Patent Application
20210167237
This application is filed based upon and claims priority to China Patent Application No. 201720562480.X, filed on May 19, 2017, which is hereby incorporated by reference in its entirety.
The application relates to the field of solar cells, and more particularly relates to a solar cell component and a solar panel.
At present, energy crisis and environmental pollution become increasingly severe, and developing renewable clean energy becomes one of major strategic issues all over the world. Solar energy is unlimited, cleanest and greatest renewable energy. A solar cell is a device capable of directly converting optical energy into electric energy by means of a photoelectric effect or a photochemical effect, which is the most direct manner for utilization of the solar energy.
Along with widespread use of solar cells, some unfavorable factors influencing service life of a cell also arise, and one of them is hot spot. A hot spot of a solar cell refers to a dark spot formed by burnout due to an excessively high temperature of covered parts with temperature rises far higher than uncovered parts when a solar cell component is exposed to the sun and part of the component is covered and cannot work. The hot spot may damage the whole cell component to bring losses. Therefore, in the prior art, influence of a hot spot effect on a cell is usually reduced in a manner of adding bypass diodes.
Now most of solar cells are connected by connecting all chips in series or connecting the chips in series and then in parallel. A measure of connecting bypass diodes in parallel with the chips is usually adopted for preventing the hot spot effect. Connecting all the chips in series will cause many bypass diodes to be used and high cost; and when the chips are connected sequentially in series and then in parallel, the number of the bypass diodes may be reduced, but a plurality of chips share the same bypass diode, and if one chip does not work or is covered, it may influence work of the other chips, so that economic benefits are poor.
One aspect of the application provides a solar cell component, so as to reduce the number of bypass diodes and improve reliability of the component.
The other aspect of the application provides a solar panel, so as to prolong service life of the solar panel, reduce cost and improve economic benefits of the product.
To this end, the application provides the following technical solutions.
The application provides a solar cell component including at least two chip sets connected in series, wherein each chip set includes a plurality of chip units connected in parallel and a bypass diode connected in parallel with the chip units, each chip unit includes one or more photovoltaic chips connected in series, positive poles of the bypass diodes are connected with negative poles of the chip units, and negative poles of the bypass diodes are connected with positive poles of the chip units.
Preferably, the photovoltaic chip is any one of a Copper Indium Gallium Selenide (CIGS) thin film double-glazed module chip, a thin film solar cell chip, a crystalline silicon solar cell chip and an amorphous silicon solar cell chip.
Preferably, each chip set includes three chip units, and each chip unit includes two photovoltaic chips.
Preferably, there are 18 chip sets.
Preferably, a maximum reverse working current of each bypass diode is more than or equal to 15 A.
The application further provides a solar panel including the foregoing solar cell component, a negative electrode and a positive electrode, wherein the negative electrode and the positive electrode are both arranged on lower surfaces of photovoltaic chips, or the negative electrode is arranged on upper surfaces of the photovoltaic chips, and the positive electrode is arranged on the lower surfaces of the photovoltaic chips;
the negative electrode is connected with a negative pole of the solar panel by a first conducting bar and a first bus-bar, the first conducting bar is arranged in a region of the solar cell component, and the first bus-bar is arranged on one side of an upper surface of the solar cell component;
the positive electrode is connected with an positive pole of the solar panel by a second conducting bar and a second bus-bar, the second conducting bar is arranged in the region of the solar cell component, and the second bus-bar is arranged on one side of a lower surface of the solar cell component and is arranged in an opposite direction or the same direction with the first bus-bar; it is necessary to note that “in the region of the solar cell component” may be explained as follows: the solar cell component is irradiated with incident light perpendicular to the solar cell component to obtain a shadow region, and then the first conducting bar and/or the second conducting bar are arranged in the shadow region; and
an insulating film is further placed between the first conducting bar and/or the second conducting bar and the solar cell component.
Preferably, adjacent chip sets are connected by metal sheets.
Preferably, bypass diodes connected in series in the adjacent chip sets are connected by connecting strips.
Preferably, the connecting strips are copper strips.
Preferably, the first conducting bar is connected with the first bus-bar in a welding manner; and the second conducting bar is connected with the second bus-bar in the welding manner.
According to the solar cell component and solar panel provided by embodiments of the application, the photovoltaic chips are grouped, series and parallel connection are combined by providing series connection within parallel connection and parallel connection within series connection, and the plurality of chip units connected in parallel in each chip set share the same bypass diode, so that the number of the bypass diodes is greatly reduced, and it will not only effectively reduce cost, but also improve economic benefits.
In order to describe the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings required to be used in the embodiments will be simply introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in the application. Those of ordinary skilled in the art may further obtain other accompanying drawings according to these accompanying drawings.
In order to make the solutions of the embodiments of the application understood by those skilled in the art better, the embodiments of the application will be further described below in combination with the accompanying drawings and implementation modes in detail.
The solar cell component includes at least two chip sets connected in series. As shown in
In the solar cell component provided by the application, the photovoltaic chips are connected in series at first to obtain the chip units, then the plurality of chip units are connected in parallel, the plurality of chip units being connected in parallel with only one bypass diode, to obtain the chip sets, and the plurality of chip sets are connected in series, so as to obtain the solar cell component of the application. As shown in
During practical application, the number of practically required chip sets may be increased and decreased according to a requirement. When a plurality of such chip sets are required, the plurality of chip sets are sequentially connected in series, as shown in
Series and parallel connection are combined by providing series connection within parallel connection and parallel connection within series connection. By such a structural design, a plurality of chip units share the same bypass diode, and when any chip unit in each chip set is covered and cannot work, a hot spot effect may be avoided by the bypass diode in the chip set, so that the number of the bypass diodes is effectively reduced to reduce cost and improve reliability of the component.
In the solar cell component structure of the application, the photovoltaic chips may be applied to various types, for example, a CIGS thin film double-glazed module chip, a thin film solar cell chip, a crystalline silicon solar cell chip and an amorphous silicon solar cell chip.
Correspondingly, the embodiments of the application further provide a solar panel with the foregoing solar cell component structure.
The solar panel of the application includes the foregoing solar cell component, a negative electrode and a positive electrode, wherein the negative electrode and the positive electrode may both be arranged on lower surfaces of photovoltaic chips, or the negative electrode may be arranged on upper surfaces of the photovoltaic chips, and the positive electrode is arranged on the lower surfaces of the photovoltaic chips. In the structure shown in
As shown in
It is necessary to note that, during practical application, the first conducting bar 11 may be arranged on the upper surfaces of the photovoltaic chips and may also be arranged on the lower surfaces of the photovoltaic chips, and the second conducting bar 21 may be arranged on the lower surfaces of the photovoltaic chips. Correspondingly, for avoiding contact between the conducting bars and the photovoltaic chips, an insulating film may be placed between the first conducting bar and/or the second conducting bar and the solar cell component.
As mentioned above, there may be a plurality of chip sets according to the application requirement, and under such a circumstance, adjacent chip sets may be connected by metal sheets 31, as shown in
In addition, the bypass diodes connected in series in the adjacent chip sets may be connected by connecting strips (for example, copper strips).
It is necessary to note that the first conducting bar 11 may be connected with the first bus-bar 12 in a welding manner and the second conducting bar 21 may also be connected with the second bus-bar 22 in the welding manner.
According to the solar cell component and solar panel provided by the embodiments of the application, the photovoltaic chips are grouped, series and parallel connection are combined by providing series connection within parallel connection and parallel connection within series connection, and the plurality of chip units connected in parallel in each chip set share the same bypass diode, so that the number of the bypass diodes is greatly reduced, and it will not only effectively reduce cost, but also improve economic benefits.
The embodiments of the application are introduced above in detail. The application is elaborated with specific implementation modes in the text, and the above descriptions about the embodiments are merely adopted to help the design of the application to be understood. In addition, those of ordinary skilled in the art may make variations to the specific implementation mode and the scope of application according to the concept of the application. From the above, the contents of the description should not be understood as limits to the application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201720562480.X | May 2017 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2018/087589 | 5/21/2018 | WO | 00 |
