Claims
- 1. A process for producing a sintered alpha silicon carbide ceramic body having equiaxed microstructure, comprising the steps of:
- (a) mixing together a mixture comprising the components:
- (i) from about 91 to about 99.85 parts by weight silicon carbide powder comprising at least 95% by weight alpha, non-cubic crystalline silicon carbide and having a surface area of from about 1 to about 100 m.sup.2 /g;
- (ii) from about 0.67 to about 20 parts by weight of a carbonizable organic material having a carbon content of at least 33% by weight;
- (iii) from about 0.15 to about 5 parts by weight of a boron source containing from about 0.15 to about 3.0 parts by weight boron;
- (iv) up to about 15 parts by weight of temporary binder; and
- (v) from about 25 to about 100% by weight of the silicon carbide powder, carbonizable organic material, boron source and temporary binder of a solvent in which the carbonizable organic material is soluble; said mixing being done in such a way as to disperse the carbonizable organic material about the silicon carbide powder and coat the silicon carbide powder therewith;
- (b) drying the mixture in such a way as to evaporate the solvent from the mixture;
- (c) shaping the dried mixture in such a way as to produce a shaped body having a density of at least about 1.60 g/cc; and
- (d) firing the shaped body under such conditions of time, temperature and atmosphere as to obtain a density of at least about 2.40 g/cc and an equiaxed microstructure, said temperature being between about 1900.degree. C. and about 2250.degree. C.
- 2. A process according to claim 1, wherein the silicon carbide of the raw batch comprises at least 99% by weight alpha, non-cubic crystalline silicon carbide.
- 3. A process according to claim 1, wherein the silicon carbide of the raw batch consists essentially of alpha, noncubic crystalline silicon carbide.
- 4. A process according to claim 1, wherein the body is fired for a time varying from about 20 to about 60 minutes; wherein said temperature is between about 1900.degree. C. and about 2160.degree. C.; and said conditions of atmosphere are firing in a vacuum or up to about 1 atmosphere of pressure of a gas selected from the group consisting of argon, carbon dioxide, carbon monoxide, helium, hydrogen, neon, and mixtures thereof.
- 5. A process according to claim 4, wherein said temperature is from about 2100.degree. C. to about 2150.degree. C.
- 6. A process according to claim 1, wherein the body is fired for a time varying from about 20 to about 60 minutes; wherein the temperature is between about 1975.degree. C. and about 2300.degree. C.; and the atmosphere is up to about 1 atmosphere of pressure of nitrogen.
- 7. A process according to claim 6, wherein the temperature is between about 2100.degree. C. and about 2250.degree. C.
- 8. A process according to claim 1, wherein the level of boron retained in the body being sintered is maintained by enclosing the body being sintered within a sealed container which is impervious to boron at the temperature of sintering, and which has a volume approximating the size of the body being sintered.
- 9. A process according to claim 1, wherein the level of boron retained in the body being sintered is maintained by containing the body being sintered within a graphite container, which container has been saturated with boron by exposure to boron at or about the temperature of sintering.
- 10. A process for producing a sintered silicon carbide ceramic body, comprising the steps of:
- (a) mixing together a mixture comprising the components:
- (i) from about 91 to about 99.85 parts by weight silicon carbide powder having a surface area of from about 1 to about 100 m.sup.2 /g;
- (ii) from about 0.67 to about 20 parts by weight of a carbonizable organic material having a carbon content of at least 33% by weight;
- (iii) from about 0.15 to about 5 parts by weight of a boron source containing from about 0.15 to about 3.0 parts by weight boron;
- (iv) up to about 15 parts by weight of temporary binder; and
- (v) from about 25 to about 100% by weight of the silicon carbide powder, carbonizable organic material, boron source and temporary binder of a solvent in which the carbonizable organic material is soluble; said mixing being done in such a way as to disperse the carbonizable organic material about the silicon carbide powder and coat the silicon carbide powder therewith;
- (b) drying the mixture in such a way as to evaporate the solvent from the mixture;
- (c) shaping the dried mixture in such a way as to produce a shaped body having a density of at least about 1.60 g/cc; and
- (d) firing the shaped body at a temperature of from about 1900.degree. C. to about 2500.degree. C.
- 11. A process according to claim 10, wherein the mixing together of the components comprises:
- (a) mixing together a raw batch comprising:
- (i) from about 91 to about 99.85 parts by weight silicon carbide powder having a surface area of from about 1 to about 100 m.sup.2 /g;
- (ii) from about 0.67 to about 20 parts by weight of carbonizable organic material having a carbon content of at least 33% by weight;
- (iii) from about 0.15 to about 5 parts by weight of a boron source containing from about 0.15 to about 3.0 parts by weight boron;
- (iv) up to about 15 parts by weight of temporary binder;
- (b) adding to the raw batch from about 25 to about 100% by weight of the raw batch of a solvent in which the carbonizable organic material is soluble; and
- (c) stirring the raw batch and organic solvent in such a way as to disperse the carbonizable organic material about the silicon carbide powder and coat the silicon carbide powder therewith.
- 12. A process according to claim 11, wherein the stirring continues for at least about 5 minutes.
- 13. A process according to claim 12, wherein the stirring continues about 15 minutes.
- 14. A process according to claim 10, wherein the mixing together of the components comprises:
- (a) dissolving the carbonizable organic material in the solvent; and
- (b) mixing the solution so formed with the remaining components.
- 15. A process according to claim 10, wherein the shaping is by extrusion.
- 16. A process according to claim 10, wherein the shaping is by compression at a pressure between about 40,000 and about 100,000 psi.
- 17. A process according to claim 16, wherein the shaping is by compression at a pressure between about 16,000 and about 20,000 psi.
- 18. A process according to claim 11, wherein the shaping is by injection molding.
- 19. A process according to claim 11, wherein the shaping is by transfer molding.
- 20. A process according to claim 11, wherein the shaping is by casting.
- 21. A process according to claim 11, wherein the shaping is by cold pressing.
- 22. A process according to claim 11, wherein the shaping is by isostatic pressing.
- 23. A process according to claim 10, wherein the temporary binder is used in an amount of from about 5 to about 15 parts.
- 24. A process according to claim 23, wherein the temporary binder is curable; and comprising a step of curing the temporary binder, after shaping the dried mixture, but prior to firing the shaped body.
- 25. A process according to claim 24, wherein the temporary binder is polyvinyl alcohol and the curing is accomplished by heating the shaped body at a temperature of about 90.degree. to about 100.degree. C. for about 1 to about 2 hours.
- 26. A process according to claim 10, wherein the shaped body is fired for from about 20 to about 60 minutes; at a temperature of from about 1900.degree. C. to about 2500.degree. C.; and in a vacuum.
- 27. A process according to claim 10, wherein the shaped body is fired for from about 20 to about 60 minutes; at a temperature of from about 1900.degree. C. to about 2500.degree. C.; and in up to about 1 atmosphere of pressure of a gas selected from the group consisting of argon, carbon dioxide, carbon monoxide, helium, hydrogen, neon, nitrogen and mixtures thereof.
- 28. A process according to claim 27, wherein the gas is approximately 1 atmosphere of the member selected from the group consisting of argon, helium and neon; and the temperature is from about 2060.degree. C. to about 2100.degree. C.
- 29. A process according to claim 27, wherein the gas is about 1 atmosphere of nitrogen, and the temperature is from about 2260.degree. C. to about 2300.degree. C.
- 30. A process according to claim 10, wherein the level of boron retained in the body being sintered is maintained by enclosing the body being sintered within a sealed container which is impervious to boron at the temperature of sintering, and which has a volume approximating the size of the body being sintered.
- 31. A process according to claim 10, wherein the level of boron retained in the body being sintered is maintained by containing the body beong sintered within a graphite container, which container has been saturated with boron by exposure to boron at or about the temperature of sintering.
- 32. A process according to claim 26, wherein the silicon carbide powder comprises predominantly alpha, non-cubic crystalline silicon carbide.
- 33. A process according to claim 10, wherein the silicon carbide powder comprises at least 95% by weight alpha, noncubic crystalline silicon carbide.
- 34. A process according to claim 10, wherein the silicon carbide powder comprises at least 99% by weight alpha, noncubic crystalline silicon carbide.
- 35. A process according to claim 10, wherein the silicon carbide powder consists essentially of alpha, non-cubic crystalline silicon carbide.
- 36. A process according to claim 10, wherein the silicon carbide powder is amorphous.
CROSS REFERENCES TO RELATED APPLICATIONS
This is a division of copending application Ser. No. 901,406, filed May 1, 1978, which was abandoned which is a continuation-in-part of copending application Ser. No. 584,226, filed June 5, 1975. Application Ser. No. 901,406 was abandoned in favor of Ser. No. 24,148, filed Mar. 26, 1979, now U.S. Pat. No. 4,179,299.
Related subject matter is disclosed in copending, commonly assigned U.S. patent applications Ser. No. 745,035, filed Nov. 26, 1976 by R. H. Smoak, now abandoned; Ser. No. 754,648, filed Dec. 27, 1976 by J. A. Coppola et al, now U.S. Pat. No. 4,123,286; Ser. No. 783,140, filed Mar. 31, 1977 by Y. Murata et al, now U.S. Pat. No. 4,135,937; Ser. No. 783,356, filed Mar. 31, 1977 by Y. Murata et al, now U.S. Pat. No. 4,135,938; Ser. No. 790,354, filed Apr. 25, 1977 by J. A. Coppola et al, now U.S. Pat. No. 4,124,667, Certificate of Correction issued June 19, 1979; Ser. No. 864,415, filed Dec. 27, 1977 by R. W. Ohnsorg, now U.S. Pat. No. 4,144,207; Ser. No. 867,860, filed Jan. 9, 1978 by M. R. Kasprzyk et al now abandoned; Ser. No. 867,861, filed Jan. 9, 1978 by H. A. Lawler, now abandoned; Ser. No. 885,139, filed Mar. 10, 1978 by H. A. Lawler now abandoned; and Ser. No. 885,828, filed Mar. 13, 1978 by J. A. Coppola et al, now abandoned. Applications Ser. No. 790,354, now U.S. Pat. Nos. 4,124,667 and 885,828 now abandoned are continuing applications, respectively, of application Ser. No. 584,226, filed June 5, 1975 now U.S. Pat. No. 4,312,954 and application Ser. No. 743,448, filed Nov. 22, 1976 by J. A. Coppola et al, now U.S. Pat. No. 4,080,415.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
49-44090 |
Nov 1974 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
901406 |
May 1978 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
584226 |
Jun 1975 |
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