Claims
- 1. A pad comprising a mass of polymer fibers, the pad having a smooth surface wherein the surface finish of the smooth surface is substantially the same as that of abrading the composite with an abrasive having particle sizes in the range of about 1 micrometer to less than 50 micrometers and all ranges subsumed therein.
- 2. A pad according to claim 1 wherein the pad has a Shore D hardness greater than about 45 and a density greater than about 0.5 grams per cubic centimeter.
- 3. A pad according to claim 1 wherein the pad has a density greater than about 0.7 grams per cubic centimeter and a Shore D hardness of at least 50.
- 4. A pad according to claim 1 wherein the pad has a Shore D hardness greater than about 60.
- 5. A pad for chemical mechanical planarization of substrates for electronic device fabrication, the pad comprising:
a non-woven felt comprising polyester fibers, the felt having a denier of about 2, the felt having a density of about 0.32±0.03 grams per cubic centimeter; a polymer resin comprising polyurethane, the resin having a modulus value of about 300 kg/cm to about 400 kg/cm; wherein, the felt is impregnated with the resin so that the pad has a density greater than about 0.5 grams per cubic centimeter, a polyurethane to fiber ratio of about 45:55, a compressive modulus greater than about 70%, a substantially homogeneous, substantially open pore structure sufficient for transporting amounts of a polishing slurry effective for chemical mechanical planarization; and the pad having a substantially smooth surface wherein the surface finish of the smooth surface is substantially the same as that of abrading the pad with an abrasive having particle sizes in the range of about 1 micrometer to less than 50 micrometers and all ranges subsumed therein.
- 6. A pad according to claim 5, wherein the pad has air permeability greater than about 12 (cubic centimeters)/((square centimeter minute)).
- 7. A pad according to claim 5, wherein the pad has air permeability in the range of about 10 to about 25 (cubic centimeters)/((square centimeter)(minute)).
- 8. A pad according to claim 7, wherein the resin has a modulus value of about 350 kg/cm, the ratio of weight percent fiber to weight percent resin is about 55:45, the felt comprises polyester, and the resin comprises polyurethane.
- 9. A pad for chemical mechanical planarization comprising:
a non-woven felt of polymer fibers, the felt having a density greater than about 0.29 grams per cubic centimeter; a resin; the felt and resin being combined so as to form a composite of felt and resin wherein the ratio of weight percent fiber to weight percent resin is in the range from about 35:65 to about 65:35; the pad having a smooth surface substantially equivalent to smoothing the surface with abrasive particles having grits greater than about 200 so as to be capable of providing effective planarization for chemical mechanical planarization processes, and the pad having a density greater than about 0.5 grams per cubic centimeter.
- 10. The pad of claim 9 wherein the grits are greater than 300.
- 11. A method of making a pad for chemical mechanical planarization of a substrate, the method comprising the steps of:
providing a composite of non-woven felt of polymer fibers impregnated with a resin; and smoothing a surface on the composite so as to obtain a surface finish substantially the same as that of abrading the composite with an abrasive having particle grits greater than 300.
- 12. The method of claim 11 wherein the smoothing step comprises abrading the composite with abrasive particles bonded to a carrier.
- 13. The method of claim 11 wherein the smoothing step comprises abrading the composite with at least one of diamond particles, aluminum oxide particles, silicon carbide particles, and zirconia particles and the particles are bonded to a carrier.
- 14. The method of claim 11 wherein the smoothing step is continued until the surface finish of the composite is capable of providing a predetermined or optimum planarization efficiency.
- 15. The method of claim 11 wherein the smoothing step comprises abrading with abrasive particles having an average size of about 30 micrometers followed by abrading with abrasive particles having an average size of about 15 micrometers.
- 16. The method of claim 11 wherein the smoothing step comprises removing about 50 micrometers from the surface of the composite using abrasive particles having an average size of about 30 micrometers followed by removing about 50 micrometers from the surface of the composite using abrasive particles having an average size of about 15 micrometers.
- 17. The method of claim 11 wherein the smoothing step comprises applying heat or applying heat and pressure to the surface of the composite.
- 18. The method of claim 11 wherein the composite has a density greater than about 0.7 grams per cubic centimeter.
- 19. A method of making a pad, the pad having a density of about 0.5 grams per cubic centimeter to about 0.7 grams per cubic centimeter, the method comprising the steps of:
providing a non-woven felt of polymer fibers, the felt having a density greater than about 0.29 grams per cubic centimeter; providing a resin; impregnating the felt with the resin so as to form a composite of felt and resin wherein the ratio of weight percent fiber to weight percent resin is in the range from about 35:65 to about 65:35 smoothing a surface on the composite so as to obtain a surface finish substantially the same as that of abrading the composite with an abrasive having particle grits greater than 300.
- 20. The method of claim 19 wherein the smoothing step comprises abrading the composite.
- 21. The method of claim 19 wherein the smoothing step is continued until the surface finish of the composite is capable of providing a predetermined or optimum planarization efficiency for chemical mechanical planarization of a substrate for an electronic device.
- 22. The method of claim 19, wherein the resin has a 100% modulus value of about 300 kg/cm to about 400 kg/cm.
- 23. The method of claim 19, wherein the ratio of weight percent fiber to weight percent resin is about 55:45.
- 24. The method of claim 19 wherein the smoothing step comprises abrading with particles having sizes less than 50 micrometers.
- 25. The method of claim 19 wherein the smoothing step comprises abrading with particles having sizes in the range of about 1 micrometer to less than 50 micrometers and all ranges subsumed therein.
- 26. A method of making a pad for chemical mechanical planarization of a substrate, the method comprising the steps of:
providing a polymer sheet; and smoothing a surface on the sheet so as to obtain a surface finish substantially the same as that of abrading the surface with an abrasive having particles less than 50 micrometers in size and the nearest neighbor distance between the particles is less than about 4 times the average size of the particles.
- 27. The method of claim 26 wherein the particles are bonded to a carrier and the nearest neighbor distance between the particles is less than about 2 times the average size of the particles.
- 28. The method of claim 26 wherein the particles are bonded to a carrier and the nearest neighbor distance between the particles is less than about the average size of the particles.
- 29. A pad for CMP or polishing a substrate, the pad comprising a polymer sheet having a polishing surface wherein the polishing surface has surface roughness measurements of at least one of
Rk less than about 25, Rpk less than about 8, Rvk less than about 12, Mr1 less than about 7, and Mr2 less than about 80.
- 30. The pad of claim 29 wherein the polymer sheet comprises polymer fibers impregnated with a resin.
- 31. The pad of claim 29 wherein the polymer sheet comprises a mass of nonwoven polymer fibers impregnated with a resin.
- 32. A pad for CMP or polishing a substrate, the pad comprising a polymer sheet having a polishing surface wherein the polishing surface has surface roughness measurements of at least one of
Rk less than about 15, Rpk not greater than about 5, Rvk not greater than about 12, Mr1 not greater than about 7, and Mr2 not greater than about 78.
- 33. A pad for CMP or polishing a substrate, the pad comprising a polymer sheet having a polishing surface wherein the polishing surface has surface roughness measurements of at least one of
Rk from about 2 to about 15, Rpk from about 0.5 to about 5, Rvk from about 8 to less than about 12, Mr1 from about 1 to less than about 7, and Mr2 from about 68 to about 78.
- 34. The pad of claim 33 wherein the polymer sheet comprises polymer fibers impregnated with a resin.
- 35. The pad of claim 33 wherein the polymer sheet comprises a mass of nonwoven polymer fibers impregnated with a resin.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims benefit of U.S. application Ser. No. 60/368048 filed Mar. 25, 2002 and U.S. application Ser. No. 60/368049 filed Mar. 25, 2002. This application is related to U.S. patent application Ser. No. 10/020081, filed Dec. 11, 2001, and U.S. patent application Ser. No. 10/020082, filed Dec. 11, 2001. The contents of all of these applications are incorporated herein by this reference in their entirety.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60368048 |
Mar 2002 |
US |
|
60368049 |
Mar 2002 |
US |