BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional view for illustrating the configuration of a thin-film magnetic head of an embodiment of the invention.
FIG. 2 is a front view of the medium facing surface of the magnetic head of FIG. 1.
FIG. 3 is a top view of the pole layer of the magnetic head of FIG. 1.
FIG. 4 is a perspective view illustrating a slider incorporating the magnetic head of FIG. 1.
FIG. 5 is a perspective view illustrating a head arm assembly incorporating the slider of FIG. 4.
FIG. 6 is a view for illustrating a main part of a magnetic disk drive incorporating the slider of FIG. 4.
FIG. 7 is a top view of the magnetic disk drive incorporating the slider of FIG. 4.
FIG. 8 is a view for illustrating an example of waveform of a plating current of the embodiment of the invention.
FIG. 9 is a view for illustrating a waveform of a reference plating current for comparison with the plating current of the embodiment of the invention.
FIG. 10 is a view for describing a method for determining the crystal structure of a plating film used in an experiment.
FIG. 11 is a plot for illustrating the relationship between the saturation flux density and the iron, cobalt and nickel contents for each of plating films of examples of the embodiment and plating films of reference examples fabricated in the experiment.
FIG. 12 is a plot for illustrating the relationship between the coercivity and the iron, cobalt and nickel contents for each of the plating films of the examples of the embodiment and the plating films of the reference examples fabricated in the experiment.
FIG. 13 is a plot for illustrating the relationship between the crystal structure and the iron, cobalt and nickel contents for each of the plating films of the examples of the embodiment and the plating films of the reference examples fabricated in the experiment.
FIG. 14 is a view for illustrating the composition range of the soft magnetic film of the embodiment of the invention.
FIG. 15 is a view for illustrating another example of waveform of the plating current of the embodiment of the invention.