The present invention relates to a socket connector mounted on a Printed Circuit Board (PCB) for receiving an IC chip or the like therein.
Socket connectors are commonly used for connecting IC chips to a PCB. Normally, the socket connector has an insulative base and a plurality of conductive contacts. The insulative base defines a recessed portion configured to receive the IC chip therein. A plurality of passageways is defined through the recessed portion in an upper-to-lower direction. Each contact is received in a corresponding passageway with a contact portion extending beyond an upper surface of the base for electrically engaging with the IC chip and a connecting portion extending downwardly for connecting with the PCB. Some socket connectors are provided with retaining means besides the recessed portion for securely retaining the IC chip therein.
When the IC chip 7 is received in the recessed portion 65, and the IC chip 7 exerts a pressure to the contact portions 50 of the contacts 5. The contact portions 50 of the 5 moves in a slant downward direction S′ which can be divided into a lateral movement S1′ and a downward movement S2′. And thus a frictional force F′ oriented toward to the beam 611 is exerted on the IC chip 7 by the contacts 5, which is a disadvantage to securely retain the IC chip 7 in the recessed portion 65.
Hence, an improved socket connector is desired to overcome the disadvantages of the prior art.
Accordingly, an object of the present invention is to provide a socket connector with reliably retaining means for an IC chip.
In order to achieve the object set forth, a socket connector is mounted on a Printed Circuit Board (PCB) and adapted for receiving an electronic element therein. The socket connector includes an insulative base, a plurality of contacts received in the base and a flexible beam for securing the electronic element in the base. The base includes sidewalls, and a recessed portion being defined in the sidewalls for receiving the electronic element therein. A plurality of receiving passageways is defined in the recessed portion and extends through upper and lower surfaces of the recessed portion. Each contact includes a retaining portion retained in the base, a flexible contact portion extending laterally from an upper portion of the retaining portion beyond upper surface of the recessed portion, and a connecting porting extending from a lower portion of the retaining portion adapted for electrically connecting with the PCB. The beam is secured with one sidewall of the base. The sidewall defines a slot adjacent to the beam. The beam has a flexible portion extending into the recessed portion and deflectable into said slot in an opposite direction to the extending direction of the contact portions of the contacts.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when take in conjunction with the accompany drawings.
Referring to
The insulative base 10, which is generally flat and rectangular shaped, includes two pairs of opposed sidewalls 12 and a recessed portion 13 in the sidewalls 12 for receiving the IC chip 3. The recessed portion 13 defines a plurality of receiving passageways 110 in matrix relationship through upper and lower surfaces thereof. A cantilevered beam 122 is integrally molded with one sidewall 12 of the base 10. The beam 122 extends from one end portion of said sidewall 12 and extends slantways along said sidewall 12 with a free flexible portion 120A extending into the recessed portion 13. A slot 121 is formed in said sidewall 12 adjacent to the beam 122, whereby the beam 122 is removable between the slot 121 and the recessed portion 13. In this embodiment, a similar beam 12 is formed with an adjacent sidewall 12.
Specially referring to
During assembly, the contacts 20 are mounted to the housing 10 with each retaining portions 201 retained in a corresponding receiving passageways 110. The contact portions 200 and the connecting portions 202 extend away from the flexible beam 120 of the base 10 and generally orthogonal to the flexible beam 120.
When an IC chip 3 is retained in the recessed portion 13, and the IC chip 3 exerts a pressure to the contact portions 200 of the contacts 20. The flexible beam 120 exerts a retained force F, substantially along the extending direction of the contact portion 200 (or connecting portions 202) of the contacts 20, to the IC chip 3. The retaining force F is passed to the contact portions 200 and the connecting portions 202. The contact portions 200 move in a slant downward direction S which can be divided into a lateral movement S1 and a downward movement S2. And thus a frictional force F oriented away from the beam 121 is exerted on the IC chip 3 by the contacts 20, whereby the beam 121 is protected from being destroyed and the IC chip 3 is retained securely in the recessed portion 13.
In the previously described embodiments, the contacts 20 are compression type with solderless connecting portions 202. Of course the connecting portions 202 can be flat type soldered to the PCB.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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92219415 | Oct 2003 | TW | national |