Socketed integrated circuit package

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Information

Patent Grant
D358806

References
Source

Patent Number
D358,806
Date Filed
Friday, September 24, 1993
32 years ago
Date Issued
Tuesday, May 30, 1995
30 years ago

Inventors
Original Assignees
- SGS-Thomson Microelectronics, Inc.
Examiners
- Sincavage; Joel
Agents
- Anderson; Rodney M.
- Jorgenson; Lisa K.
- Robinson; Richard K.

US Classifications
- D13 - Equipment for production, distribution, or transformation of energy
Field of Search
- US
- D13 125
- D13 182
- 174 521
- 174 524
- 439 55
- 439 70
- 361 718
- 361 820
- 257 678
- 257 723
- 257 730
- 257 731
- Term of Grant
  14Years

Information

Abstract

Description

Claims

The ornamental design for the socketed integrated circuit package, as shown and described.

US Referenced Citations (7)

Number	Name	Date	Kind
D82797	Cole	Dec 1930
D317592	Yoshizawa	Jun 1991
3762039	Douglass et al.	Oct 1973
3891898	Damon	Jun 1975
4422703	Christensen et al.	Dec 1983
4868349	Chia	Sep 1989
5119269	Nakayama	Jun 1992