Claims
- 1. A fabric of modules comprising:
a plurality of physically offset adjacent modules; in at least one linear array of the modules, first dimension links which connect single offset modules in a ring; second dimension links which connect the modules of each linear array in at least one ring with substantially all links between modules in each array being double offset links bypassing a single module; and third dimension links which connect the modules of each linear array in at least one ring with substantially all links between modules in each array being triple offset links bypassing two modules.
- 2. The fabric of modules of claim 1 wherein the second dimension links form two rings, each ring being formed of five modules with all links between modules in each of the rings being double offset.
- 3. The fabric of modules of claim 1 wherein the at least one linear array of modules includes plural arrays of modules interconnected by third dimension links which extend at least one ring.
- 4. The fabric of modules of claim 1 wherein the third dimension links form a first ring with four modules, and a second ring with six modules.
- 5. The fabric of modules of claim 4 wherein the links between the four modules of the first ring have offsets of 1, 3, 3, and 3, and the links between the six modules of the second ring have offsets of 3, 3, 5, 3, 3, and 3.
- 6. The fabric of modules of claim 5 wherein the at least one linear array of modules includes plural arrays of modules interconnected by third dimension links which extend the at least one ring.
- 7. The fabric of modules of claim 6 wherein the links between the arrays are single offset links.
- 8. An assembly of modules connected in a fabric comprising:
a backplane having module connections to receive modules and leads for interconnecting the modules in at least a first dimension; a first and a second link connector coupled to each module; a first interconnector configured to connect first link connectors in a first set of link connectors, and a second interconnector configured to connect second link connectors in a second set of link connectors, the interconnectors having leads to connect the modules in a second dimension, two assemblies being connectable in the second dimension by removing the first interconnector from a first assembly and the second interconnector from a second assembly and connecting the respective first and second sets of link connectors.
- 9. The assembly of claim 8 wherein the backplane has leads for interconnecting the modules in a third dimension.
- 10. The assembly of claim 8 wherein four assemblies are connectable in the second dimension by removing the first interconnector from the second assembly, both interconnectors from a third assembly, and the second interconnector from a fourth assembly, and connecting the first set of link connectors of the second assembly with the second set of link connectors of the third assembly, and the first set of link connectors of the third assembly with the second set of link connectors of the fourth assembly.
- 11. The assembly of claim 10 wherein the backplane has leads for interconnecting the modules in a third dimension.
- 12. A fabric of modules comprising:
in at least one array of modules, at least two physically offset adjacent modules connected in at least a first dimension; and one or two filler modules that occupy respective open slots physically adjacent to the at least two adjacent modules, the filler module being connected to the at least two adjacent modules in the first dimension and a second dimension to form an additional fabric link between two adjacent modules adjacent to the filler module.
- 13. The fabric of modules of claim 12 wherein the at least two physically offset adjacent modules includes three modules interconnected in the first and second dimensions, and the at least one filler module includes two filler modules.
- 14. The fabric of claim 13 wherein the at least two physically offset adjacent modules includes four or more modules interconnected in the first, second, and third dimensions.
- 15. The fabric of claim 14 wherein the at least one filler module includes two filler modules.
- 16. A method of connecting a fabric of modules comprising:
in at least one linear array of modules with a plurality of physically offset adjacent modules, connecting single offset modules in a ring with first dimension links; connecting with second dimension links in at least one ring with substantially all links between modules in each array being double offset links bypassing a single module; and connecting with third dimension links in at least one ring with substantially all links between modules in each array being triple offset links bypassing two modules.
- 17. The method of claim 16 wherein connecting with the second dimension links includes forming two rings, each ring being formed of five modules with all links between modules in each of the rings being double offset.
- 18. The method of claim 16 wherein connecting with the third dimension links includes interconnecting plural arrays of modules to extend the at least one ring.
- 19. The method of claim 16 wherein the connecting with the third dimension links includes forming a first ring with four modules, and a second ring with six modules.
- 20. The method of claim wherein the forming the first ring includes connecting between the four modules of the first ring with offsets of 1, 3, 3, and 3, and the forming the second ring includes connecting between the six modules of the second ring with offsets of 3, 3, 5, 3, 3, and 3.
- 21. A method of connecting an assembly of modules in a fabric comprising:
receiving modules in respective module connections in a backplane, and interconnecting the modules in at least a first dimension with leads of the backplane; and connecting first and second sets of link connectors with first and second interconnectors having leads to connect the modules in a second dimension, two assemblies being connectable in the second dimension by removing the first interconnector from a first assembly and the second interconnector from a second assembly and connecting the respective first and second sets of link connectors.
- 22. The method of claim 21 further comprising interconnecting the modules in a third dimension.
- 23. The method of claim 21 wherein four assemblies are connectable in the second dimension by removing the first interconnector from the second assembly, both interconnectors from a third assembly, and the second interconnector from a fourth assembly, and connecting the first set of link connector of the second assembly with the second set of link connectors of the third assembly, and the first set of link connectors of the third assembly with the second set of link connectors of the fourth assembly.
- 24. A method of connecting modules in a fabric comprising:
in at least one array of modules, connecting at least two physically offset adjacent modules in at least a first dimension; and connecting one or two filler modules to the at least two adjacent modules in the first dimension and a second dimension, the one or two filler modules occupying respective open slots physically adjacent to the at least two adjacent modules.
- 25. The method of claim 24 wherein the at least two physically offset adjacent modules includes three modules interconnected in the first and second dimensions, and the at least one filler module includes two filler modules.
- 26. The method of claim 24 wherein the at least two physically offset adjacent modules includes four or more modules interconnected in the first, second, and third dimensions.
RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Application No. 60/415,087, filed Oct. 1, 2002, the entire contents of which are incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60415087 |
Oct 2002 |
US |