The present invention relates to a solar cell module and a method for manufacturing the solar cell module.
For solar cell modules, various proposals have been made for connecting wiring materials to connection electrodes of solar cells. Patent Document 1 discloses a solar cell module in which connection electrodes of solar cells and wiring materials are connected to each other by means of an adhesive of a thermosetting resin or the like.
Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-206493
In the field of solar cell modules, there are demands to prevent wiring materials from coming off connection electrodes.
A solar cell module according to the present invention includes: solar cells each including a connection electrode on a main surface thereof; an adhesive layer provided on each connection electrode; and a wiring material that is connected to each connection electrode by means of the adhesive layer and is bent, at regions in contact with the adhesive layer, to the connection electrode side from bent portions toward end portions of the adhesive layer.
A method for manufacturing a solar cell module according to the present invention includes: providing an adhesive layer on a connection electrode provided on a main surface of each of solar cells; and connecting, when a wiring material is connected to the connection electrode by means of the adhesive layer, the wiring material to the adhesive layer in a state where the wiring material is bent, at regions in contact with the adhesive layer, to the connection electrode side from bent portions toward end portions of the adhesive layer.
According to the present invention, wiring materials may be prevented from coming off connection electrodes.
[
[
[
[
[
[
[
[
[
[
As illustrated in
The “light-receiving surface” is one of the main surfaces of each solar cell 11, and refers to a surface through which light from the outside mainly enters. For example, 50% to 100% of the light that enters each solar cell 11 enters from the light-receiving surface side. The “rear surface” is one of the main surfaces of each solar cell 11, and refers to a surface opposite the light-receiving surface.
A transparent plate or film (for example, a translucent member such as a glass plate, a resin plate, or a resin film) can be used for the first protecting member 12. Similar to the case of the first protecting member 12, a glass plate, a resin plate, a resin film, or the like can be used for the second protecting member 13. Note that, in the case where light reception from the rear surface side is not assumed, an opaque plate or film may be used for the second protecting member 13, and, for example, a laminate film such as a resin film having aluminum foil therein may be used therefor.
Each solar cell 11 includes: a photoelectric conversion section 21 that receives light such as sunlight to thereby generate carriers (electrons and holes); a light-receiving surface electrode 22 provided on a light-receiving surface of the photoelectric conversion section 21; and a rear surface electrode 23 provided on a rear surface of the photoelectric conversion section 21. In the solar cell 11, the carriers generated by the photoelectric conversion section 21 are collected by the light-receiving surface electrode 22 and the rear surface electrode 23. The light-receiving surface electrode 22 and the rear surface electrode 23 are made of metal. Note that, in order to reduce a light shielding loss, preferably, the light-receiving surface electrode 22 is smaller in area than the rear surface electrode 23.
The photoelectric conversion section 21 includes, for example, a substrate made of a semiconductor material such as crystalline silicon, gallium arsenide (GaAs), or indium phosphide (InP). No particular limitation is imposed on the structure of the photoelectric conversion section 21, and in the present embodiment the structure is described as having a heterojunction between an n-type single-crystal silicon substrate and amorphous silicon. In the photoelectric conversion section 21, for example, an i-type amorphous silicon layer, a p-type amorphous silicon layer doped with boron (B) and the like, and a transparent conductive layer made of a translucent conductive oxide such as indium oxide are laminated in the stated order on a light-receiving surface of the n-type single-crystal silicon substrate. Further, an i-type amorphous silicon layer, an n-type amorphous silicon layer doped with phosphorus (P) and the like, and a transparent conductive layer are laminated in the stated order on a rear surface of the substrate.
The light-receiving surface electrode 22 includes a plurality of (for example, 50) finger sections 24 and a plurality of (for example, 2) bus bar sections 25.
The finger sections 24 and the bus bar sections 25 are placed so as to intersect with each other, and are electrically connected to each other. The finger sections 24 and the bus bar sections 25 are formed by, for example, screen-printing a desired pattern on the transparent conductive layer using a conductive paste in which a conductive filler of silver (Ag) and the like is dispersed in a binder resin.
The finger sections 24 are electrodes that collect carriers evenly across the entire photoelectric conversion section 21. The finger sections 24 are placed so as to be parallel to each other with a predetermined interval (for example, 1.5 mm to 3 mm) over substantially the entire light-receiving surface. The width of each finger section 24 is preferably about 50 μm to 150 μm, and the thickness thereof is preferably about 20 μm to 80 μm.
The bus bar sections 25 are connection electrodes to which the wiring materials 17 are respectively electrically connected with the intermediation of an adhesive layer 27. For example, metal such as copper can be used for the wiring materials 17. For example, a thermosetting adhesive containing an adhesive resin material such as epoxy resin, acrylic resin, or urethane resin can be used for the adhesive layer 27. Further, for example, an anisotropic conductive adhesive in which conductive particles are uniformly dispersed in an adhesive having high insulation properties can also be used for the adhesive layer 27.
The bus bar sections 25 are placed so as to be parallel to each other with a predetermined interval. The bus bar sections 25 mainly serve for power collection of carriers from the finger sections 24 and transmission thereof to the wiring materials 17. The width of each bus bar section 25 is preferably about 1.5 mm to 3 mm, and the thickness thereof is preferably about 20 μm to 160 μm.
Similar to the light-receiving surface electrode 22, the rear surface electrode 23 includes a plurality of finger sections (not illustrated) and a plurality of bus bar sections 26 (connection electrodes). The number of the finger sections of the rear surface electrode 23 may be set to be larger than the number of the finger sections 24, and the interval thereof may be set to be smaller than the interval of the finger sections 24 (for example, number: 250 and interval: 0.5 mm). Note that, in the case where light reception from the rear surface side is not assumed, the rear surface electrode 23 may be obtained by forming a metal film such as a silver (Ag) thin film over the entire rear surface of the photoelectric conversion section 21.
Next, a connection relation between the wiring materials 17 and the solar cells 11 and the like is described in detail.
As illustrated in
The wiring materials 17 are respectively connected to the bus bar sections 25, 26 by means of the adhesive layers 27, and are bent, at regions in contact with the adhesive layers 27, to the bus bar section 25, 26 sides from bent portions 17a to 17d toward end portions of the adhesive layers 27. The “bent portions” refer to folds that are formed in each wiring material 17 by press working or wiring material cutting to be described later.
Each wiring material 17 is provided so as to be laid between a boundary portion 17i on the light-receiving surface of the one solar cell 11 and a boundary portion 17j on the rear surface of the other solar cell 11. The “boundary portions” refer to folds that are formed by press working to be described later such that the wiring material 17 can be laid between the light-receiving surface of the one solar cell 11 and the rear surface of the other solar cell 11 located on the opposite side. The bent portions 17a to 17d are provided on the end portion sides of the wiring material 17 with respect to the boundary portions 17i, 17j. The bent portions 17a, 17d are provided in the vicinities of the end portions of the wiring material 17. The bent portions 17b, 17c are provided in the vicinities of the boundary portions 17i, 17j of the wiring material 17.
Each wiring material 17 includes inclined portions 17e to 17h that are portions that respectively extend from the bent portions 17a to 17d toward the end portions of the adhesive layers 27. The inclined portions 17e to 17h are respectively inclined from the bent portions 17a to 17d to the bus bar section 25, 26 sides. Here, each of the lengths of the inclined portions 17e to 17h is preferably about 10% to 20% (for example, 1 cm to 2 cm) of the length along the extending direction of the wiring material 17, of the plane of the photoelectric conversion section 21.
As illustrated in
Next, a method for manufacturing the solar cell module 10 is described.
First, as illustrated in
Subsequently, as illustrated in an upper part of
Subsequently, the adhesive layers 27 are respectively formed on the bus bar sections 25 and the bus bar sections 26 of two adjacent solar cells 11, and the wiring materials 17 are placed thereon. At this time, the wiring materials 17 are placed in a state where the wiring materials 17 are bent, at the regions in contact with the adhesive layers 27, to the bus bar section 25, 26 sides from the bent portions 17a to 17d toward the end portions of the adhesive layers 27. Specifically, the wiring materials 17 are placed such that: the inclined portions 17e, 17f thereof are respectively located on top of the end portions of the adhesive layer 27 on the bus bar sections 25; and the inclined portions 17g, 17h thereof are respectively located on top of the end portions of the adhesive layer 27 on the bus bar sections 26.
Subsequently, as illustrated in
The present invention includes various embodiments that are not described herein.
For example, the wiring materials 17 do not necessarily need to be bent at all the bent portions 17a to 17d, and may be bent at only part(s) thereof. Specifically, as illustrated in
Further, the wiring materials 17 do not necessarily need to be bent by the die 30 at all the bent portions 17a to 17d. For example, in the step of cutting each wiring material 17, the wiring material 17 may be bent at the bent portions 17a, 17d. Specific description thereof is given. As illustrated in
With the use of the wiring material 17 that is bent at the bent portions 17a, 17d in such a manner, as illustrated in an upper part of
Further, even in the case of using the wiring material 17 bent at the bent portions 17a, 17d, as illustrated in an upper part of
The present application is a continuation under 35 U.S.C. §120 of PCT/JP2012/052094, filed on Jan. 31, 2012, which is incorporated herein by reference.
Number | Date | Country | |
---|---|---|---|
Parent | PCT/JP2012/052094 | Jan 2012 | US |
Child | 14202586 | US |