Korean Patent Application No. 10-2013-0062106, filed on May 30, 2013, in the Korean Intellectual Property Office, and entitled: “Solar Cell and Method of Manufacturing the Same,” is incorporated by reference herein in its entirety.
1. Field
One or more embodiments are directed to a solar cells and methods of manufacturing the same.
2. Description of the Related Art
As conventional energy resources, such as oil and coal, are expected to be depleted, interest in various alternative energy resources replacing the conventional energy resources is increasing. Among the alternative energy resources, solar cells that convert solar energy directly into electrical energy using a p-n junction of semiconductor elements have attracted attention.
The solar cells may be classified into crystalline silicon solar cells, amorphous silicon solar cells, compound solar cells, and dye-sensitized solar cells according to their materials. At present, the crystalline silicon solar cells are most widely used. However, the crystalline silicon solar cells have a high unit production cost for electricity generation efficiency.
Embodiments are directed to a solar cell that includes a substrate, a barrier layer on the substrate, a back electrode layer on the barrier layer, a light absorption layer on the back electrode layer, a buffer layer on the light absorption layer, and a transparent electrode layer on the buffer layer. The barrier layer may be selectively formed on the substrate.
A thickness of the barrier layer at a first point on the substrate may be different from a thickness of the barrier layer at a second point on the substrate.
The first point may be closer to an edge of the substrate than the second point. The thickness of the barrier layer at the first point may be greater than the thickness of the barrier layer at the second point.
The thickness of the barrier layer may increase discontinuously.
The thickness of the barrier layer may increase discontinuously in a stepped manner.
The thickness of the barrier layer may change continuously.
The substrate may be formed of a material including alkali elements.
The light absorption layer may be formed of a Group I-III-VI compound. The light absorption layer may include alkali elements diffused therein.
The barrier layer may control a diffusion of the alkali elements from the substrate into the light absorption layer.
The barrier layer may be formed of at least one of silicon oxide, silicon nitride, and silicon oxynitride.
Embodiments are also directed to a method of manufacturing a solar cell that includes selectively forming a barrier layer on a substrate, forming a back electrode layer on the barrier layer, forming a light absorption layer on the back electrode layer, forming a buffer layer on the light absorption layer, and forming a transparent electrode layer on the buffer layer. Forming the light absorption layer on the back electrode layer may include a heat treatment. During the heat treatment, the substrate may have a non-uniform temperature distribution in which a temperature of a first point is different from a temperature of a second point. The barrier layer may have a first thickness corresponding to the first point and a second thickness corresponding to the second point, the first thickness and the second thickness being different.
During the heat treatment, a temperature of the first point may be higher than a temperature of the second point. The first thickness of the barrier layer may be greater than the second thickness of the barrier layer.
The first point may be closer to an edge of the substrate than the second point.
The thickness of the barrier layer may increase toward the edge of the substrate.
The thickness of the barrier layer may increase discontinuously.
The thickness of the barrier layer may increase discontinuously in a stepped manner.
The thickness of the barrier layer may change continuously.
The light absorption layer may be formed by forming a copper-indium-gallium metal precursor film on the back electrode layer and then performing the heat treatment in a hydrogen selenide gas atmosphere.
The substrate may include alkali elements. The barrier layer may cause the alkali elements to be uniformly diffused from the substrate into the light absorption layer in the heat treatment.
Features will become apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:
Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey exemplary implementations to those skilled in the art.
In the drawing figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when a layer or element is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Like reference numerals refer to like elements throughout.
As used herein, expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
Although terms such as “first” and “second” may be used herein to describe various elements or components, these elements or components should not be limited by these terms. These terms are only used to distinguish one element or component from another element or component.
The terms used herein are for the purpose of describing exemplary embodiments only and are not intended to be limiting. As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that terms such as “comprise”, “include”, and “have” when used herein, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
Referring to
The substrate 110 may be formed of a glass material or a polymer material. A glass substrate may include soda-lime glass, and a polymer substrate may include polyimide, as examples.
The substrate 100 may be formed of a material including alkali elements in order to thermally diffuse alkali elements into the light absorption layer 140 in a heat treatment for forming the light absorption layer 140, as described below. For example, in the heat treatment for forming the light absorption layer 140, sodium (Na) may be eluted from the soda-lime glass, and the Na may be diffused into the light absorption layer 140 formed of a Group compound, thereby further improving the efficiency of the light absorption layer 140. Herein, the term “alkali elements” may refer generally to alkali metal atoms, alkali metal ions, or alkali metal-containing compounds or salts.
In the heat treatment for forming the light absorption layer 140, the barrier layer 120 causes the alkali elements to be uniformly diffused from the substrate 110 into the light absorption layer 140. The barrier layer 120 may be selectively formed on the substrate 110. Herein, the term “selectively formed on the substrate 110” includes “formed partially on the substrate 110” and “formed completely on the substrate 110 to different thicknesses depending on positions.”
In an embodiment, the barrier layer 120 may be formed completely on the substrate 110 to a non-uniform thickness. For example, the thickness of the barrier layer 120 may be different between one point and another point on the substrate 110. For example, the thickness of the barrier layer may increase toward an edge of the substrate 110. The barrier layer 120 will be described below with reference to
The barrier layer 120 may be formed of at least one of a silicon oxide, a silicon nitride, and a silicon oxynitride, as examples.
An alkali-containing layer (not illustrated) may be additionally formed between the substrate 110 and the barrier layer 120 to diffuse the alkali elements into the light absorption layer 140. For example, the alkali-containing layer (not illustrated) may include Na, and may be formed on the substrate 110 by coating or the like.
The back electrode layer 130 may collect electric charges formed by a photoelectric effect, and may reflect light that has penetrated the light absorption layer 140, such that the light may be re-absorbed by the light absorption layer 140. The back electrode layer 130 may be formed of a high-conductance and high-optical reflectance metal material, such as molybdenum (Mo), aluminum (Al), or copper (Cu), as examples.
For example, the back electrode layer 130 may be formed of Mo in consideration of high conductivity, ohmic contact with the light absorption layer 140, and high-temperature stability under a selenium (Se) atmosphere.
When the back electrode layer 130 includes Mo, a MoSe2 layer (not illustrated) may be formed between the back electrode layer 130 and the light absorption layer 140 by the Na eluted from the substrate 110 in the heat treatment for forming the light absorption layer 140. The MoSe2 layer (not illustrated) may increase the junction force between the back electrode layer 130 and the light absorption layer 140, and may act as an energy barrier that prevents electrons formed by a photoelectric effect from being discharged through the back electrode layer 130.
Also, the back electrode layer 130 may be formed as a multiple film in order to secure contact with the substrate 110 and provide the resistance characteristics of the back electrode layer 130.
The light absorption layer 140 may be formed of a Group compound. For example, the light absorption layer 140 is formed of a copper-indium-selenide (CIS) compound including copper (Cu), indium (In), and Se, to form a p-type semiconductor layer and absorb incident solar light. In other implementations, the light absorption layer 140 may be formed of a copper-indium-gallium-selenide (Cu(In, Ga)Se2 or CIGS) compound including copper (Cu), indium (In), gallium (Ga), and Se. The light absorption layer 140 may be formed to a thickness of about 0.7 μm to about 2 μm.
The buffer layer 150 reduces the bandgap difference between the light absorption layer 140 and the transparent electrode layer 160, and reduces an electron-hole recombination that may occur at the interface between the light absorption layer 140 and the transparent electrode layer 160. The buffer layer 150 may be formed of CdS, ZnS, In2S3, or ZnxMg(1-x)O, as examples.
The transparent electrode layer 160 may form a p-n junction with the light absorption layer 140. The transparent electrode layer 160 may be formed of a transparent conductive material such as ZnO:B, ZnO:Al, ZnO:Ga, indium tin oxide (ITO), or indium zinc oxide (IZO) to capture electric charges formed by a photoelectric effect.
Also, although not illustrated in the drawings, a top surface of the transparent electrode layer 160 may be textured in order to reduce the reflection of incident solar light and increase the light absorption into the light absorption layer 140.
First,
Specifically,
It may be seen from
The first point I is closer to the edge of the substrate 110 than the second point II, and the measured temperature (460° C.) of the first point I is higher than the measured temperature (430° C.) of the second point II. Generally, in the heat treatment for forming the light absorption layer 140, the temperature of the substrate 110 decreases toward a center of the substrate 110. Accordingly, it may be seen that the Na content in the light absorption layer 140 formed at the second point II decreases to 0.62 when the Na content in the light absorption layer 140 formed at the first point I is set to 1.00.
Also, it may be seen that the Na content in the light absorption layer 140 further decreases when the temperature decreases to 400° C. This is because the thermal diffusion of the Na included in the substrate 110 may occur more actively as the temperature of the substrate 110 increases.
It may be seen from
In the heat treatment for forming the light absorption layer 140, the substrate 110 may have a non-uniform temperature distribution, and the barrier layer 120 may restrict the thermal diffusion of the Na. Therefore, when the barrier layer 120 is formed only at a higher-temperature region of the substrate 110, the Na may be uniformly diffused throughout the light absorption layer 140, so that the efficiency of the solar cell 100 may be improved.
The results of
Y=−0.124Ln(X)+0.72 [Equation 1]
In Equation 1, Y is the Na content and X is the thickness of the barrier layer 120.
Therefore, when the temperature distribution of the substrate 110 in the heat treatment for forming the light absorption layer 140 and the corresponding Na content in the light absorption layer 140 are known, Equation 1 may be used to set a thickness of the barrier layer 120 that may cause the Na to be uniformly diffused throughout the light absorption layer 140 in the heat treatment for forming the light absorption layer 140.
Also, a region in which the barrier layer 120 is formed may be selected by setting a predetermined range according to the temperature gradient of the substrate 110.
Table 1 below shows the temperatures of the substrate 110 and the Na contents in the light absorption layer 140 in a case where the barrier layer 120 is formed as illustrated in
In Table 1, CASE 3 corresponds to the result of measurement at the second point II of the substrate 110, and is used as a reference value in Table 1 since it has the same result in
CASE 1 corresponds to the result of measurement at the first point I illustrated in
CASE 2 represents the temperatures of the substrate 110 that are measured at the first point I, and the relative Na content in the light absorption layer 140, in a case where the barrier layer 120 is formed to a thickness of about 30 nm on the first region A1 of the substrate 110. It may be seen that the temperature of the substrate 110 is equal to that in CASE 1, but the Na content is reduced to 1.065, which is substantially equal to that in CASE 3.
Therefore, according to the embodiment, the barrier layer 120 may be formed only at the higher-temperature region of the substrate 110. Accordingly, alkali ions, such as Na, may be uniformly diffused throughout the light absorption layer 140 even when the substrate 110 has a non-uniform temperature distribution in the heat treatment for forming the light absorption layer 140.
An alkali-containing layer (not illustrated) may be additionally formed between the substrate 110 and the barrier layer 120 to diffuse the alkali elements into the light absorption layer 140. Since the alkali-containing layer (not illustrated) has substantially the same temperature distribution as the substrate 110, the alkali elements may be uniformly diffused into the light absorption layer 140 due to the selectively-formed barrier layer 120 even when the alkali-containing layer (not illustrated) is separately provided.
Referring to both
For example, as illustrated in
The thickness of the barrier layer 120 may be set as illustrated and described with reference to
In this manner, when the substrate 110 is segmented, for example, in a stepwise manner, into regions and the thickness of the barrier layer 120 formed on the respective regions is diversified, the alkali elements may be thermally-diffused more uniformly into the light absorption layer 140 in the heat treatment for forming the light absorption layer 140.
The thickness of the barrier layer 120 may be formed to increase toward the edge in the first to fifth regions C1 to C5. Also, the barrier layer 120 may be formed completely on the substrate 110. Accordingly, impurities other than the alkali elements may be effectively prevented from diffusing from the substrate 110 into the light absorption layer 140 in the heat treatment for forming the light absorption layer 140.
Although an example in which the temperature of the substrate 110 increases gradually toward the edge has been described above, in other implementations, the temperature of the substrate 110 may increase and then decrease toward the edge, or may decrease and then increase toward the edge. In these cases, the barrier layer 120 may be formed according to the temperature distribution of the substrate 110, such that the thickness of the barrier layer 120 may increase and then decrease toward the edge of the substrate 110, or may decrease and then increase toward the edge of the substrate 110.
Hereinafter, a method of manufacturing the solar cell 100 of
A method of manufacturing the solar cell 100, according to an embodiment, includes forming a barrier layer 120 on a substrate 110, forming a back electrode layer 130 on the barrier layer 120, forming a light absorption layer 140 on the back electrode layer 130, forming a buffer layer 150 on the light absorption layer 140, and forming a transparent electrode layer 160 on the buffer layer 150.
The barrier layer 120 may be formed by chemical vapor deposition, sputtering, or the like. In order to form the barrier layer 120 selectively on the substrate 110, the barrier layer 120 may be formed by screen printing, ink printing, or the like.
As described above, the barrier layer 120 may cause the alkali elements of the substrate 110 to be uniformly diffused into the light absorption layer 140. To this end, the barrier layer 120 may be formed to different thicknesses at the respective positions according to the non-uniform temperature distribution of the substrate 110.
Specifically, the barrier layer 120 may be formed to be thicker at the edge portion of the substrate 110, at which the temperature is higher in the heat treatment, than at the center portion of the substrate 110. Also, the thickness of the barrier layer 120 may increase toward the edge portion of the substrate 110. In this case, the thickness of the barrier layer 120 may increase discontinuously or continuously toward the edge portion of the substrate 110.
The back electrode layer 130 may be formed by applying conductive paste onto the substrate 110 and then performing heat treatment on the same, or may be formed through a plating process. Also, for example, the back electrode layer 130 may be formed through a sputtering process by using a Mo target.
After the forming of the back electrode layer 130, the back electrode layer 130 is divided into several parts through a first scribing process.
The light absorption layer 140 may be formed by a sputtering/selenization process that forms a CIG metal precursor film on the back electrode layer 130 by using a copper (Cu) target, an indium (In) target, and a gallium (Ga) target, and then forms a CIGS light absorption layer as the light absorption layer 140 by a reaction with the CIG metal precursor film by performing heat treatment in a hydrogen selenide (H2Se) gas atmosphere. In other implementations, the light absorption layer 140 may be formed by various other methods. For example, the light absorption layer 140 may be formed by co-evaporation, electro-deposition, or molecular organic chemical vapor deposition (MOCVD), which inserts copper (Cu), indium (In), gallium (Ga), and Se into a small electric furnace installed in a vacuum chamber, and heats and vapor-deposits the same.
In the heat treatment for forming the light absorption layer 140, the substrate 110 may have a non-uniform temperature distribution in which the temperature is higher at the edge portion of the substrate 110. Therefore, as described above, the barrier layer 120 may be selectively formed such that the alkali elements of the substrate 110 may be uniformly diffused into the light absorption layer 140.
The buffer layer 150 may be formed by chemical bath deposition (CBD), atomic layer deposition (ALD), or ion layer gas reaction (ILGAR), as examples.
After the forming of the light absorption layer 140 and the buffer layer 150, the light absorption layer 140 and the buffer layer 150 may be divided into several parts through a second scribing process. The second scribing process may be performed at a position separate from the first scribing process.
The transparent electrode layer 160 may be formed by metalorganic chemical vapor deposition (MOCVD), low pressure chemical vapor deposition (LPCVD), or sputtering. After the forming of the transparent electrode layer 160, a third scribing process may be performed to segment a plurality of unit solar cells on the substrate 110.
By way of summation and review, interest in thin film solar cells, which have low unit production cost, is increasing. In particular, research into Group compound solar cells, which have relatively high photovoltaic efficiency, is increasing. The photovoltaic efficiency of a Group compound solar cell may increase when its light absorption layer includes alkali elements, such as sodium (Na). However, when alkali elements are non-uniformly distributed in the light absorption layer, the efficiency of the solar cell may decrease and the life of the solar cell may be shortened. Therefore, it is desirable to distribute alkali elements, such as Na, uniformly in the light absorption layer.
Embodiments provide solar cells in which alkali elements are uniformly distributed in a light absorption layer, and methods of manufacturing the same. Accordingly, the efficiency of the solar cell may be improved
Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope thereof as set forth in the following claims.
Number | Date | Country | Kind |
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10-2013-0062106 | May 2013 | KR | national |