The present disclosure relates to a solar battery.
Solar battery has been widely used as clean energy. Especially as carbon neutrality, energy saving and emission reduction have become the mainstream trend of the international community, photovoltaic power generation, as an important part of clean new energy, has gained more and more attention. However, the light utilization efficiency of current solar battery has not yet reached an ideal state, and it is still necessary to rationally design the structure of the solar battery to improve the cell efficiency.
In order to overcome the above technical problems, the present disclosure provides a tandem solar battery comprising:
In the solar battery of the present disclosure, a first charge transport layer, a transparent conductive layer, a second charge transport layer and a polysilicon layer are sequentially arranged between the first photoelectric conversion layer and the second photoelectric conversion layer. Especially the second charge transport layer may protect the polysilicon layer, may effectively transport the same type of charges, and avoid recombination phenomena at the interface or inside the film, thereby effectively improving the efficiency of the battery. The solar battery of this disclosure also has the characteristics of simple structure, simple and convenient manufacturing process, and low cost.
In an embodiment, the polysilicon layer is p-type polysilicon, and has a thickness of 1 nm to 100 μm; and
In an embodiment, the constituent material in the first charge transport layer is an n-type charge transport material; preferably, the n-type charge transport material is selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, In2O3, CdS, CdSe, BaSnO3, Nb2O5, C60 and PCBM.
In an embodiment, the polysilicon layer is n-type polysilicon, and has a thickness of 1 nm to 100 μm; and the constituent material in the second charge transport layer is an n-type charge transport material with a thickness of 0.1-100 nm; preferably, the n-type charge transport material is selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, In2O3, CdS, CdSe, BaSnO3, Nb2O5, C60 and PCBM.
In an embodiment, the constituent material in the first charge transport layer is a p-type charge transport material; preferably, the p-type charge transport material is selected from the group consisting of NiOx (where x is between 0.1 and 10), CuFeO2, CuAlO2, CuSCN, Cu2O, WO3, CuI2, MoS2, FeS2, P3HT, Spiro-meoTAD, Poly-TBD, PFN, PEDOT:PSS, PTAA, and Spiro-TTB.
In an embodiment, the first charge transport layer has a thickness of 1-500 nm.
In an embodiment, the thickness of the first charge transport layer is greater than the thickness of the second charge transport layer.
In an embodiment, the second charge transport layer is attached to the surface of the polysilicon layer away from the second photoelectric conversion layer, and is located on the polysilicon layer; and
In an embodiment, the transparent conductive layer has a thickness of 1-1000 nm, and the material of the transparent conductive layer is selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, GZO, AZO, IZO, FTO, ITO, BaSnO3, Ti-doped SnO2, and Zn-doped SnO2.
In an embodiment, the first photoelectric conversion material is selected from the group consisting of a perovskite, an amorphous silicon, GaInP, CdTe, a copper indium gallium selenide; preferably, the first photoelectric conversion material is a perovskite material with a band gap of 1.40-2.3 eV. Preferably, the first photoelectric conversion layer has a thickness of 1-5000 nm.
The second photoelectric conversion material is selected from the group consisting of a single crystal silicon, a polycrystalline silicon, GaAs, CdTe, and a perovskite; preferably, the second photoelectric conversion material is single crystal silicon.
In an embodiment, the solar battery comprises the following stacked layers from a light-incident surface:
In an embodiment, the third charge transport layer has a thickness of 1-500 nm, which is greater than that of the second charge transport layer.
In an embodiment, the first photoelectric conversion layer has a thickness of 1 00-1000 nm; and the first photoelectric conversion material is perovskite with a band gap of 1 0.40-2.3 eV; and the second photoelectric conversion layer has a thickness of 1-200 μm; and the second photoelectric conversion material is an n-type single crystal silicon.
In an embodiment, the perovskite has a three-dimensional ABX3 structure, wherein
A is selected from the group consisting of CH(NH2)2+, CH3NH3+, C(NH2)3, Cs+ and Rb+,
B is selected from the group consisting of Pb2+, Sn2+ and Sr2+, and
X is selected from the group consisting of Br−, I− and Cl−.
In an embodiment, the top transparent conductive layer has a thickness of 0.1-1000 nm, the transparent conductive layer has a thickness of 0.1-1000 nm, and the constituent material of the top transparent conductive layer and the transparent conductive layer is independently selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, GZO, AZO, IZO, FTO, ITO, BaSnO3, Ti-doped SnO2, and Zn-doped SnO2;
The present disclosure also provides a method of preparing a solar battery, comprising:
In an embodiment, the transparent conductive layer is formed by a physical vapor deposition.
The present disclosure will be further described in detail through the figures and embodiments below. Through these descriptions, the features and advantages of the present disclosure will become clearer and more specific.
The wording “exemplary” is used exclusively herein to mean “serving as an example, embodiment, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as superior or better than other embodiments. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
In addition, the technical features involved in different embodiments of the present disclosure described below may be combined with each other as long as they do not constitute a conflict with each other.
This disclosure provides a solar battery comprising:
The first charge transport layer may be disposed between the p first photoelectric conversion layer and the transparent conductive layer, and the charge transport property of the first charge transport layer is opposite to that of the second charge transport layer.
The solar battery of the present disclosure has a laminated structure, including a first cell and a second cell, and an intermediate structure between the photoelectric conversion layers of the first cell and the second cell.
The first cell comprises a first photoelectric conversion layer 10 comprising a first photoelectric conversion material having a first bandgap. The second cell comprises a second photoelectric conversion layer 20 comprising a second photoelectric conversion material having a second bandgap. The first cell is located above the second cell such that the first photoelectric conversion layer 10 is located above the second photoelectric conversion layer 20. In an embodiment, the first bandgap of the first photoelectric conversion material may be larger than the second bandgap of the second photoelectric conversion material. Of course, the first bandgap of the first photoelectric conversion material may be smaller than the second bandgap of the second photoelectric conversion material. However, the first way is preferably adopted, that is, the first bandgap of the first photoelectric conversion material is larger than the second bandgap of the second photoelectric conversion material.
In an embodiment, the first photoelectric conversion material can be selected from the group consisting of a perovskite, an amorphous silicon, GaInP, CdTe, and copper indium gallium selenide thin film. Preferably, the first photoelectric conversion material is a perovskite material.
In an embodiment, the second photoelectric conversion material may be selected from the group consisting of a single crystal silicon, a polycrystalline silicon, GaAs, CdTe, and a perovskite. Preferably, the second photoelectric conversion material is a single crystal silicon. The second photoelectric conversion layer may have a thickness of 1-500 μm, such as 1-200 μm.
For this disclosure, the perovskite may have a three-dimensional ABX3 structure, wherein A is selected from the group consisting of CH(NH2)2+, CH3NH3+, C(NH2)3+, Cs+ and Rb+; B is selected from the group consisting of Pb2+, Sn2+ and Sr2+, and X is selected from the group consisting of Br−, I− and Cl−. The perovskite may have a bandgap of 1.40-2.3 eV. The perovskite layer composed of the perovskite material may have a thickness of 1-5000 nm. For example, the perovskite layer may have a thickness of 100-1000 nm, for example, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm or 1000 nm.
The intermediate structure between the photoelectric conversion layer 10 of the first cell and photoelectric conversion layer 20 of the second cell at least comprises: a first charge transport layer 31, a transparent conductive layer 32, a second charge transport layer 33 and a polysilicon layer 34. In particular, in the embodiment where the first photoelectric conversion material is a perovskite material and the second photoelectric conversion material is a single crystal silicon, the first charge transport layer 31, the transparent conductive layer 32, the second charge transport layer 33 and a polysilicon layer 34 may be arranged sequentially from top to bottom (with the incident light surface as the top).
The first charge transport layer 31, the transparent conductive layer 32, the second charge transport layer 33 and the polysilicon layer 34 are respectively described below.
In an embodiment, the polysilicon layer 34 is a layer of an n-type polysilicon with a thickness of 1 nm to 100 μm. In an embodiment, the polysilicon layer 34 is a layer of a p-type polysilicon with a thickness of 1 nm to 100 μm. The polysilicon layer may be formed by a low pressure chemical vapor deposition (LPCVD) or a plasma enhanced chemical vapor deposition (PECVD).
In this disclosure, the second charge transport layer 33 is disposed between the polysilicon layer 34 and the transparent conductive layer 32, and the second charge transport layer 33 has a thickness smaller than that of the transparent conductive layer 32. The second charge transport layer 33 has the same charge transport properties as that of the polysilicon layer 34. The first charge transport layer 31 is disposed between the first photoelectric conversion layer 10 and the transparent conductive layer 32, and the first charge transport layer 31 has a charge transport property opposite to that of the second charge transport layer 33.
In an embodiment, the second charge transport layer 33 is attached to the surface of the polysilicon layer 34 away from the second photoelectric conversion layer 20, and is located on the polysilicon layer 34. When forming the second charge transport layer 33 on the polysilicon layer 34, in order to avoid the damage to the polysilicon layer, the second charge transport layer 33 can be prepared by a relatively mild process. In the present disclosure, the second charge transport layer 33 may have a thickness of 0.1-100 nm, such as 1-50 nm, or 1-20 nm. The second charge transport layer 33 may transport a charge while protecting the surface of the polysilicon layer 34. The second charge transport layer 33 may be produced by a thermal evaporation, an atomic layer deposition (ALD), a rapid plasma deposition, a solution process, or the like. Through the second charge transport layer 33, the polysilicon layer 34 can be protected to reduce the damage during the subsequent thin film deposition, so as to achieve the purpose of optimizing the interface and improving the efficiency of the laminated cell.
In this disclosure, the charge transport properties of the second charge transport layer 33 can be adjusted according to the properties of the polysilicon layer 34. When the polysilicon in the polysilicon layer 34 is p-type polysilicon, the constituent material in the second charge transport layer 33 is a p-type charge transport material. When the polysilicon in the polysilicon layer is n-type polysilicon, the constituent material in the second charge transport layer is an n-type charge transport material. With such setting, the consistency of the charge transport type can be maintained, and it may be achieved to effectively transport the same type of charge and avoid recombination phenomena occurring at the interface or inside the film.
In this disclosure, the p-type charge transport material can be selected from the group consisting of NiOx (where x is between 0.1 and 10), CuFeO2, CuAlO2, CuSCN, Cu2O, WO3, CuI2, MoS2, FeS2, P3HT, Spiro-meoTAD, Poly-TBD, PFN, PEDOT:PSS, PTAA and Spiro-TTB. The n-type charge transport material is selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, In2O3, CdS, CdSe, BaSnO3, Nb2O5, C60 and PCBM.
In the present disclosure, the transparent conductive layer 32 is arranged above the second charge transport layer 33. In an embodiment, the transparent conductive layer 32 is attached to the surface of the second charge transport layer 33 away from the second photoelectric conversion layer 20, and is located on the second charge transport layer 33. In an embodiment, the transparent conductive layer 32 may have a thickness of 1-1000 nm, for example 1-100 nm, such as 20 nm.
In an embodiment, the material of the transparent conductive layer 32 may be selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, GZO, AZO, IZO, FTO, ITO, BaSnO3, Ti-doped SnO2, and Zn-doped SnO2. Preferably, it may be a material with relatively strong lateral conductivity, such as ITO, IZO, or the like. The transparent conductive layer 32 may be produced by a physical vapor deposition, a solution process, a thermal evaporation, an electron beam evaporation, or an atomic layer deposition. However, it is generally to use the physical vapor deposition.
In this disclosure, the material in the transparent conductive layer 32 is different from the material in the second charge transport layer 33. In the present disclosure, a first charge transport layer 31 is further arranged between the first photoelectric conversion layer 10 and the second photoelectric conversion layer 20. The first charge transport layer 31 is generally disposed above the transparent conductive layer 32. In an embodiment, the first charge transport layer 31 is attached to the surface of the transparent conductive layer 32 away from the second photoelectric conversion layer, and is located on the transparent conductive layer 32.
Although the first charge transport layer 31 and the second charge transport layer 33 are charge transport layers, they have different requirements in terms of the preparation method, the thickness, or the like. In the present disclosure, the first charge transport layer 31 may have a thickness of 1-500 nm, such as 1-100 nm, such as 30 nm. In an embodiment, the first charge transport layer 31 may have a thickness greater than the thickness of the second charge transport layer 33.
The first charge transport layer 31 has a charge transport property opposite to that of the second charge transport layer 33. When the constituent material of the second charge transport layer 33 is an n-type charge transport material, the constituent material in the first charge transport layer 31 is a p-type charge transport material. When the constituent material of the second charge transport layer 33 is a p-type charge transport material, the constituent material in the first charge transport layer 31 is an n-type charge transport material. In this way, it can be achieved to maintain the consistency of the current in the first and second cells, so that the type of charge transferred downward by the first cell containing the first photoelectric conversion layer is opposite to the type of charge transferred upward by the second cell containing the second photoelectric conversion layer.
In this disclosure, the p-type charge transport material may be selected from the group consisting of NiOx (where x is between 0.1 and 10), CuFeO2, CuAlO2, CuSCN, Cu2O, WO3, CuI2, MoS2, FeS2, P3HT, Spiro-meoTAD, Poly-TBD, PFN, PEDOT:PSS, PTAA, and Spiro-TTB. The n-type charge transport material may be selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, In2O3, CdS, CdSe, BaSnO3, Nb2O5, C60 and PCBM.
The first charge transport layer 31 may be produced by a solution process, a thermal evaporation, a sputtering or an atomic layer deposition, or the like.
As shown in
In the present disclosure, there may be a tunneling layer 21 between the polysilicon layer 34 and the second photoelectric conversion layer (such as a single crystal silicon layer) 20. The tunneling layer 21 may be formed by a high temperature thermal oxidation, a nitric acid oxidation, or an ozone oxidation. The tunneling layer 21 may have a thickness of 0.1-100 nm.
In this disclosure, a diffused silicon layer 22 may be formed on the surface of the second photoelectric conversion layer (such as, a single crystal silicon layer) 20 away from the tunneling layer 21, and may have a charge transport property opposite to that of the second photoelectric conversion layer (such as, a single crystal silicon layer) 20. In an embodiment, the second photoelectric conversion layer (such as a single crystal silicon layer) 20 is a layer of an n-type single crystal silicon, and the diffused silicon layer 22 is a layer of a p-type single crystal silicon.
A passivation layer 23 may be provided on the surface of the diffused silicon layer 22 away from the tunneling layer 21. The passivation layer 23 may have a thickness of 0.1-500 μm, and the material may include one or a combination of at least two of SiO2, a silicon nitride, an aluminum oxide or a silicon oxynitride.
At least one bottom metal electrode 24 may be interposed on the diffused silicon layer 22. The material of the bottom metal electrode includes one or a combination of at least two of Au, Ag, Al or Cu.
Thus, the second cell containing the second photoelectric conversion layer 20 may be formed.
The third charge transport layer 13 may be formed on the first photoelectric conversion layer 10, and the third charge transport layer 13 and the first charge transport layer 31 respectively extract different types of charges from the first photoelectric conversion layer 10 and transport them to the external circuit. Therefore, the constituent material of the third charge transport layer 13 has the same charge transport property as that of the constituent material of the second charge transport layer 33, but has the charge transport property opposite to that of the constituent material of the first charge transport layer 31. When the constituent material of the second charge transport layer 33 is an n-type charge transport material, the constituent material in the third charge transport layer 13 is an n-type charge transport material. When the constituent material of the second charge transport layer 33 is a p-type When using a charge transport material, the constituent material in the third charge transport layer 13 is a p-type charge transport material.
In this disclosure, the p-type charge transport material may be selected from the group consisting of NiOx (where x is between 0.1 and 10), CuFeO2, CuAlO2, CuSCN, Cu2O, WO3, CuI2, MoS2, FeS2, P3HT, Spiro-meoTAD, Poly-TBD, PFN, PEDOT:PSS, PTAA, and Spiro-TTB. The n-type charge transport material may be selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, In2O3, CdS, CdSe, BaSnO3, Nb2O5, C60 and PCBM.
The third charge transport layer 13 may have a thickness of 1-500 nm, which is greater than that of the second charge transport layer 33. The third charge transport layer 13 may be produced by a solution process, a thermal evaporation, a sputtering, an atomic layer deposition, and the like.
A top transparent conductive layer 12 may be formed on the third charge transport layer 13. In an embodiment, the top transparent conductive layer 12 may have a thickness of 0.1-1000 nm, and the material can be selected from the group consisting of TiO2, SnO2, ZnO, ZrO2, GZO, AZO, IZO, FTO, ITO, BaSnO3, Ti-doped SnO2, and Zn-doped SnO2. It may be produced by a sputtering, a solution process, a thermal evaporation, an electron beam thermal evaporation, or an atomic layer deposition. In general, a sputtering can be used.
At least one top metal electrode 11 may be formed on the top transparent conductive layer 12. The material of the top metal electrode may include one or a combination of at least two of Au, Ag, Al or Cu.
Thus, the first cell including the first photoelectric conversion layer may be formed.
According to needs, other layers can be arranged between the layers of the second cell and the first cell to adjust or passivate the interface and improve the efficiency of the device. For example, a buffer layer 14 may be formed between the third charge transport layer 13 and the first photoelectric conversion layer 10. The material of the buffer layer 14 may include one or a combination of at least two of molybdenum oxide, LiF, C60, SnO2, TiO2, SiO2, and the like. The buffer layer may be formed by ALD, PECVD, a spin coating, a sputtering or a thermal evaporation. For another example, an anti-reflection layer (not shown) may be formed on the top transparent conductive layer 12, and the material of the anti-reflection layer may include LiF, MgF2, Si3N4, SiO2 or dimethylsiloxane polymer, etc. It may be formed by an evaporation, a sputtering or ALD.
The disclosure provides a process for preparing a solar battery, comprising:
Various processes known in the art may be used to form the first cell and the second cell, as well as the layers between the second photoelectric conversion layer and the first photoelectric conversion layer such as the polysilicon layer, the first charge transport layer, and the like. However, in this disclosure, the second charge transport layer shall be formed by a mild process such as a thermal evaporation, an atomic layer deposition, a plasma rapid deposition or a solution process. In such way, the polysilicon layer may be protected during the subsequent film deposition so as to reduce the damage to the polysilicon layer, and the purpose of optimizing the interface and improving the efficiency of laminated batteries can be achieved. In an embodiment, the transparent conductive layer may be formed by a physical vapor deposition.
The preparation process of the comparative example 1 was the same as that of Example 1, except that the step (6) was not included, that is, a transparent conductive layer of ITO with a thickness of 15 nm was directly deposited on the n-type polysilicon by a magnetron sputtering in step (7).
Testing
The testing was performed as follows:
The laminated batteries prepared in Example 1 and Comparative Example 1 were placed under the AM 1.5G standard simulated sunlight with a light intensity of 100 mW/cm2, to measure the current density-voltage curve of the batteries.
By obtaining the Open-circuit voltage (Voc), short-circuit current density (Jsc), and fill factor (FF), the photoelectric conversion efficiency (PCE) of the battery can be calculated. The results are shown in Table 1, and
It can be seen that after adding the second charge transport layer SnO2 in Example 1, all the parameters of the laminated battery have been significantly improved. For example, the photoelectric conversion efficiency has been increased from 18.71% to 23.99%. The increased efficiency helps the tandem cell convert more light into electricity, while also reducing the cost of the system.
The present disclosure has been described above in conjunction with preferred embodiments, but these embodiments are only exemplary and serve as illustrations only. On this basis, various replacements and improvements can be made to the present disclosure, all of which fall within the protection scope of the present disclosure.
Number | Date | Country | Kind |
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202210991928.5 | Aug 2022 | CN | national |