A1
20120026124 Li et al. Feb 2012 A1
20120032899 Waeller et al. Feb 2012 A1
20120032907 Koizumi et al. Feb 2012 A1
20120032915 Wittorf Feb 2012 A1
20120044169 Enami Feb 2012 A1
20120044172 Ohki et al. Feb 2012 A1
20120050159 Yu et al. Mar 2012 A1
20120050208 Dietz Mar 2012 A1
20120056818 Shafi et al. Mar 2012 A1
20120056837 Park et al. Mar 2012 A1
20120062603 Mizunuma et al. Mar 2012 A1
20120068946 Tang et al. Mar 2012 A1
20120068965 Wada et al. Mar 2012 A1
20120068969 Bogana et al. Mar 2012 A1
20120081327 Heubel et al. Apr 2012 A1
20120086659 Perlin et al. Apr 2012 A1
20120086670 Teil et al. Apr 2012 A1
20120092250 Hadas et al. Apr 2012 A1
20120092279 Martin Apr 2012 A1
20120092294 Ganapathi et al. Apr 2012 A1
20120092299 Harada et al. Apr 2012 A1
20120092324 Buchan et al. Apr 2012 A1
20120105358 Momeyer et al. May 2012 A1
20120105367 Son et al. May 2012 A1
20120113028 Marsden et al. May 2012 A1
20120113054 Hashimoto et al. May 2012 A1
20120113061 Ikeda May 2012 A1
20120120009 Lussey et al. May 2012 A1
20120126959 Zarrabi et al. May 2012 A1
20120127088 Pance et al. May 2012 A1
20120127107 Miyashita et al. May 2012 A1
20120127179 Aspelin May 2012 A1
20120139864 Sleeman et al. Jun 2012 A1
20120146945 Miyazawa et al. Jun 2012 A1
20120147052 Homma et al. Jun 2012 A1
20120154315 Aono Jun 2012 A1
20120154316 Kono Jun 2012 A1
20120154317 Aono Jun 2012 A1
20120154318 Aono Jun 2012 A1
20120154328 Kono Jun 2012 A1
20120154329 Shinozaki Jun 2012 A1
20120154330 Shimizu Jun 2012 A1
20120162122 Geaghan Jun 2012 A1
20120169609 Britton Jul 2012 A1
20120169617 Mäenpää Jul 2012 A1
20120169635 Liu Jul 2012 A1
20120169636 Liu Jul 2012 A1
20120188181 Ha et al. Jul 2012 A1
20120194460 Kuwabara et al. Aug 2012 A1
20120194466 Posamentier Aug 2012 A1
20120199921 Tanaka et al. Aug 2012 A1
20120204653 August et al. Aug 2012 A1
20120205165 Strittmatter et al. Aug 2012 A1
20120206393 Hillis et al. Aug 2012 A1
20120218212 Yu et al. Aug 2012 A1
20120229424 Behles et al. Sep 2012 A1
20120235940 Ludwig Sep 2012 A1
20130002538 Mooring et al. Jan 2013 A1
20130038437 Talati et al. Feb 2013 A1
20130063389 Moore Mar 2013 A1
20130113715 Grant et al. May 2013 A1
20130128587 Lisseman et al. May 2013 A1
20130307788 Rao et al. Nov 2013 A1
20130338847 Lisseman et al. Dec 2013 A1
20140253504 Noshadi et al. Sep 2014 A1
20140267113 Lisseman et al. Sep 2014 A1
20140267114 Lisseman et al. Sep 2014 A1
20150067513 Zambetti et al. Mar 2015 A1
20150067596 Brown et al. Mar 2015 A1
Foreign Referenced Citations (53)
Number Date Country
60011078 Jun 2005 DE
60210951 Jan 2007 DE
60130983 Jul 2008 DE
1640697 Mar 2006 EP
1887595 Feb 2008 EP
2423646 Aug 2006 GB
2445505 Jul 2008 GB
2448893 Nov 2008 GB
2450587 Dec 2008 GB
2452714 Mar 2009 GB
2454619 May 2009 GB
2462920 Mar 2010 GB
2465077 May 2010 GB
2465713 Jun 2010 GB
2468870 Sep 2010 GB
2437997 Jul 2011 GB
2443658 Sep 2011 GB
58-141835 Sep 1983 JP
64-66522 Mar 1989 JP
06-037056 May 1994 JP
2005-175815 Jun 2005 JP
2006-129893 May 2006 JP
2008-181709 Aug 2008 JP
2009-008613 Jan 2009 JP
2009-521006 May 2009 JP
2009-186452 Aug 2009 JP
2009-244931 Oct 2009 JP
2010-511916 Apr 2010 JP
2012058159 Mar 2012 JP
10-1999-0047429 Jul 1999 KR
10-2009-0074571 Jul 2009 KR
10-2010-0087721 Aug 2010 KR
10-2011-0014115 Feb 2011 KR
10-2011-0042924 Apr 2011 KR
9803193 Jul 1998 WO
9938173 Jul 1999 WO
0079546 Dec 2000 WO
0188935 Nov 2001 WO
0188935 Nov 2001 WO
02099822 Dec 2002 WO
2005029514 Mar 2005 WO
2006016138 Feb 2006 WO
2006123616 Nov 2006 WO
2007072319 Jun 2007 WO
2007107522 Sep 2007 WO
2008-062403 May 2008 WO
2008135787 Nov 2008 WO
2009034313 Mar 2009 WO
2010023449 Sep 2010 WO
2010109186 Sep 2010 WO
2011045929 Apr 2011 WO
2012-001428 Jan 2012 WO
2012-088549 Jun 2012 WO
Non-Patent Literature Citations (34)
Entry
Knite, M., et al., “Polyisoprene-multi-wall carbon nanotube composites for sensing strain,” Materials Science and Engineering C., vol. 37, No. 5, Oct. 2, 2006, pp. 1125-1128.
International Search Report and Written Opinion, dated Dec. 17, 2013, in connection with corresponding International Application No. PCT/US2013/060046.
Office Action dated Nov. 4, 2014, received in connection with JP Patent Application No. 2011-075258. (English Translation attached).
Office Action dated Mar. 11, 2013 in U.S. Appl. No. 13/076,226, which issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015.
Office Action dated Feb. 13, 2014 in U.S. Appl. No. 13/076,226, which issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015.
Office Action dated Sep. 11, 2014 in U.S. Appl. No. 13/076,226, which issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015.
U.S. Appl. No. 13/076,226, filed Mar. 30, 2011, which has now issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015, and its file history.
Co-pending U.S. Appl. No. 13/863,363, filed Apr. 15, 2013 and its file history.
Office Action dated Nov. 10, 2015 in U.S. Appl. No. 13/863,363.
International Preliminary Report on Patentability and Written Opinion of the U.S. International Searching Authority from Application No. PCT/US2013/060046 mailed Mar. 26, 2015.
Co-pending U.S. Appl. No. 14/211,475, filed Mar. 14, 2014 and its file history.
Co-pending U.S. Appl. No. 14/211,665, filed Mar. 14, 2014, and its file history.
Co-pending U.S. Appl. No. 13/673,463, filed Nov. 9, 2012, and its file history.
International Search Report and Written Opinion dated Mar. 29, 2013 issued for PCT/US2012/064409.
International Search Report and Written Opinion dated Jun. 21, 2013 issued for PCT/US2013/030417.
International Search Report and Written Opinion dated Jun. 24, 2014 issued for PCT/US2014/027735.
International Search Report and Written Opinion dated Jun. 26, 2014 issued for PCT/US2014/027777.
Non-Final Office Action dated Feb. 18, 2015 in U.S. Appl. No. 13/673,463.
Final Office Action dated Aug. 20, 2015 in U.S. Appl. No. 13/673,463.
Advisory Action dated Nov. 5, 2015 in U.S. Appl. No. 13/673,463.
Non-Final Office Action dated Jan. 21, 2016 in U.S. Appl. No. 13/673,463.
Final Office Action dated Jun. 3, 2016 in U.S. Appl. No. 13/863,363.
Non-Final Office Action dated Dec. 17, 2015 in U.S. Appl. No. 14/211,475.
Final Office Action dated Aug. 16, 2016 in U.S. Appl. No. 14/211,475.
Non-Final Office Action dated Dec. 15, 2015 in U.S. Appl. No. 14/211,665.
Final Office Action dated Aug. 16, 2016 in U.S. Appl. No. 14/211,665.
Office Action, dated Oct. 18, 2016, received in connection with JP Application No. 2014-541319. (English translation attached).
Office Action, dated Nov. 3, 2016, received in connection with U.S. Appl. No. 13/863,363.
Office Action, dated Aug. 16, 2016, received in connection with U.S. Appl. No. 14/211,665.
Office Action, dated Aug. 24, 2016, received in connection with U.S. Appl. No. 13/673,463.
Office Action, dated Aug. 16, 2016, received in connection with U.S. Appl. No. 14/211,475.
Office Action, dated Jan. 23, 2017, received in connection with U.S. Appl. No. 14/211,475.
Office Action, dated Jan. 23, 2017, received in connection with U.S. Appl. No. 14/211,665.
Office Action, dated May 2, 2017, received in connection with Japanese Application No. 2015-532133 (English-language translation attached).
Related Publications (1)
Number Date Country
20140076063 A1 Mar 2014 US
Provisional Applications (1)
Number Date Country
61701884 Sep 2012 US