The present invention relates generally to improving the performance of power-combined amplifiers, and more particularly but not exclusively to improving the performance of power-combined solid-state power amplifiers (SSPAs) and vacuum electronics-based amplifiers.
Power-combined amplifiers use a variety of technologies, including vacuum tube amplifiers such as traveling wave tubes, and solid-state amplifiers realized in GaAs, GaN, InP, SiGe, and silicon CMOS processes. There is a broad need for the ability to sense and correct transmission phases in combined amplifiers, because normal phase variations in unit amplifiers can degrade overall efficiency as some portion of the signal that should coherently combine at the power amplifier output is dissipated in isolation resistors. (Conservation of energy demands that dissipation in isolation resistors is subtracted from the potential output power of the amplifier, thus degrading overall efficiency.)
“Phase efficiency” in a power-combined amplifier is approximately related to RMS phase error between constituent amplifiers as:
ηphase=cos2(φRMS). (1)
For reference, RMS error is defined as:
where phase angles are typically expressed in degrees.
Prior attempts to solve the phase mismatch problem in power-combined amplifiers include binning component amplifiers into transmission phase windows based on measurements. However, in solid-state power amplifiers, for example, often only small-signal data is known prior to assembling the amplifier, and small-signal phase may be different from large-signal phase. Furthermore, amplifiers can change over time and temperature. Thus, a solution provided at initial device fabrication may fail or unacceptably degrade later with amplifier change. Also, effects of interconnects must be considered, including wirebonds and non-ideal phase performance of divider and combiner. Enforcing narrow phase bins on a widely varying but finite population of amplifier chips can force undesirable compromises in phase alignment, particularly during a rework event where an amplifier chip must be replaced using “leftover” amplifiers.
In contrast, phase trim has been used with vacuum-tube amplifiers to adjust phases of individual component amplifiers, in-situ, during large signal operation. The loss of the phase trim circuit is not important, as it is configured on the input side of the individual amplifiers. In such a case, the phase shifter is set to maximize the ratio of output power to wasted power, or minimize the wasted power for a fixed input power, through trial and error. A mechanical adjustment is used, and it is recommended that the adjustment be made at the factory. Further, the amplifier must be taken off-line to evaluate the phase mismatch.
In a similar manner, power sensing may be performed using isolation loads on hybrid couplers which include 90-degree hybrids and 180-degree hybrids; however, schemes such as these are not ideal and provide only one sense for every pair of amplifiers. One sense for two amplifiers can indicate the magnitude of the phase mismatch but not the direction (positive or negative) of the mismatch. Consequently using this type of power sensing for phase correction results in an iterative solution. In addition, hybrid couplers are generally not applicable to direct N-way combiners.
While it is theoretically possible to perform power sensing across the isolation resistor in a Wilkinson power divider, decoupling the DC signal from the RF at this most-sensitive node in the combiner is a tricky endeavor, which would result in reduced power combining efficiency due to common-mode loading. Schemes have been introduced that decouple the Wilkinson resistor to a one-port network using balun structures at the expense of bandwidth and complexity. Thus, it would be an advance in the art to overcome the above noted deficiencies in power-combined amplifiers.
In one of its aspects, the present invention provides a power-combined amplifier which may include first and second constituent amplifiers each having a respective power output and a power combiner electrically connected to the power outputs of the first and second constituent amplifiers. The power combiner may include an output configured to the deliver combined power outputs of the constituent amplifiers and may include a respective isolated termination for each of the first and second constituent amplifiers. At least one detector may be operably connected to the isolated terminations of the first and second constituent amplifiers and configured to measure a load excitation at each of the isolated terminations. Additionally, the power-combined amplifier may include a controller operably connected to the at least one detector to receive the measured load excitations of the first and second constituent amplifiers. The controller may be configured to analyze the measured load excitations and determine a phase mismatch between the first and second constituent amplifiers. For example, the controller may be configured to determine the frequency of a load excitation null at the respective power output of each of the first and second constituent amplifiers. The controller may also be configured to determine the phase difference between the first and second constituent amplifiers from the respective determined frequencies of the load excitation nulls of the first and second constituent amplifiers. Further, the power-combined amplifier may include a phase shifter in electrical communication with an input of the first constituent amplifier, and the phase shifter may be operably connected to the controller. The controller in turn may be configured to communicate a signal to the phase shifter to correct the phase mismatch between the first and second constituent amplifiers.
In another of its aspects, the present invention provides a method for combining power outputs of constituent amplifiers with phase matching, which may comprise combining the power outputs of first and second constituent amplifiers; determining the frequency of a load excitation null at the respective power output of each of the first and second constituent amplifiers; determining the phase difference between the first and second constituent amplifiers from the respective determined frequencies of the load excitation nulls of the first and second constituent amplifiers; and applying a phase correction related to the determined phase difference to at least one of the first and second constituent amplifiers to decrease phase mismatch between the first and second constituent amplifiers. The step of applying a phase correction may include providing a controller operably connected to at least one of the first and second constituent amplifiers, where the controller provides the phase correction to at least one of the first and second constituent amplifiers to decrease phase mismatch between the first and second constituent amplifiers.
In yet another of its aspects, the present invention provides a power amplification device having a monitored power output. The power amplification device may include a power amplifier having a power output and a shunt coupler in electrical communication with the power output. The shunt coupler may include a high-impedance quarter-wave line configured to shunt the power output to ground and may include a port tapped-off proximate to the ground. The power amplification device may also include a detector in electrical communication with the port and configured to detect the power at the power output of the power amplifier.
In a still further aspect of the present invention, a power-combined amplifier may be provided comprising N constituent amplifiers each having a respective power input and power output, where N is three or more. A power combiner may be electrically connected to the power outputs of the N constituent amplifiers and may be configured to deliver the combined power outputs of the constituent amplifiers. In addition, a plurality of reflection-phase correction lines may be provided with each of the lines electrically connected to the power input or power output of a respective constituent amplifier, where the reflection-phase correction lines may be selected from the values of the set
A total of 2·(N−1) lines may be selected from the set. The selection may be made such that when a selected first of the plurality of reflection-phase correction lines is electrically connected to the input of a selected constituent amplifier, and a selected second of the plurality of reflection-phase correction lines is electrically connected to the output of the selected constituent amplifier, the sum of the values of the selected first and second lines is
In yet another aspect, the present invention may provide a power-combined amplifier, comprising N constituent amplifiers each having a respective power input and power output, where N is an even number greater than two, and the N constituent amplifiers are composed of first and second groups of N/2 amplifiers. A power splitter having a power input and N power outputs may be provided with each splitter output electrically connected to the power input of a respective constituent amplifier. A power combiner may be electrically connected to the power outputs of the N constituent amplifiers, and may be configured to deliver the combined power outputs of the constituent amplifiers. N 90° reflection-phase correction lines may be provided with half disposed in electrical communication with the power input of a respective constituent amplifier of the first group and half disposed in electrical communication with the power output of a respective constituent amplifier of the second group.
Among the benefits and advantages afforded by the devices and methods of the present invention is a solution to the problem of sensing out-of-phase conditions in power-combined power amplifiers, for N-way direct combiners as well as N-way corporate combiners. The solution provided by the present invention can provide a direct measurement of phase value differences (including sign) between all constituent amplifiers. In so doing, the present invention eliminates guesswork in achieving phase shift correction settings to align amplifiers to within the phase tolerances of the phase shifters used to impart the correction. The phase control/correction can be operated manually or be implemented using sophisticated electronics, which can be resident on a phase shifter integrated circuit. In addition, devices and methods of the present invention can detect which amplifier(s) is at fault during a soft failure in an N-way combiner, and can provide information on load dissipation, which can be used to shut down the circuit if it is in danger of damage.
In addition, in exemplary configurations, the present invention may use load/detectors employing semiconductor diodes for near-instantaneous and accurate power sensing, which is not be the case in prior devices where thermistors, resistance temperature detectors (RTDs) or thermocouples are used to sense temperature changes caused by load heating. Exemplary configurations can also provide a “free” home for placing isolation load/detectors, by monolithically integrating the load/detectors with power amplifiers so the benefits of phase sensing are economical and compact. Still further, in another of its aspects, the present invention provides a compact output coupler with near-zero insertion loss for high-power-indicate function, as well as quadrature or poly-phase operation using appropriate transmission line segments to reduce input and output reflection coefficients.
The foregoing summary and the following detailed description of the preferred embodiments of the present invention may be further understood when read in conjunction with the appended drawings, in which:
Referring now to the figures, wherein like elements are numbered alike throughout,
A better understanding of the principles of operation of smart power combiners of the present invention and discoveries related thereto may be had by considering the effects of phase mismatch between constituent amplifiers 301, 302 on power output in a canonical two-way power-combined amplifier 300 in which two ideal amplifiers 301, 302 are combined,
Matched ports, PORT3, PORT4, of 100 ohms may be added to the Gysel isolation loads so that excitation of each load relative to a respective input signal can be evaluated. One hundred ohms is the correct termination value when the Gysel ring is uniformly 70.7 ohms impedance which is used in this example, the possibilities for changing load and transmission line segment impedances are well known. The ports, PORT3, PORT5, may include other impedances such as fifty ohms to facilitate desired system requirements. For purposes of the present analysis, the amplifiers 301, 302 may be modeled to have zero gain so that the power sensed at the isolation loads at PORT3, PORT4 is relative to the amplifier output power as well as amplifier input power.
To illustrate the effect of phase mismatch between the amplifiers 301, 302 on the power output of the two-way power-combined amplifier 300, a mathematical simulation was conducted in which the phase angle between the amplifiers 301, 302 was swept from 0 to 40 degrees in 10-degree increments (one amplifier 302 was swept 0, +5, +10, +15, +20 degrees while the other amplifier 301 was swept 0, −5, −10, −15, −20 degrees). The resulting load excitations relative to amplifier output power (dB) versus frequency (GHz) are plotted in
Varying the phase between the amplifiers 301, 302 over the range from +/−90 degrees and plotting the frequency distance of the load excitation minima versus phase difference results in the plot shown in
Δφ=−0.9 ΔF, (3)
where Δφ is the transmission phase difference between amplifiers measured in degrees and ΔF is the frequency difference in load excitation nulls measured as a percentage bandwidth. The straight-line approximation of Eqn. 3 illustrated in
In addition, the relative phase of the two amplifiers 301, 302 is also revealed: when φ2−φ1 is positive, F2−F1 will be negative, and vice-versa. Thus, it is known which amplifier 301, 302 leads and which one lags. Thus, in accordance with the present invention, a single frequency sweep of the two load excitations is all that is required to determine ΔF, from which Δφ may be determined to enable phase-alignment of the two-way power-combined amplifier 300. The calculated phase correction may be delivered to the amplifiers 301, 302 through phase shifters added to the input of amplifiers 301, 302. Moreover, applicant has discovered that the relationship of Eqn. 3 and
For example, four constituent amplifiers 701, 702, 703, 704 with phases at 0, 20, −50 and −10 degrees, respectively, may be combined with a direct, four-way Gysel 720 to provide a four-way combined power amplifier 700,
Considering the effect of the phase errors among amplifiers 701-704 in more detail,
Using Eqn. 3 to calculate the phase relationships (AO between the three amplifiers 704, 701, 702 relative to amplifier 703 based on the frequency difference of the load excitation nulls (ΔF), Δφ is calculated to be 30, 40 and 54 degrees, respectively. By comparison, the actual values of Δφ are known by this simulation to be 40, 50 and 70 degrees, which demonstrates the error present in the approximation of Eqn. 3. Thus, if one were to measure the frequency difference of the load excitation nulls (ΔF) at PORT5-PORT6, one can use Eqn. 3 to determine the approximate phase correction (30, 40 and 54 degrees) to be applied to each amplifier 701-704 without knowledge of the actual relative phase error (40, 50 and 70 degrees) present between the amplifiers 701-704.
In one exemplary configuration, the calculated phase correction may be delivered to each amplifier 701-704 via phase shifters 731, 732, 733, 734 provided at the inputs of amplifier 701-704, respectively. However, other suitable ways to integrate phase control into the power combiner systems of the present invention may be used. For instance, phase shifters can be mechanically or electrically adjustable, in either continuous or discrete steps. Moreover, since one amplifier, e.g., amplifier 703, may be deemed the reference amplifier to which the remaining N−1 amplifiers are matched, phase correction may be provided only to the remaining three amplifiers 704, 701, 702 to match their respective phases to that of the reference amplifier 703. Following the linear correction model of Eqn. 3, the phase of amplifier 701 may be made more negative by 40 degrees by phase shifter 731, the phase of amplifier 702 may be made more negative by 54 degrees by phase shifter 732, and the phase of amplifier 704 may be made more negative by 30 degrees by phase shifter 734.
In
Thus, phases of N-way combined amplifiers may be conveniently and rapidly corrected using the above-described models. In contrast, existing methods of phase alignment applied to N-way combined amplifiers would take many iterations to converge, as a form of gradient or random optimization would be required, and the result could potentially fail to fully maximize power as local maxima may exist.
In another aspect of the present invention, it is also possible to make phase corrections from a single frequency point measurement, instead of a frequency sweep, as illustrated in
In yet another aspect of the smart power combiner system of the present invention, a determination can be made of which amplifier is to blame in event of a failure.
Quadrature or Poly-Phase Operation of Smart Power Combiner
For all of its advantages of providing isolated loads for each power amplifier, the Gysel is an in-phase combiner. Quadrature or poly-phase operation are desirable particularly in situations where constituent amplifiers have poor reflection coefficients.
It is possible to obtain quadrature operation in an N-way Gysel-combined amplifier when N is an even number. This is shown in
Poly-phase reflection-coefficient cancellation is shown in
i.e.,
or {45°, 90°, 135°}. For a given value of N, 2·(N−1) lines may be selected from the set, e.g., for N=4, six lines 841-846, are used,
and none of the line segments are repeated on input or output. Thus, lines 844, 843 have a phase of 135°, lines 841, 846 have a phase of 45°, and lines 842, 825 have a phase of 90°, respectively. This has the effect of arranging the reflection coefficients in a circle around Z0 on a Smith chart, where the average of the N reflections becomes zero.
Turning now to
Intelligent Termination
For instance, in another of its aspects, the smart power combiner of the present invention may include a new form of termination, a load/detector 151, 152, where a load termination 200 is directly integrated with a Schottky or other semiconductor diode detector 210,
Further, an intelligent termination may be provided in the form of an impedance-matched RF termination comprising in the simplest case a load resistor 202 capable of dissipating RF power, an integrated diode detector 212, an RC decoupling network 214 using at least one ground return such as resistor 215 and one or more capacitors 216, 217. The load/detector 151, 152 may provide both an impedance-matched RF input port, RF IN, and a high-impedance DC output port, BIT OUT, that is decoupled from the RF input port, RF IN.
The load/detectors 151, 152 may be used to monitor wasted power at each of the respective constituent amplifiers 101, 102, such as loss due to phase mismatching, when the load/detectors 151, 152 are substituted for the power combiner's commonly-used isolation loads. At the RF input side of the load/detector, a load 200 of sufficient power capacity (application-dependent) is used to dissipate incident RF power. The diode 212 rectifies the RF voltage, and the RC decoupling network 214 of passive components 215-217 provides DC and RF ground for the diode 212 and a direct current output signal which provides built-in-test capabilities (BIT). The BIT signal may be directly correlated to exact power that is dissipated in the load 200 through an equation, curve fit or lookup table. In an N-way amplifier, there will be N BIT signals, one associated with each amplifier. Because the load 200 is integrated to the detector 210, the entire circuit may be optimized for broad-band performance in terms of VSWR at the input ports P9, P10 and other parameters. For example, the design can be optimized for better RF impedance match than if the load and detector were independent designs, i.e., the load resistor 202 could be increased to greater than Z0 to account for loading of the detector 212.
The diode detector 212 may be configured in parallel to the load resistor 202 such that the full RF voltage is available for sensing. The impedance of the diode detector 212 may be much higher than the characteristic impedance of the system, yet the detector's loading effect may be compensated to achieve a broadband impedance match; for example, if the detector presents 500 ohms to the RF signal, the load resistor could be 55 ohms to achieve 50 ohms in parallel to match to 50 ohms system impedance. The majority of the signal's energy may be dissipated in the load resistor 202, as the load resistor 202 is of much closer to system impedance Z0 than the detector 212. In addition, the response of the load/detectors 151, 152 may be fast but not instantaneous, as the detector output voltage is integrated over a series of pulses though the RC decoupling network 214, though it may be orders of magnitude faster than any means employing thermal response.
Viewed in-situ in the smart power amplifier 100, the wasted RF power from the Gysel combiner 120 enters the input ports P9, P10 of the load/detectors 151, 152, respectively, and is largely dissipated in the high power load 200,
The load/detectors 151, 152 may be implemented monolithically on a GaN, GaAs, InP, silicon, or other RF semiconductor processes, or using discrete components. One desirable way to fabricate the load/detectors 151, 152 is to use a GaN-on-silicon carbide process. SiC can provide tremendous heat spreading capabilities (k=400 W-m-K). The Schottky diode 212 may be monolithically integrated with the load 200, along with the RC coupling network 214. Indeed, there is often wasted area at the input side of a power amplifier 101, 102, because the input stage active devices are much smaller than the output stage devices. Thus, the input side can be an ideal location for implementing the load/detectors 151, 152 with no added cost. Special consideration must be paid to electrically isolating the intelligent termination from the amplifier's RF path to prevent feedback which could lead to oscillations. In this respect it may be advantageous to provide the intelligent termination as a discrete component. A reference diode may be fabricated on the intelligent termination to provide a means for compensating for temperature and/or manufacturing tolerances.
Phase Control System
With the inclusion of the load/detectors 151, 152 to monitor any wasted power from each of the respective constituent amplifiers 101, 102, the monitored power may be analyzed to determine the phase correction required to phase-align the constituent amplifiers 101, 102, the utility of which has been demonstrated above in connection with the discussion of
Phase control system can be simple or complex depending on application. In one embodiment, phase settings may be singular. In this case, optimum conditions may be determined at the factory, and the phase settings strapped to the correct value, which could be done in hardware or software. This could provide costs savings in manufacturing, as trial and error correction is avoided.
Output Power Monitor Using a Shunt Coupler and Detector
In addition to the above features of the exemplary smart power combiner 100, it is often desirable to have a means to monitor the output power of a power-combined amplifier, which is sometimes called a high-power indicate (HPI) function. A shunt coupler 160 is connected to the output of the power amp 100 in
The performance of the shunt coupler 160 is illustrated in
Drain Voltage Sense Monitor
Voltage drop to a power amplifier drain is important in design and operation of a solid-state power amp, and the connection to monitor drain voltage should be as close to the power amplifier as possible. In a further aspect of the present invention, a drain sense 180 may be integrated on-board a MMIC (Monolithic Microwave Integrated Circuit) implementation of the smart power amplifier 100, in a position to monitor the absolute drain voltage of the amplifier 100,
These and other advantages of the present invention will be apparent to those skilled in the art from the foregoing specification. Accordingly, it will be recognized by those skilled in the art that changes or modifications may be made to the above-described embodiments without departing from the broad inventive concepts of the invention. It should therefore be understood that this invention is not limited to the particular embodiments described herein, but is intended to include all changes and modifications that are within the scope and spirit of the invention as set forth in the claims.
This invention was made with government support under contract numbers FA9453-11-M-0062 and FA9453-12-C-0096 awarded by the Air Force Research Laboratory. The government has certain rights in the invention.
Number | Name | Date | Kind |
---|---|---|---|
2502479 | Pearson et al. | Apr 1950 | A |
4590446 | Hsu et al. | May 1986 | A |
4812782 | Ajioka | Mar 1989 | A |
5079527 | Goldfarb | Jan 1992 | A |
5117377 | Finman | May 1992 | A |
5126704 | Dittmer et al. | Jun 1992 | A |
5222246 | Wolkstein | Jun 1993 | A |
5287069 | Okubo et al. | Feb 1994 | A |
5736898 | Kohl et al. | Apr 1998 | A |
5872491 | Kim et al. | Feb 1999 | A |
5880648 | Aves et al. | Mar 1999 | A |
5884143 | Wolkstein et al. | Mar 1999 | A |
5953811 | Mazzochette | Sep 1999 | A |
6046609 | Toyoshima et al. | Apr 2000 | A |
6046649 | Lange | Apr 2000 | A |
6242984 | Stones et al. | Jun 2001 | B1 |
6483397 | Catoiu | Nov 2002 | B2 |
6614325 | Kocin | Sep 2003 | B1 |
6753807 | McLaughlin et al. | Jun 2004 | B1 |
6799020 | Heidmann et al. | Sep 2004 | B1 |
6982613 | Wu et al. | Jan 2006 | B2 |
7012489 | Sherrer | Mar 2006 | B2 |
7113056 | Wu et al. | Sep 2006 | B2 |
7148772 | Sherrer et al. | Dec 2006 | B2 |
7227428 | Fukunaga | Jun 2007 | B2 |
7271680 | Hall et al. | Sep 2007 | B2 |
7312673 | Wu et al. | Dec 2007 | B2 |
7382212 | Lo Hine Tong et al. | Jun 2008 | B2 |
7385462 | Epp et al. | Jun 2008 | B1 |
7405638 | Sherrer et al. | Jul 2008 | B2 |
7463109 | Ilo | Dec 2008 | B2 |
7482894 | Wu et al. | Jan 2009 | B2 |
7598805 | Staudinger et al. | Oct 2009 | B2 |
7616058 | Nezakati et al. | Nov 2009 | B1 |
7623006 | Ezzeddine et al. | Nov 2009 | B2 |
7649432 | Sherrer et al. | Jan 2010 | B2 |
7656256 | Houck et al. | Feb 2010 | B2 |
7746175 | Rector | Jun 2010 | B2 |
7755174 | Rollin et al. | Jul 2010 | B2 |
7898356 | Sherrer et al. | Mar 2011 | B2 |
7932781 | Lopez | Apr 2011 | B2 |
7948335 | Sherrer et al. | May 2011 | B2 |
8031037 | Sherrer et al. | Oct 2011 | B2 |
8319583 | Huettner | Nov 2012 | B2 |
20030174018 | Cooper et al. | Sep 2003 | A1 |
20050174194 | Wu et al. | Aug 2005 | A1 |
20070001907 | Hall et al. | Jan 2007 | A1 |
20110187453 | Deckman et al. | Aug 2011 | A1 |
20120062335 | Sherrer et al. | Mar 2012 | A1 |
20130050055 | Paradiso et al. | Feb 2013 | A1 |
Number | Date | Country |
---|---|---|
2012003506 | Jan 2012 | WO |
Entry |
---|
Written Opinion of the International Searching Authority mailed Jan. 5, 2012 on PCT/US2011/042902. |
A Novel Broadband High-Power Combiner, Q Gu et al, 2005 IEEE Asia Pacific Microwave Conference Proceedings. |
Comtech EF Data, PCB-4000, 1+1 Phase Combiner Installation and Operation Manual, Revision 2, Oct. 9, 2012. http://www.comtechefdata.com/files/manuals/mn-amplifiers-pdf/mn-pcb4000.pdf. |
CPI, Power Amplifier Phase (Power) Combining, Jun. 8, 2005. http://www.ramayes.com/Data%20Files/Communications%20Power%20Industries/CPI%201000-Watt%20Amplifier%20System.pdf. |
Chance, G.I. et al., “A suspended-membrane balanced frequency doubler at 200GHz,” 29th International Conference on Infrared and Millimeter Waves and Terahertz Electronics, pp. 321-322, Karlsrube, 2004. |
Immorlica, Jr., T. et al., “Miniature 3D micro-machined solid state power amplifiers,” COMCAS 2008. |
Ehsan, N. et al., “Microcoaxial lines for active hybrid-monolithic circuits,” 2009 IEEE MTT-S Int. Microwave.Symp. Boston, MA, Jun. 2009. |
Filipovic, D. et al., “Monolithic rectangular coaxial lines. Components and systems for commercial and defense applications,” Presented at 2008 IASTED Antennas, Radar, and Wave Propagation Conferences, Baltimore, MD, USA, Apr. 2008. |
Filipovic, D.S., “Design of microfabricated rectangular coaxial lines and components for mm-wave applications,” Microwave Review, vol. 12, No. 2, Nov. 2006, pp. 11-16. |
Ingram, D.L. et al., “A 427 mW 20% compact W-band InP HEMT MMIC power amplifier,” IEEE RFIC Symp. Digest 1999, pp. 95-98. |
Lukic, M. et al., “Surface-micromachined dual Ka-band cavity backed patch antennas,” IEEE Trans. AtennasPropag., vol. 55, pp. 2107-2110, Jul. 2007. |
Oliver, J.M. et al., “A 3-D micromachined W-band cavity backed patch antenna array with integrated rectacoax transition to wave guide,” 2009 Proc. IEEE International Microwave Symposium, Boston, MA 2009. |
Rollin, J.M. et al., “A membrane planar diode for 200GHz mixing applications,” 29th International Conference on Infrared and Millimeter Waves and Terahertz Electronics, pp. 205-206, Karlsrube, 2004. |
Rollin, J.M. et al., “Integrated Schottky diode for a sub-harmonic mixer at millimetre wavelengths,” 31st International Conference on Infrared and Millimeter Waves and Terahertz Electronics, Paris, 2006. |
Saito et al., “Analysis and design of monolithic rectangular coaxial lines for minimum coupling,” IEEE Trans. Microwave Theory Tech., vol. 55, pp. 2521-2530, Dec. 2007. |
Vanhille, K. et al., “Balanced low-loss Ka-band μ-coaxial hybrids,” IEEE MTT-S Dig., Honolulu, Hawaii, Jun. 2007. |
Vanhille, K. et al., “Ka-Band surface mount directional coupler fabricated using micro-rectangular coaxial transmission lines,” 2008 Proc. IEEE International Microwave Symposium, 2008. |
Vanhille, K.J. et al., “Ka-band miniaturized quasi-planar high-Q resonators,” IEEE Trans. Microwave Theory Tech., vol. 55, No. 6, pp. 1272-1279, Jun. 2007. |
Vyas R. et al., “Liquid Crystal Polymer (LCP): The ultimate solution for low-cost RF flexible electronics and antennas,” Antennas and Propagation Society, International Symposium, p. 1729-1732 (2007). |
Wang, H. et al., “Design of a low integrated sub-harmonic mixer at 183GHz using European Schottky diode technology,” From Proceedings of the 4th ESA workshop on Millimetre-Wave Technology and Applications, pp. 249-252, Espoo, Finland, Feb. 2006. |
Wang, H. et al., “Power-amplifier modules covering 70-113 GHz using MMICs,” IEEE Trans Microwave Theory and Tech., vol. 39, pp. 9-16, Jan. 2001. |
Vanhille, K., “Design and Characterization of Microfabricated Three-Dimensional Millimeter-Wave Components,” Dissertation, 2007. |
Ehsan, N., “Broadband Microwave Litographic 3D Components,” Dissertation 2009. |
Colantonio, P., et al., “High Efficiency RF and Microwave Solid State Power Amplifiers,” pp. 380-395, 2009. |
Palacios, T. et al., “High-power AlGaN/GaN HEMTs for Ka-band applications,” IEEE Electron Device Letters 26, No. 11 (2005): 781-783. |
York, R.A., et al., “Some considerations for optimal efficiency and low noise is large power combiners,” IEEE Transactions on Microwave Theory and Techniques, vol. 49, No. 8, Aug. 2001. |
Guannella, G., “Novel Matching Systems for High Frequencies,”: Brown-Boveri Review, vol. 31, Sep. 1944, pp. 327-329. |
Chen, A.C., “Development of Low-Loss Broad-Band Planar Baluns Using Multilayered Organic Thin Films,” IEEE Transactions on Microwave Theory and Techniques, vol. 53, No. 11, pp. 3648-3655, Nov. 2005. |
Sherrer, D, Vanhille, K, Rollin, J.M., “PolyStrata Technology: A Disruptive Approach for 3D Microwave Components and Modules,” Presentation (Apr. 23, 2010). |
Ali Darwish et al.; Three Dimensional Transmission Lines and Power Divider Circuits; 2009 IEEE; pp. 184-190. |
Ali Darwish et al.; Vertical Balun and Wilkinson Divider; 2002 IEEE MTT-S Digest; pp. 109-112. 2002. |
Anthony A. Immorlica, Jr., et al., Miniature 3D Micro-Machined Solid State Power Amplifiers; Distribution Statement “A” (Approved for Public Release, Distribution Unlimited) N/A., Apr. 4, 2008. |
Written Opinion of the International Searching Authority mailed Jan. 5, 2012 on PCT/US2011/042902. Jan. 5, 2012. |
Saito, Y., Fontaine, D., Rollin, J-M., Filipovic, D., “Micro-Coaxial Ka-Band Gysel Power Dividers,” Microwave Opt Technol Lett 52: 474-478, 2010, Feb. 2010. |
Dong, Y., et al., “60 GHz Low Loss, Amplitude and Phase Balanced Radial Waveguide Power Combiner”, International Conference on Communications and Control, Sep. 9-11, 2011, pp. 4077-4073. |
Vanhille, K., et al., “A Capacitively-Loaded Quasi-Planar Ka-Band Resonator”, 36th European Microwave Conference, Sep. 10-15, 2006. |
Vanhille, K., et al., “Quasi-Planar High-Q Millimeter Wave Resonators”, IEEE Transactions on Microwave Theory and Techniques, Jun. 2006. |
Extended EP Search Report for EP Application No. 11801527.0 dated Oct. 13, 2014. |