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This invention is related to a smart chip assemblies, which includes at least two single-chips having feature extraction. Use each lens module of the single-chip to take images from multiple angles or depths of field, communicate between each intelligent single-chip, calculate and analyze, and achieve a creative design for more accurate image recognition.
In the modern era where artificial intelligence is booming, using intelligent recognition to interpret external information has become an important technology. Most applications are to obtain various information from the outside, through external connection or wireless transmission sent to a remote intelligent system for interpretation and analysis. This traditional method requires the process of external data transmission leading to the disadvantages of poor efficiency and stability. Therefore, the inventor of this application has designed a single-chip intelligent identification device (U.S. patent application Ser. No. 16/680,662), which is used in a smart single-chip body combined with a camera lens module, and can be directly assembled in various devices. That can achieve efficient real-time identification to gain the purpose of analysis and interpretation. After actual use, it does have considerable results. On this basis, in order to improve the more accurate identification effect, the inventor design a better present invention to improve recognition ability and analysis judgment, and to obtain more satisfactory recognition accuracy.
The present invention relates to a smart chip assembly capable of communicating with each other and variable array in packaging. It contains at least two intelligent single-chip, which can be easily formed into a smart chip assembly by cutting after packaging. Each intelligent single-chip has a camera lens module, and each lens module is arranged in a different position and angle to separately obtain images of different angles or depths of field of the object to be recognized, and provide each intelligent single-chip to independently process the image and judge by itself. The result of each judgment based on the obtained images of different angles or depths of field can also be used as one of the options for reference judgment. Then through the mutual communication between the intelligent single-chips, they calculate and analyze different image and image dynamics, and make comprehensive judgments to obtain the best interpretation. Finally, the command is sent to the connected power mechanism to perform corresponding actions to achieve more flexible application and improve the accuracy of identification.
The present invention relates to a smart chip assembly 1 capable of communicating with each other and variable array in packaging. First, as shown in
In another embodiment, the present invention can be used to combine three intelligent single-chips 11, 12, 13 into a smart chip assembly 1. The arrangement of the intelligent single-chips can be arranged in a single row, as shown in
The characteristic of this invention is to combining at least two intelligent single-chips as a smart chip assembly, and the arrangement of each intelligent single-chip can be changed according to needs. Each intelligent single-chip has a camera lens module to obtain images of different angles or depths of field of the object to be identified. In addition to self-judgment, it can also communicate with each other between intelligent single-chips, calculate and analyze, and make comprehensive judgments to get the best interpretation. Finally, send instructions to the connected power mechanism to perform corresponding actions to improve the accuracy of identification. However, this operation does not need to be connected by an external transmission line or wireless transmission method, and has direct and effective communication, and can provide more applications in more fields, which has significant progress.
Number | Date | Country | Kind |
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109128900 | Aug 2020 | TW | national |