This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 099120428 filed in Taiwan, R.O.C. on Jun. 23, 2010, the entire contents of which are hereby incorporated by reference.
The present invention relates to a touch panel, and more particularly to a single piece type capacitive touch panel applies in a projective capacitive touch panel to effectively increase the visible area, enhance the surface flatness and eliminate Mura phenomenon.
Referring to
In view of the above demands, the inventors provide a single piece type capacitive touch panel to overcome the conventional drawback, which the icon layer 50 is disposed on the glass substrate 40. The present invention uses the alternative technique by etching a frame on periphery of the transparent substrate, and an icon layer is then disposed into the frame by printing or sputtering, and a flattened surface is finally acquired by fully filling the frame within the icon layer. Therefore, the short circuit caused by climbing effect produced by film thickness of stack structure can be controlled effectively, thus increase yield rate and eliminate Mura phenomenon.
To achieve the forgoing objective, the present invention provides a new designed single piece type capacitive touch panel. A frame is formed at a periphery of a transparent substrate by using the etching process. An icon layer is disposed in the frame by using printing or sputtering coating to allow the icon layer to fully fill the frame, thereby increasing the visible area, enhancing the flatness. Simultaneously, thicker thickness caused by climbing effect on the conventional icon layer or Mura phenomenon generated by the stacked structure at the side can be avoided.
To achieve the foregoing objective, the single piece type capacitive touch panel of the present invention comprises a transparent substrate and an icon layer. A frame is provided on periphery of the transparent substrate, and the icon layer is disposed and fully filled in the frame, so as to completely flatten the icon layer and a surface of the transparent substrate. The frame is a ring groove formed by etching process.
In summation of the description above, in order to smooth back end process, the single piece capacitive touch panel further comprises an optical film overlapped on one side face of the icon layer, so that the optical film completely covers the icon layer and the transparent substrate.
The foregoing and other technical characteristics of the present invention will become apparent with the detailed description of the preferred embodiments and the illustration of the related drawings.
With reference to
The transparent substrate 10 is selected from one of glasses or polymer plastic. For example, while adopting a glass material, the glass material is firstly cut into a plurality of glasses with small pieces, wherein its thickness is about 0.5-1.1 mm, and a frame 11 is formed at a periphery of a surface of the transparent substrate 10 through etching process. As shown in the figures, the frame 11 is a ring groove and has a depth of about 5-7 μm. Since the transparent substrate 10 has a surface that is directly in contact with the outside, the surface treatment is utilized to achieve goals of protection and scratch prevention. Therefore, the etched transparent substrate 10 is processed with the surface enhancement to hardening the surface chemically. For instance, chemical agents such as glass ionization, potassium nitrate or potassium sulfide, are adopted to immerse the substrate, but the present invention is not limited thereto. The transparent substrate 11 of the present invention can select hydrofluoric acid as an etching solution for etching the substrate.
The icon layer 20 is mainly used for covering signal lead wires at an edge of the touch panel. The icon layer 20 is disposed in the frame 11 at the periphery of the transparent substrate 10 through one such manner of printing or sputtering coating to allow the icon layer 20 to fully fill within the frame 11, thereby completely flattening the icon layer 20 and a surface of the transparent substrate 10. The printing material of the icon layer utilized herein can be implemented by selecting the resin photoresist.
In summation described above, the present invention utilizes etching method to form a frame 11 at a periphery of the transparent substrate 10. The etched transparent substrate 10 then is processed with the surface enhancement. Finally, the icon layer 20 is completely filled inside the frame 11 to allow a surface of the transparent substrate 10 to form a flattened plane. Since the frame 11 is taken as a limit structure, the disposition position and scope of the icon layer 20 can be conveniently controlled, and the visible area can be increased. Moreover, Mura phenomenon produced by climbing effect on conventional icon layer 50 due to higher thickness of optical film of stack structure can thus be prevented.
With reference to
The present invention improves over the prior art and complies with patent application requirements, and thus is duly filed for patent application. While the invention has been described by device of specific embodiments, numerous modifications and variations could be made thereto by those generally skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Number | Date | Country | Kind |
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099120428 | Jun 2010 | TW | national |