Socket module for an electronic relay

Information

  • Patent Grant
  • D701176
  • Patent Number
    D701,176
  • Date Filed
    Thursday, January 31, 2013
    11 years ago
  • Date Issued
    Tuesday, March 18, 2014
    10 years ago
  • US Classifications
    Field of Search
    • US
    • D13 110
    • D13 123
    • D13 146
    • D13 147
    • D13 151
    • D13 158-160
    • D13 184
    • 439 639000
    • 439 271000
    • 439 535000
    • 439 652000
    • 439 709000
    • 439 715-717
    • 439 736000
    • 361 823000
    • 361 686000
    • D14 240
    • D14 433
    • D14 434
    • D14 356-358
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a top front perspective view of a socket module for an electronic relay in accordance with our new design;



FIG. 2 is a front elevation view thereof;



FIG. 3 is a rear elevation view thereof;



FIG. 4 is a right side elevation view thereof;



FIG. 5 is a left side elevation view thereof; and,



FIG. 6 is a top plan view thereof.


The broken line portion of the figure drawings is included to show unclaimed subject matter only and forms no part of the claimed design.


Claims
  • The ornamental design for a socket module for an electronic relay, as shown and described.
Priority Claims (1)
Number Date Country Kind
002081927 Jul 2012 EM regional
US Referenced Citations (6)
Number Name Date Kind
D471158 Mori et al. Mar 2003 S
7553199 Correll Jun 2009 B2
D634713 Giordanino et al. Mar 2011 S
D638371 Giordanino et al. May 2011 S
D671897 Kettern et al. Dec 2012 S
20020132504 Mori et al. Sep 2002 A1