This disclosure relates generally to electronic systems and more specifically to miniaturized electrical connectors able to carry high-frequency signals.
Electrical connectors are used in many electronic systems. In general, various electronic devices (e.g., smart phones, tablet computers, desktop computers, notebook computers, digital cameras, and the like) have been provided with assorted types of connectors whose primary purpose is to enable an electronic device to exchange data, commands, and/or other signals with one or more other electronic devices. Electrical connectors are basic components needed to make some electrical systems functional. Signal transmission to transfer information (e.g., data, commands, and/or other electrical signals) often utilize electrical connectors between electronic devices, between components of an electronic device, and between electrical systems that may include multiple electronic devices.
It is generally easier and more cost effective to manufacture an electrical system as separate electronic assemblies, such as printed circuit boards (“PCBs”). The PCBs may be connected with electrical connectors that pass electrical signals or power between the PCBs. In some scenarios, the PCBs to be connected may each have connectors mounted on them, which may be mated directly to interconnect the PCBs.
In other scenarios, the PCBs may be connected indirectly via a cable. Electrical connectors may nonetheless be used to make such connections. For example, the cable may be terminated on one or both ends with a plug type of electrical connector (“plug connector” herein). A PCB may be equipped with a board electrical connector, containing an opening (“receptacle connector” herein) into which the plug connector may be inserted to connect the cable to the PCB. A similar arrangement may be used at the other end of the cable, to connect the cable to another PCB, so that signals may pass between the PCBs via the cable.
In some systems, the cable assemblies may route signals between locations near the middle of a PCB and other locations on the PCB. For distances greater than about 6 inches, for example, signal losses within a PCB may interfere with high frequency operation, but a cable of similar length might provide acceptable signal integrity. In these architectures, the receptacle connector might be mounted to the midboard. Such receptacles are generally very small and may be mounted using surface mount solder techniques along with other components to be mounted to the PCB. For surface mounting, a PCB, with components placed on it, is heated. Solder or solder paste between leads of the component and the PCB is heated to a reflow temperature of the solder, which allows the solder to wet the leads on the component and pads on the PCB. When the PCB cools, the solder solidifies, creating bonds between the leads of the component and the PCB.
Connectors are designed to satisfy a range of requirements, including requirements relating to mechanical or electrical performance, cost, reliability and ease of use. For example, connectors may be designed to fit within constrained spaces inside an electronic device and to ensure reliable mating. Additionally, connectors may need to pass signals with high integrity so that operation of the electronic device is not disrupted by unintended changes to signals. Simultaneously satisfying all requirements can be a challenge, particularly for high-speed or high-density interconnections.
For electronic devices that require a high-density, high-speed connector, techniques may be used to reduce interference between conductive elements within the connectors, and to provide other desirable electrical properties. One such technique involves the use of shield members between or around adjacent conductive elements that carry signals through a connector system. The shields may prevent signals carried on one conductive element from creating “crosstalk” on another conductive element. The shields may also have an impact on an impedance of the conductive elements, which may further contribute to desirable electrical properties of the connector system.
Another technique that may be used to control performance characteristics of a connector entails transmitting signals differentially. Differential signals result from signals carried on a pair of conducting paths, called a “differential pair.” The voltage difference between the conductive paths represents the differential signal. In general, a differential pair is designed with preferential coupling between the conducting paths of the pair. For example, the two conducting paths of a differential pair may be arranged to run closer to each other than to other adjacent signal paths in the connector.
Disclosed in the present application is a receptacle connector, comprising: a housing comprising a mating interface for receiving a complementary connector; a plurality of contacts disposed in the housing; a shell at least partially covering the housing, the shell comprising: a rear face; a top face; first and second side faces disposed opposite from each other; a first bent portion disposed between the rear face and the top face and coupling the rear face to the top face; second bent portions disposed between the first and second side faces and the top face and coupling the first and second side faces to the top face; and at least one hole disposed in the first bent portion configured to allow air to flow through.
In some embodiments, the at least one hole comprises a plurality of holes. In some embodiments, the shell comprises a width between the first and second side faces; and the at least one hole extends over at least 80% of the width of the shell. In some embodiments, the shell further comprises first and second openings disposed between the first bent portion and the second bent portions. In some embodiments, the receptacle connector further comprises at least one terminal module disposed in the housing, the at least one terminal module comprising the plurality of contacts.
In some embodiments, the plurality of contacts comprise contact tails configured for connection to a substrate; the housing has a bottom face; and the contact tails extend beyond the bottom face of the housing. In some embodiments, the housing has a bottom face; the housing comprises a plurality of standoffs extending from the bottom face; the first and second side faces of the shell have lower edges; and the plurality of standoffs extend beyond the lower edges of the first and/or second side faces of the shell. In some embodiments, the standoffs extend from the bottom face between 0.2 and 0.4 mm. In some embodiments, the housing comprises a plurality of standoffs extending from a bottom face of the housing; the first and second side faces of the shell have lower edges; and the plurality of standoffs extend beyond the lower edges of the first and/or second side faces of the shell. In some embodiments, the lower edges of the first and second side faces of the shell align with the bottom face.
In some embodiments, the receptacle connector is described in combination with a substrate, wherein the housing comprises a plurality of standoffs extending from a bottom face of the housing, and the receptacle connector is mounted to the substrate with the plurality of standoffs between the bottom face and the substrate such that there is a gap between the shell and the substrate, and the housing and the substrate. In some embodiments, the housing further comprises a front face opposite the rear face of the shell and comprising the mating interface and the gap extends from the front face to the rear face. In some embodiments, the gap extends from the first side face to the second side face. In some embodiments, the substrate is a circuit board and the receptacle connector is surface mount soldered to the printed circuit board.
In some embodiments, the rear face of the shell comprises a lower edge; the contact tails of at least a portion of the plurality of contacts are disposed in a row adjacent to the lower edge of the rear face of the shell; and a first distance, in a direction perpendicular to the bottom face of the housing, between the top face and the lower edge of the rear face of the shell is less than a second distance, in the direction perpendicular to the bottom face of the housing, between the top face and a lower edge of the first or second side faces of the shell. In some embodiments, the difference between the first and second distances is between 0.5 and 1.5 mm. In some embodiments the rear face of the shell comprises a cutout exposing at least a portion of the plurality of contacts.
In some embodiments, the housing comprises a pair of projections disposed on opposing sides of the housing. In some embodiments, the shell further comprises a first hole disposed in the first side face and a second hole disposed in the second side face; wherein the first and second holes are configured to engage with first and second projections of the complementary connector.
In some embodiments, the shell has a height less than 5 mm. In some embodiments, the shell has a height less than 4 mm.
Also disclosed herein is an assembly, comprising a receptacle connector and a substrate, wherein: the receptacle connector is the receptacle connector as described herein; and a bottom face of the housing is mounted to the substrate.
In some embodiments, the substrate is a printed circuit board and the receptacle connector is surface mount soldered to the printed circuit board. In some embodiments, the at least one hole comprises a plurality of holes. In some embodiments, the shell comprises a width between the first and second side faces; and the plurality of holes extend over at least 80% of the width of the shell. In some embodiments, the shell further comprises first and second openings disposed between the first bent portion and the second bent portions. In some embodiments, the plurality of contacts comprise contact tails configured for connection to the printed circuit board; the housing has a bottom face; and the contact tails extend beyond the bottom face of the housing.
In some embodiments, the housing comprises a plurality of standoffs extending from the bottom face; the first and second side faces of the shell have lower edges; and the plurality of standoffs extend beyond the lower edges of the first and/or second side faces of the shell and the bottom face of the housing such that there is a gap between the shell and the printed circuit board, and the housing and the printed circuit board. In some embodiments, the assembly further comprises a front face opposite the rear face of the shell and comprising the mating interface, wherein the gap extends from the front face to the rear face. In some embodiments, the gap extends from the first side face to the second side face.
In some embodiments, the contact tails of at least a portion of the plurality of contacts are disposed in a row adjacent a lower edge of the rear face of the shell; and a first distance, in a direction perpendicular to the top face and the lower edge of the rear face of the shell is less than a second distance, in a direction perpendicular to the bottom face of the housing, between the top face and a lower edge of the first or second side faces of the shell. In some embodiments, the difference between the first and second distances is between 0.5 mm and 1.5 mm. In some embodiments, the contact tails of at least a portion of the plurality of contacts are exposed within a third distance, in a direction perpendicular to the bottom face of the housing, between the lower edge of the rear face of the shell and the printed circuit board.
In some embodiments, the assembly further comprises a plug connector; the plug connector comprising a connector body having a terminal interface for mating with the mating interface of the receptacle connector. In some embodiments, the housing comprises a pair of projections disposed on opposing sides of the housing at an end adjacent to the mating interface; the plug connector further comprises first and second engagement arms; the first engagement arm comprises a first recess; the second engagement arm comprises a second recess; and the first recess is configured to receive a first one of the pair of projections and the second recess is configured to receive a second one of the pair of projections when the plug connector is mated with the receptacle connector.
In some embodiments, the assembly further comprises a high speed electronic component mounted to the printed circuit board adjacent to the receptacle connector; wherein: the receptacle connector is mated with the plug connector. In some embodiments, the high speed electronic component comprises a processor; the assembly further comprises a heat sink mounted to the processor; and the receptacle connector is disposed at least in part below the periphery of the heat sink. In some embodiments, the assembly further comprises an I/O connector; and a cable coupling the plug connector to the I/O connector.
In some embodiments, the shell of the receptacle connector has a height less than 5 mm. In some embodiments, the housing of the receptacle connector comprises a plurality of standoffs extending from a bottom face of the housing, and the receptacle connector is mounted to the printed circuit board with the plurality of standoffs between the bottom face and the printed circuit board such that there is a gap between the shell and the printed circuit board, and the housing and the printed circuit board.
Also disclosed herein is a method of manufacturing an electronic assembly, the method comprising: positioning a receptacle connector on a printed circuit board, wherein: the receptacle connector comprises: a housing comprising a mating interface for receiving a complementary connector; a plurality of contacts disposed in the housing; and a shell at least partially covering the housing, the shell comprising: a rear face; a top face; a first bent portion disposed between the rear face and the top face and coupling the rear face to the top face; flowing heated air over contact tails of the plurality of contacts so as to wet tails of the plurality of contacts and conductive pads on the substrate with solder; and releasing heat from inside the shell through at least one hole disposed in the first bent portion.
In some embodiments, releasing heat comprises air flow through the at least one hole. In some embodiments, flowing heated air over the contact tails comprises flowing the heated air through a gap between the receptacle connector and the substrate. In some embodiments, the at least one hole comprises a plurality of holes. In some embodiments, the shell comprises a width between the first and second side faces; and the at least one hole extends over at least 80% of the width of the shell. In some embodiments, the shell as a height less than 5 mm. In some embodiments, the shell has a height less than 4 mm.
In some embodiments, the gap extends a first distance, in a perpendicular direction from a bottom face of the housing to the substrate, and the first distance has a height between 0.2 mm and 0.4 mm. In some embodiments, the shell further comprises second bent portions disposed between the first and second side faces and the top face and coupling the first and second side faces to the top face, and the shell comprises first and second openings disposed between the first bent portion and the second bent portions.
In some embodiments, the contact tails of at least a portion of the plurality of contacts are disposed in a row adjacent to a lower edge of the rear face of the shell; and a first distance, in a direction perpendicular to a bottom face of the housing, between the top face and the lower edge of the rear face of the shell is less than a second distance, in the direction perpendicular to the bottom face of the housing, between the top face and a lower edge of the first or second side faces of the shell. In some embodiments, the difference between the first and second distances is between 0.5 mm and 1.5 mm.
The foregoing features may be used, separately or together in any combination, in any of the embodiments discussed herein.
Various aspects and embodiments of the present technology disclosed herein are described below with reference to the accompanying figures. It should be appreciated that the figures are not necessarily drawn to scale. Items appearing in multiple figures may be indicated by the same reference numeral. For the purposes of clarity, not every component may be labeled in every figure.
The following labels are used to identify principal components illustrated in the drawings:
The inventors have recognized and appreciated designs for electrical connectors, suitable for systems with midboard cable connections, that enable secure latching that is resistant to unlatching in use. A receptacle connector may be at least partially surrounded by a shell, which may be metal and attached to a printed circuit board, providing mechanical integrity to the sidewalls of the shell. Side faces of the shell may be spaced from a housing of the receptacle connector, leaving a cavity on each side of the receptacle into which arms of a plug connector may be inserted. A lock portion on the arms of the plug may engage apertures in the side faces of the shell. As the lock portion is inside the cavity, the side faces block unintentional pressure on the lock portion, that otherwise might release the latching of the plug to the receptacle.
In some embodiments, the connector designs reduce the risk of damage to connectors during surface mount soldering operations. These designs may enable the manufacture of a compact electronic system that processes high speed signals, which benefit from miniaturized electrical connectors of low height, such as 5 mm or less, relative to a surface of a printed circuit board to which the connector system is mounted. The inventors have further recognized and appreciated that miniaturized electrical connectors having closely spaced terminal contacts, such as on a center-to-center pitch of 0.5 mm to 0.7 mm, have thin housings and would, with conventional designs, be susceptible to warpage or other damage as a result of high temperatures present when the terminal contacts are soldered to a printed circuit board. The high temperature air may damage or deform the housing of the electrical connector.
Miniaturized electrical connectors designed as described herein may be less susceptible to damage by high temperature air during surface mount soldering. In some embodiments, a receptacle connector comprises one or more airflow holes in a shell around the connector which are shaped and/or positioned so as to enable heat to flow away from the receptacle connector, thus allowing heat to dissipate as opposed to causing damage to the connector.
A high reliability SMT receptacle connector is described herein. In some embodiments, the receptacle connector comprises a housing comprising a mating interface for receiving a complementary connector, a plurality of contacts disposed in the housing, and a shell at least partially covering the housing. The shell may comprise a rear face, a top face, first and second side faces disposed opposite from each other, a first bent portion disposed between the rear face and the top face and coupling the rear face to the top face, second bent portions disposed between the first and second side faces and the top face and coupling the first and second side faces to the top face, and at least one hole disposed in the first bent portion configured to allow air to flow through.
The inventors have appreciated that airflow holes in bent portions of the shell as described herein provide for improved ventilation of heat that might otherwise be trapped within the shell and deform or damage the receptacle. When terminal contacts of the receptacle connector are soldered to a substrate, such as a printed circuit board, heat needed inside the shell for soldering contacts of the receptacle connector to the substrate will flow out through the holes and dissipate, preventing damage or deformation of the receptacle connector housing.
The inventors have further appreciated that the configuration of the holes as described herein enable easier and cheaper manufacture of the receptacle connector. For example, assembling the shell requires folding portions of a sheet of metal to be bent to form the corner between the top and rear faces. A hole may be punched through that sheet of metal where it will be bent into the corner portion of the shell as part of the bending operation. In this way, the sheet may be more easily bent and an additional machining station is not required to form the holes.
According to some embodiments, the housing of the receptacle connector has standoffs, and the lower edges of the shell are aligned with the bottom of the connector housing to leave a gap formed between the receptacle connector and a substrate, such as a printed circuit board, when the receptacle connector is mounted to the substrate. In some embodiments, the standoffs extend from the bottom face of the housing between 0.2 mm and 0.4 mm so as to create a gap having a height between 0.2 mm and 0.4 mm. In some embodiments, the gap extends from the rear face to a front face of the receptacle connector. In some embodiments, the gap extends between opposing side faces of the receptacle connector. The gap enables high temperature air used to solder the terminal contacts to the substrate to heat the solder during a reflow operation but then flow out and away from the receptacle connector, thereby preventing damage to or deformation of the receptacle connector.
In some embodiments, the rear face of the shell comprises a cutout exposing at least a portion of the plurality of contacts. In some embodiments, a first distance, in a direction perpendicular to the bottom face of the housing, between the top face and a lower edge of the rear face of the shell is less than a second distance, in the direction perpendicular to the bottom face of the housing, between the top face and a lower edge of the first or second side faces of the shell. In the embodiments described herein, contact tails of at least a portion of the plurality of contacts can be disposed in a row adjacent to the lower edge of the rear face of the shell such that the contact tails are exposed from the receptacle shell.
Designs as disclosed herein may also facilitate inspection and/or rework of solder joints between the connectors and a PCB in the event that the terminal contacts are not soldered accurately. The airflow gap, alone or in combination with a cutout in one or more faces of the shell, enables better access to the terminal contacts for reworking of the terminal contacts. Thus, designs as described herein may enable an electronic assembly of higher quality.
Connectors according to the embodiments described herein may have a height less than other components that might otherwise be on a printed circuit board in the system. For example, in some embodiments, the shell has a height less than 5 mm. In some embodiments, the shell has a height less than 4 mm.
In some embodiments, the receptacle connector comprises latching elements to configure a secure connection of a complementary connector to the receptacle connector. In some embodiments, the receptacle connector comprises a pair of projections configured to engage with a pair of recesses of the complementary connector. The pair of projections may allow for easier guiding of the complementary connector in a proper alignment when mating with the receptacle connector. In some embodiments, the shell of the receptacle connector comprises an aperture configured to receive a projection of the complementary connector. The aperture may allow for easy insertion of the complementary connector, while preventing the complementary connector from being removed from the receptacle connector inadvertently. Inadvertent removal of the complementary connector from the receptacle connector may result in an undesired break in electrical communication between the connectors.
Secure latching may promote reliable operation of the system by avoiding problems that might otherwise occur were the mated connectors free to move relative to each other over a range of motion allowed by conventional latching systems. Such problems could include intermittent disconnection of the mating contacts within the connectors, separation of the connectors sufficient to break connections between the mating contacts, changes in impedance of the signal paths, and fretting of mating contacts of the connectors and eventual failure of the interconnects that might result were the connectors able to move relative to each other while mated.
Further, the unlatching structures described herein occupy little space, and the structures are compact, making it easier to realize product functions.
Representative embodiments are explained further below with reference to the accompanying drawings.
Shell 102 may be formed of any suitable material. For example, shell 102 may be formed of metal to provide shielding for the receptacle connector 100. Shell 102 may at least partially cover the housing 104. Shell further comprises posts 106 extending from the shell 102. Posts 106 may extend into openings in printed circuit board 150, to which receptacle connector 100 is mounted to position receptacle connector 100 with respect to pads on the surface of printed circuit board 150 before soldering and to increase ruggedness of the assembly after soldering. Posts 106 may be soldered into the holes in the printed circuit board 150 or may be shaped to provide retention force upon insertion into the holes using an interference fit or a press-fit.
Shell 102 comprises a top face 132, a rear face 126, and opposing side faces 130. Rear face 126 may be substantially parallel to a front face 128 of the receptacle connector 100, and substantially perpendicular to top face 132 and side faces 130. Opposing side faces 130 may be disposed opposite and substantially parallel to each other, and substantially perpendicular to top face 132, rear face 126, and front face 128. Shell 102 may be formed by stamping and bending operations on a sheet of metal. Accordingly, a first bent portion 152 may be disposed between top face 132 and rear face 126, coupling top face 132 to rear face 126. Second bent portions 154 may be formed between top face 132 and side faces 130, coupling top face 132 to side faces 130, respectively.
Shell 102 may have a relatively low height. For example, in some embodiments, the shell 102 has a height less than 5 mm. In some embodiments, the shell 102 has a height less than 4 mm.
In some embodiments, side faces 130 of shell 102 are provided with features that facilitate latching with a complementary connector, such as plug connector 200. As shown in
In the embodiment illustrated in
As described herein, the plurality of holes 120 are configured to provide for ventilation of high temperature air generated when terminal contacts 112, 114 are soldered to a printed circuit board 150. The plurality of holes 120 may be shaped and/or positioned so as to enable heat to flow away from the receptacle connector 100, thus allowing heat to dissipate as opposed to causing damage to the receptacle connector 100. The inventors have appreciated that placement of the plurality of holes 120 in the first bent portion 152 of the shell 102 according to embodiments of the technology described herein provides for improved ventilation of heat through the plurality of holes 120 that might otherwise be trapped within the shell 102 and deform or damage the receptacle connector 100 during a surface mount soldering operation.
The inventors have further appreciated that the configuration of the plurality of holes 120 as described herein enables easier and cheaper manufacture of the receptacle connector 100. For example, assembly the shell 102 requires folding a sheet of metal to form a top face 132, a rear face 126, and a first bent portion 152 therebetween. One or more of the plurality of holes 120 may be punched through the sheet of metal where it is to be bent into the first bent portion 152 of the shell 102 as part of the bending operation. Therefore, the sheet of metal comprising the shell 102 may be more easily bent and additional machining is not required form the plurality of holes 120.
As shown in
In the illustrated embodiment, a first row 168A of contacts is illustrated as exposed by the cutout 170. In particular, mounting portions 114B of the plurality of signal contacts 114 are illustrated as exposed by the cutout 170. Cutout 170 facilitates inspection and/or rework of solder joints between the connector 100 and a printed circuit board 150 in the event that the plurality of contacts 112, 114 are not soldered accurately.
The receptacle connector 100 may have a cover 124 to cover the mating interface 108, as shown in
As shown in
As shown in
In some embodiments, openings 122 in shell 102 are disposed between the first bent portion 152 and second bent portions 154. Openings 122 may be formed when folding portions 158 of the rear face 126 are folded onto side faces 130. Therefore, no additional machining is required to form openings 122. Openings 122, like holes 120, may allow air to flow away from receptacle connector 100. Therefore, openings 122 may serve as an additional ventilation mechanism for receptacle connector 100. However, it is not a requirement that openings 122 be configured to allow air to flow through.
As an example of engagement features, shell 102 may comprise a tab 134 formed in portion 135, which in this example has been cut from the upper surface of the shell 102 and bent perpendicular to it. Housing 104 may have a slot 136 next to projection 118. To secure shell 102 to housing 104, shell 102 may be pressed downwards such that portion 135 fits between projection 118 and the rest of housing 104. Tab 134 may be pressed into portion 135 until it is aligned with slot 136 such that tab 134 extends into slot 136. Motion of shell 102 away from housing 104 will thereafter be blocked because tab 134 will abut an end of the slot 136.
As shown in
The one or more standoffs 160 may be manufactured having dimensions that result in a gap 148 to enable suitable airflow for surface mount soldering while providing a compact electronic assembly. In some embodiments, the one or more standoffs 160 extend from the bottom face 166 of the housing 104 between 0.2 mm and 0.4 mm so as to create a gap 148 having a height between 0.2 mm and 0.4 mm. The inventors have appreciated that manufacturing the receptacle connector 100 such that the one or more standoffs 160 extend from the bottom face 166 of the housing 104 between 0.2 mm and 0.4 mm facilitates a receptacle connector 100 having a low profile while still enabling the creation of a gap 148 large enough to allow air to flow through, as described herein.
In some embodiments, left and right sides of housing 104 are provided with features that facilitate latching to a complementary connector, such as plug connector 200. As shown in
The engagement blocks 138 are provided with a projection 118 at an end close to the mating interface 108. Projections 118 are configured to engage with a recess 218 of a complementary connector, such as plug connector 200. In this way, projections 118 allow for easier guiding of the complementary connector in a proper alignment when mating with the receptacle connector 100, and are an example of a guide portion.
First and second terminal modules 110A-B comprise a plurality of contacts. In the illustrated embodiment, the contacts are arrayed in two rows, with upper row contacts 114 and lower row contacts 112. Upper row contacts 114 comprise a mating portion 114A to mate with contacts of a complementary connector, such as pads on an upper surface of a paddle card of a plug connector 200, and a mounting portion 114B to be mounted to printed circuit board. Likewise, lower row contacts 112 comprise a mating portion 112A to mate with contacts of a complementary connector, such as pads on a lower surface of a paddle card of a plug connector 200, and a mounting portion 112B, to be mounted to a printed circuit board.
In the illustrated embodiment, the contacts in each of the upper row and the lower row are of the same size and shape, each contact may be used as a signal or a ground contact. In other embodiments, the contacts may have different shapes or may be spaced differently with respect to adjacent contact. For example, ground contacts may be wider than signal contact so the edge to edge spacing between a pair of signal contacts may be less than the spacing between each of those signal contacts and another adjacent contact.
As shown in
In an electronic system, printed circuit board 150, may have electronic components in addition to the receptacle connector 100 mounted to it. In some embodiments, receptacle connector 100 may be mounted in a central portion of the printed circuit board 150.
As described herein, posts 106 may facilitate alignment and/or mounting of receptacle connector 100 to printed circuit board 150. Posts 106 may be soldered to printed circuit board 150 to ensure a secure connection of receptacle connector 100 to the printed circuit board 150. In embodiments in which a latch of a plug connector engages with apertures in shell 102, securing posts 106 to printed circuit board 150, may enhance the reliability of the connection between the plug and the receptacle. In some embodiments, posts 106 may be received in holes formed in the printed circuit board 150. In some embodiments, posts 106 may extend completely through the holes in the printed circuit board 150. In other embodiments, posts 106 may only extend partially through the holes in the printed circuit board 150. Those holes may be connected to ground structures within the printed circuit board such that, attaching the posts 106 inside the holes, the shell 102 is grounded, enabling it to serve as an electromagnetic shield.
Mounting portions 112B, 114B of the plurality of lower row contacts 112 and the plurality of upper row contacts 114 may be soldered to the printed circuit board 150. High temperature air may be flowed over mounting portions 112B, 114B to solder them to the printed circuit board 150, A gap 148 may be provided to selectively direct that high temperature air to the mounting portions 112B, 114B, which may, for example, be placed in solder paste that is heated to fuse the mounting portions to pads on a surface a printed circuit board 150.
In some embodiments, when receptacle connector 100 is mounted to the printed circuit board 150, connector 100 is spaced from the printed circuit board 150 to leave a gap 148 between the receptacle connector 100 and the printed circuit board 150. In some embodiments, the gap 148 may be formed such that the only contact between the printed circuit board 150 and the receptacle connector 100 occurs at the posts 106, the mounting portions 112B, 114B, and the one or more standoffs 160. In other words, the housing 104 and the shell 102 may only contact the printed circuit board 150 at discrete locations where the posts 106 and the one or more standoffs 160 are formed.
As shown in
In some embodiments, the gap 148 extends from the front face 128 of the receptacle connector 100 to the rear face 126. In some embodiments, the gap 148 extends between the side faces 130 of the receptacle connector 100, and is bounded, on an upper side by a substantially solid bottom face 166.
Nonetheless, heat from that soldering operation may build up inside shell 102 and may deform or otherwise damage the housing 104 and/or any of the components of the terminal subassembly inside the housing. Deformation of any of the components that position the terminals may interfere with proper mating of the receptacle connector to a plug, and may impact performance of the electronic system using such a connector, such as by providing a mating force that is lower than the designed value. The risk of deformation is particularly high for a miniaturized connector as described herein. The plurality of holes 120 enable high temperature air to flow out through the holes 120 to prevent damage to the receptacle connector 100.
Positioning the holes as illustrated may desirably release heat, may be formed as part of other operations that would otherwise be performed to shape shell 102 and may provide a relatively low impact on the effectiveness of shell 102 as an electromagnetic shield.
The airflow passage formed by gap 148 may be used in instead of or in addition to the plurality of holes 120. However, in the illustrated embodiment, the airflow passage formed by gap 148 is used in conjunction with the plurality of holes 120.
As described herein, the receptacle connector 100 according to some embodiments may also facilitate inspection and/or rework of solder joints between the receptacle connector 100 and the printed circuit board 150 in the event that the plurality of contacts 112, 114 are not soldered accurately. Gap 148, alone or in combination with cutout 170 in one or more faces of the shell as described herein, enables better access to the terminal contacts for reworking of the terminal contacts. Thus, designs as described herein may enable an electronic assembly of higher quality.
Plug body 202 may be formed of an insulative material, such as plastic, which may be molded to provide the shape illustrated. Plug body 202 may be shaped to hold paddle cards 210A-B so as to form a mating interface.
As illustrated in
As illustrated in
The pair of engagement arms 238 are configured for engagement with receptacle connector 100. When the plug connector 200 is mated with the receptacle connector 100 by moving the plug connector 200 towards the receptacle connector 100 in the mating direction 240, the pair of engagement arms 238 may be configured to abut the engagement blocks 138. The pair of engagement arms 238 may comprise recesses 218 for receiving projections 118 of the receptacle connector 100 when the plug connector 200 is mated with receptacle connector 100.
Plug body 202 may comprise a pair of side tabs 248 disposed on sides of the plug body 202. An activation mechanism, such as belt 246, may be configured to pass through the side tab 248. The side tabs 248 may be formed as a portion of the plug body 202. In some embodiments, the side tabs 248 may be separately formed and then attached to the plug body 202, but in the illustrated embodiments, the side tabs 248 are integrally formed with the rest of the plug body 202.
Engagement arms 238 may comprising mounting points 254 and limiting points 256.
Mounting points 256 may be configured to engage with fixed portions 244 of deformable members 204 so as to fix the fixed portions 244 to engagement arms 238. Deformable portions 242 may abut the limiting points 256 when deformable portions 242 reach a point of maximum inward deflection.
As described herein, a belt 246 may be coupled to ends of deformable members 204 to control the inward deflection of deformable portions 242. Prior to the point of attachment to the deformable members 204, ends of the pull tab 403 may pass through a side tab 248 of the plug body 202. As shown in
When a pulling force is exerted on the belt 246 in a direction opposite a mating direction 240, belt 246 may slide through the side tab 248, drawing the distal end of deformable portion 242 downwards towards the base of side tab 248 close to the plug body 202. In this way, tension force applied to belt 246 is redirected, at least partially, into an inwards lateral direction perpendicular to the mating direction 240.
With a portion of the tension force being directed laterally inwards towards the fixed portions 244, the deformable portions 242 of the deformable members 204 deflect inwards towards the fixed portions 244 until the deformable portions 242 reach maximum inward deflection points at the limiting points 256. The inward deflection of the deformable portions 242 can thus be controlled by exerting a pulling force on the belt 246 in a direction opposite the mating direction 240.
Deformable portions 242 of deformable members 204 may comprise a latching member that engages when plug connector 200 is inserted into receptacle connector 100 and releases when deformable portions 242 deflect inwardly. Here, the latching member is illustrated as a projection 216, as shown in
When the connector assembly 250 is in the unmated state, plug connector 200 may be aligned with the mating interface 108 of the receptacle connector 100. Plug connector 200 and receptacle connector 100 may be brought together by moving plug connector 200 towards receptacle connector 100 in the mating direction 240 such that engagement arms 238 abut engagement blocks 138 and projections 118 are received in the recesses 218 of engagement arms 238.
When plug connector 200 is moved in the mating direction 240 towards receptacle connector 100, deformable members 204 are received inside the shell 102. Side faces 130 are configured to slide over projections 216 of deformable members 204 by virtue of the inclined surface of projection 216. In doing so, deformable portions 242 of deformable members 204 are caused to deflect inwards towards the fixed portions 244 of deformable members 204 by the force exerted by side faces 130 on projections 216. When plug connector 200 has been moved sufficiently far in the mating direction 240 such that projections 216 reach apertures 116 of receptacle connector 100, the deformable portions 242 of deformable members 204 are caused to deflect outwards by a spring force generated by the cantilevered configuration of deformable members 204. The outward deflection of the deformable portions 242 of deformable members 204 cause projections 216 to be received in apertures 116 of the receptacle connector 100.
When it is necessary to perform unmating, deformable portions 242 of deformable members may be caused to deflect inwardly towards fixed portions 242, such as by pulling belt 246 in a direction opposite from the mating direction 240, so that projections 216 are removed from the apertures 116. With the projections 216 removed from apertures 116, motion of the plug connector 200 in a direction opposite the mating direction 240 is no longer restrained, plug connector 200 can be removed from the mating interface 108 of receptacle connector 100, and the projections 118 can be removed from the recesses 218 of engagement arms 238. As described herein, any suitable mechanism may be employed to cause deformable portions 242 to deflect inwardly, such as the flexible pull belt 246 described herein, for example. With the embodiments of the technology described herein, both mating and unmating of the connectors 100, 200 require motion parallel to the surface of the printed circuit board 150, to which receptacle connector 100 is mounted.
Connectors 100, 200 according to embodiments of the technology described herein may have a relatively short height such as less than 5 mm, approximately 4.5 mm, approximately 4 mm, and such as between 4 and 5 mm, in some embodiments. In some embodiments, the connectors 100, 200 may be even shorter. For example, first and second slots 212A-B of plug connector 200 may be lined with mating contacts only on one side, enabling a shorter connector, such as on the order of 3.5 mm, producing a connectors having a height between 3 and 4 mm, in some embodiments.
Processor 86, as well as other electronic components 83, are mounted to a printed circuit board 82. Signals may be routed to and from processor 86 through traces in printed circuit board 82, as in conventional electronic systems. Some of those signals may pass in and out of electronic device 80 with I/O connector 81. Here I/O connector 81 is shown mounted in an opening of an enclosure of electronic device 80.
For some electronic devices that process high-speed signals, the amount of signal loss that occurs in a path through printed circuit board 82 from I/O connector 81 to processor 86 may be unacceptably large. Such losses might occur, for example, in an electronic system processing 56 GHz or 112 GHz signals when the path through the printed circuit board 82 is approximately 6 inches or longer.
A low loss path may be provided through cables 85. In the electronic device illustrated in
Such a configuration uses less space on printed circuit board 82 than if a connector were mounted to printed circuit board 82 outside the perimeter of heatsink 87. Such a configuration enables more electronic components 83 to be mounted to printed circuit board 82, increasing the functionality of electronic device 80. Alternatively, printed circuit board 82 may be made smaller, reducing its cost. Moreover, the integrity with which signals pass from connector assembly 84 to processor 86 may be increased relative to an electronic device in which a conventional connector is used to terminate cable 85, because the length of the signal path through printed circuit board 82 is less.
Connectors as described herein may also be used in a method of manufacturing an electronic assembly. The method may comprise the steps of: positioning a receptacle connector 100 according to any of the embodiments described herein on a printed circuit board 150; flowing heated air over mounting portions 112B, 114B of the plurality of contacts 112, 114 so as to wet the mounting portions 112B, 114B and conductive pads on the printed circuit board 150 with solder; and releasing heat from inside the shell 102 through at least one hole 120 disposed in the first bent portion 152. In some embodiments, releasing heat comprises air flow through the at least one hole 120. In some embodiments, flowing heated air over the mounting portions 112B, 114B comprises flowing the heated air through a gap 148 between the receptacle connector 100 and the printed circuit board 150.
Although the present invention has been shown and presented specifically with reference to preferred embodiments, those skilled in the art will understand that various changes in form and detail made to the present invention within the spirit and scope of the present invention as defined in the attached claims are included in the scope of protection of the present invention.
Techniques described herein may enable an electrical connector to have improved the integrity of signals over a range of high frequencies, such as frequencies up to about 56 or 120 GHz or higher, while maintaining a small connector size. That is, the mating contacts of the connector may be maintained at a high density, such as an edge to edge spacing between adjacent conductive elements of approximately 0.25 mm or less, with a center-to-center spacing between adjacent contacts in a row of between 0.5 mm and 0.8 mm. The contacts may have a width of between 0.3 mm and 0.4 mm for some types of contacts, and may have a width of between 0.65 mm and 0.75 mm for other types of contacts.
It should be understood that various alterations, modifications, and improvements may be made to the structures, configurations, and methods discussed above, and are intended to be within the spirit and scope of the invention disclosed herein.
Further, although advantages of the present invention are indicated, it should be appreciated that not every embodiment of the invention will include every described advantage. Some embodiments may not implement any features described as advantageous herein. Accordingly, the foregoing description and attached drawings are by way of example only.
It should be understood that some aspects of the present technology may be embodied as one or more methods, and acts performed as part of a method of the present technology may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than shown and/or described, which may include performing some acts simultaneously, even though shown and/or described as sequential acts in various embodiments.
Various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.
Further, terms denoting direction have been used, such as “left”, “right”, “forward” or “up”. These terms are relative to the illustrated embodiments, as depicted in the drawings, for ease of understanding. It should be understood that the components as described herein may be used in any suitable orientation.
Use of ordinal terms such as “first,” “second,” “third,” etc., in the description and the claims to modify an element does not by itself connote any priority, precedence, or order of one element over another, or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one element or act having a certain name from another element or act having a same name (but for use of the ordinal term) to distinguish the elements or acts.
All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.
The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”
As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.
As used herein in the specification and in the claims, the phrase “equal” or “the same” in reference to two values (e.g., distances, widths, etc.) means that two values are the same within manufacturing tolerances. Thus, two values being equal, or the same, may mean that the two values are different from one another by ±5%.
The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.
As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.
Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. Use of terms such as “including,” “comprising,” “comprised of,” “having,” “containing,” and “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.
The terms “approximately” and “about” if used herein may be construed to mean within ±20% of a target value in some embodiments, within ±10% of a target value in some embodiments, within ±5% of a target value in some embodiments, and within ±2% of a target value in some embodiments. The terms “approximately” and “about” may equal the target value.
The term “substantially” if used herein may be construed to mean within 95% of a target value in some embodiments, within 98% of a target value in some embodiments, within 99% of a target value in some embodiments, and within 99.5% of a target value in some embodiments. In some embodiments, the term “substantially” may equal 100% of the target value.
Number | Date | Country | Kind |
---|---|---|---|
108204949 | Apr 2019 | TW | national |
The present application is a continuation of U.S. application Ser. No. 16/695,062, filed on Nov. 25, 2019, entitled “SMT RECEPTACLE CONNECTOR WITH SIDE LATCHING”, which claims priority to and the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 62/864,470, filed on Jun. 20, 2019, and titled “HIGH RELIABILITY SMT RECEPTACLE CONNECTOR.” U.S. application Ser. No. 16/695,062 also claims priority to and the benefit of Taiwanese Patent Application No. 108204949, filed on Apr. 22, 2019. The foregoing applications are hereby incorporated by reference in their entirety.
Number | Name | Date | Kind |
---|---|---|---|
2996710 | Pratt | Aug 1961 | A |
3002162 | Garstang | Sep 1961 | A |
3134950 | Cook | May 1964 | A |
3322885 | May et al. | May 1967 | A |
3530422 | Goodman | Sep 1970 | A |
3631381 | Pittman | Dec 1971 | A |
3786372 | Epis et al. | Jan 1974 | A |
3825874 | Peverill | Jul 1974 | A |
3863181 | Glance et al. | Jan 1975 | A |
3977757 | Yurtin | Aug 1976 | A |
4155613 | Brandeau | May 1979 | A |
4195272 | Boutros | Mar 1980 | A |
4276523 | Boutros et al. | Jun 1981 | A |
4286837 | Yasutake et al. | Sep 1981 | A |
4371742 | Manly | Feb 1983 | A |
4408255 | Adkins | Oct 1983 | A |
4447105 | Ruehl | May 1984 | A |
4471015 | Ebneth et al. | Sep 1984 | A |
4484159 | Whitley | Nov 1984 | A |
4490283 | Kleiner | Dec 1984 | A |
4518651 | Wolfe, Jr. | May 1985 | A |
4519664 | Tillotson | May 1985 | A |
4519665 | Althouse et al. | May 1985 | A |
4632476 | Schell | Dec 1986 | A |
4636752 | Saito | Jan 1987 | A |
4682129 | Bakermans et al. | Jul 1987 | A |
4687267 | Header et al. | Aug 1987 | A |
4728762 | Roth et al. | Mar 1988 | A |
4751479 | Parr | Jun 1988 | A |
4761147 | Gauthier | Aug 1988 | A |
4787548 | Abbagnaro et al. | Nov 1988 | A |
4806107 | Arnold et al. | Feb 1989 | A |
4846724 | Sasaki et al. | Jul 1989 | A |
4846727 | Glover et al. | Jul 1989 | A |
4871316 | Herrell et al. | Oct 1989 | A |
4878155 | Conley | Oct 1989 | A |
4948922 | Varadan et al. | Aug 1990 | A |
4970354 | Iwasa et al. | Nov 1990 | A |
4975084 | Fedder et al. | Dec 1990 | A |
4992060 | Meyer | Feb 1991 | A |
5000700 | Masubuchi et al. | Mar 1991 | A |
5041023 | Lytle | Aug 1991 | A |
5066236 | Broeksteeg | Nov 1991 | A |
5141454 | Garrett et al. | Aug 1992 | A |
5150086 | Ito | Sep 1992 | A |
5166527 | Solymar | Nov 1992 | A |
5168252 | Naito | Dec 1992 | A |
5168432 | Murphy et al. | Dec 1992 | A |
5171161 | Kachlic | Dec 1992 | A |
5176538 | Hansell, III et al. | Jan 1993 | A |
5266055 | Naito et al. | Nov 1993 | A |
5280257 | Cravens et al. | Jan 1994 | A |
5287076 | Johnescu et al. | Feb 1994 | A |
5334050 | Andrews | Aug 1994 | A |
5340334 | Nguyen | Aug 1994 | A |
5346410 | Moore, Jr. | Sep 1994 | A |
5429520 | Morlion et al. | Jul 1995 | A |
5429521 | Morlion et al. | Jul 1995 | A |
5433617 | Morlion et al. | Jul 1995 | A |
5433618 | Morlion et al. | Jul 1995 | A |
5456619 | Belopolsky et al. | Oct 1995 | A |
5461392 | Mott et al. | Oct 1995 | A |
5474472 | Niwa et al. | Dec 1995 | A |
5484310 | McNamara et al. | Jan 1996 | A |
5496183 | Soes et al. | Mar 1996 | A |
5499935 | Powell | Mar 1996 | A |
5551893 | Johnson | Sep 1996 | A |
5562497 | Yagi et al. | Oct 1996 | A |
5597328 | Mouissie | Jan 1997 | A |
5651702 | Hanning et al. | Jul 1997 | A |
5669789 | Law | Sep 1997 | A |
5796323 | Uchikoba et al. | Aug 1998 | A |
5810623 | Regnier et al. | Sep 1998 | A |
5831491 | Buer et al. | Nov 1998 | A |
5885088 | Brennan et al. | Mar 1999 | A |
5924899 | Paagman | Jul 1999 | A |
5981869 | Kroger | Nov 1999 | A |
5982253 | Perrin et al. | Nov 1999 | A |
5993259 | Stokoe et al. | Nov 1999 | A |
6019616 | Yagi et al. | Feb 2000 | A |
6152747 | McNamara | Nov 2000 | A |
6168469 | Lu | Jan 2001 | B1 |
6174202 | Mitra | Jan 2001 | B1 |
6174203 | Asao | Jan 2001 | B1 |
6174944 | Chiba et al. | Jan 2001 | B1 |
6217372 | Reed | Apr 2001 | B1 |
6293827 | Stokoe | Sep 2001 | B1 |
6296491 | Pickles | Oct 2001 | B1 |
6296496 | Trammel | Oct 2001 | B1 |
6299438 | Sahagian et al. | Oct 2001 | B1 |
6299483 | Cohen et al. | Oct 2001 | B1 |
6315615 | Raistrick | Nov 2001 | B1 |
6322395 | Nishio et al. | Nov 2001 | B1 |
6328601 | Yip et al. | Dec 2001 | B1 |
6347962 | Kline | Feb 2002 | B1 |
6350134 | Fogg et al. | Feb 2002 | B1 |
6361363 | Hwang | Mar 2002 | B1 |
6364711 | Berg et al. | Apr 2002 | B1 |
6375510 | Asao | Apr 2002 | B2 |
6379188 | Cohen et al. | Apr 2002 | B1 |
6394842 | Sakurai et al. | May 2002 | B1 |
6398588 | Bickford | Jun 2002 | B1 |
6409543 | Astbury, Jr. et al. | Jun 2002 | B1 |
6447170 | Takahashi et al. | Sep 2002 | B1 |
6482017 | Van Doorn | Nov 2002 | B1 |
6503103 | Cohen et al. | Jan 2003 | B1 |
6506076 | Cohen et al. | Jan 2003 | B2 |
6517360 | Cohen | Feb 2003 | B1 |
6530790 | McNamara et al. | Mar 2003 | B1 |
6537087 | McNamara et al. | Mar 2003 | B2 |
6540559 | Kemmick et al. | Apr 2003 | B1 |
6551140 | Billman et al. | Apr 2003 | B2 |
6554647 | Cohen et al. | Apr 2003 | B1 |
6565387 | Cohen | May 2003 | B2 |
6565390 | Wu | May 2003 | B2 |
6579116 | Brennan et al. | Jun 2003 | B2 |
6582244 | Fogg et al. | Jun 2003 | B2 |
6592381 | Cohen et al. | Jul 2003 | B2 |
6595801 | Leonard et al. | Jul 2003 | B1 |
6595802 | Watanabe et al. | Jul 2003 | B1 |
6602095 | Astbury, Jr. et al. | Aug 2003 | B2 |
6607402 | Cohen et al. | Aug 2003 | B2 |
6609922 | Torii | Aug 2003 | B2 |
6616864 | Jiang et al. | Sep 2003 | B1 |
6652318 | Winings et al. | Nov 2003 | B1 |
6652319 | Billman | Nov 2003 | B1 |
6655966 | Rothermel et al. | Dec 2003 | B2 |
6709294 | Cohen et al. | Mar 2004 | B1 |
6713672 | Stickney | Mar 2004 | B1 |
6726492 | Yu | Apr 2004 | B1 |
6743057 | Davis et al. | Jun 2004 | B2 |
6749463 | Fan | Jun 2004 | B1 |
6776659 | Stokoe et al. | Aug 2004 | B1 |
6786771 | Gailus | Sep 2004 | B2 |
6808420 | Whiteman, Jr. et al. | Oct 2004 | B2 |
6814619 | Stokoe et al. | Nov 2004 | B1 |
6830489 | Aoyama | Dec 2004 | B2 |
6872085 | Cohen et al. | Mar 2005 | B1 |
6875031 | Korsunsky et al. | Apr 2005 | B1 |
6932649 | Rothermel et al. | Aug 2005 | B1 |
6979202 | Benham et al. | Dec 2005 | B2 |
6979226 | Otsu et al. | Dec 2005 | B2 |
6986681 | Tsai | Jan 2006 | B2 |
7008267 | Fan | Mar 2006 | B2 |
7044794 | Consoli et al. | May 2006 | B2 |
7057570 | Irion, II et al. | Jun 2006 | B2 |
7074086 | Cohen et al. | Jul 2006 | B2 |
7086872 | Myer et al. | Aug 2006 | B2 |
7094102 | Cohen et al. | Aug 2006 | B2 |
7104842 | Huang et al. | Sep 2006 | B1 |
7108556 | Cohen et al. | Sep 2006 | B2 |
7156672 | Fromm et al. | Jan 2007 | B2 |
7163421 | Cohen et al. | Jan 2007 | B1 |
7232344 | Gillespie et al. | Jun 2007 | B1 |
7285018 | Kenny et al. | Oct 2007 | B2 |
7316585 | Smith et al. | Jan 2008 | B2 |
7318740 | Henry et al. | Jan 2008 | B1 |
7320614 | Toda et al. | Jan 2008 | B2 |
7322845 | Regnier et al. | Jan 2008 | B2 |
7331822 | Chen n | Feb 2008 | B2 |
7335063 | Cohen et al. | Feb 2008 | B2 |
7364464 | Iino et al. | Apr 2008 | B2 |
7371117 | Gailus | May 2008 | B2 |
7407413 | Minich | Aug 2008 | B2 |
7467977 | Yi et al. | Dec 2008 | B1 |
7473124 | Briant et al. | Jan 2009 | B1 |
7494383 | Cohen et al. | Feb 2009 | B2 |
7540781 | Kenny et al. | Jun 2009 | B2 |
7581990 | Kirk et al. | Sep 2009 | B2 |
7588464 | Kim | Sep 2009 | B2 |
7604502 | Pan | Oct 2009 | B2 |
7645165 | Wu et al. | Jan 2010 | B2 |
7690946 | Knaub et al. | Apr 2010 | B2 |
7699644 | Szczesny et al. | Apr 2010 | B2 |
7722401 | Kirk et al. | May 2010 | B2 |
7727027 | Chiang et al. | Jun 2010 | B2 |
7727028 | Zhang et al. | Jun 2010 | B1 |
7731537 | Amleshi et al. | Jun 2010 | B2 |
7731541 | Lee et al. | Jun 2010 | B1 |
7753731 | Cohen et al. | Jul 2010 | B2 |
7771233 | Gailus | Aug 2010 | B2 |
7789676 | Morgan et al. | Sep 2010 | B2 |
7794240 | Cohen et al. | Sep 2010 | B2 |
7794278 | Cohen et al. | Sep 2010 | B2 |
7806729 | Nguyen et al. | Oct 2010 | B2 |
7824192 | Lin et al. | Nov 2010 | B2 |
7871296 | Fowler et al. | Jan 2011 | B2 |
7874873 | Do et al. | Jan 2011 | B2 |
7883369 | Sun et al. | Feb 2011 | B1 |
7887371 | Kenny et al. | Feb 2011 | B2 |
7887379 | Kirk | Feb 2011 | B2 |
7906730 | Atkinson et al. | Mar 2011 | B2 |
7914304 | Cartier et al. | Mar 2011 | B2 |
7946889 | Mizumura | May 2011 | B2 |
7985097 | Gulla | Jul 2011 | B2 |
7993147 | Cole et al. | Aug 2011 | B2 |
8018733 | Jia | Sep 2011 | B2 |
8083553 | Manter et al. | Dec 2011 | B2 |
8123544 | Kobayashi | Feb 2012 | B2 |
8142207 | Ljubijankic et al. | Mar 2012 | B1 |
8182289 | Stokoe et al. | May 2012 | B2 |
8215968 | Cartier et al. | Jul 2012 | B2 |
8216001 | Kirk | Jul 2012 | B2 |
8262411 | Kondo | Sep 2012 | B2 |
8272877 | Stokoe et al. | Sep 2012 | B2 |
8337247 | Zhu | Dec 2012 | B2 |
8348701 | Lan et al. | Jan 2013 | B1 |
8371875 | Gailus | Feb 2013 | B2 |
8382524 | Khilchenko et al. | Feb 2013 | B2 |
8440637 | Elmen | May 2013 | B2 |
8480432 | Wu | Jul 2013 | B2 |
8506319 | Ritter et al. | Aug 2013 | B2 |
8506331 | Wu | Aug 2013 | B2 |
8545253 | Amidon et al. | Oct 2013 | B2 |
8550861 | Cohen et al. | Oct 2013 | B2 |
8597051 | Yang et al. | Dec 2013 | B2 |
8657627 | McNamara et al. | Feb 2014 | B2 |
8715003 | Buck et al. | May 2014 | B2 |
8715005 | Pan | May 2014 | B2 |
8740637 | Wang et al. | Jun 2014 | B2 |
8764492 | Chiang | Jul 2014 | B2 |
8771016 | Atkinson et al. | Jul 2014 | B2 |
8864506 | Little et al. | Oct 2014 | B2 |
8864521 | Atkinson et al. | Oct 2014 | B2 |
8905777 | Zhu et al. | Dec 2014 | B2 |
8926377 | Kirk et al. | Jan 2015 | B2 |
8944831 | Stoner et al. | Feb 2015 | B2 |
8968034 | Hsu | Mar 2015 | B2 |
8998642 | Manter et al. | Apr 2015 | B2 |
9004942 | Paniagua | Apr 2015 | B2 |
9011177 | Lloyd et al. | Apr 2015 | B2 |
9022806 | Cartier, Jr. et al. | May 2015 | B2 |
9028281 | Kirk et al. | May 2015 | B2 |
9065230 | Milbrand, Jr. | Jun 2015 | B2 |
9124009 | Atkinson et al. | Sep 2015 | B2 |
9166317 | Briant et al. | Oct 2015 | B2 |
9219335 | Atkinson et al. | Dec 2015 | B2 |
9225085 | Cartier, Jr. et al. | Dec 2015 | B2 |
9246253 | Defibaugh | Jan 2016 | B1 |
9257778 | Buck et al. | Feb 2016 | B2 |
9257794 | Wanha et al. | Feb 2016 | B2 |
9263835 | Guo | Feb 2016 | B2 |
9281590 | Liu et al. | Mar 2016 | B1 |
9287668 | Chen et al. | Mar 2016 | B2 |
9300074 | Gailus | Mar 2016 | B2 |
9337585 | Yang | May 2016 | B1 |
9350095 | Arichika et al. | May 2016 | B2 |
9431734 | Guo | Aug 2016 | B2 |
9450344 | Cartier, Jr. et al. | Sep 2016 | B2 |
9484674 | Cartier, Jr. et al. | Nov 2016 | B2 |
9509101 | Cartier, Jr. et al. | Nov 2016 | B2 |
9520686 | Hu et al. | Dec 2016 | B2 |
9520689 | Cartier, Jr. et al. | Dec 2016 | B2 |
9531130 | Phillips et al. | Dec 2016 | B1 |
9537250 | Kao et al. | Jan 2017 | B2 |
9640915 | Phillips et al. | May 2017 | B2 |
9692183 | Phillips et al. | Jun 2017 | B2 |
9742132 | Hsueh | Aug 2017 | B1 |
9831605 | Buck et al. | Nov 2017 | B2 |
9843135 | Guetig et al. | Dec 2017 | B2 |
9887485 | Lambie et al. | Feb 2018 | B2 |
9935385 | Phillips et al. | Apr 2018 | B2 |
9972945 | Huang et al. | May 2018 | B1 |
9997853 | Little | Jun 2018 | B2 |
9997871 | Zhong et al. | Jun 2018 | B2 |
10050369 | Yang | Aug 2018 | B1 |
10122129 | Milbrand, Jr. et al. | Nov 2018 | B2 |
10135197 | Little et al. | Nov 2018 | B2 |
10211577 | Milbrand, Jr. et al. | Feb 2019 | B2 |
10243304 | Kirk et al. | Mar 2019 | B2 |
10270191 | Li et al. | Apr 2019 | B1 |
10276995 | Little | Apr 2019 | B2 |
10283910 | Chen et al. | May 2019 | B1 |
10320102 | Phillips et al. | Jun 2019 | B2 |
10320125 | Ju | Jun 2019 | B2 |
10348040 | Cartier, Jr. et al. | Jul 2019 | B2 |
10381767 | Milbrand, Jr. et al. | Aug 2019 | B1 |
10431936 | Horning et al. | Oct 2019 | B2 |
10439311 | Phillips et al. | Oct 2019 | B2 |
10511128 | Kirk et al. | Dec 2019 | B2 |
10541482 | Sasame et al. | Jan 2020 | B2 |
10573987 | Osaki et al. | Feb 2020 | B2 |
10601181 | Lu et al. | Mar 2020 | B2 |
10680387 | Cheng | Jun 2020 | B2 |
10714875 | Wan | Jul 2020 | B2 |
10741944 | Long | Aug 2020 | B2 |
10777921 | Lu et al. | Sep 2020 | B2 |
10797446 | Liu et al. | Oct 2020 | B2 |
10826214 | Phillips et al. | Nov 2020 | B2 |
10833437 | Huang et al. | Nov 2020 | B2 |
10840622 | Sasame et al. | Nov 2020 | B2 |
10855020 | Phillips et al. | Dec 2020 | B1 |
10950961 | Lai et al. | Mar 2021 | B2 |
10965064 | Hsu | Mar 2021 | B2 |
11146025 | Lu et al. | Oct 2021 | B2 |
11189971 | Lu | Nov 2021 | B2 |
11264755 | Te | Mar 2022 | B2 |
11381015 | Lu | Jul 2022 | B2 |
11444397 | Sasame et al. | Sep 2022 | B2 |
11588277 | Jiang | Feb 2023 | B2 |
20010012730 | Ramey et al. | Aug 2001 | A1 |
20010042632 | Manov et al. | Nov 2001 | A1 |
20010046810 | Cohen et al. | Nov 2001 | A1 |
20020042223 | Belopolsky et al. | Apr 2002 | A1 |
20020061671 | Torii | May 2002 | A1 |
20020089464 | Joshi | Jul 2002 | A1 |
20020098738 | Astbury et al. | Jul 2002 | A1 |
20020111068 | Cohen et al. | Aug 2002 | A1 |
20020111069 | Astbury et al. | Aug 2002 | A1 |
20020123266 | Ramey et al. | Sep 2002 | A1 |
20020132518 | Kobayashi | Sep 2002 | A1 |
20020146926 | Fogg et al. | Oct 2002 | A1 |
20030119360 | Jiang et al. | Jun 2003 | A1 |
20030220018 | Winings et al. | Nov 2003 | A1 |
20040005815 | Mizumura et al. | Jan 2004 | A1 |
20040020674 | McFadden et al. | Feb 2004 | A1 |
20040058572 | Fromm et al. | Mar 2004 | A1 |
20040115968 | Cohen | Jun 2004 | A1 |
20040121652 | Gailus | Jun 2004 | A1 |
20040171305 | McGowan et al. | Sep 2004 | A1 |
20040196112 | Welbon et al. | Oct 2004 | A1 |
20040235352 | Takemasa | Nov 2004 | A1 |
20040259419 | Payne et al. | Dec 2004 | A1 |
20050042928 | Yi et al. | Feb 2005 | A1 |
20050048818 | Pan | Mar 2005 | A1 |
20050048838 | Korsunsky et al. | Mar 2005 | A1 |
20050048842 | Benham et al. | Mar 2005 | A1 |
20050070160 | Cohen et al. | Mar 2005 | A1 |
20050133245 | Katsuyama et al. | Jun 2005 | A1 |
20050176835 | Kobayashi et al. | Aug 2005 | A1 |
20050233610 | Tutt et al. | Oct 2005 | A1 |
20050283974 | Richard et al. | Dec 2005 | A1 |
20050287869 | Kenny et al. | Dec 2005 | A1 |
20060019525 | Lloyd et al. | Jan 2006 | A1 |
20060068640 | Gailus | Mar 2006 | A1 |
20060166560 | Shuey et al. | Jul 2006 | A1 |
20060255876 | Kushta et al. | Nov 2006 | A1 |
20060276082 | Hung et al. | Dec 2006 | A1 |
20060292932 | Benham et al. | Dec 2006 | A1 |
20070004282 | Cohen et al. | Jan 2007 | A1 |
20070004828 | Khabbaz | Jan 2007 | A1 |
20070021000 | Laurx | Jan 2007 | A1 |
20070021001 | Laurx et al. | Jan 2007 | A1 |
20070021002 | Laurx et al. | Jan 2007 | A1 |
20070021003 | Laurx et al. | Jan 2007 | A1 |
20070021004 | Laurx et al. | Jan 2007 | A1 |
20070037419 | Sparrowhawk | Feb 2007 | A1 |
20070042639 | Manter et al. | Feb 2007 | A1 |
20070054554 | Do et al. | Mar 2007 | A1 |
20070059961 | Cartier et al. | Mar 2007 | A1 |
20070155241 | Lappohn | Jul 2007 | A1 |
20070173118 | Chen | Jul 2007 | A1 |
20070197063 | Ngo et al. | Aug 2007 | A1 |
20070218765 | Cohen et al. | Sep 2007 | A1 |
20070243764 | Liu et al. | Oct 2007 | A1 |
20070293084 | Ngo | Dec 2007 | A1 |
20080020640 | Zhang et al. | Jan 2008 | A1 |
20080194146 | Gailus | Aug 2008 | A1 |
20080246555 | Kirk et al. | Oct 2008 | A1 |
20080248658 | Cohen et al. | Oct 2008 | A1 |
20080248659 | Cohen et al. | Oct 2008 | A1 |
20080248660 | Kirk et al. | Oct 2008 | A1 |
20090011641 | Cohen et al. | Jan 2009 | A1 |
20090011645 | Laurx et al. | Jan 2009 | A1 |
20090035955 | McNamara | Feb 2009 | A1 |
20090061661 | Shuey et al. | Mar 2009 | A1 |
20090117386 | Vacanti et al. | May 2009 | A1 |
20090203259 | Nguyen et al. | Aug 2009 | A1 |
20090239395 | Cohen et al. | Sep 2009 | A1 |
20090258516 | Hiew et al. | Oct 2009 | A1 |
20090291593 | Atkinson et al. | Nov 2009 | A1 |
20090305530 | Ito et al. | Dec 2009 | A1 |
20090305533 | Feldman et al. | Dec 2009 | A1 |
20090305553 | Thomas et al. | Dec 2009 | A1 |
20100048058 | Morgan et al. | Feb 2010 | A1 |
20100068934 | Li et al. | Mar 2010 | A1 |
20100075538 | Ohshida | Mar 2010 | A1 |
20100081302 | Atkinson et al. | Apr 2010 | A1 |
20100112846 | Kotaka | May 2010 | A1 |
20100124851 | Xiong et al. | May 2010 | A1 |
20100144167 | Fedder et al. | Jun 2010 | A1 |
20100203772 | Mao et al. | Aug 2010 | A1 |
20100291806 | Minich et al. | Nov 2010 | A1 |
20100294530 | Atkinson et al. | Nov 2010 | A1 |
20110003509 | Gailus | Jan 2011 | A1 |
20110067237 | Cohen et al. | Mar 2011 | A1 |
20110104948 | Girard, Jr. et al. | May 2011 | A1 |
20110130038 | Cohen et al. | Jun 2011 | A1 |
20110136388 | Fu et al. | Jun 2011 | A1 |
20110143605 | Pepe | Jun 2011 | A1 |
20110212649 | Stokoe et al. | Sep 2011 | A1 |
20110212650 | Amleshi et al. | Sep 2011 | A1 |
20110230095 | Atkinson et al. | Sep 2011 | A1 |
20110230096 | Atkinson et al. | Sep 2011 | A1 |
20110256739 | Toshiyuki et al. | Oct 2011 | A1 |
20110287663 | Gailus et al. | Nov 2011 | A1 |
20120094536 | Khilchenko et al. | Apr 2012 | A1 |
20120156929 | Manter et al. | Jun 2012 | A1 |
20120184145 | Zeng | Jul 2012 | A1 |
20120184154 | Frank et al. | Jul 2012 | A1 |
20120202363 | McNamara et al. | Aug 2012 | A1 |
20120202386 | McNamara et al. | Aug 2012 | A1 |
20120202387 | McNamara | Aug 2012 | A1 |
20120214344 | Cohen et al. | Aug 2012 | A1 |
20130012038 | Kirk et al. | Jan 2013 | A1 |
20130017733 | Kirk et al. | Jan 2013 | A1 |
20130065454 | Milbrand, Jr. | Mar 2013 | A1 |
20130078870 | Milbrand, Jr. | Mar 2013 | A1 |
20130078871 | Milbrand, Jr. | Mar 2013 | A1 |
20130090001 | Kagotani | Apr 2013 | A1 |
20130109232 | Paniaqua | May 2013 | A1 |
20130143442 | Cohen et al. | Jun 2013 | A1 |
20130196553 | Gailus | Aug 2013 | A1 |
20130217263 | Pan | Aug 2013 | A1 |
20130225006 | Khilchenko et al. | Aug 2013 | A1 |
20130237100 | Affeltranger | Sep 2013 | A1 |
20130316590 | Hon | Nov 2013 | A1 |
20140004724 | Cartier, Jr. et al. | Jan 2014 | A1 |
20140004726 | Cartier, Jr. et al. | Jan 2014 | A1 |
20140004746 | Cartier, Jr. et al. | Jan 2014 | A1 |
20140024263 | Dong et al. | Jan 2014 | A1 |
20140057498 | Cohen | Feb 2014 | A1 |
20140113487 | Chen et al. | Apr 2014 | A1 |
20140273557 | Cartier, Jr. et al. | Sep 2014 | A1 |
20140273627 | Cartier, Jr. et al. | Sep 2014 | A1 |
20140370729 | Wang | Dec 2014 | A1 |
20140377992 | Chang et al. | Dec 2014 | A1 |
20150056856 | Atkinson et al. | Feb 2015 | A1 |
20150072546 | Li | Mar 2015 | A1 |
20150099408 | Myer et al. | Apr 2015 | A1 |
20150111401 | Guo | Apr 2015 | A1 |
20150111427 | Foxconn | Apr 2015 | A1 |
20150126068 | Fang | May 2015 | A1 |
20150140866 | Tsai et al. | May 2015 | A1 |
20150214673 | Gao et al. | Jul 2015 | A1 |
20150236451 | Cartier, Jr. et al. | Aug 2015 | A1 |
20150236452 | Cartier, Jr. et al. | Aug 2015 | A1 |
20150255904 | Ito | Sep 2015 | A1 |
20150255926 | Paniagua | Sep 2015 | A1 |
20150340798 | Kao et al. | Nov 2015 | A1 |
20160118736 | Hoyack et al. | Apr 2016 | A1 |
20160149343 | Atkinson et al. | May 2016 | A1 |
20160268744 | Little et al. | Sep 2016 | A1 |
20170077654 | Yao et al. | Mar 2017 | A1 |
20170302031 | Cheng et al. | Oct 2017 | A1 |
20170352970 | Liang et al. | Dec 2017 | A1 |
20180062323 | Kirk et al. | Mar 2018 | A1 |
20180076555 | Scholeno et al. | Mar 2018 | A1 |
20180145438 | Cohen | May 2018 | A1 |
20180198220 | Sasame et al. | Jul 2018 | A1 |
20180205177 | Zhou et al. | Jul 2018 | A1 |
20180212376 | Wang et al. | Jul 2018 | A1 |
20180212385 | Little | Jul 2018 | A1 |
20180219331 | Cartier, Jr. et al. | Aug 2018 | A1 |
20180241156 | Huang et al. | Aug 2018 | A1 |
20180269607 | Wu et al. | Sep 2018 | A1 |
20180331444 | Ono | Nov 2018 | A1 |
20190006778 | Fan et al. | Jan 2019 | A1 |
20190044284 | Dunham | Feb 2019 | A1 |
20190052019 | Huang et al. | Feb 2019 | A1 |
20190067854 | Ju et al. | Feb 2019 | A1 |
20190165518 | Hsu et al. | May 2019 | A1 |
20190173209 | Lu et al. | Jun 2019 | A1 |
20190173232 | Lu et al. | Jun 2019 | A1 |
20190214755 | Manickam | Jul 2019 | A1 |
20190334292 | Cartier, Jr. et al. | Oct 2019 | A1 |
20200021052 | Milbrand, Jr. et al. | Jan 2020 | A1 |
20200076131 | Hu et al. | Mar 2020 | A1 |
20200076135 | Tang et al. | Mar 2020 | A1 |
20200153134 | Sasame et al. | May 2020 | A1 |
20200161811 | Lu | May 2020 | A1 |
20200203865 | Wu et al. | Jun 2020 | A1 |
20200203867 | Lu | Jun 2020 | A1 |
20200203886 | Wu et al. | Jun 2020 | A1 |
20200235529 | Kirk et al. | Jul 2020 | A1 |
20200259294 | Lu | Aug 2020 | A1 |
20200266584 | Lu | Aug 2020 | A1 |
20200328541 | Lai et al. | Oct 2020 | A1 |
20200335914 | Hsu et al. | Oct 2020 | A1 |
20200358226 | Lu et al. | Nov 2020 | A1 |
20200395698 | Hou et al. | Dec 2020 | A1 |
20200403350 | Hsu | Dec 2020 | A1 |
20210036452 | Phillips et al. | Feb 2021 | A1 |
20210050683 | Sasame et al. | Feb 2021 | A1 |
20210135389 | Jiang | May 2021 | A1 |
20210135403 | Yang et al. | May 2021 | A1 |
20210135404 | Jiang | May 2021 | A1 |
20210203104 | Chen | Jul 2021 | A1 |
20210313726 | Huang et al. | Oct 2021 | A1 |
20210351529 | Yang et al. | Nov 2021 | A1 |
20210399449 | Guo et al. | Dec 2021 | A1 |
20220059954 | Yue | Feb 2022 | A1 |
20220069496 | Yi et al. | Mar 2022 | A1 |
20220077632 | Chen et al. | Mar 2022 | A1 |
20220336980 | Lu | Oct 2022 | A1 |
20220360016 | Lu et al. | Nov 2022 | A1 |
20230013147 | Lu | Jan 2023 | A1 |
Number | Date | Country |
---|---|---|
1175101 | Mar 1998 | CN |
1192068 | Sep 1998 | CN |
1275825 | Dec 2000 | CN |
2519434 | Oct 2002 | CN |
1179448 | Dec 2004 | CN |
1650479 | Aug 2005 | CN |
1799290 | Jul 2006 | CN |
2896615 | May 2007 | CN |
1996678 | Jul 2007 | CN |
2930006 | Aug 2007 | CN |
101019277 | Aug 2007 | CN |
101176389 | May 2008 | CN |
101208837 | Jun 2008 | CN |
101312275 | Nov 2008 | CN |
201323275 | Oct 2009 | CN |
101600293 | Dec 2009 | CN |
201374434 | Dec 2009 | CN |
101752700 | Jun 2010 | CN |
101790818 | Jul 2010 | CN |
101120490 | Nov 2010 | CN |
101926055 | Dec 2010 | CN |
201846527 | May 2011 | CN |
102106041 | Jun 2011 | CN |
201868621 | Jun 2011 | CN |
102195173 | Sep 2011 | CN |
102224640 | Oct 2011 | CN |
102232259 | Nov 2011 | CN |
102239605 | Nov 2011 | CN |
102292881 | Dec 2011 | CN |
101600293 | May 2012 | CN |
102456990 | May 2012 | CN |
102487166 | Jun 2012 | CN |
102593661 | Jul 2012 | CN |
102598430 | Jul 2012 | CN |
202395248 | Aug 2012 | CN |
102694318 | Sep 2012 | CN |
102738621 | Oct 2012 | CN |
102859805 | Jan 2013 | CN |
202695788 | Jan 2013 | CN |
202695861 | Jan 2013 | CN |
203445304 | Feb 2014 | CN |
103840285 | Jun 2014 | CN |
203690614 | Jul 2014 | CN |
204030057 | Dec 2014 | CN |
204167554 | Feb 2015 | CN |
104409906 | Mar 2015 | CN |
104577577 | Apr 2015 | CN |
104659573 | May 2015 | CN |
204349140 | May 2015 | CN |
204577746 | Aug 2015 | CN |
204696287 | Oct 2015 | CN |
105633660 | Jun 2016 | CN |
105703103 | Jun 2016 | CN |
106099546 | Nov 2016 | CN |
107069281 | Aug 2017 | CN |
304240766 | Aug 2017 | CN |
304245430 | Aug 2017 | CN |
206712072 | Dec 2017 | CN |
206712089 | Dec 2017 | CN |
107706632 | Feb 2018 | CN |
207677189 | Jul 2018 | CN |
208078300 | Nov 2018 | CN |
208209042 | Dec 2018 | CN |
208797273 | Apr 2019 | CN |
210326355 | Apr 2020 | CN |
112072400 | Dec 2020 | CN |
212412336 | Jan 2021 | CN |
107706675 | Apr 2021 | CN |
212874843 | Apr 2021 | CN |
113517619 | Oct 2021 | CN |
60216728 | Nov 2007 | DE |
0 560 551 | Sep 1993 | EP |
0 820 124 | Jan 1998 | EP |
1 018 784 | Jul 2000 | EP |
1 779 472 | May 2007 | EP |
2 169 770 | Mar 2010 | EP |
2 405 537 | Jan 2012 | EP |
1049435 | Nov 1966 | GB |
1272347 | Apr 1972 | GB |
H3-156761 | Jul 1991 | JP |
H07-302649 | Nov 1995 | JP |
2001-510627 | Jul 2001 | JP |
2002-151190 | May 2002 | JP |
2006-344524 | Dec 2006 | JP |
2010-129173 | Jun 2010 | JP |
9907324 | Aug 2000 | MX |
200835073 | Aug 2008 | TW |
M357771 | May 2009 | TW |
M474278 | Mar 2014 | TW |
M502979 | Jun 2015 | TW |
I535129 | May 2016 | TW |
M534922 | Jan 2017 | TW |
I596840 | Aug 2017 | TW |
M558481 | Apr 2018 | TW |
M558482 | Apr 2018 | TW |
M558483 | Apr 2018 | TW |
M559006 | Apr 2018 | TW |
M559007 | Apr 2018 | TW |
M560138 | May 2018 | TW |
M562507 | Jun 2018 | TW |
M565894 | Aug 2018 | TW |
M565895 | Aug 2018 | TW |
M565899 | Aug 2018 | TW |
M565900 | Aug 2018 | TW |
M565901 | Aug 2018 | TW |
M605564 | Dec 2020 | TW |
M613035 | Jun 2021 | TW |
WO 8805218 | Jul 1988 | WO |
WO 9835409 | Aug 1998 | WO |
WO 2004059794 | Jul 2004 | WO |
WO 2004059801 | Jul 2004 | WO |
WO 2006039277 | Apr 2006 | WO |
WO 2007005597 | Jan 2007 | WO |
WO 2007005599 | Jan 2007 | WO |
WO 2008124052 | Oct 2008 | WO |
WO 2008124054 | Oct 2008 | WO |
WO 2008124057 | Oct 2008 | WO |
WO 2008124101 | Oct 2008 | WO |
WO 2010030622 | Mar 2010 | WO |
WO 2010039188 | Apr 2010 | WO |
WO 2011100740 | Aug 2011 | WO |
WO 2017007429 | Jan 2017 | WO |
Entry |
---|
Chinese communication for Chinese Application No. 201580014851.4, dated Jun. 1, 2020. |
Chinese Office Action dated Jan. 18, 2021 in connection with Chinese Application No. 202010031395.7. |
Chinese Office Action for Application No. 20168005149LX dated Apr. 30, 2019. |
Chinese Office Action for Chinese Application No. 201580014851.4 dated Sep. 4, 2019. |
Chinese Office Action for Chinese Application No. 201780064531.9 dated Jan. 2, 2020. |
Chinese Office Action for Chinese Application No. 201780097919.9, dated Mar. 10, 2021. |
Chinese Office Action for Chinese Application No. 201780097919.9, dated Dec. 3, 2021. |
Extended European Search Report dated May 19, 2021 in connection with European Application No. 17930428.2. |
Extended European Search Report for European Application No. EP 11166820.8 dated Jan. 24, 2012. |
International Preliminary Report on Patentability Chapter II for International Application No. PCT/CN2017/108344 dated Mar. 6, 2020. |
International Preliminary Report on Patentability for International Application No. PCT/US2010/056482 dated May 24, 2012. |
International Preliminary Report on Patentability for International Application No. PCT/US2011/026139 dated Sep. 7, 2012. |
International Preliminary Report on Patentability for International Application No. PCT/US2012/023689 dated Aug. 15, 2013. |
International Preliminary Report on Patentability for International Application No. PCT/SG2016/050317 dated Jan. 18, 2018. |
International Search Report and Written Opinion for International Application No. PCT/US2010/056482 dated Mar. 14, 2011. |
International Search Report and Written Opinion for International Application No. PCT/US2011/026139 dated Nov. 22, 2011. |
International Search Report and Written Opinion for International Application No. PCT/US2012/023689 dated Sep. 12, 2012. |
International Search Report and Written Opinion for International Application No. PCT/US2012/060610 dated Mar. 29, 2013. |
International Search Report and Written Opinion for International Application No. PCT/US2015/012463 dated May 13, 2015. |
International Search Report and Written Opinion for International Application No. PCT/US2017/047905 dated Dec. 4, 2017. |
International Search Report and Written Opinion for International Application No. PCT/CN2017/108344 dated Aug. 1, 2018. |
International Search Report and Written Opinion for International Application No. PCT/US2005/034605 dated Jan. 26, 2006. |
International Search Report and Written Opinion for International Application No. PCT/US2011/034747 dated Jul. 28, 2011. |
International Search Report and Written Opinion for International Application No. PCT/SG2016/050317 dated Oct. 18, 2016. |
International Search Report and Written Opinion dated Jul. 18, 2019 for International Application No. PCT/CN2018/118798. |
International Search Report and Written Opinion dated Nov. 29, 2021 for International Application No. PCT/CN2021/114671. |
International Search Report with Written Opinion for International Application No. PCT/US2006/025562 dated Oct. 31, 2007. |
[No Author Listed], Carbon Nanotubes for Electromagnetic Interference Shielding. SBIR/STTR. Award Information. Program Year 2001. Fiscal Year 2001. Materials Research Institute, LLC. Chu et al. Available at http://sbir.gov/sbirsearch/detail/225895. Last accessed Sep. 19, 2013. |
[No Author Listed], High Speed Backplane Connectors. Tyco Electronics. Product Catalog No. 1773095. Revised Dec. 1, 2008—40 pages. |
[No Author Listed], MCIO 124pos 85ohm. Amphenol Assembletech. 1 page. URL:http://www.amphenol-ast.com/v3/en/overview.aspx?classId=234 [retrieved on Apr. 11, 2022]. |
[No Author Listed], Military Fibre Channel High Speed Cable Assembly, www.gore.com.2008. [last accessed Aug. 2, 2012 via Internet Archive: Wayback Machine http://web.archive.org] Link archived: http://www.gore.com/en.sub.--xx/products/cables/copper/networking/militar-y/military.sub.--fibre . . . Last archive date Apr. 6, 2008. |
[No Author Listed], Mini Cool Edge IO—The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System. Jul. 25, 2018. 2 pages. URL:https://www.amphenol-icc.com/connect/mini-cool-edge-io-the-ideal-solution-to-transmit-next-generation-high-speedsignal.html [retrieved on Apr. 11, 2022]. |
[No Author Listed], Mini Cool Edge IO Connector. Commercial IO. Amphenol ICC. 5 pages. URL:https://cdn.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/inputoutput/io_mini_cool_edge_io.pdf [retrieved on Apr. 11, 2022]. |
[No Author Listed], SFF-TA-1016 Specification for Internal Unshielded High Speed Connector System. Rev 0.0.1. SNIA SFF TWG Technology Affiliate. Nov. 15, 2019. 40 pages. |
Beaman, High Performance Mainframe Computer Cables. 1997 Electronic Components and Technology Conference. 1997;911-7. |
Reich et al., Microwave Theory and Techniques. Boston Technical Publishers, Inc. 1965;182-91. |
Shi et al. Improving Signal Integrity in Circuit Boards by Incorporating Absorbing Materials. 2001 Proceedings. 51st Electronic Components and Technology Conference, Orlando FL. 2001:1451-56. |
European Communication Pursuant to Article 94(3) EPC dated Sep. 8, 2022 for European Application No. 17930428.2. |
Taiwanese Office Action dated Jun. 16, 2022 for Taiwan Application No. 107138468. |
Lu, Electrical Connector With a Housing Surrounded by a Shell With Surface Protrusions, U.S. Appl. No. 18/193,552, filed Mar. 30, 2023. |
Lu, Electrical Connector With Segments Having Different Widths, U.S. Appl. No. 18/193,555, filed Mar. 30, 2023. |
Lu, Multi-Width Electrical Connector With Recessed Neck Segment, U.S. Appl. No. 18/193,561, filed Mar. 30, 2023. |
Sasame et al., Electrical connector with cavity between terminals, U.S. Appl. No. 17/942,435, filed Sep. 12, 2022. |
Number | Date | Country | |
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20210218195 A1 | Jul 2021 | US |
Number | Date | Country | |
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62864470 | Jun 2019 | US |
Number | Date | Country | |
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Parent | 16695062 | Nov 2019 | US |
Child | 17216463 | US |