The present disclosure relates generally to ultra-small form factor optical connectors, termed “micro optical connectors,” and related connections within adapters and optical transceivers.
The prevalence of the Internet has led to unprecedented growth in communication networks. Consumer demand for service and increased competition has caused network providers to continuously find ways to improve quality of service while reducing cost.
Certain solutions have included deployment of high-density interconnect panels. High-density interconnect panels may be designed to consolidate the increasing volume of interconnections necessary to support the fast-growing networks into a compacted form factor, thereby increasing quality of service and decreasing costs such as floor space and support overhead. However, room for improvement in the area of data centers, specifically as it relates to fiber optic connects, still exists. For example, manufacturers of connectors and adapters are always looking to reduce the size of the devices, while increasing ease of deployment, robustness, and modifiability after deployment. In particular, more optical connectors may need to be accommodated in the same footprint previously used for a smaller number of connectors in order to provide backward compatibility with existing data center equipment. For example, one current footprint is known as the small form-factor pluggable transceiver footprint (SFP). This footprint currently accommodates two LC-type ferrule optical connections. However, it may be desirable to accommodate four optical connections (two duplex connections of transmit/receive) within the same footprint. Another current footprint is the quad small form-factor pluggable (QSFP) transceiver footprint. This footprint currently accommodates four LC-type ferrule optical connections. However, it may be desirable to accommodate eight optical connections of LC-type ferrules (four duplex connections of transmit/receive) within the same footprint.
In communication networks, such as data centers and switching networks, numerous interconnections between mating connectors may be compacted into high-density panels. Panel and connector producers may optimize for such high densities by shrinking the connector size and/or the spacing between adjacent connectors on the panel. While both approaches may be effective to increase the panel connector density, shrinking the connector size and/or spacing may also increase the support cost and diminish the quality of service.
In a high-density panel configuration, adjacent connectors and cable assemblies may obstruct access to the individual release mechanisms. Such physical obstructions may impede the ability of an operator to minimize the stresses applied to the cables and the connectors. For example, these stresses may be applied when the user reaches into a dense group of connectors and pushes aside surrounding optical fibers and connectors to access an individual connector release mechanism with his/her thumb and forefinger. Overstressing the cables and connectors may produce latent defects, compromise the integrity and/or reliability of the terminations, and potentially cause serious disruptions to network performance.
While an operator may attempt to use a tool, such as a screwdriver, to reach into a dense group of connectors and activate a release mechanism, adjacent cables and connectors may obstruct the operator's line of sight, making it difficult to guide the tool to the release mechanism without pushing aside the adjacent cables. Moreover, even when the operator has a clear line of sight, guiding the tool to the release mechanism may be a time-consuming process. Thus, using a tool may not be effective at reducing support time and increasing the quality of service.
The following terms shall have, for the purposes of this application, the respective meanings set forth below.
A connector, as used herein, refers to a device and/or components thereof that connects a first module or cable to a second module or cable. The connector maybe configured for fiber optic transmission or electrical signal transmission. The connector may be any suitable type now known or later developed, such as, for example, a ferrule connector (FC), a fiber distributed data interface (FDDI) connector, an LC connector, a mechanical transfer (MT) connector, a square connector (SC) connector, an SC duplex connector, or a straight tip (ST) connector. The connector maybe generally defined by a connector housing body. In some embodiments, the housing body may incorporate any or all of the components described herein.
A “fiber optic cable” or an “optical cable” refers to a cable containing one or more optical fibers for conducting optical signals in beams of light. The optical fibers can be constructed from any suitable transparent material, including glass, fiberglass, and plastic. The cable can include a jacket or sheathing material surrounding the optical fibers. In addition, the cable can be connected to a connector on one end or on both ends of the cable.
Various embodiments described herein generally provide a remote release mechanism such that a user can remove cable assembly connectors that are closely spaced together on a high density panel without damaging surrounding connectors, accidentally disconnecting surrounding connectors, disrupting transmissions through surrounding connectors, and/or the like. Various embodiments also provide narrow pitch LC duplex connectors and narrow width multi-fiber connectors, for use, for example, with future narrow pitch LC SFPs and future narrow width SFPs. The remote release mechanisms allow use of the narrow pitch LC duplex connectors and narrow width multi-fiber connectors in dense arrays of narrow pitch LC SFPs and narrow width multi-fiber SFPs.
As depicted
Referring to
Referring to
Alignment key, and alignment and offset key is defined as a protrusion adjacent to a side of the connector housing.
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
In the above detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. Other embodiments may be used, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein.
It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (for example, bodies of the appended claims) are generally intended as “open” terms (for example, the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” et cetera). For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to embodiments containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (for example, “a” and/or “an” should be interpreted to mean “at least one” or “one or more”).
This application is a continuation of U.S. patent application Ser. No. 18/171,358, titled Small Form Factor Fiber Optic Connector with Multi-Purpose Boot filed on Feb. 19, 2023, which is a continuation of U.S. patent application Ser. No. 17/342,988, titled Small Form Factor Fiber Optic Connector with Multi-Purpose Boot filed on Jun. 9, 2021, which is a continuation of U.S. application Ser. No. 16/782,196 titled Small Form Factor Fiber Optic Connector with Multi-Purpose Boot Assembly, filed on Feb. 5, 2020, which is a divisional of U.S. patent application Ser. No. 16/368,828, titled Small Form Factor Fiber Optic Connector with Multi-Purpose Boot Assembly, filed on Mar. 28, 2019, which is a continuation of U.S. application Ser. No. 16/103,555, titled Ultra-Small Form Factor Optical Connectors Using a Push-Pull Boot Receptacle Release, filed on Aug. 14, 2018, which is a Continuation-in-Part of Ser. No. 16/035,691, titled Ultra-Small Form Factor Optical Connectors filed on Jul. 15, 2018, which claims priority to U.S. Provisional Application No. 62/649,539 titled Micro Connector with Multi-Purpose Boot, filed on Mar. 28, 2018; which claims priority to U.S. Provisional Application Ser. No. 62/588,276 filed Nov. 17, 2017; U.S. Provisional Application Ser. No. 62/549,655 filed Aug. 24, 2017; and U.S. Provisional Application Ser. No. 62/532,710 filed Jul. 14, 2017, all of the above applications are incorporated by reference in this non-provisional patent application.
Number | Name | Date | Kind |
---|---|---|---|
3733576 | Cooper | May 1973 | A |
4645295 | Pronovost | Feb 1987 | A |
5181267 | Gerace et al. | Jan 1993 | A |
5222168 | Saito et al. | Jun 1993 | A |
5390272 | Repta et al. | Feb 1995 | A |
5528712 | Belenkiy et al. | Jun 1996 | A |
5615293 | Sayegh | Mar 1997 | A |
5673346 | Iwano et al. | Sep 1997 | A |
5719977 | Lampert et al. | Feb 1998 | A |
5915058 | Clairardin et al. | Jun 1999 | A |
6146023 | Weigel | Nov 2000 | A |
6149313 | Giebel et al. | Nov 2000 | A |
6220762 | Kanai et al. | Apr 2001 | B1 |
6224268 | Manning et al. | May 2001 | B1 |
6305961 | Szilagyi et al. | Oct 2001 | B1 |
6331079 | Grois et al. | Dec 2001 | B1 |
6357931 | Shirakawa et al. | Mar 2002 | B1 |
6371659 | Weigel | Apr 2002 | B1 |
6386768 | Yoon et al. | May 2002 | B1 |
6419399 | Loder et al. | Jul 2002 | B1 |
6450695 | Matsumoto | Sep 2002 | B1 |
6511230 | Connelly et al. | Jan 2003 | B1 |
6568861 | Benner et al. | May 2003 | B2 |
6575640 | Connelly et al. | Jun 2003 | B2 |
6715928 | Matasek et al. | Apr 2004 | B1 |
6764222 | Szilagyi et al. | Jul 2004 | B1 |
6796715 | Chiu et al. | Sep 2004 | B2 |
6918704 | Marrs et al. | Jul 2005 | B2 |
6929406 | Amorim | Aug 2005 | B2 |
7001081 | Cox et al. | Feb 2006 | B2 |
7150567 | Luther et al. | Dec 2006 | B1 |
7204644 | Barnes et al. | Apr 2007 | B2 |
7284912 | Suzuki et al. | Oct 2007 | B2 |
7347634 | Güenther et al. | Mar 2008 | B2 |
7500790 | Erdman et al. | Mar 2009 | B2 |
7628545 | Cody et al. | Dec 2009 | B2 |
7677812 | Castagna et al. | Mar 2010 | B2 |
8061906 | Nehler et al. | Nov 2011 | B2 |
8406597 | Case | Mar 2013 | B2 |
8465317 | Gniadek et al. | Jun 2013 | B2 |
8556646 | Kappla et al. | Oct 2013 | B2 |
8636424 | Kuffel et al. | Jan 2014 | B2 |
8641293 | Lin et al. | Feb 2014 | B2 |
8662760 | Cline et al. | Mar 2014 | B2 |
8764308 | Irwin et al. | Jul 2014 | B2 |
8834038 | Limbert et al. | Sep 2014 | B2 |
8858089 | Bradley | Oct 2014 | B2 |
9366829 | Czosnowski et al. | Jun 2016 | B2 |
9411111 | Banal, Jr. et al. | Aug 2016 | B2 |
9557495 | Raven et al. | Jan 2017 | B2 |
9568689 | Nguyen et al. | Feb 2017 | B2 |
9599778 | Wong et al. | Mar 2017 | B2 |
9625658 | Lin | Apr 2017 | B1 |
9684130 | Veatch et al. | Jun 2017 | B2 |
10156683 | Manes et al. | Dec 2018 | B2 |
10156684 | Nguyen et al. | Dec 2018 | B2 |
10191230 | Wong et al. | Jan 2019 | B2 |
10495823 | Good et al. | Dec 2019 | B2 |
10890723 | Nguyen et al. | Jan 2021 | B2 |
11061190 | Takano et al. | Jul 2021 | B2 |
11181701 | Wong et al. | Nov 2021 | B2 |
11307369 | Takano et al. | Apr 2022 | B2 |
11333836 | Wong et al. | May 2022 | B2 |
11340405 | Hendrick | May 2022 | B2 |
11385415 | Nguyen et al. | Jul 2022 | B2 |
11415760 | Takano et al. | Aug 2022 | B2 |
11428875 | Nguyen et al. | Aug 2022 | B2 |
11525965 | Childers et al. | Dec 2022 | B2 |
11719893 | Higley et al. | Aug 2023 | B2 |
11733466 | Higley et al. | Aug 2023 | B2 |
11808994 | Higley et al. | Nov 2023 | B1 |
11846813 | Childers et al. | Dec 2023 | B2 |
11880075 | Nguyen et al. | Jan 2024 | B1 |
11906794 | Higley et al. | Feb 2024 | B2 |
20030118293 | Canace et al. | Jun 2003 | A1 |
20030147230 | Hutermans et al. | Aug 2003 | A1 |
20040043654 | Lee et al. | Mar 2004 | A1 |
20040078961 | Chen et al. | Apr 2004 | A1 |
20040247252 | Ehrenreich et al. | Dec 2004 | A1 |
20050111796 | Matasek et al. | May 2005 | A1 |
20050135752 | Kiani et al. | Jun 2005 | A1 |
20050135753 | Eigenmann et al. | Jun 2005 | A1 |
20050136722 | Cairns | Jun 2005 | A1 |
20050281509 | Cox et al. | Dec 2005 | A1 |
20080037938 | Kiani et al. | Feb 2008 | A1 |
20080144303 | Ice | Jun 2008 | A1 |
20080260333 | Roth | Oct 2008 | A1 |
20100284656 | Morra et al. | Nov 2010 | A1 |
20110019962 | Childers et al. | Jan 2011 | A1 |
20110091159 | de Jong et al. | Apr 2011 | A1 |
20110299814 | Nakagawa | Dec 2011 | A1 |
20120057824 | Katoh | Mar 2012 | A1 |
20120057826 | Katoh | Mar 2012 | A1 |
20120082416 | Katoh | Apr 2012 | A1 |
20120099822 | Kuffel | Apr 2012 | A1 |
20120141072 | Katagiyama et al. | Jun 2012 | A1 |
20120177326 | Peng et al. | Jul 2012 | A1 |
20120213484 | Childers et al. | Aug 2012 | A1 |
20130094816 | Lin et al. | Apr 2013 | A1 |
20130122745 | Soubh et al. | May 2013 | A1 |
20130308916 | Buff | Nov 2013 | A1 |
20130322825 | Cooke et al. | Dec 2013 | A1 |
20130322826 | Henke et al. | Dec 2013 | A1 |
20140169727 | Veatch | Jun 2014 | A1 |
20140241689 | Bradley et al. | Aug 2014 | A1 |
20150177463 | Lee | Jun 2015 | A1 |
20160161680 | Nguyen et al. | Jun 2016 | A1 |
20160178850 | Nhep | Jun 2016 | A1 |
20160202431 | Hill et al. | Jul 2016 | A1 |
20160238796 | Nguyen et al. | Aug 2016 | A1 |
20160327756 | Raven et al. | Nov 2016 | A1 |
20170153879 | George et al. | Jun 2017 | A1 |
20170205587 | Chang et al. | Jul 2017 | A1 |
20170205588 | Lee | Jul 2017 | A1 |
20170227720 | Lin | Aug 2017 | A1 |
20170343740 | Nguyen | Nov 2017 | A1 |
20170351037 | Watanabe et al. | Dec 2017 | A1 |
20170363818 | Suzic | Dec 2017 | A1 |
20180106972 | Liu et al. | Apr 2018 | A1 |
20180156988 | Gniadek | Jun 2018 | A1 |
20180217340 | Wong | Aug 2018 | A1 |
20180224608 | Liu et al. | Aug 2018 | A1 |
20180252872 | Chen | Sep 2018 | A1 |
20190018201 | Takano et al. | Jan 2019 | A1 |
20190018209 | Takano et al. | Jan 2019 | A1 |
20190179089 | Takano | Jun 2019 | A1 |
20190204513 | Davidson et al. | Jul 2019 | A1 |
20190243072 | Takano et al. | Aug 2019 | A1 |
20200150357 | Higley | May 2020 | A1 |
20200285005 | Watanabe et al. | Sep 2020 | A1 |
20210099229 | Cox et al. | Apr 2021 | A1 |
20210149120 | Wong | May 2021 | A1 |
20230213709 | Higley et al. | Jul 2023 | A1 |
20230393351 | Childers et al. | Dec 2023 | A1 |
Number | Date | Country |
---|---|---|
201740886 | Feb 2011 | CN |
2573482 | Mar 1998 | JP |
2001305391 | Oct 2001 | JP |
2004-354693 | Dec 2004 | JP |
3886610 | Feb 2007 | JP |
2012-53375 | Mar 2012 | JP |
WO2012174227 | Dec 2012 | WO |
WO2013100892 | Jul 2013 | WO |
WO2014057264 | Apr 2014 | WO |
WO2015027033 | Feb 2015 | WO |
WO2017127208 | Jul 2017 | WO |
WO2018042775 | Mar 2018 | WO |
WO2019126337 | Jun 2019 | WO |
WO2002042818 | May 2022 | WO |
Entry |
---|
Petition for Inter Partes Review of U.S. Pat. No. 11,340,413, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00118, U.S. Pat. No. 11,340,413, dated Dec. 21, 2023, 131pgs. |
Fibermart, “Fiber Optic Connector Tutorial,” accessed on the internet at https://www.fiber-mart.com/news/fiber-optic-connector-tutorial-a-848.html, retrieved Dec. 21, 2023, 5pgs. |
“Fiber Optic Rack Mount Enclosure, 3-Panel 1 RMS,” accessed on the internet at https://www.computercablestore.com/fiber-optic-rack-mount-enclosure-3-panel-1-rms, retrieved Dec. 21, 2023, 4pgs. |
Liteon, “19-Inch Rack,” accessed on the internet at https://liteon-cips.com/products/racks/19-inch-rack/, retrieved Dec. 21, 2023, 5pgs. |
Wagner et al., “SC-DC/SC-QC fiber optic connector,” Opt. Eng., 37(12) 3129-3133, Dec. 1998. |
Wenke, “Report on Fiber Optic Cables,” Optical Communication ONT, Hochschule Bremen, City University of Applied Sciences, pp. 1-30, Dec. 18, 2015. |
Kant, “Data center evolution a tutorial on state of the art, issues, and challenges,” Computer Networks, 53:2939-2965, 2009. |
Curran et al. “Basics of Fiber Optics,” Amphenol Fiber Systems International, pp. 1-13, dated no later than Jan. 11, 2024. |
Nishimura et al., “High-Density Multi-Fiber Connectors for Optical Interconnection,” Furukawa Review, 34:13-16, Aug. 29, 2008. |
Gurreri et al, “Multi-Fiber, MT Ferrule Endface Fiber Tip Displacement Model for Physical Contact Interconnects,” 2006, pp. 1-12. |
Declaration of James F. Brennan III, Ph.D. in Support of Petition for Inter Partes Review of U.S. Pat. No. 11,340,413, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00118, U.S. Pat. No. 11,340,413, dated Dec. 21, 2023, 294pgs. |
Petition for Inter Partes Review of U.S. Pat. No. 10,191,230, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00120, U.S. Pat. No. 10,191,230 B2, dated Dec. 22, 2023, 177pgs. |
“HDI-45 connector,” accessed on the internet at https://en.wikipedia.org/wiki/HDI-45_connector, retrieved Dec. 22, 2023, 4pgs. |
Google Data Centers gallery, accessed on the internet at https://www.google.com/about/datacenters/gallery/, retrieved Dec. 24, 2023, 83pgs. |
Order Staying Case, Senko Advanced Components, Inc. vs. US Conec Ltd., In the United States District Court for the District of Delaware, C.A. No. 23-083 (JPM), Jul. 6, 2023, 2pgs. |
Kordz, “RJ45 CAT6 Field Termination Connector & & Strain Relief,” Technical Data Sheet, kordz.com, 2019, 2pgs. |
“Machine Design—An Integrated Approach,” 3rd Edition, Pearson College Div, Jan. 1, 2005, 93pgs. |
Declaration of William Singhose, PH.D. in Support of Petition for Inter Partes Review of U.S. Pat. No. 10,191,230, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00120, U.S. Pat. No. 10,191,230 B2, dated Dec. 19, 2023, 342pgs. |
Petition for Inter Partes Review of U.S. Pat. No. 11,385,415, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00805, U.S. Pat. No. 11,385,415, dated Apr. 12, 2024, 207pgs. |
Scheduling Order, Senko Advanced Components, Inc. vs. US Conec Ltd., In the United States District Court for the District of Delaware, Case No. 1:23-cv-00083-JPM, Mar. 12, 2024, 9pgs. |
Declaration of Edward Lurie, Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00805, U.S. Pat. No. 11,385,415, dated Apr. 11, 2024, 386pgs. |
U.S. Appl. No. 61/789,499, filed Mar. 15, 2013, 32pgs. |
Petition for Inter Partes Review of U.S. Pat. No. 11,181,701, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00121, U.S. Pat. No. 11,181,701, dated Dec. 28, 2023, 112pgs. |
“Maelstrom (ride),” Wikipedia, accessed on the internet at https://en.wikipedia.org/wiki/Maelstrom_(ride), retrieved Dec. 27, 2023, 3pgs. |
Declaration of William Singhose, PH.D. in Support of Petition for Inter Partes Review of U.S. Pat. No. 11,181,701, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00121, U.S. Pat. No. 11,181,701, dated Dec. 27, 2023, 330pgs. |
“Fiber Optic adapter/Coupler Tutorial,” accessed on the internet at https://community.fs.com/article/fiber-optic-adaptercoupler-tutorial.html, retrieved Dec. 21, 2023, 4pgs. |
“What Is Optical Fiber Technology, and How Does It Work?,” accessed on the internet at https://www.nai-group.com/optical-fiber-technology-how-it-works/, retrieved Dec. 21, 2023, 8pgs. |
Petition for Inter Partes Review of U.S. Pat. No. 11,333,836, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00117, U.S. Pat. No. 11,333,836, dated Dec. 30, 2023, 131pgs. |
U.S. Appl. No. 62/546,920, filed Aug. 17, 2017, 76pgs. |
U.S. Appl. No. 62/458,042, filed Feb. 13, 2017, 22pgs. |
U.S. Appl. No. 62/463,898, filed Feb. 27, 2017, 87pgs. |
U.S. Appl. No. 62/457,150, filed Feb. 9, 2017, 76pgs. |
U.S. Appl. No. 62/463,901, filed Feb. 27, 2017, 87pgs. |
Moxel Adaptor, dated no later than Apr. 22, 2024, 1pg. |
Hendrick, “Interface Specification for MDC Receptacle,” Feb. 6, 2020, 7pgs. |
Declaration of William Singhose, PH.D. in Support of Petition for Inter Partes Review, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00117, U.S. Pat. No. 11,333,836, 225pgs. |
Fiberoad, “QSFP-DD releases Interface Specification,” accessed on the internet at https://fiberroad.com/400g-qsfpdd-dco-standards/, retrieved Dec. 30, 2023, 3pgs. |
Cabling, “QSFP-DD MSA Group intros new specs, plus white paper,” accessed on the internet at https://www.cablinginstall.com/standards/article/14203903/qsfp-dd-msa-group-intros-new-specs-plus-white-paper, retrieved Dec. 30, 2023, 3pgs. |
Lightwave, “QSFP-DD MSA Group offers rev 6.0 specifications for QSFPDDS00, QSFP112,” accessed on the internet at https://www.lightwaveonline.com/optical-tech/transmission/article/14204021/qsfp-dd-msa-group-offers-rev-60-specifications-for-qsfp-dd800-qsfp112, retrieved Dec. 30, 2023, 4pgs. |
Jenkins et al., “Controlling Human Perception of Haptic Profiles Using Contextual Cues,” 2023 IEEE World Haptics Conference (WHC), WHC 2023, Delft, Netherlands, Jul. 10-13, 2023, pp. 1-7. |
Petition for Inter Partes Review of U.S. Pat. No. 11,415,760, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00119, U.S. Pat. No. 11,415,760, dated Jan. 3, 2024, 126pgs. |
Patent Owner's Preliminary Response to the Petition for Inter Partes Review, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00119, U.S. Pat. No. 11,415,760, dated Apr. 18, 2024, 42pgs. |
Assignment of U.S. Appl. No. 14/996,865, Takano, Gniadek to Senko Advanced Components, Inc., dated Jan. 15, 2016, 3pgs. |
Assignment of U.S. Appl. No. 14/521,414, Wong, Ruffner to Senko Advanced Components, Inc., dated Apr. 23, 2015, 8pgs. |
Declaration of Eric Pearson, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00119, U.S. Pat. No. 11,415,760, dated Apr. 17, 2024, 35pgs. |
The New. Oxford American Dictionary, 2nd ed., Cover and Bibliographic pages, p. 1596 “Slickenslide—Slip,” 2005, 4pgs. |
Meriam Webster's Collegiate Dictionary, 11th ed., Cover and Bibliographic pages, p. 1172 “sleep-slider,” 2012, 4pgs. |
Webster's New International Dictionary of the English Language, 2nd ed., p. 2364, “Slick-Slight,” 1947, 4pgs. |
Satake, “The History of the MT and its Variations,” accessed on the internet at IEEE Xplore, retrieved Oct. 30, 2023, 2pgs. |
Nissin Kasei USA Corp., “MPO Connector Kit, Product Specifications,” dated no later than Apr. 22, 2024, 9pgs. |
Furukawa Electric, “MT Ferrules,” accessed on the internet at https://www.furukawa.eo.jp/telecom/en/product/connector/product/mt.html#:-:text=MT ferrules are key components,wealth of technology and experience., retrieved Nov. 1, 2023, 4pgs. |
OCC, “18 Port Rack Mount Fiber Enclosure,” accessed on the internet at https://www.computercablestore.com/18-port-rack-mount-fiber-enclosure, retrieved Dec. 18, 2023, 4pgs. |
“Rack unit,” accessed on the internet https://en.wikipedia.org/wiki/Rack_unit, retrieved Oct. 24, 2023, 5pgs. |
Declaration of James F. Brennan III, Ph.D. in Support of Petition for Inter Partes Review, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00119, U.S. Pat. No. 11,415,760, dated Jan. 3, 2024, 281pgs. |
Petition for Inter Partes Review of U.S. Pat. No. 11,061,190, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00122, U.S. Pat. No. 11,061,190, dated Jan. 4, 2024, 147pgs. |
Patent Owner's Preliminary Response to the Petition for Inter Partes Review, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00122, U.S. Pat. No. 11,061,190, dated Mar. 27, 2024, 93pgs. |
International Standard, “Fibre optic interconnecting devices and passive components—Fibre optic connector interfaces—Part 20: Type LC connector family,” Ed. 2.0, Apr. 2012, 30pgs. |
Senko, “The Importance of Proper Crimping in Fiber Optic Assemblies,” Application Note, Rev. 01, pp. 1-9, Feb. 2021. |
Buijs, Marcel, Fiber Optic Center, “Proper Crimping Techniques are Critical When Terminating Fiber Optic Connectors,” FOC Blogs, accessed on the internet https://focenter.com/blog/proper-crimping-techniques-are-critical-when-terminating-fiber-optic-connectors, retrieved Feb. 20, 2024, 7pgs. |
Bulgin, “Terminating and crimping for fiber optics:methods and tips,” Nov. 25, 2019, accessed on the internet https://community.element14.com/products/manufacturers/bulgin/b/blog/posts/terminating-and-crimping-for-fiber-optics-methods-and-tips, retrieved Feb. 20, 2024, 4pgs. |
Cambridge English Dictionary, “Meaning of elongate in English,” accessed on the internet https://dictionary.cambridge.org/us/dictionary/english/elongate, retrieved Feb. 20, 2024, 8pgs. |
Declaration of Eric Pearson, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00122, U.S. Pat. No. 11,061,190, dated Mar. 26, 2024, 115pgs. |
Leviton, “Application Note: Understanding Duplex Polarity,” 2020, 3pgs. |
L-com Fiber Coupler, LC Duplex Bronze Sleeve, Low Profile (SKU_ FOA-802), dated no later than Apr. 22, 2024, 1pg. |
Huber+Suhner LC-XD Connector, dated no later than Apr. 22, 2024, 2pgs. |
PolyPhaser Fiber Optic Patch Cord Duplex Uniboot LC to LC Single Mode Fiber, OFNR, Yellow 3.0mm Jacket, 5m (SKU_ FPC2LCLC-USMRY30-05), dated no later than Apr. 22, 2024, 2pgs. |
Universal LC Fiber Cable—Singlemode 9_125—Plenum 4M with Uniboot LC Connectors (SKU_FODULC-SNG-4m), dated no later than Apr. 22, 2024, 10pgs. |
Declaration of James F. Brennan III, Ph.D. in Support of Petition for Inter Partes Review of U.S. Pat. No. 11,061,190, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, U.S. Pat. No. 11,061,190, IPR2024-00122, dated Jan. 4, 2024, 271pgs. |
Petition [1 of 2] for Inter Partes Review of U.S. Pat. No. 11,307,369 [Claims 1-22], US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00115, U.S. Pat. No. 11,307,369, dated Jan. 6, 2024, 121pgs. |
Petition [2 of 2] for Inter Partes Review of U.S. Pat. No. 11,307,369 [Claims 23-40], US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00116, U.S. Pat. No. 11,307,369, dated Jan. 6, 2024, 126pgs. |
Declaration of James F. Brennan III, Ph.D. in Support of Petition for Inter Partes Review of Claims 23-40 of U.S. Pat. No. 11,307,369, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00116, U.S. Pat. No. 11,307,369, dated Jan. 5, 2024, 257pgs. |
Declaration of James F. Brennan III, Ph.D. in Support of Petition for Inter Partes Review of Claims 1-22 of U.S. Pat. No. 11,307,369, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00115, U.S. Pat. No. 11,307,369, dated Jan. 5, 2024, 256pgs. |
Decision Denying Institution of Inter Partes Review, US Conec Ltd. V. Senko Advanced Components Inc, Before the Patent Trial and Appeal Board, Case IPR2024-00122, U.S. Pat. No. 11,061,190, Jun. 5, 2024, 23 pages. |
White Paper: SC-RJ—Reliability for Every Category, 2008, 14 pages. |
Petition for Post-Grant Review of U.S. Pat. No. 11,733,466, Senko Advanced Components v. US Conec LTD, Case PGR2024-00032, May 21, 2024, 242 pages. |
Declaration of Edward Lurie, Senko Advanced Components v. US Conec LTD, Case PGR2024-00032, U.S. Pat. No. 11,733,466, May 19, 2024, 310 pages. |
U.S. Appl. No. 62/532,710, filed Jul. 14, 2017, 79 pages. |
QSFP-DD Hardware Specification, Sep. 19, 2017, 69 pages. |
TIA/EI Standard, FOCIS 10 Fiber Optic Connector Intermateability Standard—Type LC, 2002, 38 pages. |
CS Connector, May 20, 2024, 8 pages. |
Exhibit I, US Conec EX1007, IPR2024-00116, U.S. Pat. No. 11,307,369, dated no later than Apr. 22, 2024; 4pgs. |
BSI Standards Publication, Fibre Optic Interconnecting Devices and Components, Part 24, Jan. 2010, 32pgs. |
INTL Standard 61754-4 ed1.2b Connector interfaces SC connector, Mar. 2002, 92pgs. |
Declaration of Edward M. Cady, Jr., Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-01074, U.S. Pat. No. 11,880,075, dated Jun. 19, 2024, 258pgs. |
Petition for Inter Partes Review of U.S. Pat. No. 11,880,075, Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-01074, U.S. Pat. No. 11,880,075, dated Jun. 20, 2024, 159pgs. |
Representative Claim Chart Showing Infringement of U.S. Pat. No. 11,880,075, Mar. 22, 2024, 67pgs. |
Declaration of Edward Lurie, Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case PGR2024-00037, U.S. Pat. No. 11,906,794, dated Jun. 14, 2024, 311pgs. |
Petition for Post-Grant Review of U.S. Pat. No. 11,906,794, Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case PGR2024-00037, U.S. Pat. No. 11,906,794, dated Jun. 20, 2024, 270pgs. |
U.S. Appl. No. 62/649,539, filed Mar. 28, 2018, 209pgs. |
U.S. Appl. No. 62/640,914, filed Mar. 9, 2018, 41pgs. |
Senko Advanced Components, “The Importance of Proper Cleaving for Fiber Optic Connectors,” Application Engineering Note, Feb. 2022, 10pgs. |
Thorlabs, Guide to Connectorization and Polishing Optical Fibers, FN96A, Apr. 17, 2013, 36pgs. |
Designerdata Polypropylene, accessed on the internet at https://designerdata.nl/materials/plastics/thermo-plastics/polypropylene-(cop.)?cookie=YES, retrieved Apr. 28, 2024, 2pgs. |
Typical Engineering Properties of Polypropylene, INEOS Olefins & Polymers USA, accessed on the internet at www.ineos-op.com, Apr. 2014, 2pgs. |
The Engineering ToolBox: Polymers, accessed on the internet at https://www.engineeringtoolbox.com/polymer-properties-d_1222.html, retrieved Apr. 28, 2024, 9pgs. |
Omnexus Plastics & Elastomers, accessed on the internet at https://omnexus.specialchem.com/polymer-property/young-modulus, retrieved Apr. 28, 2024, 14pgs. |
U.S. Appl. No. 62/793,198, filed Jan. 16, 2019, 55pgs. |
U.S. Appl. No. 62/653,706, filed Apr. 6, 2018, 19pgs. |
Exhibit A-1—U.S. Pat. No. 11,733,466 Invalidity Claim Chart, Jun. 21, 2024, 55pgs. |
Exhibit A-2—U.S. Pat. No. 11,733,466 Invalidity Claim Chart, Jun. 21, 2024, 43pgs. |
Exhibit A-3—U.S. Pat. No. 11,733,466 Invalidity Claim Chart, Jun. 21, 2024, 49pgs. |
Exhibit A-4—U.S. Pat. No. 11,733,466 Invalidity Claim Chart, Jun. 21, 2024, 37pgs. |
Exhibit B-1—U.S. Pat. No. 11,808,994 Invalidity Claim Chart, Jun. 21, 2024, 38pgs. |
Exhibit B-2—U.S. Pat. No. 11,808,994 Invalidity Claim Chart, Jun. 21, 2024, 64pgs. |
Exhibit B-3—U.S. Pat. No. 11,808,994 Invalidity Claim Chart, Jun. 21, 2024, 68pgs. |
Exhibit B-4—U.S. Pat. No. 11,808,994 Invalidity Claim Chart, Jun. 21, 2024, 53pgs. |
Exhibit C-1—U.S. Pat. No. 11,906,794 Invalidity Claim Chart, Jun. 21, 2024, 105pgs. |
Exhibit C-2—U.S. Pat. No. 11,906,794 Invalidity Claim Chart, Jun. 21, 2024, 98pgs. |
Exhibit C-3—U.S. Pat. No. 11,906,794 Invalidity Claim Chart, Jun. 21, 2024, 105pgs. |
Exhibit C-4—U.S. Pat. No. 11,906,794 Invalidity Claim Chart, Jun. 21, 2024, 33pgs. |
Exhibit C-5—U.S. Pat. No. 11,906,794 Invalidity Claim Chart, Jun. 21, 2024, 39pgs. |
Exhibit C-6—U.S. Pat. No. 11,906,794 Invalidity Claim Chart, Jun. 21, 2024, 22pgs. |
Exhibit D-1—U.S. Pat. No. 11,880,075 Invalidity Claim Chart, Jun. 21, 2024, 90pgs. |
Exhibit D-2—U.S. Pat. No. 11,880,075 Invalidity Claim Chart, Jun. 21, 2024, 91pgs. |
Exhibit D-3—U.S. Pat. No. 11,880,075 Invalidity Claim Chart, Jun. 21, 2024, 86pgs. |
Exhibit E-1—U.S. Pat. No. 11,385,415 Invalidity Claim Chart, Jun. 21, 2024, 50pgs. |
Exhibit E-2—U.S. Pat. No. 11,385,415 Invalidity Claim Chart, Jun. 21, 2024, 25pgs. |
Exhibit E-3—U.S. Pat. No. 11,385,415 Invalidity Claim Chart, Jun. 21, 2024, 57pgs. |
Exhibit E-4—U.S. Pat. No. 11,385,415 Invalidity Claim Chart, Jun. 21, 2024, 57pgs. |
Exhibit E-5—U.S. Pat. No. 11,385,415 Invalidity Claim Chart, Jun. 21, 2024, 8pgs. |
Exhibit F-1—U.S. Pat. No. 10,495,823 Invalidity Claim Chart, Jun. 21, 2024, 29pgs. |
Exhibit F-2—U.S. Pat. No. 10,495,823 Invalidity Claim Chart, Jun. 21, 2024, 26pgs. |
Exhibit G—Other Validity Grounds (Non-Prior Art), Jun. 21, 2024, 54pgs. |
Molex Incorporated, HBMT Motherboard Adapter, Doc. No. SD-106105-100MX, Oct. 31, 2005, 2pgs. |
EX1027—Meriam Webster's Collegiate Dictionary, 11th ed., Cover and Bibliographic pages, p. 551 “groove,” 2003, 4pgs. |
EX1028—The Deposition of Witness, William Singhose, Ph.D, The United States International Trade Commission, Investigation No. 337-TA, Sep. 9, 2024, 82pgs. |
EX1028—QSFP-DD, “Thermal Whitepaper: Enabling QSFP-001600 Ecosystem With Performance-Driven Thermal Innovations,” accessed on the internet at www.qsfp-dd.com/wp-content/uploads/, retrieved Aug. 6, 2024, 12pgs. |
EX1029—Representative Domestic Industry Claim Chart for U.S. Pat. No. 11,385,415 by MMC Adapters, Aug. 19, 2024, 5pgs. |
EX2002—Molex Adaptor, Jul. 24, 2024, 1pg. |
EX2003—Encyclopedia.com, Definition of Frame, accessed on the internet at https://www.encyclopedia.com/science-and-technology/computers-and-electrical-engineering/computers-and-computing/frame, retrieved Jul. 23, 2024, 12pgs. |
Exhibit 1002—Declaration of Edward Lurie, Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case PGR2024-00046, U.S. Pat. No. 11,808,994, dated Jul. 10, 2024, 362pgs. |
Exhibit 1016—MOLEX—SFP-DD Hardware Specification for SFP Double Density 2x Pluggable Transceiver, Rev 1.0, Sep. 14, 2017, 50pgs. |
Exhibit 1028—Tutorials of Fiber Optic Products, “Fiber Optic Connector Polishing,” accessed on the internet at https://www.fiber-optic-tutorial.com/category/network-solutions/fiber-optic-polishing, retrieved Jun. 4, 2024, 6pgs. |
Exhibit 1029—Fiber Cabling Solution, “UPC or APC—Which One to Choose?,” accessed on the internet at https://www.fiber-optic-cable-sale.com/upc-or-apc-which-one-to-choose.html, retrieved Jun. 4, 2024, 3pgs. |
Exhibit 1030—BELDEN, “APC vs. UPC: What's the Difference?,” accessed on the internet at https://www.belden.com/blogs/upc-or-apc#:˜:text=The main difference between APC,curvature for better core alignment 1, retrieved Jun. 4, 2024, 3pgs. |
Exhibit 1035—QSFP-DD, “QSFP-DD MSA Group Announces New Hardware Specification,” accessed on the internet at www.qsfp-dd.com/qsfp-dd-msa-group-announces-new-hardware-specification/, retrieved Jul. 10, 2024, 2pgs. |
Exhibit 1036—QSFP-DD, “QSFP-DD MSA Group Announces New Hardware Specification,” Internet Archive WayBack Machine, accessed on the internet at www.qsfp-dd.com/qsfp-dd-msa-group-announces-new-hardware-specification/, retrieved Oct. 29, 2017, 2pgs. |
Exhibit 1037—SFP-DD, SFP-DD MSA Releases Specification for High-Speed, High-Density Interface, accessed on the internet at sfp-dd.com/2017/09/sfp-dd-msa-releases-specification-for-high-speed-high-density-interface/, retrieved Jul. 10, 2024, 4pgs. |
Exhibit 1038—SFP-DD, SFP-DD MSA Releases Specification for High-Speed, High-Density Interface, Internet Archive WayBack Machine, accessed on the internet at sfp-dd.com/2017/09/sfp-dd-msa-releases-specification-for-high-speed-high-density-interface/, retrieved Oct. 15, 2017, 3pgs. |
Patent Owner's Preliminary Response Under 37 C.F.R. § 42.107(a), Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00805, U.S. Pat. No. 11,385,415, dated Jul. 24, 2024, 44pgs. |
Petition for Post-Grant Review of U.S. Pat. No. 11,808,994, Senko Advanced Components, Inc., Petitioner v. US Conec Ltd., Patent Owner, Before the Patent Trial and Appeal Board, Case PGR2024-00046, U.S. Pat. No. 11,808,994, dated Jul. 23, 2024, 266pgs. |
Paper 6, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00117, U.S. Pat. No. 11,333,836 B2, dated Jul. 9, 2024, 25pgs. |
Paper 6, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00118, U.S. Pat. No. 11,340,413 B2, dated Jul. 9, 2024, 28pgs. |
Paper 6, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00120, U.S. Pat. No. 10,191,230 C1, dated Jul. 9, 2024, 44pgs. |
Paper 6, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00121, U.S. Pat. No. 11,181,701 B2, dated Jul. 9, 2024, 26pgs. |
Paper 7, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00115, U.S. Pat. No. 11,307,369 B2, dated Jul. 9, 2024, 20pgs. |
Paper 7, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00116, U.S. Pat. No. 11,307,369 B2, dated Jul. 9, 2024, 16pgs. |
Petitioner's Reply to Preliminary Response to the Petition for Inter Partes Review, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00805, U.S. Pat. No. 11,385,415, dated Aug. 19, 2024, 10pgs. |
Petitioner's Request for Rehearing of the Institution Decision, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00122, U.S. Pat. No. 11,061,190, dated Jul. 5, 2024, 19pgs. |
Paper 9, Decision Granting Institution of Inter Partes Review 35 U.S.C. § 314, US Conec Ltd., Petitioner v. Senko Advanced Components, Inc., Patent Owner, Before the Patent Trial and Appeal Board, Case IPR2024-00119, U.S. Pat. No. 11,415,760 B2, dated Jul. 9, 2024, 41pgs. |
Number | Date | Country | |
---|---|---|---|
20240272376 A1 | Aug 2024 | US |
Number | Date | Country | |
---|---|---|---|
62649539 | Mar 2018 | US | |
62588276 | Nov 2017 | US | |
62549655 | Aug 2017 | US | |
62532710 | Jul 2017 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 16368828 | Mar 2019 | US |
Child | 16782196 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 18171358 | Feb 2023 | US |
Child | 18648893 | US | |
Parent | 17342988 | Jun 2021 | US |
Child | 18171358 | US | |
Parent | 16782196 | Feb 2020 | US |
Child | 17342988 | US | |
Parent | 16103555 | Aug 2018 | US |
Child | 16368828 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 16035691 | Jul 2018 | US |
Child | 16103555 | US |