The present disclosure relates to pressure sensitive sensors. In particular, the disclosure relates to the use of electroactive materials to create single-layer pressure sensors.
Pressure sensors have been used in a wide range of applications. Most pressure sensors rely on deflection elements to span empty spaces or gaps between conductors. Such deflection elements have the advantage of avoiding inadvertent activation of the sensor through touching of the conducting elements during minor load application.
Pressure sensors relying on piezoelectric effects generate an electrical signal in response to mechanical placement or pressure. The piezoelectric materials, however, do not generate signals that are universally applicable to a full range of control algorithms.
A need remains for pressure sensors that are adaptable to different ranges of control algorithms.
A sensor for sensing an application of pressure is disclosed. The sensor includes a substrate, conductive elements and an electroactive layer. First and second conductive elements are supported on the substrate and have elongate edges spaced apart from each other. The electroactive layer has a common surface adhered against the conductive elements. The electroactive layer defines at least one electrical property in a portion of the layer between the conductive elements. The electrical property is configured to vary in relation to a magnitude of the pressure.
The electrical property may be a resistance or a capacitance.
A logic device may be connected to the conductive elements and configured to determine the electrical property. The first and second conductive elements may be connected to a power source. The electrical property may be a resistance generating a voltage difference between the conductive elements. The voltage difference varies in proportion to the magnitude of the pressure.
The sensor may also include a calibrator configured to determine the magnitude of the pressure using the voltage difference.
The electroactive layer may comprise a quantum tunneling composite (QTC) or a nanotube doped ink or a doped carbon. The doped carbon may be an ink, for example, printed onto a second substrate and laminated on the substrate and conductive elements.
The conductive elements may have different patterns, such as a square or spiral pattern. The square pattern may include interdigitated fingers. The spiral pattern may include intertwined conductive elements. The first conductive element may include a plurality of first fingers. The second conductive element may include a plurality of second fingers. The fingers may extend between each other, such as in a parallel, spaced array. The fingers may alternate with each other across the common surface to form a plurality of adjacent edges spaced apart from each other. Also, the fingers may extend in different directions.
The first fingers may also extend from a first trunk trace and the second fingers extend from a second trunk trace. The first trunk trace may have a first concavity. The second trunk trace may have a second concavity. The first and second fingers may extend into the concavity in opposite directions from each other. The concavities may face each other to define a circular pressure sensitive region.
Also, the fingers may have varied spacing. One pair of first and second fingers may be more closely spaced than another pair of first and second fingers. Closer spacing may be used to provide greater sensitivity to pressure.
The electroactive layer may also be varied in its sensitivity. Some areas may have a greater resistance between fingers. Other areas may have lower resistance between fingers.
The electrical property of the electroactive layer may exhibit a characteristic curve, such as a relationship between pressure and resistance. This characteristic may be varied as a function of a distance between the elongate edges of the conductive elements. An increase in the distance may, for example, increase a threshold for detection of the application of pressure. Also, a width of the conductive elements may be varied to increase the threshold. Also, increases in the distance or width may increase a radius of curvature of the characteristic curve.
The width and/or spacing of the conductive elements or fingers may range from 10 microns to 500 microns. Lower ranges may be accomplished, for example, using printing, such as aerosol jet printing. Closer spacing and smaller widths may be facilitated by printing the conductive elements with carbon ink.
The electroactive layer may include a conductive carbon ink printed on a second substrate and adhered against the conductive elements using an adhesive layer. The adhesive layer may be, for example, 5 microns thick and comprised of liquid or pressure sensitive adhesive.
The sensor may include a coating deposited on the electroactive layer. The coating may protect against the environment, such as by being impermeable to water. Also, the coating may be configured to adjust a characteristic response curve of the sensor. For example, the coating may be configured to increase a radius of curvature of the characteristic curve of the sensor. The coating may have variations in hardness, stiffness, thickness, material composition or shape, for example, to modify the characteristic response curve of the sensor.
The coating may be applied by printing, chemical vapor deposition, atomic layer deposition, spraying or dipping, for example. Coating materials may include parylene, silicone and dielectric, for example. The coating may also be formed as a second substrate that is adhered over or to the electroactive layer. The coating may have a dome shape or be a separate single-thickness layer.
The electroactive layer may include a portion comprising a compliant molding. The compliant molding may include a conductive polymer, such as a phenolic resole or a conductive elastomer.
A top side of the electroactive layer may include a force-deflection element, such as a detent or secondary feature that decreases a contact area of the force-deflection element.
In another implementation, the first and second conductive elements may have a same length and width adhered against the electroactive layer. In addition, the conductive elements may extend in parallel in a same direction. They may also be equally spaced from each other. A plurality of first and second conductive elements may be employed as dedicated channels. The conductive elements, for example, may have a spacing and width in a range of 250 to 500 micrometers.
The terminology used herein is for the purpose of describing particular implementations only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof
With reference now to
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The implementation was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various implementations with various modifications as are suited to the particular use contemplated.
Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
Computer program code for carrying out operations for aspects of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C++ or the like and conventional procedural programming languages, such as the “C” programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider).
Aspects of the present invention are described below with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to implementations of the invention. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.
The computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks.
Referring again to
Optionally, the compressibility of the substrate 12 may be adjusted to adjust recruitment of the electroactive layer 18 and conductive elements 14, 16. Increased compressibility may, for example, result in bending and deflection of the electroactive layer and modifying its response to the application of pressure. Also, additional adjacent conductive elements may be deflected to generate changes in conduction characteristics. A soft substrate may also have appealing soft-touch characteristics suitable for some surfaces, such as automotive interiors or textile supported controls.
The substrate 12 may have different surface contours than flat, such as curved, textured or angled. Surface variations may adapt the sensor 10 to fit contours of various controllers. For example, a rounded shape may be employed for a window control in an automobile interior to fit the rounded surface adjacent to the window. A cylindrical shape may be used to wrap around a steering wheel.
The substrate 12 may also be fashioned to have different perimeter shapes for fitting into controllers based on the desired control dynamic. For example, a strip shape may be used for long, gliding gestures or swipes applying pressure to the sensor 10. Expanded two dimensional shapes may facilitate sensing in two dimensions (X-Y) as well as the force (Z) dimension. Circular shapes may be employed for circumferential position detection or detection of circular or dial motions along with pressure.
Generally, the substrate 12 should have limited or no conductivity to prevent inadvertent communication between the adjacently arranged first and second conductive elements 14, 16. The substrate 12 may also be constructed from an electroactive material to facilitate electrical communication between conductive elements during application of a pressure to the pressure sensor 10.
As shown in
The substrate 12 may have a range of thicknesses and may be a structure of an underlying surface of the object being controlled. For example, it may be a dash of an automotive interior with the conductive elements 14, 16 and electroactive layer 18 mounted thereon. The substrate 12 also has the advantage of not only supporting the conductive elements and electroactive layer, but also by “pushing back” at the applied force to facilitate compression of those components.
The first conductive elements 14, as shown in
The second conductive elements 16, as shown in
The first and second conductive elements 14, 16 connect respectively to first and second conductors that have attached thereto some form of power supply. This power supply generates a voltage difference between the conductive elements. As is described below, the amount and area of an application of pressure allows for current conduction between the conductive elements of the pressure sensor 10.
As shown in
The electroactive layer 18 preferably has an electrical property which varies with an applied force. For example, the electroactive layer 18 may be comprised of a pressure sensitive material configured to change resistance or conductive/electrical characteristics in response to force or pressure acting thereupon. The pressure sensitive material can behave substantially as an isolator when no force or pressure is present and decreases in resistance as more force or pressure is present. Between low and high forces, the pressure sensitive material responds to force or pressure in a predictable manner, decreasing in resistance with increasing force.
The pressure sensitive material may, for example, be a carbon nanotube conductive polymer. The pressure sensitive material can be applied over the conductive elements 14, 16 by a printing process, such as two- or three-dimensional ink jet or screen printing, vapor deposition, or printed circuit techniques, such etching, photo-engraving, or milling. As pressure sensitive materials with smaller particle sizes are used, such as that of grapheme or a grapheme conductive polymer, the pressure sensitive material may also be applied through printed circuit techniques such as vapor deposition.
According to other implementations, the pressure sensitive material may be a silicene polymer material doped with a conductor, such as silver or copper. According to other examples, the pressure sensitive material can be a quantum tunneling composite (QTC), which is a variable resistance pressure sensitive material that employs Fowler-Nordheim tunneling. The QTC material in the sensors may act as an insulator when zero pressure or zero force is applied, since the conductive particles may be too far apart to conduct, but as pressure (or force) is applied, the conductive particles move closer to other conductive particles, so that electrons can pass through the insulator layer changing the insulator layer changing the resistance of the sensor. Thus, the resistance of the QTC in the sensors is a function of the force or pressure acting upon the sensor.
As shown in
Advantageously, the size, positioning and other characteristics of the fingers may be employed to modify the characteristic response curve of the sensor beyond the response expected for an electroactive layer 18 interposed between two conductors. For example, as shown in
This characteristic curve has its advantages, such as for deterministic on-off switch operation, although it may be less applicable to systems requiring more gradual response characteristics. For example, fuzzy logic systems may benefit from a gradual transition in the force-resistance response of the sensor. Such characteristics can be programmed or custom-crafted using the above-described finger configuration of conductive elements 14, 16 of a single-layer sensor 10. Variations of the finger size, length, and composition and other geometry, can modify and soften the characteristic response curve. For example,
Restated, by modifying one or more finger geometries, such as width or spacing, or finger material, the resultant force-response characteristic curve of the pressure sensor 10 may be changed. For the small and medium finger size and spacing, the curve moves higher on the resistive scale. This causes a greater drop in resistance by a force threshold “F” and therefore a greater force threshold.
The sensor 10 characteristic response curve may be modified by configurations of conductive elements other than finger geometry. For example, the fingers may be shaped in the form of intertwined traces, such as in a spiral pattern, on the substrate 12.
Notably, the use of additional or smaller or more closely spaced conductive elements results in migration of the curve toward the characteristic curve of the substrate 12. For example,
Modifying the sensor 10 to use smaller, more closely spaced fingers may be used to expand the range of materials used for the electroactive layer 18 to include less sensitive materials. For example, a carbon ink electroactive layer 18 may be formed by printing carbon ink on a cover layer. The cover layer is then applied over the conductive elements 14, 16 on the substrate 12. Increased force or pressure coincides with increased contact area on the micro fingers, as shown in
One advantage of carbon ink is that it is less likely (generally) to migrate than silver or softer materials. Therefore, carbon ink may be employed for smaller width and spacing of conductive elements. The carbon ink electroactive layer 18 may also have the characteristic of higher resistance given the curve migration promoted by the use of the small and close elements 14, 16. In this implementation, it may be advantageous to have a small or thin layer between the conductive elements and the electroactive layer 18. This intervening layer could comprise, for example, a liquid adhesive or pressure sensitive adhesive, of 5 microns or more.
The conductive elements 14, 16 may also be deposited on the substrate with printed circuit board etching, printing, chemical deposition, atomic layer deposition or aerosol jet, for example. The electroactive layer 18 may include a conductive plastic or elastomer in the form of semi-compliant molding. The molding may include a tolerancing feature 32, such as is shown in
The implementation of
As another option, a hybrid sensor 10 may be created combining single and multi-layer architecture. Example hybrid sensors 10 are shown in
The fingers 14, 16 could also be modified to configure the sensor 10's characteristic sensitivity. For example, the finger width may be increased for more robust measurements. Also, the finger material could change from higher to lower resistance materials along its length.
Mechanical adaptations may also be made to modify the response characteristics of the pressure sensor 10. For example, the characteristic curve shapes of
As shown in
As shown in
For example, as shown in
Portions of the line traces 36 and conductive elements 14, 16 may comprise different materials. For example, they may both be printed silver. Or, one may be printed silver and the other printed carbon. The line width and spacing may also be varied as described above, such as with 250, 350 or 500 micron widths and/or spacing.
The dedicated channels provide multiple output lines for readings from the sensor 10. These outputs from these lines can be compared to each other over varying distances. Multiple output lines may facilitate tracking moving along the length of the sensor since resistance increases with distance from the input (applied pressure). Also, multiple output lines allow for redundant self-checking or double parsing results. Sensor or computer logic can check adjacent or proximal lines bridged by an applied force or pressure. The multiple outputs may also be used to determine width-wise position or the area of the applied force.
Referring now to
In addition, the central server 500 may include at least one storage device 515, such as a hard disk drive, a floppy disk drive, a CD Rom drive, or optical disk drive, for storing information on various computer-readable media, such as a hard disk, a removable magnetic disk, or a CD-ROM disk. As will be appreciated by one of ordinary skill in the art, each of these storage devices 515 may be connected to the system bus 545 by an appropriate interface. The storage devices 515 and their associated computer-readable media may provide nonvolatile storage for a central server. It is important to note that the computer-readable media described above could be replaced by any other type of computer-readable media known in the art. Such media include, for example, magnetic cassettes, flash memory cards and digital video disks.
A number of program modules may be stored by the various storage devices and within RAM 530. Such program modules may include an operating system 550 and a plurality of one or more (N) modules 560. The modules 560 may control certain aspects of the operation of the central server 500, with the assistance of the processor 510 and the operating system 550. For example, the modules may perform the functions described above and illustrated by the figures and other materials disclosed herein. The modules may include an electrical property determination module 562 that is configured to determine an electrical property of the electroactive layer based connection to the conductive elements. Further, the modules may include a calibrator module 564 configured to determine the magnitude of a pressure using a voltage difference between the conductive elements.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various implementations of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The implementation was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various implementations with various modifications as are suited to the particular use contemplated.
This application claims the benefit of U.S. Provisional Patent Application No. 61/701,884, filed on Sep. 17, 2012, entitled “SINGLE LAYER FORCE SENSOR,” the disclosure of which is expressly incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
4268815 | Eventoff et al. | May 1981 | A |
4276538 | Eventoff et al. | Jun 1981 | A |
4301337 | Eventoff | Nov 1981 | A |
4314227 | Eventoff | Feb 1982 | A |
4314228 | Eventoff | Feb 1982 | A |
4315238 | Eventoff | Feb 1982 | A |
4451714 | Eventoff | May 1984 | A |
4484026 | Thornburg | Nov 1984 | A |
4489302 | Eventoff | Dec 1984 | A |
4540979 | Gerger et al. | Sep 1985 | A |
4739299 | Eventoff et al. | Apr 1988 | A |
4801771 | Mizuguchi et al. | Jan 1989 | A |
4810992 | Eventoff | Mar 1989 | A |
4929934 | Ueda et al. | May 1990 | A |
4963702 | Yaniger et al. | Oct 1990 | A |
5053585 | Yaniger | Oct 1991 | A |
5159159 | Asher | Oct 1992 | A |
5186055 | Kovacich et al. | Feb 1993 | A |
5209967 | Wright et al. | May 1993 | A |
5262778 | Saunders | Nov 1993 | A |
5296837 | Yaniger | Mar 1994 | A |
5302936 | Yaniger | Apr 1994 | A |
5365671 | Yaniger | Nov 1994 | A |
5398962 | Kropp | Mar 1995 | A |
5408873 | Schmidt et al. | Apr 1995 | A |
5423569 | Reighard et al. | Jun 1995 | A |
5453941 | Yoshikawa | Sep 1995 | A |
5463258 | Filion et al. | Oct 1995 | A |
5510783 | Findlater et al. | Apr 1996 | A |
5539259 | Filion et al. | Jul 1996 | A |
5659334 | Yaniger et al. | Aug 1997 | A |
5670988 | Tickle | Sep 1997 | A |
5793297 | Takeuchi et al. | Aug 1998 | A |
5828363 | Yaniger et al. | Oct 1998 | A |
5847639 | Yaniger | Dec 1998 | A |
5854625 | Frisch et al. | Dec 1998 | A |
5871063 | Young | Feb 1999 | A |
5907419 | Martinelli et al. | May 1999 | A |
5914658 | Arakawa | Jun 1999 | A |
5943044 | Martinelli et al. | Aug 1999 | A |
5965952 | Podoloff et al. | Oct 1999 | A |
5982519 | Martinelli et al. | Nov 1999 | A |
6084572 | Yaniger | Jul 2000 | A |
6239790 | Martinelli et al. | May 2001 | B1 |
6291568 | Lussey | Sep 2001 | B1 |
6333736 | Sandbach | Dec 2001 | B1 |
6378384 | Atkinson et al. | Apr 2002 | B1 |
6388556 | Imai et al. | May 2002 | B1 |
6396523 | Segal et al. | May 2002 | B1 |
6429846 | Rosenberg et al. | Aug 2002 | B2 |
6437682 | Vance | Aug 2002 | B1 |
6495069 | Lussey et al. | Dec 2002 | B1 |
6501463 | Dahley et al. | Dec 2002 | B1 |
6529122 | Magnussen et al. | Mar 2003 | B1 |
6531951 | Serban et al. | Mar 2003 | B2 |
6538643 | Mori et al. | Mar 2003 | B2 |
6563415 | Armstrong | May 2003 | B2 |
6646540 | Lussey | Nov 2003 | B1 |
6690365 | Hinckley et al. | Feb 2004 | B2 |
6750803 | Yates et al. | Jun 2004 | B2 |
6758689 | Bair et al. | Jul 2004 | B1 |
6765557 | Segal et al. | Jul 2004 | B1 |
6791532 | Hirano et al. | Sep 2004 | B2 |
6801191 | Mukai et al. | Oct 2004 | B2 |
6809280 | Divigalpitiya et al. | Oct 2004 | B2 |
6809462 | Pelrine et al. | Oct 2004 | B2 |
6820804 | Segal et al. | Nov 2004 | B2 |
6822640 | Derocher | Nov 2004 | B2 |
6850221 | Tickle | Feb 2005 | B1 |
6861961 | Sandbach et al. | Mar 2005 | B2 |
6875938 | Schmiz et al. | Apr 2005 | B2 |
6888537 | Benson et al. | May 2005 | B2 |
6906700 | Armstrong | Jun 2005 | B1 |
6909354 | Baker et al. | Jun 2005 | B2 |
6947031 | Sandbach et al. | Sep 2005 | B2 |
6995752 | Lu | Feb 2006 | B2 |
7050045 | Baker et al. | May 2006 | B2 |
7084859 | Pryor | Aug 2006 | B1 |
7091436 | Serban | Aug 2006 | B2 |
7091998 | Miller-Smith | Aug 2006 | B2 |
7112755 | Kitano et al. | Sep 2006 | B2 |
7113179 | Baker et al. | Sep 2006 | B2 |
7126583 | Breed | Oct 2006 | B1 |
7154484 | Komata | Dec 2006 | B2 |
7158122 | Roberts | Jan 2007 | B2 |
7161460 | Federspiel | Jan 2007 | B2 |
7170428 | Himberg et al. | Jan 2007 | B2 |
7176889 | Baker et al. | Feb 2007 | B2 |
7190348 | Kennedy et al. | Mar 2007 | B2 |
7213323 | Baker et al. | May 2007 | B2 |
7215330 | Rantet | May 2007 | B2 |
7250940 | Jayanetti et al. | Jul 2007 | B2 |
7258026 | Papakostas et al. | Aug 2007 | B2 |
7295904 | Kanevsky et al. | Nov 2007 | B2 |
7301435 | Lussey et al. | Nov 2007 | B2 |
7310089 | Baker et al. | Dec 2007 | B2 |
7324095 | Sharma | Jan 2008 | B2 |
7336260 | Martin et al. | Feb 2008 | B2 |
7345675 | Minakuchi | Mar 2008 | B1 |
7356769 | Lehtonen | Apr 2008 | B2 |
7377133 | Sandbach et al. | May 2008 | B2 |
7388571 | Lowles et al. | Jun 2008 | B2 |
7432459 | Stoschek et al. | Oct 2008 | B2 |
7468199 | Divigalpitiya et al. | Dec 2008 | B2 |
7511702 | Hotelling | Mar 2009 | B2 |
7554045 | Sandbach et al. | Jun 2009 | B2 |
7554051 | Crispin | Jun 2009 | B2 |
7554531 | Baker et al. | Jun 2009 | B2 |
7573464 | Baker et al. | Aug 2009 | B2 |
7576294 | Clemens et al. | Aug 2009 | B2 |
7603917 | Graham et al. | Oct 2009 | B2 |
7614008 | Ording | Nov 2009 | B2 |
7619616 | Rimas-Ribikauskas et al. | Nov 2009 | B2 |
7629966 | Anson | Dec 2009 | B2 |
7649278 | Yoshida et al. | Jan 2010 | B2 |
7683889 | Rimas-Ribikauskas et al. | Mar 2010 | B2 |
7683890 | Geaghan | Mar 2010 | B2 |
7693631 | Yukawa et al. | Apr 2010 | B2 |
7721609 | Wright | May 2010 | B2 |
7724242 | Hillis et al. | May 2010 | B2 |
7733209 | Kurtz | Jun 2010 | B2 |
7746327 | Miyakoshi | Jun 2010 | B2 |
7772960 | Baker | Aug 2010 | B2 |
7773075 | Otsuka et al. | Aug 2010 | B2 |
7777730 | Geurts et al. | Aug 2010 | B2 |
7791596 | Errico et al. | Sep 2010 | B2 |
7808488 | Martin et al. | Oct 2010 | B2 |
7813774 | Perez-Noguera | Oct 2010 | B2 |
7822443 | Kim et al. | Oct 2010 | B2 |
7863822 | Stoschek et al. | Jan 2011 | B2 |
7898381 | Hatsuda | Mar 2011 | B2 |
7903090 | Soss et al. | Mar 2011 | B2 |
7952566 | Poupyrev et al. | May 2011 | B2 |
7973773 | Pryor | Jul 2011 | B2 |
8022933 | Hardacker et al. | Sep 2011 | B2 |
8026902 | Medler et al. | Sep 2011 | B2 |
8026906 | Mölne | Sep 2011 | B2 |
8035535 | Nousiainen | Oct 2011 | B2 |
8037770 | Larson et al. | Oct 2011 | B2 |
8049730 | Joguet et al. | Nov 2011 | B2 |
8049731 | Baker et al. | Nov 2011 | B2 |
8049737 | Cho et al. | Nov 2011 | B2 |
8052293 | Hurwitz | Nov 2011 | B2 |
8059104 | Shahoian et al. | Nov 2011 | B2 |
8063322 | Katsurahira | Nov 2011 | B2 |
8063886 | Serban et al. | Nov 2011 | B2 |
8072439 | Hillis et al. | Dec 2011 | B2 |
8072440 | Pryor | Dec 2011 | B2 |
8081165 | Reiner | Dec 2011 | B2 |
8094130 | Griffin et al. | Jan 2012 | B2 |
8095278 | Schaaf et al. | Jan 2012 | B2 |
8098236 | Klein et al. | Jan 2012 | B2 |
8113065 | Ohsato et al. | Feb 2012 | B2 |
8120586 | Hsu et al. | Feb 2012 | B2 |
8120588 | Klinghult | Feb 2012 | B2 |
8130207 | Nurmi et al. | Mar 2012 | B2 |
8134535 | Choi et al. | Mar 2012 | B2 |
8139038 | Chueh et al. | Mar 2012 | B2 |
8144133 | Wang et al. | Mar 2012 | B2 |
8149211 | Hayakawa et al. | Apr 2012 | B2 |
8151210 | Nezu et al. | Apr 2012 | B2 |
8154528 | Chen et al. | Apr 2012 | B2 |
8159473 | Cheng et al. | Apr 2012 | B2 |
8169295 | Walkington | May 2012 | B2 |
8171431 | Grossman et al. | May 2012 | B2 |
8184093 | Tsuiki | May 2012 | B2 |
8184106 | Serban | May 2012 | B2 |
8188985 | Hillis et al. | May 2012 | B2 |
8199116 | Jeon et al. | Jun 2012 | B2 |
8203454 | Knight et al. | Jun 2012 | B2 |
8212790 | Rimas-Ribikauskas et al. | Jul 2012 | B2 |
8214105 | Daly et al. | Jul 2012 | B2 |
8222799 | Polyakov et al. | Jul 2012 | B2 |
8228305 | Pryor | Jul 2012 | B2 |
8229603 | Miyata et al. | Jul 2012 | B2 |
8237324 | Pei et al. | Aug 2012 | B2 |
8237537 | Kurtz | Aug 2012 | B2 |
8239784 | Hotelling et al. | Aug 2012 | B2 |
8243035 | Abe et al. | Aug 2012 | B2 |
8243039 | Trachte | Aug 2012 | B2 |
8253699 | Son | Aug 2012 | B2 |
8269731 | Molne | Sep 2012 | B2 |
8368505 | Deppiesse | Feb 2013 | B2 |
8698764 | Karakotsios et al. | Apr 2014 | B1 |
9030419 | Freed | May 2015 | B1 |
20010040551 | Yates et al. | Nov 2001 | A1 |
20020041164 | Kim | Apr 2002 | A1 |
20020054060 | Schena | May 2002 | A1 |
20020097229 | Rose et al. | Jul 2002 | A1 |
20020135457 | Sandbach et al. | Sep 2002 | A1 |
20030011576 | Sandbach et al. | Jan 2003 | A1 |
20030043014 | Nakazawa et al. | Mar 2003 | A1 |
20030076968 | Rast | Apr 2003 | A1 |
20030083131 | Armstrong | May 2003 | A1 |
20030160808 | Foote et al. | Aug 2003 | A1 |
20040071471 | Baker et al. | Apr 2004 | A1 |
20040207605 | MacKey et al. | Oct 2004 | A1 |
20040217331 | Lussey et al. | Nov 2004 | A1 |
20040252007 | Lussey et al. | Dec 2004 | A1 |
20050052426 | Hagermoser et al. | Mar 2005 | A1 |
20050052427 | Wu et al. | Mar 2005 | A1 |
20050067889 | Chernoff | Mar 2005 | A1 |
20050110769 | DaCosta et al. | May 2005 | A1 |
20050156705 | Baker et al. | Jul 2005 | A1 |
20050273218 | Breed et al. | Dec 2005 | A1 |
20060025897 | Shostak et al. | Feb 2006 | A1 |
20060028454 | Branton et al. | Feb 2006 | A1 |
20060054479 | Iisaka | Mar 2006 | A1 |
20060113880 | Pei et al. | Jun 2006 | A1 |
20060177212 | Lamborghini et al. | Aug 2006 | A1 |
20060202954 | Ho | Sep 2006 | A1 |
20060248478 | Liau | Nov 2006 | A1 |
20060255903 | Lussey et al. | Nov 2006 | A1 |
20070056493 | Burkitt et al. | Mar 2007 | A1 |
20070062753 | Yoshida et al. | Mar 2007 | A1 |
20070100523 | Trachte | May 2007 | A1 |
20070132736 | Crispin | Jun 2007 | A1 |
20070141939 | Sandbach et al. | Jun 2007 | A1 |
20070146313 | Newman et al. | Jun 2007 | A1 |
20070146342 | Medler et al. | Jun 2007 | A1 |
20070152959 | Peters | Jul 2007 | A1 |
20070176902 | Newman et al. | Aug 2007 | A1 |
20070229478 | Rosenberg et al. | Oct 2007 | A1 |
20070289859 | Sandbach et al. | Dec 2007 | A1 |
20080024438 | Collins et al. | Jan 2008 | A1 |
20080024454 | Everest | Jan 2008 | A1 |
20080030479 | Lowles et al. | Feb 2008 | A1 |
20080030482 | Elwell et al. | Feb 2008 | A1 |
20080036743 | Westerman et al. | Feb 2008 | A1 |
20080060854 | Perlin | Mar 2008 | A1 |
20080062145 | Shahoian et al. | Mar 2008 | A1 |
20080079604 | Madonna et al. | Apr 2008 | A1 |
20080088577 | Lenneman et al. | Apr 2008 | A1 |
20080088600 | Prest et al. | Apr 2008 | A1 |
20080094367 | Van De Ven et al. | Apr 2008 | A1 |
20080130126 | Brooks et al. | Jun 2008 | A1 |
20080170043 | Soss et al. | Jul 2008 | A1 |
20080202912 | Boddie et al. | Aug 2008 | A1 |
20080211766 | Westerman et al. | Sep 2008 | A1 |
20080230283 | Yoon et al. | Sep 2008 | A1 |
20080264183 | Graham et al. | Oct 2008 | A1 |
20080271933 | Morimoto | Nov 2008 | A1 |
20080278455 | Atkins et al. | Nov 2008 | A1 |
20080284743 | Hsu et al. | Nov 2008 | A1 |
20080289886 | Burkitt | Nov 2008 | A1 |
20080296073 | McDermid | Dec 2008 | A1 |
20080296140 | Yoshihara et al. | Dec 2008 | A1 |
20080302014 | Szczerba et al. | Dec 2008 | A1 |
20080303799 | Schwesig et al. | Dec 2008 | A1 |
20080303802 | Destura et al. | Dec 2008 | A1 |
20080309624 | Hotelling | Dec 2008 | A1 |
20080309626 | Westerman et al. | Dec 2008 | A1 |
20080316181 | Nurmi | Dec 2008 | A1 |
20090002325 | Jha et al. | Jan 2009 | A1 |
20090009482 | McDermid | Jan 2009 | A1 |
20090020343 | Rothkopf et al. | Jan 2009 | A1 |
20090027353 | Im et al. | Jan 2009 | A1 |
20090061823 | Chu | Mar 2009 | A1 |
20090087655 | Yamada et al. | Apr 2009 | A1 |
20090095541 | Lee | Apr 2009 | A1 |
20090128507 | Hoshino et al. | May 2009 | A1 |
20090140985 | Liu | Jun 2009 | A1 |
20090140989 | Ahlgren | Jun 2009 | A1 |
20090140994 | Tanaka et al. | Jun 2009 | A1 |
20090140996 | Takashima et al. | Jun 2009 | A1 |
20090151447 | Jin et al. | Jun 2009 | A1 |
20090153522 | Chou | Jun 2009 | A1 |
20090160529 | Lamborghini | Jun 2009 | A1 |
20090160793 | Rekimoto | Jun 2009 | A1 |
20090167722 | Villain | Jul 2009 | A1 |
20090174674 | Forutanpour | Jul 2009 | A1 |
20090184921 | Scott et al. | Jul 2009 | A1 |
20090201261 | Day | Aug 2009 | A1 |
20090237374 | Li et al. | Sep 2009 | A1 |
20090241378 | Ellis | Oct 2009 | A1 |
20090244017 | Pala et al. | Oct 2009 | A1 |
20090249191 | Leoutsarakos et al. | Oct 2009 | A1 |
20090256807 | Nurmi | Oct 2009 | A1 |
20090256817 | Perlin et al. | Oct 2009 | A1 |
20090258677 | Ellis et al. | Oct 2009 | A1 |
20090265670 | Kim et al. | Oct 2009 | A1 |
20090267921 | Pryor | Oct 2009 | A1 |
20090273573 | Hotelling | Nov 2009 | A1 |
20090279811 | Kilburn et al. | Nov 2009 | A1 |
20090309616 | Klinghult et al. | Dec 2009 | A1 |
20090322695 | Cho et al. | Dec 2009 | A1 |
20090327977 | Bachfischer et al. | Dec 2009 | A1 |
20100013774 | Chen et al. | Jan 2010 | A1 |
20100020030 | Kim et al. | Jan 2010 | A1 |
20100024573 | Daverman et al. | Feb 2010 | A1 |
20100026640 | Kim et al. | Feb 2010 | A1 |
20100039393 | Pratt et al. | Feb 2010 | A1 |
20100045612 | Molne | Feb 2010 | A1 |
20100045624 | Hisatsugu et al. | Feb 2010 | A1 |
20100053078 | Kim et al. | Mar 2010 | A1 |
20100053116 | Daverman et al. | Mar 2010 | A1 |
20100062148 | Lussey et al. | Mar 2010 | A1 |
20100066697 | Jacomet et al. | Mar 2010 | A1 |
20100079391 | Joung | Apr 2010 | A1 |
20100079395 | Kim et al. | Apr 2010 | A1 |
20100085169 | Poupyrev et al. | Apr 2010 | A1 |
20100090973 | Algreatly | Apr 2010 | A1 |
20100097335 | Jung et al. | Apr 2010 | A1 |
20100097336 | Gomes et al. | Apr 2010 | A1 |
20100099394 | Hainzl | Apr 2010 | A1 |
20100102922 | Walkington | Apr 2010 | A1 |
20100110018 | Faubert et al. | May 2010 | A1 |
20100110026 | Kis et al. | May 2010 | A1 |
20100117978 | Shirado | May 2010 | A1 |
20100123667 | Kim et al. | May 2010 | A1 |
20100123678 | Kim et al. | May 2010 | A1 |
20100123686 | Klinghult et al. | May 2010 | A1 |
20100126840 | Walkington | May 2010 | A1 |
20100127975 | Jensen | May 2010 | A1 |
20100127983 | Irani et al. | May 2010 | A1 |
20100141410 | Aono et al. | Jun 2010 | A1 |
20100153879 | Rimas-Ribikauskas et al. | Jun 2010 | A1 |
20100156818 | Burrough et al. | Jun 2010 | A1 |
20100168998 | Matsunaga | Jul 2010 | A1 |
20100171713 | Kwok et al. | Jul 2010 | A1 |
20100214239 | Wu | Aug 2010 | A1 |
20100222972 | Hustyi | Sep 2010 | A1 |
20100231540 | Cruz-Hernandez et al. | Sep 2010 | A1 |
20100250071 | Pala et al. | Sep 2010 | A1 |
20100253645 | Bolender | Oct 2010 | A1 |
20100265170 | Norieda | Oct 2010 | A1 |
20100271325 | Conte et al. | Oct 2010 | A1 |
20100277438 | Kawashima et al. | Nov 2010 | A1 |
20100283749 | Walkington | Nov 2010 | A1 |
20100308844 | Day et al. | Dec 2010 | A1 |
20100315267 | Chung et al. | Dec 2010 | A1 |
20100315349 | Choi | Dec 2010 | A1 |
20100321310 | Kim et al. | Dec 2010 | A1 |
20110006980 | Taniguchi et al. | Jan 2011 | A1 |
20110007023 | Abrahamsson et al. | Jan 2011 | A1 |
20110021251 | Lindén | Jan 2011 | A1 |
20110022393 | Wäller et al. | Jan 2011 | A1 |
20110030502 | Lathrop | Feb 2011 | A1 |
20110032203 | Pryor | Feb 2011 | A1 |
20110037721 | Cranfill et al. | Feb 2011 | A1 |
20110043468 | Lathrop et al. | Feb 2011 | A1 |
20110043491 | Oh | Feb 2011 | A1 |
20110046788 | Daly et al. | Feb 2011 | A1 |
20110050588 | Li et al. | Mar 2011 | A1 |
20110050589 | Yan et al. | Mar 2011 | A1 |
20110050591 | Kim et al. | Mar 2011 | A1 |
20110050629 | Homma et al. | Mar 2011 | A1 |
20110054359 | Sazonov et al. | Mar 2011 | A1 |
20110057899 | Sleeman et al. | Mar 2011 | A1 |
20110063248 | Yoon | Mar 2011 | A1 |
20110069024 | Kim | Mar 2011 | A1 |
20110074724 | Pryor | Mar 2011 | A1 |
20110082627 | Small et al. | Apr 2011 | A1 |
20110087983 | Shim | Apr 2011 | A1 |
20110107272 | Aguilar | May 2011 | A1 |
20110109578 | Wäller et al. | May 2011 | A1 |
20110115736 | Joguet et al. | May 2011 | A1 |
20110128164 | Kang et al. | Jun 2011 | A1 |
20110128235 | Rogers et al. | Jun 2011 | A1 |
20110128250 | Murphy et al. | Jun 2011 | A1 |
20110141052 | Bernstein et al. | Jun 2011 | A1 |
20110141053 | Bulea et al. | Jun 2011 | A1 |
20110175754 | Karpinsky | Jul 2011 | A1 |
20110175844 | Berggren | Jul 2011 | A1 |
20110175845 | Honda et al. | Jul 2011 | A1 |
20110181430 | Hu et al. | Jul 2011 | A1 |
20110181546 | Joguet et al. | Jul 2011 | A1 |
20110187674 | Baker et al. | Aug 2011 | A1 |
20110193813 | Gralewski et al. | Aug 2011 | A1 |
20110205151 | Newton et al. | Aug 2011 | A1 |
20110205162 | Wäller et al. | Aug 2011 | A1 |
20110205182 | Miyazawa et al. | Aug 2011 | A1 |
20110210926 | Pasquero et al. | Sep 2011 | A1 |
20110216015 | Edwards | Sep 2011 | A1 |
20110221564 | Deppiesse et al. | Sep 2011 | A1 |
20110221684 | Rydenhag | Sep 2011 | A1 |
20110221693 | Miyazaki | Sep 2011 | A1 |
20110221694 | Karaoguz et al. | Sep 2011 | A1 |
20110227870 | Kim | Sep 2011 | A1 |
20110227872 | Huska et al. | Sep 2011 | A1 |
20110239110 | Garrett et al. | Sep 2011 | A1 |
20110241850 | Bosch et al. | Oct 2011 | A1 |
20110242029 | Kasahara et al. | Oct 2011 | A1 |
20110245992 | Stahlin et al. | Oct 2011 | A1 |
20110248728 | Maruyama | Oct 2011 | A1 |
20110248942 | Yana et al. | Oct 2011 | A1 |
20110248948 | Griffin et al. | Oct 2011 | A1 |
20110253948 | Lussey et al. | Oct 2011 | A1 |
20110260965 | Kim et al. | Oct 2011 | A1 |
20110265002 | Hong et al. | Oct 2011 | A1 |
20110267294 | Kildal | Nov 2011 | A1 |
20110273394 | Young et al. | Nov 2011 | A1 |
20110275412 | Khawand | Nov 2011 | A1 |
20110278078 | Schediwy et al. | Nov 2011 | A1 |
20110290038 | Hoshino et al. | Dec 2011 | A1 |
20110304559 | Pasquero | Dec 2011 | A1 |
20110304581 | An et al. | Dec 2011 | A1 |
20110316811 | Kitagawa | Dec 2011 | A1 |
20120001870 | Lee et al. | Jan 2012 | A1 |
20120013573 | Liu et al. | Jan 2012 | A1 |
20120019448 | Pitkanen et al. | Jan 2012 | A1 |
20120019463 | Ng et al. | Jan 2012 | A1 |
20120026124 | Li et al. | Feb 2012 | A1 |
20120032899 | Waeller et al. | Feb 2012 | A1 |
20120032907 | Koizumi et al. | Feb 2012 | A1 |
20120032915 | Wittorf | Feb 2012 | A1 |
20120044169 | Enami | Feb 2012 | A1 |
20120044172 | Ohki et al. | Feb 2012 | A1 |
20120050159 | Yu et al. | Mar 2012 | A1 |
20120050208 | Dietz | Mar 2012 | A1 |
20120056818 | Shafi et al. | Mar 2012 | A1 |
20120056837 | Park et al. | Mar 2012 | A1 |
20120062603 | Mizunuma et al. | Mar 2012 | A1 |
20120068946 | Tang et al. | Mar 2012 | A1 |
20120068965 | Wada et al. | Mar 2012 | A1 |
20120068969 | Bogana et al. | Mar 2012 | A1 |
20120081327 | Heubel et al. | Apr 2012 | A1 |
20120086659 | Perlin et al. | Apr 2012 | A1 |
20120086670 | Teil et al. | Apr 2012 | A1 |
20120092250 | Hadas et al. | Apr 2012 | A1 |
20120092279 | Martin | Apr 2012 | A1 |
20120092294 | Ganapathi et al. | Apr 2012 | A1 |
20120092299 | Harada et al. | Apr 2012 | A1 |
20120092324 | Buchan et al. | Apr 2012 | A1 |
20120105358 | Momeyer et al. | May 2012 | A1 |
20120105367 | Son et al. | May 2012 | A1 |
20120113028 | Marsden et al. | May 2012 | A1 |
20120113054 | Hashimoto et al. | May 2012 | A1 |
20120113061 | Ikeda | May 2012 | A1 |
20120120009 | Lussey et al. | May 2012 | A1 |
20120126959 | Zarrabi et al. | May 2012 | A1 |
20120127088 | Pance et al. | May 2012 | A1 |
20120127107 | Miyashita et al. | May 2012 | A1 |
20120127179 | Aspelin | May 2012 | A1 |
20120139864 | Sleeman et al. | Jun 2012 | A1 |
20120146945 | Miyazawa et al. | Jun 2012 | A1 |
20120147052 | Homma et al. | Jun 2012 | A1 |
20120154315 | Aono | Jun 2012 | A1 |
20120154316 | Kono | Jun 2012 | A1 |
20120154317 | Aono | Jun 2012 | A1 |
20120154318 | Aono | Jun 2012 | A1 |
20120154328 | Kono | Jun 2012 | A1 |
20120154329 | Shinozaki | Jun 2012 | A1 |
20120154330 | Shimizu | Jun 2012 | A1 |
20120162122 | Geaghan | Jun 2012 | A1 |
20120169609 | Britton | Jul 2012 | A1 |
20120169617 | Mäenpää | Jul 2012 | A1 |
20120169635 | Liu | Jul 2012 | A1 |
20120169636 | Liu | Jul 2012 | A1 |
20120188181 | Ha et al. | Jul 2012 | A1 |
20120194460 | Kuwabara et al. | Aug 2012 | A1 |
20120194466 | Posamentier | Aug 2012 | A1 |
20120199921 | Tanaka et al. | Aug 2012 | A1 |
20120204653 | August et al. | Aug 2012 | A1 |
20120205165 | Strittmatter et al. | Aug 2012 | A1 |
20120206393 | Hillis et al. | Aug 2012 | A1 |
20120218212 | Yu et al. | Aug 2012 | A1 |
20120229424 | Behles et al. | Sep 2012 | A1 |
20120235940 | Ludwig | Sep 2012 | A1 |
20130002538 | Mooring et al. | Jan 2013 | A1 |
20130038437 | Talati et al. | Feb 2013 | A1 |
20130063389 | Moore | Mar 2013 | A1 |
20130113715 | Grant et al. | May 2013 | A1 |
20130128587 | Lisseman et al. | May 2013 | A1 |
20130307788 | Rao et al. | Nov 2013 | A1 |
20130338847 | Lisseman et al. | Dec 2013 | A1 |
20140253504 | Noshadi et al. | Sep 2014 | A1 |
20140267113 | Lisseman et al. | Sep 2014 | A1 |
20140267114 | Lisseman et al. | Sep 2014 | A1 |
20150067513 | Zambetti et al. | Mar 2015 | A1 |
20150067596 | Brown et al. | Mar 2015 | A1 |
Number | Date | Country |
---|---|---|
60011078 | Jun 2005 | DE |
60210951 | Jan 2007 | DE |
60130983 | Jul 2008 | DE |
1640697 | Mar 2006 | EP |
1887595 | Feb 2008 | EP |
2423646 | Aug 2006 | GB |
2445505 | Jul 2008 | GB |
2448893 | Nov 2008 | GB |
2450587 | Dec 2008 | GB |
2452714 | Mar 2009 | GB |
2454619 | May 2009 | GB |
2462920 | Mar 2010 | GB |
2465077 | May 2010 | GB |
2465713 | Jun 2010 | GB |
2468870 | Sep 2010 | GB |
2437997 | Jul 2011 | GB |
2443658 | Sep 2011 | GB |
58-141835 | Sep 1983 | JP |
64-66522 | Mar 1989 | JP |
06-037056 | May 1994 | JP |
2005-175815 | Jun 2005 | JP |
2006-129893 | May 2006 | JP |
2008-181709 | Aug 2008 | JP |
2009-008613 | Jan 2009 | JP |
2009-521006 | May 2009 | JP |
2009-186452 | Aug 2009 | JP |
2009-244931 | Oct 2009 | JP |
2010-511916 | Apr 2010 | JP |
2012058159 | Mar 2012 | JP |
10-1999-0047429 | Jul 1999 | KR |
10-2009-0074571 | Jul 2009 | KR |
10-2010-0087721 | Aug 2010 | KR |
10-2011-0014115 | Feb 2011 | KR |
10-2011-0042924 | Apr 2011 | KR |
9803193 | Jul 1998 | WO |
9938173 | Jul 1999 | WO |
0079546 | Dec 2000 | WO |
0188935 | Nov 2001 | WO |
0188935 | Nov 2001 | WO |
02099822 | Dec 2002 | WO |
2005029514 | Mar 2005 | WO |
2006016138 | Feb 2006 | WO |
2006123616 | Nov 2006 | WO |
2007072319 | Jun 2007 | WO |
2007107522 | Sep 2007 | WO |
2008-062403 | May 2008 | WO |
2008135787 | Nov 2008 | WO |
2009034313 | Mar 2009 | WO |
2010023449 | Sep 2010 | WO |
2010109186 | Sep 2010 | WO |
2011045929 | Apr 2011 | WO |
2012-001428 | Jan 2012 | WO |
2012-088549 | Jun 2012 | WO |
Entry |
---|
Knite, M., et al., “Polyisoprene-multi-wall carbon nanotube composites for sensing strain,” Materials Science and Engineering C., vol. 37, No. 5, Oct. 2, 2006, pp. 1125-1128. |
International Search Report and Written Opinion, dated Dec. 17, 2013, in connection with corresponding International Application No. PCT/US2013/060046. |
Office Action dated Nov. 4, 2014, received in connection with JP Patent Application No. 2011-075258. (English Translation attached). |
Office Action dated Mar. 11, 2013 in U.S. Appl. No. 13/076,226, which issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015. |
Office Action dated Feb. 13, 2014 in U.S. Appl. No. 13/076,226, which issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015. |
Office Action dated Sep. 11, 2014 in U.S. Appl. No. 13/076,226, which issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015. |
U.S. Appl. No. 13/076,226, filed Mar. 30, 2011, which has now issued as U.S. Pat. No. 9,007,190 on Apr. 14, 2015, and its file history. |
Co-pending U.S. Appl. No. 13/863,363, filed Apr. 15, 2013 and its file history. |
Office Action dated Nov. 10, 2015 in U.S. Appl. No. 13/863,363. |
International Preliminary Report on Patentability and Written Opinion of the U.S. International Searching Authority from Application No. PCT/US2013/060046 mailed Mar. 26, 2015. |
Co-pending U.S. Appl. No. 14/211,475, filed Mar. 14, 2014 and its file history. |
Co-pending U.S. Appl. No. 14/211,665, filed Mar. 14, 2014, and its file history. |
Co-pending U.S. Appl. No. 13/673,463, filed Nov. 9, 2012, and its file history. |
International Search Report and Written Opinion dated Mar. 29, 2013 issued for PCT/US2012/064409. |
International Search Report and Written Opinion dated Jun. 21, 2013 issued for PCT/US2013/030417. |
International Search Report and Written Opinion dated Jun. 24, 2014 issued for PCT/US2014/027735. |
International Search Report and Written Opinion dated Jun. 26, 2014 issued for PCT/US2014/027777. |
Non-Final Office Action dated Feb. 18, 2015 in U.S. Appl. No. 13/673,463. |
Final Office Action dated Aug. 20, 2015 in U.S. Appl. No. 13/673,463. |
Advisory Action dated Nov. 5, 2015 in U.S. Appl. No. 13/673,463. |
Non-Final Office Action dated Jan. 21, 2016 in U.S. Appl. No. 13/673,463. |
Final Office Action dated Jun. 3, 2016 in U.S. Appl. No. 13/863,363. |
Non-Final Office Action dated Dec. 17, 2015 in U.S. Appl. No. 14/211,475. |
Final Office Action dated Aug. 16, 2016 in U.S. Appl. No. 14/211,475. |
Non-Final Office Action dated Dec. 15, 2015 in U.S. Appl. No. 14/211,665. |
Final Office Action dated Aug. 16, 2016 in U.S. Appl. No. 14/211,665. |
Office Action, dated Oct. 18, 2016, received in connection with JP Application No. 2014-541319. (English translation attached). |
Office Action, dated Nov. 3, 2016, received in connection with U.S. Appl. No. 13/863,363. |
Office Action, dated Aug. 16, 2016, received in connection with U.S. Appl. No. 14/211,665. |
Office Action, dated Aug. 24, 2016, received in connection with U.S. Appl. No. 13/673,463. |
Office Action, dated Aug. 16, 2016, received in connection with U.S. Appl. No. 14/211,475. |
Office Action, dated Jan. 23, 2017, received in connection with U.S. Appl. No. 14/211,475. |
Office Action, dated Jan. 23, 2017, received in connection with U.S. Appl. No. 14/211,665. |
Office Action, dated May 2, 2017, received in connection with Japanese Application No. 2015-532133 (English-language translation attached). |
Number | Date | Country | |
---|---|---|---|
20140076063 A1 | Mar 2014 | US |
Number | Date | Country | |
---|---|---|---|
61701884 | Sep 2012 | US |