DESCRIPTION OF RELATED ART
Conventional fiber optic modules require highly precise alignment between the light source (e.g., a laser or LED on the transmitter side or a fiber on the receiver side), the lens, and the target (e.g., a fiber on the transmitter side or a photodiode on the receiver side). In general, this alignment is achieved “actively,” meaning that the optical link is powered and the coupling between the light source and the target is monitored while moving some portion of the system. At the location of maximum coupled power, the solution is mechanically locked in place. This process is slow and costly, requiring not only a set of precision mechanical movers but also opto-electronic test equipment to power and monitor the system.
SUMMARY
In one embodiment of the invention, an optical subassembly includes a substrate, a group of solder feature on the substrate, a die on the substrate, and a cap on the substrate and over the die. The cap includes (1) a lens over the die and (2) an inner or outer surface that snap-fits to the solder features.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective cut-away view of an optical subassembly in one embodiment of the invention.
FIG. 2 is a cross-sectional view of the optical subassembly of FIG. 1 in one embodiment of the invention.
FIG. 3 is a top view of the optical subassembly of FIG. 1 in one embodiment of the invention.
FIG. 4 is a perspective cut-away view of an optical subassembly in one embodiment of the invention.
FIG. 5 is a cross-sectional view of the optical subassembly of FIG. 1 in one embodiment of the invention.
FIG. 6 is a top cross-sectional view of the optical subassembly of FIG. 1 in one embodiment of the invention.
FIG. 7 is a top view of an optical subassembly in one embodiment of the invention.
FIG. 8 is a perspective cut-away view of another optical subassembly in one embodiment of the invention.
FIG. 9 is a perspective cut-away view of another optical subassembly in one embodiment of the invention.
FIGS. 10, 11, 12, 13, 14 are top cross-sectional views of optical subassemblies in embodiments of the invention.
FIGS. 15 and 16 are side and top cross-sectional views of another optical assembly in one embodiment of the invention.
Use of the same reference numbers in different figures indicates similar or identical elements.
DETAILED DESCRIPTION
A snap-fit optical element allows the elimination of expensive equipment and the slow process time that constrain manufacturers today. This opens the door to manufacturing the product at less sophisticated locations to reduce the manufacturing costs.
FIGS. 1, 2, and 3 illustrate an optical subassembly 10 in one embodiment of the invention. Optical subassembly 10 includes a group of solder fiducial features 12 (e.g., a ring of solder balls) formed on a substrate 14. The ring of solder balls 12 forms a female snap-fit feature for receiving a male snap-fit feature. Solder balls 12 can be deposited or screen printed atop circular solder pads 16 (FIG. 2) on substrate 14. In one embodiment, solder pads 16 are generally circular and solder balls 12 are generally spherical. Nonetheless, the concepts disclosed herein are applicable to solder pads and solder fiducial features consisting of other repeatable shapes. Substrate 14 can be a printed circuit board (PCB), a flexible circuit, a ceramic substrate, or a silicon substrate.
A die 18 is mounted at the center of the ring of solder balls 12. Die 18 can be an optical device such as a laser, a light emitting diode, a transmitter, a photodiode, a receiver, or a transceiver. A die 19 can also be mounted within the ring of solder balls 12. Die 19 can be driver integrated circuit (IC), a post-amplification IC, or any other IC that works with die 18. Dies 18 and 19 can be electrically connected by wire bonds or traces in substrate 14.
A lens cap 20 is mounted on substrate 14 over die 18. Lens cap 20 can be made of a high temperature optical material such as Ultem® from General Electric Plastics or other suitable optical material. In one embodiment, lens cap 20 is a hollow cylinder with a base 24 and an outer cylindrical surface 22. Base 24 include a lens 26 (e.g., a collimating lens) on the top base surface and/or a lens 28 (e.g., a converging lens) on the bottom base surface. Outer cylindrical surface 22 forms a male snap-fit feature that is received by the female snap-fit feature formed by the ring of solder balls 12. The snap-fit features retain lens cap 20 on substrate 14 and aligns lens 26/28 to die 18. Lens cap 20 can be an injection molded piece with a deformable outer surface 22 that forms a tight fit with deformable solder balls 12.
One advantage of optical subassembly 10 is the ability to accurately locate solder balls 12 due to its inherent tight tolerance to solder pads 16, which are quite accurate since they are conventional photolithographically defined features. While a single solder ball 12 may be susceptible to small variations (e.g., ball volume, surface tension, reflow condition, and oxide level), the geometric center of solder ball 12 is nonetheless located close to the geometric center of solder pad 16. Typically, the tolerance of PCB pad center to pad center over about a 5 mm distance is about ±5 μm, the tolerance of solder ball radius for a 300 μm diameter balls is about ±5 μm, the tolerance of solder ball center to pad center alignment is about ±1 μm. In the worst case, the overall alignment may be off by ±11 μm. Assuming a normal distribution of all three tolerances, a root-mean-square analysis gives an overall tolerance of ±7 μm. Furthermore, if multiple solder balls 12 are used as the alignment reference, the variations between solder balls and solder pads can be averaged out to provide an ever higher degree of accuracy.
FIGS. 4, 5, and 6 illustrate an optical subassembly 100 in one embodiment of the invention. Optical subassembly 100 is similar to optical subassembly 10 except that an inner cylindrical surface 122 of lens cap 20 forms a female snap-fit feature while the ring of solder balls 12 form a male snap-fit feature. Thus, inner cylindrical surface 122 fits around the ring of solder balls 12 to create the snap-fit.
Although cylindrical snap-fit features formed by the solder balls and the lens cap have been illustrated above, other shapes can be utilized. FIG. 7 illustrates an optical subassembly 200 in one embodiment of the invention. A lens cap 220 has notches 230 that form a snap-fit feature for receiving another snap-fit feature formed by two solder balls 12 on substrate 214. Here, only two solder balls 12 are necessary to mount and align lens cap 220. Lens cap 220 further includes one or more lens 228 located over a die on substrate 214.
FIG. 8 illustrates an optical subassembly 300 in one embodiment of the invention. Optical subassembly 300 uses a rectangular lens cap 320 having a base 324 and orthogonal sidewalls 322. Base 324 include a lens 326 (e.g., a collimating lens) on the top base surface and/or a lens 328 (e.g., a converging lens) on the bottom base surface. The outer sidewall surfaces 322A form a male snap-fit feature that is received by a female snap-fit feature formed by solder balls 12. The snap-fit features retain lens cap 320 on substrate 14 and aligns lens 326/328 to die 18.
FIG. 9 illustrates an optical subassembly 500 in one embodiment of the invention. Subassembly 500 is similar to subassembly 300 except that two opposing outer corners of rectangular lens cap 320 are sandwiched between two opposing pairs of solder balls 12.
FIG. 10 illustrates an optical subassembly 600 in one embodiment of the invention. Subassembly 600 is similar to subassembly 300 except that rectangular lens cap 320A has notches 330A formed at its four corners to fit against four solder balls 12.
FIG. 11 illustrates an optical subassembly 700 in one embodiment of the invention. Subassembly 700 is similar to subassembly 300 except that lens cap 320B has two opposing sidewalls 322 with notches 330 to fit against solder balls 12.
FIG. 12 illustrates an optical subassembly 400 in one embodiment of the invention. Subassembly 400 is similar to subassembly 300 except that inner sidewalls surfaces 322B form a female snap-fit feature that receives a male snap-fit feature formed by solder balls 12.
FIG. 13 illustrates an optical subassembly 800 in one embodiment of the invention. Subassembly 800 is similar to subassembly 400 except that two opposing pairs of solder balls 12 are located to fit against two opposing inside corners of rectangular lens cap 320.
FIG. 14 illustrates an optical subassembly 900 in one embodiment of the invention. Subassembly 900 is similar to subassembly 400 except that two opposing solder balls 12 are located to fit against two opposing inside corners of rectangular lens cap 320.
FIGS. 15 and 16 illustrate an optical assembly 1000 in one embodiment of the invention. Subassembly 1000 is similar to subassembly 500 except that lens cap 1020 includes lenses 1026A and 1028B for a die 18A, and lenses 1026B and 1028B for a die 18B. This shows that any of the embodiments described above may multiple dies having corresponding lenses.
Various other adaptations and combinations of features of the embodiments disclosed are within the scope of the invention. Numerous embodiments are encompassed by the following claims.
Patent Grant
6978068
