SOLAR CELL AND PREPARATION METHOD THEREOF

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefits of the priority of Chinese Patent Application No. No. 202211337828.7 filed on Oct. 28, 2022, titled “SOLAR CELL AND PREPARATION METHOD THEREOF” in the China National Intellectual Property Administration, the entire content of which is incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the technical field of solar cells, and in particular, to a solar cell and a preparation method thereof.

BACKGROUND

In a Heterojunction Back Contact (HBC) solar cell, an intrinsic a-Si layer is disposed on a back side (a side facing away from a light incident side) of a silicon substrate, while a base electrode and an emitter electrode are disposed on a side of the intrinsic a-Si layer away from the silicon substrate, and different polarities are doped on a surface of the intrinsic a-Si layer corresponding to different electrodes, respectively.

SUMMARY

The present disclosure provides a solar cell with a novel structure and a preparation method thereof.

In a first aspect, an embodiment of the present disclosure provides a solar cell, including:

a silicon substrate having a first polarity or a second polarity, wherein the silicon substrate includes a first side and a second side opposite to each other; the first polarity is used for transporting one of electrons and holes, and the second polarity is used for transporting the other of electrons and holes;
a first passivation structure on the first side of the silicon substrate, wherein a portion of the first passivation structure farthest from the silicon substrate has a first polarity; and a position where the first passivation structure is located is a first electrode region;
a second passivation structure on a side of the first passivation structure away from the silicon substrate and in at least a second electrode region, wherein a portion of the second passivation structure farthest from the silicon substrate has a second polarity; the second passivation structure has a process temperature lower than the first passivation structure; and
a first electrode in the first electrode region on a side of the second passivation structure away from the silicon substrate, and a second electrode in the second electrode region on a side of the second passivation structure away from the silicon substrate.

Optionally, the silicon substrate has a first polarity; and

the second passivation structure completely covers the second side of the silicon sub strate.

Optionally, the first passivation structure includes:

a tunneling passivation sublayer; and
a first passivation sublayer on a side of the tunneling passivation sublayer away from the silicon substrate, wherein the first passivation sublayer has the first polarity.

Optionally, the tunneling passivation sublayer is made of a material including at least one of silicon oxide, aluminum oxide, silicon oxynitride or silicon carbide; and

the first passivation sublayer is made of a material including at least one of doped polysilicon or doped silicon carbide.

Optionally, the tunneling passivation sublayer has a thickness ranging from 1 nm to 3 nm; and

the first passivation sublayer has a thickness ranging from 10 nm to 200 nm.

Optionally, the second passivation structure includes:

a dielectric passivation sublayer; and
a second passivation sublayer on a side of the dielectric passivation sublayer away from the silicon substrate, wherein the second passivation sublayer has the second polarity.

Optionally, the dielectric passivation sublayer is made of a material including at least one of polysilicon, amorphous silicon or silicon oxide; and

the second passivation sublayer is made of a material including at least one of doped polysilicon, doped amorphous silicon or doped silicon carbide.

Optionally, the dielectric passivation sublayer has a thickness ranging from 1 nm to 15 nm; and

the second passivation sublayer has a thickness ranging from 1 nm to 20 nm.

Optionally, the second passivation structure is an electron transport layer or a hole transport layer.

Optionally, the second passivation structure has a thickness ranging from 20 nm to 200 nm.

Optionally, the first electrode is a base electrode; and

the second electrodes is an emitter electrode.

Optionally, the first electrode region includes a plurality of strip-shaped regions spaced apart, the second electrode region includes a plurality of strip-shaped regions spaced apart, and the strip-shaped regions of the first electrode region and the strip-shaped regions of the second electrode region are alternately distributed.

Optionally, the first passivation structure has a process temperature ranging from 300° C. to 650° C.; and

the second passivation structure has a process temperature ranging from 150° C. to 200° C.

In a second aspect, an embodiment of the present disclosure provides a method for preparing a solar cell, wherein the solar cell is a solar cell according to any embodiment of the present disclosure, and the method includes:

forming a first passivation structure in a first electrode region on a first side of the silicon substrate through a patterning process;
forming a second passivation structure at least in a second electrode region on the first side of the silicon substrate; and
forming a first electrode in a first electrode region and a second electrode in a second electrode region on the first side of the silicon substrate through a patterning process.

Optionally, the second passivation structure in the solar cell completely covers a second side of the silicon substrate; and

forming the second passivation structure at least in the second electrode region on the first side of the silicon substrate includes: depositing a second passivation structure completely covered on the first side of the silicon substrate.

It can be seen that in the embodiments of the present disclosure, both electrodes are disposed on the back side of the silicon substrate, and passivation layers (the first passivation structure and the second passivation structure) with different polarities are disposed on the silicon substrate at positions corresponding to the two electrodes, respectively, so that a novel form of hybrid HBC solar cell is provided.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic structural diagram of an HBC solar cell in the related art;

FIG. 2 is a schematic sectional view of a solar cell according to an embodiment of the present disclosure;

FIG. 3 is a schematic sectional view of another solar cell according to an embodiment of the present disclosure;

FIG. 4 is a schematic sectional view of another solar cell according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram illustrating a distribution of electrode regions in a solar cell according to an embodiment of the present disclosure;

FIG. 6 is a schematic flowchart of preparing a solar cell according to an embodiment of the present disclosure;

FIG. 7 is a schematic sectional view of a silicon substrate used in a method for preparing a solar cell according to an embodiment of the present disclosure;

FIG. 8 is a schematic sectional view when an antireflection layer is formed in a method for preparing a solar cell according to an embodiment of the present disclosure;

FIG. 9 is a schematic sectional view when a first passivation structure is patterned in a method for preparing a solar cell according to an embodiment of the present disclosure; and

FIG. 10 is a schematic sectional view when a second passivation structure is formed in a method for preparing a solar cell according to an embodiment of the present disclosure.

Reference Signs: 1. First passivation structure; 11. Tunneling passivation sublayer; 12. First passivation sublayer; 2. Second passivation structure; 21. Dielectric passivation sublayer; 22. Second passivation sublayer; 31. Front dielectric passivation layer; 32. Antireflection layer; 51. N-type doped region; 52. P-type doped region; 59. Intrinsic a-Si layer; 81. First electrode; 82. Second electrode; 89. Transparent conductive oxide layer; 9. Silicon substrate; 91. First electrode region; and 92. Second electrode region.

DETAIL DESCRIPTION OF EMBODIMENTS

To improve understanding of the technical solution of the present disclosure for those skilled in the art, the present disclosure will be described in detail with reference to accompanying drawings and specific implementations.

It will be appreciated that the specific embodiments and drawings described herein are used merely for the purpose of explaining the present disclosure instead of limiting the present disclosure.

It will be appreciated that embodiments of the present disclosure and features thereof may be combined with each other as long as they are not contradictory.

It will be appreciated that, for convenience of description, only parts related to embodiments of the present disclosure are shown in the drawings, and parts not related to embodiments of the present disclosure are not shown in the drawings.

In the embodiments of the present disclosure, the terms “first polarity” and “second polarity” refer to two semiconductor types; that is, the first polarity and the second polarity are P-type (transporting holes) and N-type (transporting electrons) respectively and non-repetitively. For example, the first polarity may be P-type and the second polarity may be the N-type, or the first polarity may be the N-type and the second polarity may be P-type.

In the embodiments of the present disclosure, the phrase “A is on a side of B away from C” means that A and B are both formed on a same side of C, and A is formed after B, so that A covers B at a position with both A and B. However, it does not mean that all positions of A necessarily cover B, nor that all positions of B are covered with A.

In the embodiments of the present disclosure, the phrase “process temperature of a structure” refers to the maximum temperature to be reached in formation of the structure.

In the embodiments of the present disclosure, the phrase “patterning process” refers to a process for forming a structure having a specific pattern, which may specifically include a photolithography process, a laser process, a wet film etching process, or the like.

Referring to FIG. 1, a Heterojunction Back Contact (HBC) solar cell includes a silicon substrate 9. An intrinsic a-Si layer 59 is disposed on a back side (a first side) of the silicon substrate 9, while -type doped regions 51 and P-type doped regions 52 are alternately formed on a surface of the intrinsic a-Si layer 59 to transport holes and electrons, respectively, and different types of electrodes, i.e., a first electrode 81 (e.g., a base electrode) and a second electrode 82 (e.g., an emitter electrode) arranged in an interdigitated manner are disposed on a side of the two types of doped regions away from the silicon substrate 9.

A front dielectric passivation layer 31, an antireflection layer 32, and other structures may be further disposed sequentially on a light incident side (a second side) of the silicon substrate 9.

As can be seen, in the HBC solar cell, the PN junction, and also the base electrode and the emitter electrode, are all located on the back side so that no electrode is provided on the light incident side of the HBC solar cell, and thus light will not be shielded by electrodes. Therefore, the HBC solar cell has smaller optical loss, higher short-circuit current density, higher efficiency and better performance.

In a first aspect, referring to FIGS. 2 to 5, an embodiment of the present disclosure provides a solar cell, including:

a silicon substrate 9 having a first polarity or a second polarity, where the silicon substrate 9 includes a first side and a second side opposite to each other; the first polarity is used for transporting one of electrons and holes, and the second polarity is used for transporting the other of electrons and holes;
a first passivation structure 1 on the first side of the silicon substrate 9, where a portion of the first passivation structure 1 farthest from the silicon substrate 9 has a first polarity; and a position where the first passivation structure 1 is located is a first electrode region 91;
a second passivation structure 2 on a side of the first passivation structure 1 away from the silicon substrate 9 and in at least a second electrode region 92, where a portion of the second passivation structure 2 farthest from the silicon substrate 9 has a second polarity; the second passivation structure 2 has a process temperature lower than the first passivation structure 1; and
a first electrode 81 in the first electrode region 91 on a side of the second passivation structure 2 away from the silicon substrate 9, and a second electrode 82 in the second electrode region 92 on a side of the second passivation structure 2 away from the silicon substrate 9.

Referring to FIG. 2, the solar cell according to the embodiment of the present disclosure has a silicon substrate 9 with a certain polarity (a first polarity or a second polarity), which is a P-type doped or N-type doped silicon-based semiconductor.

Referring to FIG. 2, the silicon substrate 9 has a first side and a second side opposite to each other. The second side may be a “light incident side” for light incidence, and the first side may be a “back side” opposite to the light incident side.

Referring to FIGS. 2 and 5, one part of a surface on the first side of the silicon substrate 9 is a first electrode region 91 for disposing the first electrode 81, and the other part is a second electrode region 92 for disposing the second electrode 82.

It will be appreciated that the first electrode region 91 and the second electrode region 92 are different regions, i.e., may be non-overlapping; and further, the first electrode region 91 and the second electrode region 92 may “completely cover” the first side of the silicon substrate 9.

It will be appreciated that it is also possible that the first electrode region 91 and the second electrode region 92 do not completely cover the first side of the silicon sub strate 9.

Optionally, the first electrode region 91 includes a plurality of strip-shaped regions spaced apart, the second electrode region 92 includes a plurality of strip-shaped regions spaced apart, and the strip-shaped regions of the first electrode region 91 and the strip-shaped regions of the second electrode region 92 are alternately distributed.

As an implementation of the embodiment of the present disclosure, referring to FIG. 5, the first electrode region 91 may include a plurality of strips parallel to and spaced apart from each other, the second electrode region 92 may also include a plurality of strips parallel to and spaced apart from each other, and the strips of the two electrode regions are parallel to each other and alternately distributed along a width direction of the stripes(apparently, the stripes of the two electrode regions may contact each other on sides, as shown in FIG. 4, or may be spaced apart from each other by a certain distance). As a result, the first electrode 81 and the second electrode 82 in the first electrode region 91 and the second electrode region 92, respectively, are distributed in an “interdigitated” manner.

Referring to FIG. 2, a first passivation structure 1 (passivation layer) in the first electrode region 91 is disposed on the first side of the silicon substrate 9. In other words, the first passivation structure 1 is “patterned”, and a position where the first passivation structure 1 is located is the first electrode region 91 (therefore, the first passivation structure 1 completely covers, but does not exceed, the first electrode region 91). Further, the first passivation structure 1 has a polarity (first polarity), which is the same as or opposite to the polarity of the silicon substrate 9, in at least a surface layer farthest from the silicon substrate 9.

Referring to FIG. 2, a second passivation structure 2 is further disposed on a side of the first passivation structure 1 away from the silicon substrate 9 and at least in the second electrode region 92 (therefore, the second passivation structure 2 completely covers, and may exceed, the second electrode region 92. For example, the second passivation structure 2 may be also distributed over the entire or a part of the first electrode region 91), and the second passivation structure 2 has a polarity (second polarity), which is “opposite” to that of the first passivation structure 1, in at least a surface layer farthest from the silicon substrate 9. For example, if the first passivation structure 1 is P-type, the second passivation structure 2 is the N-type, and if the first passivation structure 1 is the N-type, the second passivation structure 2 is P-type. Meanwhile, one of the first passivation structure 1 and the second passivation structure 2 has the same polarity as the silicon substrate 9, while the other has an opposite polarity to the silicon substrate 9.

The first passivation structure 1 and the second passivation structure 2 are distinguished through a comparison of their respective process temperatures. That is, the second passivation structure 2 has a process temperature lower than the first passivation structure 1. Therefore, the first passivation structure 1 is a high-temperature passivation structure (high-temperature passivation layer) having a higher process temperature, while the second passivation structure 2 is a low-temperature passivation structure (low-temperature passivation layer) having a lower process temperature.

It will be appreciated that an order of formation of the second passivation structure 2 and the first passivation structure 1 may be determined from the structure of the solar cell product. If the first passivation structure 1 is formed first, heating in subsequent formation of the second passivation structure 2 will not affect the already formed first passivation structure 1; but if the second passivation structure 2 is formed first, heating in subsequent formation of the first passivation structure 1 may damage the already formed second passivation structure 2.

Optionally, the first passivation structure 1 has a process temperature ranging from 300° C. to 650° C.; and the second passivation structure 2 has a process temperature ranging from 150° C. to 200° C.

As an implementation of the embodiment of the present disclosure, a maximum temperature (process temperature) in formation of the first passivation structure 1 may be 300° C. to 650° C., or further 400° C. to 600° C. Accordingly, a maximum temperature (process temperature) in formation of the second passivation structure 2 may be 150° C. to 200° C., or further 170° C. to 190° C.

Referring to FIG. 2, a first electrode 81 that does “not exceed” the first electrode region 91 is disposed on a side of the second passivation structure 2 away from the silicon substrate 9. In other words, the first electrode 81 is in communication with the silicon substrate 9 through the first passivation structure 1. Further, a second electrode 82 that does “not exceed” the second electrode region 92 is disposed on a side of the second passivation structure 2 away from the silicon substrate 9. In other words, the second electrode 82 is in conduction with the silicon substrate 9 through the second passivation structure 2.

One of the first electrode 81 and the second electrode 82 is an emitter electrode, and the other is a base electrode.

It will be appreciated that different types of electrodes cannot contact each other.

It can be seen that in the embodiment of the present disclosure, both electrodes are disposed on the back side of the silicon substrate 9, and passivation layers (the first passivation structure 1 and the second passivation structure 2) with different polarities are disposed on the silicon substrate 9 at positions corresponding to the two electrodes, respectively, so that a novel form of hybrid HBC solar cell is provided.

Referring to FIGS. 3 and 4, optionally, the silicon substrate 9 has a first polarity; and

the second passivation structure 2 completely covers the second side of the silicon sub strate 9.

As a specific implementation of the embodiment of the present disclosure, the silicon substrate 9 may have the same polarity (first polarity) as the first passivation structure 1, and correspondingly, the second passivation structure 2 has an opposite polarity (second polarity) to the silicon substrate 9 and the first passivation structure 1. Moreover, the second passivation structure 2 is an unpatterned full area structure. In other words, the second passivation structure 2 is located in both the first electrode region 91 and the second electrode region 92, thereby covering the first passivation structure 1 in the first electrode region 91 and directly covering the silicon substrate 9 in the second electrode region 92.

Thereby, the second passivation structure 2 may form a tunneling junction on the back side of the silicon substrate 9.

According to the above manner, a second passivation structure 2 with a polarity different from that of the first passivation structure 1 is further disposed between the first electrode 81 and the corresponding first passivation structure 1. However, it has been found in studies that since the second passivation structure 2 is relatively thinner and has poor conductivity, carriers (holes or electrons) may pass through the second passivation structure 2 in a tunneling manner, and therefore, the presence of the second passivation structure 2 will not affect transport of the carriers between the first electrode 81 and the silicon substrate 9.

It can be seen that according to the above manner, the second passivation structure 2 may be formed directly by deposition instead of a patterning process.

Referring to FIG. 1, in the related art, in order to form the above N-type doped region 51 and P-type doped region 52 in the existing art, two patterning processes, such as two photolithography processes (mask-exposure development-etching-stripping), two laser processes (mask + laser grooving + etching + stripping), two wet film etching processes (corrosion-resistant layer + printing corrodent + corrosion + corrosion-resistant layer removal), or the like are desired, resulting in a complicated preparation process. Moreover, the patterning processes necessarily uses a mask, a laser, or the like. The mask is desired to be removed (e.g., dissolved) after preparation, which naturally has an effect on the formed structure. The laser removes some film layers by direct irradiation, and due to thermal diffusion and other factors, it is impossible to ensure that the laser can completely remove the target film layer without causing any damage to other film layers no matter how precise the process is.

Therefore, with the implementation of the embodiments of the present disclosure, the preparation process of the HBC solar cell can be simplified and the processing cost of the HBC solar cell can be reduced while performance advantages of the HBC solar cell are reserved. Meanwhile, due to reduced use of masks and lasers, damages to and influences on other structures are reduced in the process, and performance of the solar cell is further improved.

Optionally, the first electrode 81 is a base electrode; and

the second electrodes 82 is an emitter electrode.

As an implementation of the embodiment of the present disclosure, when the second passivation structure 2 is in a full area form, the first electrode 81 corresponding to the patterned (and therefore having a smaller area) first passivation structure 1 may be a base electrode (back surface field), and the second electrode 82 corresponding to the full area (with a larger area) second passivation structure 2 may be an emitter electrode.

Optionally, the first passivation structure 1 includes:

a tunneling passivation sublayer 11; and
a first passivation sublayer 12 on a side of the tunneling passivation sublayer 11 away from the silicon substrate 9, where the first passivation sublayer 12 has the first polarity.

Referring to FIG. 3, as an implementation of the embodiment of the present disclosure, the first passivation structure 1 may specifically include two sublayers, i.e., a tunneling passivation sublayer 11 contacting the silicon substrate 9, and a first passivation sublayer 12 on the tunneling passivation sublayer 11. At least the first passivation sublayer 12 has a first polarity the same as the polarity of the silicon substrate 9, e.g., a doped P-type or N-type.

It will be appreciated that the tunneling passivation sublayer 11 and the first passivation sublayer 12 are both patterned and have a same pattern.

Optionally, the tunneling passivation sublayer 11 is made of a material including at least one of silicon oxide, aluminum oxide, silicon oxynitride or silicon carbide; and

the first passivation sublayer 12 is made of a material including at least one of doped polysilicon or doped silicon carbide.

As an implementation of the embodiment of the present disclosure, in the first passivation structure 1, the tunneling passivation sublayer 11 may be made of a material selected from SiOx, AlOx, SiNOx, SiCx, or any other dielectric material. The tunneling passivation sublayer 11 may be free-dopant and thus may have no polarity.

The first passivation sublayer 12 in the first passivation structure 1 corresponds to the base electrode, and thus has a first polarity the same as the polarity of the silicon substrate 9, which may be specifically a P-type or N-type doped polysilicon, silicon carbide or the like.

For example, if the first polarity is P-type, the first passivation sublayer 12 may be doped with a group III element, such as boron (B); if the first polarity is N-type, the first passivation sublayer 12 may be doped with a V group element, such as phosphorus (P).

With the doped polysilicon, silicon carbide, or the like in the first passivation sublayer 12, optical absorption can be further reduced, while effective doping of a higher concentration can be implemented, thereby reducing the contact resistance of the electrode and improving the cell fill factor.

Optionally, the tunneling passivation sublayer 11 has a thickness ranging from 1 nm to 3 nm; and

the first passivation sublayer 12 has a thickness ranging from 10 nm to 200 nm.

As an implementation of the embodiment of the present disclosure, the tunneling passivation sublayer 11 in the first passivation structure 1 may have a thickness (a dimension in a direction perpendicular to the first side of the silicon substrate 9) ranging from 1 to 3 nm, and further from 1.5 to 2 nm; and the first passivation sublayer 12 may have a thickness ranging from 10 to 200 nm, and further from 80 to 120 nm.

Optionally, the second passivation structure 2 includes:

a dielectric passivation sublayer 21; and
a second passivation sublayer 22 on a side of the dielectric passivation sublayer 21 away from the silicon substrate 9, where the second passivation sublayer 22 has the second polarity.

Referring to FIG. 3, as an implementation of the embodiment of the present disclosure, the second passivation structure 2 may also include two sublayers, i.e., a dielectric passivation sublayer 21 close to the silicon substrate 9, and a second passivation sublayer 22 on the dielectric passivation sublayer 21.

It will be appreciated that the dielectric passivation sublayer 21 and the second passivation sublayer 22 are both full area structures.

Optionally, the dielectric passivation sublayer 21 is made of a material including at least one of polysilicon, amorphous silicon or silicon oxide; and

the second passivation sublayer 22 is made of a material including at least one of doped polysilicon, doped amorphous silicon or doped silicon carbide.

As an implementation of the embodiment of the present disclosure, the dielectric passivation sublayer 21 may be specifically made of a material including amorphous silicon, polysilicon (poly-Si, which may be specifically microcrystalline silicon, nanocrystalline silicon) or the like, and may be a single layer or a stacked structure of layers of various different materials.

The dielectric passivation sublayer 21 may have no polarity, i.e., may be an intrinsic free-dopant layer.

The second passivation sub-layer 22 corresponds to the emitter electrode, and thus has an opposite polarity to the silicon substrate 9, and may be, for example, made of a material including doped polysilicon, amorphous silicon, silicon carbide, or the like, where the doped element may be a group III element (e.g., boron) or a group V element (e.g., phosphorus), or the like.

Optionally, the dielectric passivation sublayer 21 has a thickness ranging from 1 nm to 15 nm; and

the second passivation sublayer 22 has a thickness ranging from 1 nm to 20 nm.

As an implementation of the embodiment of the present disclosure, in the second passivation structure 2, the dielectric passivation sublayer 21 may have a thickness ranging from 1 to 15 nm, and further from 5 to 8 nm; and the second passivation sublayer 22 may have a thickness ranging from 1 to 20 nm, and further from 5 to 15 nm.

Optionally, the second passivation structure 2 is an electron transport layer or a hole transport layer.

Optionally, the second passivation structure 2 has a thickness ranging from 20 nm to 200 nm.

Referring to FIG. 4, as another implementation of the embodiment of the present disclosure, an electron transport layer (ETL) or a hole transport layer (HTL) may be directly used as the second passivation structure 2.

Since the electron transport layer or the hole transport layer itself is used for transporting electrons or holes, it naturally has a polarity although it is free-dopant, i.e., the electron transport layer is N-type and the hole transport layer is P-type.

Therefore, the second passivation structure 2 may directly employ an electron transport layer or a hole transport layer, as long as it is ensured that the polarity of the second passivation structure 2 is opposite to the polarity of the silicon substrate 9.

The second passivation structure 2 (electron transport layer or hole transport layer) as described above may have a thickness ranging from 20 to 200 nm, and further from 50 to 150 nm.

The electron transport layer may be made of a material selected from TiO₂, ZnO, Ta2O₅, Nb₂O₅, CdO, MgO, BaO, SnO₂, LiF, TiN, TaN or the like.

The hole transport layer may be made of a material selected fromMO₃, V2O₅, CrO₃, NiO, Cu₂O, CoO, ReO₃ or the like.

It will be appreciated that the above is merely an exemplary introduction of some structures of the solar cell according to the embodiments of the present disclosure, and the solar cell according to the embodiments of the present disclosure may further satisfy other characteristics.

For example, the silicon substrate 9 may be in the form of monocrystalline silicon, polysilicon, or the like, and doped to produce a desired polarity.

For another example, a textured surface (light trapping surface) may be formed on the second side (light incident side) of the silicon substrate 9 to increase absorption of light.

For another example, referring to FIGS. 3 and 4, a complete front dielectric passivation layer 31, which may be specifically made of the same material as the second passivation sublayer 22 in the second passivation structure 2, may be formed on the second side of the silicon substrate 9.

For another example, referring to FIGS. 3 and 4, an antireflection layer 32 may be further formed on the second side of the silicon substrate 9 (e.g., outside the front dielectric passivation layer 31) to reduce light emission. The antireflection layer 32 may also serve as a protective layer (AR film) that may be specifically made of a material including one or more of silicon oxide, silicon nitride, silicon oxynitride, or the like, and may be a single layer or a stacked structure of multiple layers with different refractive indexes.

For another example, referring to FIGS. 3 and 4, a transparent conductive oxide (TCO) layer 89 for improving the contact resistance may be further provided between the electrode and the second passivation structure 2. The TCO layer 89 may be, for example, a single layer of ITO, IWO, AZO, ICO, IMO, IHO, SCOT or the like, or a stacked structure of multiple layers of different materials.

Referring to FIGS. 3 and 4, in order to prevent the transparent conductive oxide layer 89 from conducting different electrodes, a gap may be provided between transparent conductive oxide layers 89 in different electrode regions.

For another example, referring to FIGS. 3 and 4, the first electrode 81 and the second electrode 82 may be disposed in a same layer (made of a same material simultaneously), and made of a metal material including silver, copper, aluminum, tin-clad copper, silver-clad copper, or a composite electrode made of multiple materials, such as nickel, copper, aluminum, tin, or the like, or may be composite electrodes made of various materials including nickel, copper, aluminum, tin and the like.

In a second aspect, referring to FIGS. 2 to 10, an embodiment of the present disclosure provides a method for preparing a solar cell, where the solar cell is a solar cell according to any embodiment of the present disclosure.

The method provided in the embodiment of the present disclosure is used for preparing the solar cell as described above.

Referring to FIG. 6, a method for preparing a solar cell according to an embodiment of the present disclosure includes the following steps S101 to S103.

At S101, forming a first passivation structure 1 in a first electrode region 91 on a first side of the silicon substrate 9 through a patterning process.

At S102, forming a second passivation structure 2 at least in a second electrode region 92 on the first side of the silicon substrate 9.

At S103, forming a first electrode 81 in a first electrode region 91 and a second electrode 82 in a second electrode region 92 on the first side of the silicon substrate 9 through a patterning process.

To prepare the solar cell, a first passivation structure 1 in the first electrode region 91 may be formed on a first side of the silicon substrate 9 through a patterning process, then a second passivation structure 2 is further formed, and then the first electrode 81 and the second electrode 82 in the first electrode region 91 and the second electrode region 92 are formed, respectively.

Optionally, the second passivation structure 2 in the solar cell completely covers a second side of the silicon substrate 9; and forming the second passivation structure 2 at least in the second electrode region 92 on the first side of the silicon substrate 9 (S102) includes the following operation S1021

At S1021, depositing a second passivation structure 2 completely covered on the first side of the silicon substrate 9.

When the second passivation structure 2 is a full area structure, a complete second passivation structure 2 can be directly deposited without a patterning process.

It will be appreciated that the above is merely an exemplary introduction of the method for preparing a solar cell according to the embodiments of the present disclosure, and the method according to the embodiments of the present disclosure may further satisfy other characteristics.

For example, the silicon substrate 9 may be formed through a czochralski method (CZ), a float zone method (FZ), a casting method, or the like.

For another example, the silicon substrate 9 may be cleaned and polished before being subjected to any other step.

For another example, when the second side (light incident side) of the silicon substrate 9 is textured, the texture may be formed through wet chemical texturing, dry reactive ion etching (RIE), or the like.

For another example, the front dielectric passivation layer 31 as described above may be formed on the second side of the silicon substrate 9 through plasma enhanced chemical vapor deposition (PECVD), hot wire chemical vapor deposition (HWCVD), or the like.

For another example, the antireflection layer 32 (protective layer) as described above may be further formed on the second side of the silicon substrate 9 through PECVD or the like.

For another example, when the first passivation structure 1 is prepared, a complete first passivation structure 1 may be formed first, and then patterned to remove the first passivation structure 1 from the second electrode region 92. The complete first passivation structure 1 may be formed by any one of the following methods.

(1) Forming the tunneling passivation sublayer 11 and the intrinsic a-Si layer sequentially through a low pressure chemical vapor deposition (LPCVD) process, and then doping the intrinsic a-Si layer through high temperature diffusion (e.g., phosphorous diffusion or boron diffusion) to form the first passivation sublayer 12.

Since the diffusion environment contains oxygen, a very thin PSG (silicon oxide containing phosphorus) or BSG (silicon oxide containing boron) structure is synchronously formed on the surface of the first passivation sublayer 12, and may be used as a mask in subsequent processes.

(2) Forming the tunneling passivation sublayer 11 and an in-situ doped amorphous silicon layer sequentially through an LPCVD process, then crystalizing the in-situ doped amorphous silicon layer into polysilicon through high temperature annealing or excimer laser annealing (ELA), and activating the doped element so that the in-situ doped amorphous silicon layer forms the first passivation sublayer 12.

In the high temperature annealing process, a proper amount of oxygen (O₂) may be simultaneously introduced so that a PSG (or BSG) structure is synchronously formed on the surface of the first passivation sublayer 12 and serves as a mask in subsequent processes.

(3) Forming the tunneling passivation sublayer 11, an in-situ doped amorphous silicon layer and a silicon oxynitride layer sequentially through a PECVD process, then crystalizing the in-situ doped amorphous silicon layer into polysilicon through high temperature annealing or ELA, and activating the doped element so that the in-situ doped amorphous silicon layer forms the first passivation sublayer 12.

The silicon oxynitride layer does not belong to the first passivation structure 1, but serves as a mask in subsequent processes.

(4) Forming the tunneling passivation sublayer 11 and an in-situ doped amorphous silicon layer sequentially through a PECVD process, then crystalizing the in-situ doped amorphous silicon layer into polysilicon through high temperature annealing or ELA, and activating the doped element so that the in-situ doped amorphous silicon layer forms the first passivation sublayer 12.

In this method, no mask is formed.

For another example, when formed, the complete first passivation structure 1 may be patterned by any one of the following modes.

Mode I: when the first passivation structure 1 is formed by any one of the above methods (1) to (3), a mask of a PSG (or BSG) structure, a silicon oxynitride layer, or the like is provided, so the mask on the second electrode region 92 may be removed through laser film opening, and then the first passivation structure 1 is removed from the second electrode region 92 through wet etching, while the first passivation structure 1 in the first electrode region 91 is protected by the mask and not etched, thereby completing patterning of the first passivation structure 1. Thereafter, the mask on the first electrode region 91 is removed.

Mode II: when the first passivation structure 1 is formed by the above method (4) and including no mask, ink may be formed on the first electrode region 91 through inkjet printing as a mask, and then the first passivation structure 1 is removed from the second electrode region 92 through wet etching. Thereafter, the ink mask on the first electrode region 91 is removed.

It can be seen that when the complete first passivation structure 1 is formed according to the above modes I and II, it is equivalent to that a mask (for patterning the first passivation structure 1) is formed at the same time of preparing the first passivation structure 1, and thus, a separate step of preparing the mask is omitted, which simplifies the process, and can further reduce one process of preparing the mask (such as forming ink).

It can be seen that when the complete first passivation structure 1 is formed according to the above mode I, in the process of forming the first passivation sublayer 12, the diffused element therein can further form a phosphorus or boron diffusion layer on the second side of the silicon substrate 9 synchronously, which plays a role of phosphorus or boron gettering. Further, the diffusion layer can be naturally removed during the subsequent patterning (wet etching) of the first passivation structure 1, so that no additional process is required, and the structure on the second side of the silicon substrate 9 will not be changed.

For another example, depending on property requirements of the surface of the silicon substrate 9 in the second electrode region 92, a corresponding wet etching process may be selected so that while the first passivation structure 1 is patterned, the surface of the second electrode region 92 of the silicon substrate 9 is also formed into a polished surface, a micro-textured surface, a textured surface, or the like.

For another example, if the surface of the second electrode region 92 of the silicon substrate 9 is desired to be formed into a textured surface while the first passivation structure 1 is patterned, the textured surface on the second side of the silicon substrate 9 may also be formed synchronously.

For another example, the second passivation structure 2 may be formed through physical vapor deposition (PVD), rapid plasma deposition (RPD), or the like.

For another example, while the second passivation sublayer 22 of the second passivation structure 2 is doped (with boron, for example), elements such as oxygen (O), carbon (C), nitrogen (N), and the like may also be used, so as to further widen the band gap, improve the doping quality, and reduce the optical absorption.

For another example, the transparent conductive oxide layer 89 as described above may be further formed on the first side of the silicon substrate 9 through PVD, RPD, or the like, and the transparent conductive oxide layer 89 in the first electrode region 91 and the second electrode region 92 may be separated through a mask and wet etching, laser etching, etchant etching, or the like.

For another example, when the second passivation sublayer 22 is made of an amorphous silicon material, the transparent conductive oxide layer 89 in the first electrode region 91 may be completely removed through laser etching, and the amorphous silicon in the second passivation sublayer 22 on the surface of the first electrode region 91 is crystallized by the energy of laser to reduce a tunneling resistance of the tunneling junction.

For another example, the first electrode 81 and the second electrode 82 may be disposed in a same layer, and formed simultaneously through screen printing, electroplating, PVD (e.g., vapor deposition), or the like.

Example 1

A method for preparing a solar cell according to an embodiment of the present disclosure specifically includes the following steps A101 to A111.

At A101, cleaning and polishing an N-type (first polarity) silicon wafer (silicon substrate 9), to obtain the structure shown in FIG. 7.

At A102, sequentially forming a silicon oxide tunneling layer (tunneling passivation sublayer 11) and an intrinsic a-Si layer on a back side (first side) of the silicon wafer by LPCVD, and forming N-type (first polarity) doping on the intrinsic a-Si layer through subsequent high-temperature phosphorus diffusion, to obtain an N-type amorphous silicon layer (first passivation sublayer 12), and synchronously growing PSG as a mask on the surface.

The silicon oxide tunneling layer has a thickness of 1.5 nm, and the N-type amorphous silicon layer has a thickness of 120 nm.

At A103, forming a textured surface on a light incident side (second side) of the silicon wafer through wet chemical texturing.

At A104, forming an amorphous silicon passivation layer (front dielectric passivation layer 31) on the light incident side of the silicon wafer through PECVD.

At A105, forming an AR film (antireflection layer 32) of a stack of silicon oxide and silicon nitride through PECVD on the light incident side of the silicon wafer, to obtain the structure shown in FIG. 8.

At A106, removing the PSG mask on the N-type amorphous silicon surface in the second electrode region 92 by laser film opening.

At A107, removing the N-type amorphous silicon layer and the silicon oxide tunneling layer in the second electrode region 92 by wet etching, while forming a surface of the second electrode region 92 on the back side of the silicon wafer into a micro-textured surface, to obtain a patterned N-type amorphous silicon layer and a patterned silicon oxide tunneling layer (first passivation structure 1), and to obtain the structure shown in FIG. 9.

After that, the PSG mask is removed by wet etching.

At A108, sequentially forming full-area intrinsic a-Si (dielectric passivation sublayer 21) and boron-doped P-type (second polarity) amorphous silicon (second passivation sublayer 22) on the back side of the silicon wafer through RPD, i.e., forming a second passivation structure 2, to obtain the structure shown in FIG. 10.

The intrinsic a-Si layer may have a thickness of 10 nm, and the P-type amorphous silicon layer may have a thickness of 12 nm.

At A109, forming an ITO layer (transparent conductive oxide layer 89) on the back side of the silicon wafer through PVD.

At A110, removing the ITO layer at an interface of the first electrode region 91 and the second electrode region 92 through laser etching, i.e., separating the ITO layers corresponding to the first electrode 81 and the second electrode 82 respectively.

At A111, forming silver electrodes (the first electrode 81 and the second electrode 82) in the first electrode region 91 and the second electrode region 92, respectively, on the back side of the silicon wafer through screen printing, to obtain the structure shown in FIG. 3.

The solar cell according to the embodiment of the present disclosure is subjected to performance test, and has a photoelectric conversion efficiency of 25.5%.

Therefore, the solar cell according to the embodiment of the present disclosure has excellent performance.

Example 2

A method for preparing a solar cell according to an embodiment of the present disclosure, which is similar to that of example 1.

The difference lies in that in example 2, steps A106 and A107 are performed directly after step A102.

In the patterning of step A107, a textured surface is formed in the second electrode region 92 on the back side of the silicon wafer, while the surface on the light incident side of the silicon wafer is also formed into a textured surface, so that the light incident side of the silicon wafer does not need to be specially textured, that is, the step A103 can be omitted, and steps A104, A105, A108, A109, A110 and A111 can be continuously and sequentially performed.

The solar cell according to the embodiment of the present disclosure is subjected to performance test, and has a photoelectric conversion efficiency of 25.5%.

Therefore, the solar cell according to the embodiment of the present disclosure has excellent performance, and the preparation process is further simplified.

Example 3

A method for preparing a solar cell according to an embodiment of the present disclosure, which is similar to that of example 1.

The difference is that in operation A108 of example 3, an HTL (having a first polarity) is directly formed as the second passivation structure 2 so that a solar cell structure as shown in FIG. 4 is finally obtained.

The HTL is specifically made of vanadium pentoxide (V₂O₅), and has a thickness of 120 nm.

The solar cell according to the embodiment of the present disclosure is subjected to performance test, and has a photoelectric conversion efficiency of 25.6%.

Therefore, the solar cell according to the embodiment of the present disclosure has excellent performance.

It will be appreciated that the above implementations are merely exemplary implementations for the purpose of illustrating the principle of the present disclosure, and the present disclosure is not limited thereto. It will be apparent to one of ordinary skill in the art that various modifications and variations may be made without departing from the spirit or essence of the present disclosure. Such modifications and variations should also be considered as falling into the protection scope of the present disclosure.

SOLAR CELL AND PREPARATION METHOD THEREOF

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