Patent Application
20170373207
Pursuant to 35 U.S.C. §119(a), this application claims the benefit of earlier filing date and right of priority to Korean Application No. 10-2016-0081134, filed on Jun. 28, 2016, No. 10-2016-0081135, filed on Jun. 28, 2016, and No. 10-2016-0086336, filed on Jul. 7, 2016, the entire contents of all of which are incorporated by reference herein in their entirety.
The present disclosure relates to a solar cell module configured to produce electric power using light, a manufacturing method thereof, an electronic device having the solar cell module, and a manufacturing method thereof.
A solar cell is configured to convert light energy into an electric energy. In general, a solar cell includes a P type semiconductor and an N type semiconductor, and when the solar cell receives light, electric charges migrate to cause a potential difference.
A solar cell module refers to a module having a solar cell to produce electric power from light. A module refers to a constituent unit of a machine or a system and indicates an independent unit assembled to several electronic components or mechanical components to have a specific function. Thus, the solar cell module may be understood as indicating an independent unit having a solar cell and having a function of producing electric power from light.
A small solar cell module used as a driving power source of an electronic component generally has a structure including a printed circuit board (PCB), a solar cell, a protective layer formed on the entire surface of the solar cell, and an encapsulant layer formed between the solar cell and the protective layer. One or more solar cells are mounted on the PCB and electrically connected to an electrode connection part of the PCB. The solar cells are encapsulated by the protective layer and the encapsulant layer.
When a solar cell module is utilized in an electronic device, the electronic device may be driven using 1) indoor light supplied from a fluorescent light or an LED or 2) using natural light provided from the sun, without having to connect a separate power cable to the electronic device. Thus, compared with the related art electronic device which is necessarily to be connected to a separate power cable, the electronic device having a solar cell module is not limited in an installation place.
In spite of the advantages, however, the related art solar cell module has some problems to be solved.
First, component mounting is performed manually. The related art solar cell module has a component vulnerable to heat, and thus, a high temperature surface mount technology (SMT) cannot be applied during a process of manufacturing the solar cell module or during another process of using the solar cell module. Instead, in the related art solar cell module, components are mounted through a manual operation, and thus, it is difficult to secure process reliability and an operation pace is very slow.
Next, the related art solar cell module does not have sufficient light transmittance. Since the solar cell module produces electric power using light incident to a solar cell, high light transmittance is prerequisite for improvement of efficiency of the solar cell module. However, the related art solar cell module has a limitation in enhancement of light transmittance.
Thus, in order to solve the problem of the related art, a new approach to a structure of a solar cell module and a manufacturing method is required.
A solar cell module may be utilized as a sensor. The solar cell module utilized as a sensor may have a solar cell and is driven using electric power produced by the solar cell. Thus, the solar cell module utilized as a sensor may be used for the purpose of sensing a sensing target, without being limited to an installation place.
In spite of the advantages, however, the related art solar cell module has some problems to be solved.
In the related art, components such as a solar cell, a power source module, a communication module, and the like, are separately provided to form a single solar cell module to be utilized as a sensor, and the solar cell and other components are connected to each other by an electric cable. Thus, a connection structure of a cable for electrically connecting the solar cell and the other components is complicated and a large area is required to dispose the solar cell and the components. This leads to an increase in a size of a solar cell module, resultantly limiting an installation place of the solar cell module.
If the solar cell module, which is advantageously driven without being connected to a power cable, is limited in an installation place due to a size thereof, the strengths of the solar cell module cannot be sufficiently brought out, and thus, a design to reduce a size of the solar cell module is required.
Therefore, a first aspect of the detailed description is to provide a solar cell module having a configuration in which a component is automatically mounted. The present disclosure proposes a solar cell module having an encapsulant layer which is not melted or deformed during a process employing a high temperature surface-mount technology (SMT).
A second aspect of the detailed description is to provide a solar cell module in which an encapsulant layer has light transmittance higher than a multilayer structure of a polymer protective layer and an EVA encapsulant layer, and the encapsulant layer forms an outermost layer.
A third aspect of the detailed description is to provide a method for manufacturing a solar cell module having the encapsulant layer mentioned in the first aspect and the second aspect, and a method for manufacturing an electronic device having the solar cell module.
A fourth aspect of the detailed description is to provide a sensor module in which both surfaces of a printed circuit board (PCB) are utilized for mounting a solar cell, a circuit component, and the like, as an example of a solar cell module, and a manufacturing method.
A fifth aspect of the detailed description is to provide a structure of a solar cell module simpler than that of a related art.
A sixth aspect of the detailed description is to provide a solar cell module not limited in an installation place.
A seventh aspect of the detailed description is to provide a structure of a solar cell module smaller than that of a related art, without reducing an installation area of a solar cell required to secure an area to receive light.
In an aspect, a solar cell module may include an encapsulant layer formed of a material including silicon. The encapsulant layer may be formed to cover a solar cell or a primer layer to protect the solar cell. The silicon may have sufficient heat resistance even during a process employing a surface mount technology (SMT) at a high temperature of a maximum of 250° C. The primer layer may be formed between the solar cell and the encapsulant layer to strength bonding force between the solar cell and the encapsulant layer.
The solar cell module may include a solar cell mounted on a printed circuit board (PCB) and the encapsulant layer. The solar cell module may selectively include a dam layer forming edges of the encapsulant layer. The dam layer may be coupled to one surface of the PCB. The dam layer may serve to prevent a liquid encapsulant layer material from flowing to outside of the PCB during a process of manufacturing the solar cell module.
The liquid encapsulant layer material may include a curing agent for curing liquid silicon and a sunscreen to protect the solar cell from ultraviolet ray, as well as silicon.
The encapsulant layer may have high light transmittance in every light wavelength. The encapsulant layer may have light transmittance of 80% or greater with respect to light having a wavelength of 300 nm, light transmittance of 91% to 93% with respect to light having a wavelength of 350 nm, and light transmittance of 93% to 94% with respect to light having a wavelength of 400 nm to 700 nm. Also, the encapsulant layer has light transmittance of 91% to 94% with respect to visible light.
In order to protect the solar cell and have sufficient light transmittance, the encapsulant layer may have a thickness ranging from 200 to 1,000 The encapsulant layer may have a planar shape, may be uneven, or may have a dome shape.
In another aspect, a method for manufacturing a solar cell module may include: dispensing a liquid encapsulant layer material formed of a material including silicon and thermally curing the liquid encapsulant layer material. A method for manufacturing an electronic device may be classified into two embodiments depending on viscosity of an encapsulant layer material.
A manufacturing method of a first embodiment may include: preparing a printed circuit board (PCB) having an electrode connection part; performing a process of forming a dam layer on one surface of the PCB and a process of mounting at least one solar cell, regardless of order; dispensing a liquid encapsulant layer material formed of a material including silicon to cover the solar cell; thermally curing the encapsulant layer material to form an encapsulant layer; and cutting a solar cell module assembly formed by the preparing step and the thermally curing step into a unit size of a solar cell module.
In the first embodiment, the liquid encapsulant layer material may have viscosity of 10 Pa·s or less to have sufficient spreading characteristics.
A manufacturing method of a second embodiment may include: preparing a printed circuit board (PCB) having an electrode connection part; mounting at least one solar cell on one surface of the PCB; dispensing a liquid encapsulant layer material formed of a material including silicon to cover the solar cell; thermally curing the encapsulant layer material to form an encapsulant layer; and cutting a solar cell module assembly formed by the preparing step and the thermally curing step into a unit size of a solar cell module.
In the second embodiment, the liquid encapsulant layer material may have viscosity of 40 Pa·s or less not to flow to outside of the PCB.
Conditions for thermally curing the encapsulant layer material may be varied depending on types of silicon included in the encapsulant layer material. When heat is applied to the encapsulant layer material at about 130° C. to 170° C. for 30 to 150 minutes, the encapsulant layer material may be cured to form an encapsulant layer.
The solar cell module manufactured thusly is free of a problem that the encapsulant layer is melted or deformed during a process of employing a surface mount technology (SMT) of mounting a component by applying heat at a high temperature in a furnace, and thus, the solar cell module may be mounted on a main PCB of an electronic device through the SMT. Here, a temperature of heat applied to the solar cell module during the process employing the SMT is 200° C. to 250° C.
In the present disclosure, both surfaces of the PCB are utilized for mounting a component such that a solar cell, or the like, is stacked on a first surface of the PCB and a circuit component is mounted on a second surface of the PCB. Accordingly, an integrated sensor module may be realized. The first surface and the second surface face in mutually opposite directions, an electrode connection part may be formed on the first surface and a circuit wiring may be formed on the second surface. The solar cell and the encapsulant layer may be mounted on the first surface and a sensor part and the circuit component may be mounted on the second surface.
The first surface may be disposed to face a direction in which light is supplied, and the solar cell required to receive light may be mounted on the first surface and a circuit component not required to receive light may be mounted on the second surface.
The PCB may have a multilayer structure, and a circuit wiring of the PCB may include an inner layer wiring formed within the multilayer structure and an outer layer wiring formed on an outer surface of the multilayer structure. The inner layer wiring and the outer layer wiring may be connected to each other through the multilayer structure and may also be connected to the electrode connection part of the first surface.
The sensor part may be selectively mounted on the first surface or the second surface of the main PCB depending on whether the sensor part is required to be exposed to light or an external environment. An infrared sensor, an ultrasonic sensor, and an illumination sensor are required to be exposed to light or an external environment, so these sensors may be mounted on the first surface. A temperature sensor, a humidity sensor, and a gas sensor are not required to be exposed to light or an external environment, and thus, these sensors may be mounted on the second surface.
A battery may be coupled to the second surface, electrically connected to a circuit wiring, and store electric power produced by the solar cell.
The PCB may be protected by a case and a window. A coupling part may be provided in the case, and the coupling part may be configured to fixate the PCB to the inside of the case.
In order to achieve an object of the present disclosure, a solar cell module of the present disclosure may include a first PCB and a second PCB disposed in a multi-stage to face each other. The first PCB and the second PCB each may have a first surface and a second surface facing in mutually opposite directions. A solar cell may be stacked on the first surface of the first PCB so as to be exposed to light, an electric element may be stacked on the second PCB, and the first PCB and the second PCB may be electrically connected by a connection part.
The solar cell of the first PCB and the electric element of the second PCB may be electrically connected by the connection part, and electric power produced by the solar cell may be used to drive the electric element.
The connection part may be formed by a flexible printed circuit (FPC) or at least one connector. When the connection part is formed by a connector, the connector may be installed between the first PCB and the second PCB to support the first PCB.
The solar cell module may include the first PCB or a sensor part mounted on the first PCB.
The solar cell module may include: a case configured to accommodate the first PCB and the second PCB; and a window formed of a transparent material, covering the solar cell accommodated in the case, and coupled to the case.
The solar cell module may include a sensor part installed on the first surface of the first PCB, and the sensor part may include at least one of an infrared sensor, an ultrasonic sensor, and an illumination sensor and may be disposed to be visually exposed through the window.
The solar cell module may include a sensor part installed on the second PCB, the sensor part may include at least one of a temperature sensor, a humidity sensor, and a gas sensor, and a vent hole may be formed in the case.
A coupling part may be formed in the case to fixate the first PCB and the second PCB at different levels.
The solar cell module may include a power conversion circuit, a battery, or a communication unit, and the power conversion circuit, the battery, and the communication unit may be mounted on the first PCB or the second PCB. The power conversion circuit and the battery may be mounted on the second surface of the first PCB, and the communication unit may be mounted on the first PCB.
Further scope of applicability of the present application will become more apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the scope of the invention will become apparent to those skilled in the art from the detailed description.
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate example embodiments and together with the description serve to explain the principles of the invention.
In the drawings:
Description will now be given in detail of the example embodiments, with reference to the accompanying drawings. For the sake of brief description with reference to the drawings, the same or equivalent components will be provided with the same reference numbers, and description thereof will not be repeated.
A solar cell module 100 refers to a module having a solar cell 120 to produce electric power from light. A module refers to a constituent unit of a machine or a system and represents an independent unit assembled to several electronic components or mechanical components to have a specific function. Thus, the solar cell module 100 may be understood as indicating an independent unit having a solar cell 120 and having a function of producing electric power from light.
The solar cell module 100 includes a printed circuit board (PCB) 110, a solar cell 120, an encapsulant layer 130, a dam layer 140, output terminals 151 and 152, and an electrode connection part 160. Hereinafter, the components will be described in detail.
The PCB 110 supports the entirety of the solar cell module 100 and is electrically connected to the solar cell 120. The PCB 110 is formed of an insulating material. An electrode part of the solar cell 120 and the electrode connection part 160 of the PCB 110 are electrically connected, while a region other than a region in which the electrode connection part 160 is formed is electrically insulated by an insulating material.
The PCB 110 has a first surface and a second surface which face in the opposite directions. The first surface may be referred to as a front surface or an upper surface, and the second surface may be referred to as a rear surface or a lower surface. The electrode connection part 160 electrically connected to the solar cell 120 is exposed to the first surface, and output terminals 151 and 152 outputting power collected from the solar cell 120 are exposed to the second surface. However, alternatively, the output terminals 151 and 152 may be exposed to the first surface of the PCB 110, unlike those illustrated in
The electrode connection part 160 is configured to connect a plurality of solar cells 121, 122, 123, and 124 in series. For example, a plurality of electrode connection parts 162, 163, and 164 are disposed between the solar cells 121, 122, 123, and 124, and each of the electrode connection units 162, 163, and 164 electrically connect two adjacent solar cells 121 and 122, 122 and 123, and 123 and 124. The electrode connection unit 160 is electrically connected to the output terminals 151 and 152.
The solar cell 120 is mounted on the PCB 110 and an electrode part of the solar cell 120 is electrically connected to the electrode connection unit 160 of the PCB 110. The solar cell 120 may be mounted on a first surface of the PCB 110 partially converts the electrode connection unit 160 formed on the first surface of the PCB 110. An electrical connection structure of the electrode part of the solar cell 120 and the electrode connection part 160 of the PCB 110 will be described hereinafter with reference to
One solar cell module may have a plurality of solar cells 121, 122, 123, and 124. The plurality of solar cells 121, 122, 123, and 124 may be dispose to be spaced apart from each other on the same planar surface. The plurality of solar cells 121, 122, 123, and 124 may be connected in series to each other by the electrode connection parts 162, 163, and 164. In
The solar cell 120 is configured to convert light energy into electrical energy. In general, the solar cell 120 is formed of a P type semiconductor and an N type semiconductor and when light is applied to the solar cell 120, electric charges migrate to generate a potential difference.
A structure in which two electrodes of each solar cell 120 are all formed on the opposite surface of a light receiving surface (or a light collecting surface) of the solar cell 120 may be termed a back contact structure. It can be seen that two electrodes of each of the solar cells 121, 122, 123, and 124 are all formed on the opposite surface of the light receiving surface in that the solar cells 121, 122, 123, and 124 illustrated in
In contrast, a structure in which one electrode is formed on each of a light receiving surface and an opposite surface of a solar cell is classified as a general structure. In the general structure, an electrode of a certain solar cell and an electrode of another solar cell adjacent to the certain solar cell (the two electrodes have the opposite polarities) are connected in series by a separate conductor.
The encapsulant layer 130 covers the solar cell 120 to protect the solar cell 120 from external impact, moisture, and the like. In cases where the solar cells 121, 122, 123, and 124 are provided in plurality, the encapsulant layer 130 may cover all of the plurality of solar cells 121, 122, 123, and 124.
The encapsulant layer 130 is transparent. Since the solar cell 120 produces electric power using light, an amount of light transmitted to the solar cell 120 may be increased as transparency of the encapsulant layer 130 is increased.
A primer layer may be formed between the encapsulant layer 130 and the solar cell 120 to bond the encapsulant layer 130 to the solar cell 120. However, in cases where the encapsulant layer 130 is adhesive, the encapsulant layer 130 may not be separated from the solar cell 120, even without the primer layer. Thus, the primer layer is optional, and not essential to the solar cell module 100.
In order to solve the problem of the related art solar cell module, the encapsulant layer 130 of the present disclosure is formed of a material including silicon.
The material including silicon refers to a material including any other material in addition to silicon. Here, the other material includes, for example, a curing agent for curing liquid silicon during a process of manufacturing the solar cell module 100, a sunscreen for blocking ultraviolet ray incident to the solar cell, and an adhesive providing adhesion to the encapsulant layer. In the present disclosure, types of the curing agent, sunscreen, and adhesive are not particularly limited.
Silicon has high heat resistance, relative to a polymer protective layer and an ethylene-vinyl acetate copolymer (EVA) adhesive layer. Thus, the solar cell module 100 having the encapsulant layer 130 formed of a material including silicon does not cause melting or deformation of the encapsulant layer 130 even in a process of applying a high temperature surface-mount technology (SMT). A temperature of the process of applying the SMT is a maximum of 250° C. and silicon has sufficient heat resistance at the temperature.
Thus, according to the present disclosure having the encapsulant layer 130 formed of a material including silicon, it is possible to mount a circuit component by applying a high temperature SMT to the PCB 110 of the solar cell module 100, as well as mounting the solar cell module 100 on a main PCB (a separate component on which the solar cell module 100 is to be mounted) by applying the high temperature SMT.
The solar cell module 100 of the present disclosure has an outermost layer formed of the silicon encapsulant layer 130 on the solar cell 120. Unlike the related art solar cell module having the encapsulant layer and the protective layer, the silicon encapsulant layer 130 also has a function of a protective layer, and thus, the solar cell module 100 of the present disclosure does not require a separate protective layer on the silicon encapsulant layer 130.
Compared with a case in which an encapsulant layer and a protective layer are separately provided, the outermost layer formed only on the silicon encapsulant layer 130 may realize a more reduced thickness. Thus, compared with the related art, in the present disclosure, an amount of light reaching the solar cell 120 may be increased, and thus, efficiency of the solar cell module 100 may be enhanced. Such an effect relates to light transmittance of the silicon encapsulant layer 130 as described hereinafter with reference to
The encapsulant layer 130 preferably has a thickness ranging from 200 to 1,000 μm. If the thickness of the encapsulant layer 130 is smaller than 200 μm, it is difficult to sufficiently protect the solar cell 120. Thus, in order to protect the solar cell 120, the encapsulant layer 130 has a thickness of 200 μm or greater. Conversely, if the thickness of the encapsulant layer 130 exceeds 1,000 μm, light transmittance is degraded to lower efficiency of the solar cell module 100. Thus, preferably, the thickness of the encapsulant layer 130 does not exceed 1,000 μm.
The dam layer 140 is coupled to one surface of the PCB 110. One surface of the PCB 110 indicates a surface on which the solar cell 120 and the encapsulant layer 130 are formed. As mentioned above, opposing surfaces of the PCB 110 are divided into the first surface and the second surface and the solar cell 120 and the encapsulant layer 130 are formed on the first surface. According to the descriptions, the dam layer 140 is coupled to the first surface of the PCB 110.
The dam layer 140 is formed on the edges of the encapsulant layer 130. The dam layer 140 supports the edges of the encapsulant layer 130 and protects the solar cell 120 and the edges of the encapsulant layer 130.
The dam layer 140 serves to prevent a liquid encapsulate layer material from flowing to an outer side of the PCB 110 during a process of manufacturing the solar cell module 100. Thus, when the liquid encapsulant layer material has sufficiently high viscosity, the dam layer 140 is not required and, and in this case, the dam layer 140 may be not be essential but optional.
Hereinafter, various structures of the solar cell module will be described. Cross-sectional views of the solar cell module illustrated in
A PCB 210 includes an electrode connection part 260 and the electrode connection parts 260 are exposed to a first surface of the PCB 210. The electrode connection parts 260 are disposed to be spaced apart from each other and connect solar cells 221, 222, 223, and 224 in series. The solar cells 221, 222, 223, and 224 have two electrodes 221a and 221b, 222a and 222b, 223a and 223b, and 224a and 224b, having the opposite polarities, respectively.
Referring to
The first solar cell 221 has electrode parts 221a and 221b including a negative electrode 221a and a positive electrode 221b, and the negative electrode 221a and the positive electrode 221b are disposed to be spaced apart from each other on the opposite surface of a light receiving surface. When the first solar cell 221 is mounted on the PCB 210, the negative electrode 221a is connected to the first electrode connection part 261 and the positive electrode 221b is connected to the second electrode connection part 262.
The second solar cell 222 has electrode parts 222a and 222b including a negative electrode 222a and a positive electrode 222b, and the negative electrode 222a and the positive electrode 222b are disposed to be spaced apart from each other on the opposite surface of a light receiving surface. When the second solar cell 222 is mounted on the PCB 210, the negative electrode 222a is connected to the second electrode connection part 262 and the positive electrode 222b is connected to the third electrode connection part 263.
The third solar cell 223 has electrode parts 223a and 223b including a negative electrode 223a and a positive electrode 223b, and the negative electrode 223a and the positive electrode 223b are disposed to be spaced apart from each other on the opposite surface of a light receiving surface. When the third solar cell 223 is mounted on the PCB 210, the negative electrode 223a is connected to the third electrode connection part 263 and the positive electrode 223b is connected to the fourth electrode connection part 264.
The fourth solar cell 224 has electrode parts 224a and 224b including a negative electrode 224a and a positive electrode 224b, and the negative electrode 224a and the positive electrode 224b are disposed to be spaced apart from each other on the opposite surface of a light receiving surface. When the fourth solar cell 224 is mounted on the PCB 210, the negative electrode 224a is connected to the fourth electrode connection part 264 and the positive electrode 224b is connected to the fifth electrode connection part 265.
The electrode connection parts 261, 262, 263, 264, and 265 and output terminals 251 and 252 formed on the second surface of the PCB 210 are electrically connected to each other. A structure such as a through hole or a via hole may be formed on the PCB 210, and the electrode connection parts 261 and 265 at both ends are connected to the output terminals 251 and 252 by a wiring passing through the through hole or the via hole. For example, the first electrode connection part 261 is connected to the output terminal 251 on one side and the fifth electrode connection part 265 is connected to the output terminal 252 on the other side. The wiring excluding the electrode connection parts may be formed within the PCB 210.
The plurality of solar cells 221, 222, 223, and 224 are mounted on the first surface of the PCB 210, and an encapsulant layer 230 is disposed on the plurality of solar cells 221, 222, 223, and 224 to protect the plurality of solar cells 221, 222, 223, and 224. An upper surface of the encapsulant layer 230 illustrated in
A primer layer 280 for strengthening adhesion may be provided between the solar cell 220 and the encapsulant layer 230. The primer layer 280 is configured to bond the encapsulant layer 230 to the solar cell 220. However, as mentioned above, the primer layer 280 is not essential to the solar cell module 200.
A dam layer 240 is provided on the edges of the PCB 210. The dam layer 240 has a height higher than a side surface of the encapsulant layer 230 to define a region of the encapsulant layer 230. An outer boundary of the solar cell module 200 may be formed by the dam layer 240.
The solar cell module 300 illustrated in
The concavo-convex portion of the encapsulant layer 330 is formed on the edges of the solar cells 321, 322, 323, and 324. For example, the concavo-convex portion may be formed at a left end portion and a right end portion of the solar cell 320 and between the solar cells 321 and 322, between the solar cells 322 and 323, and between the solar cells 323 and 324.
When the encapsulant layer 330 has the concavo-convex portion, a thickness of the encapsulant layer 330 is thinner than the planar encapsulant layer 230 of
Components not described in
The solar cell module 400 illustrated in
A thickness of the encapsulant layer 430 is most thick in a position facing the middle portion of each of the solar cells 421, 422, 423, and 424 and is reduced toward left and right ends of each of the solar cells 421, 422, 423, and 424. The thickness of the encapsulant layer 430 is most thin at left and right ends of each of the solar cells 421, 422, 423, and 424 and between two solar cells 421 and 422, between two solar cells 422 and 423, and between two solar cells 423 and 424.
When the thickness of the encapsulant layer 430 is increased, light transmittance of the encapsulant layer 430 may be slightly lowered, but the solar cell 420 may be more stably protected from a physical external force. A physical external force applied to the solar cell 420 is highly likely to concentrate largely on a middle portion, rather than on left and right ends of each of the solar cells 421, 422, 423, and 424. Thus, when the thickness of the encapsulant layer 430 is thick in the position facing a middle portion of each of the solar cells 421, 422, 423, and 424, the solar cells 421, 422, 423, and 424 may be sufficiently protected. Also, when the thickness of the encapsulant layer 430 is reduced at left and right ends of each of the solar cells 421, 422, 423, and 424, a degradation of light transmittance may be slightly restrained.
Components not described in
The solar cell module 500 illustrated in
If the liquid encapsulant layer material has sufficiently high viscosity, it may not flow to the outside of the PCB 510. Thus, in cases where the encapsulant layer 530 is formed of an encapsulant layer material with sufficiently high viscosity, the solar cell module 500 may be manufactured without a dam layer. The sufficiently high viscosity will be described hereinafter.
Without the dam layer at the edges of the encapsulant layer 530, a size of the solar cell module 500 may be reduced even it has the solar cells 521, 522, 523, and 524 having the same area. For example, the solar cell module 500 illustrated in
Efficiency of the solar cell module 500 is determined on the basis of an overall size of the solar cell module 500. Thus, when the solar cell module 500 has the solar cells 521, 522, 523, and 524 having the same area, the solar cell module 500 has higher efficiency as a size thereof is reduced. Thus, when the size of the solar cell module 500 is reduced by the width of the dam layer, efficiency of the solar cell module 500 may be enhanced by the corresponding ratio.
Components not described in
The solar cell module 600 illustrated in
The concavo-convex portion of the encapsulant layer 630 is formed at edges of each of the solar cells 621, 622, 623, and 624. For example, a concavo-convex portion may be formed at a left end portion and a right end portion of each of the solar cells 621, 622, 623, and 624, and between two solar cells 621 and 622 and two solar cells 622 and 623, and between two solar cells 623 and 624.
When the encapsulant layer 630 has the concavo-convex portion, a thickness of the encapsulant layer 630 is thinner than a planar encapsulant layer, and thus, light transmittance of the encapsulant layer 630 is increased. Thus, an amount of light incident to the solar cell 620 may be increased and efficiency of the solar cell module 600 may be increased.
Components not described in
The solar cell module 700 illustrated in
A thickness of the encapsulant layer 730 is most thick in a position facing the middle portion of each of the solar cells 721, 722, 723, and 724 and is reduced toward left and right ends of each of the solar cells 721, 722, 723, and 724. The thickness of the encapsulant layer 730 is most thin at left and right ends of each of the solar cells 721, 722, 723, and 724 and between two solar cells 721 and 722, between two solar cells 722 and 723, and between two solar cells 723 and 724.
In a region where the thickness of the encapsulant layer 730 is large, light transmittance of the encapsulant layer 730 may be slightly lowered but the solar cell may be more stably protected from a physical external force.
Components not described in
In the graph, the horizontal axis represents wavelength (nm) of light incident to a solar cell, and the vertical axis represents light transmittance (%) of encapsulant layer.
A solar cell module is configured to produce electric power using light incident to a solar cell. Thus, as light transmittance of an encapsulant layer covering the solar cell is higher, efficiency of the solar cell module is higher. However, UV light having strong energy, relative to visible light or infrared light, may damage the solar cell. For this reason, the encapsulant layer may include a sunscreen.
Referring to the graph of
The encapsulant layer formed of silicon has light transmittance of 80% or greater with respect to light having a wavelength of 300 nm, and more strictly, has light transmittance of 85% or greater. Compared with a polymer protective layer and an EVA bonding layer having light transmittance lower than 80% with respect to light having a wavelength of 300 nm, light transmittance of the encapsulant layer formed of silicon is high.
Also, the encapsulant layer formed of a material including silicon has light transmittance of 91% to 93% with respect to light having a wavelength of 350 nm. Compared with light transmittance of the polymer protective layer and the EVA bonding layer having light transmittance lower than 91% with respect to light having a wavelength of 350 nm, the light transmittance of the encapsulant layer formed of a material including silicon is high.
Also, the encapsulant layer formed of a material including silicon has light transmittance of 93% to 94% with respect to light having a wavelength of 400 nm to 780 nm. Compared with the polymer protective layer and the EVA bonding layer having light transmittance lower than 91% with respect to light having a wavelength of 400 nm to 780 nm, light transmittance of the encapsulant layer formed of a material including silicon is high.
Also, the encapsulant layer formed of a material including silicon has light transmittance of 91% to 94% with respect to visible light. A wavelength range in which a human being may feel or perceive light with his eyes may be slightly different by persons so it may be difficult to clearly determine a range of visible light, but light having a wavelength of about 380 nm to 800 nm corresponds to visible light. Compared with the polymer protective layer and the EVA bonding layer having light transmittance lower than 91% with respect to visible light, light transmittance of the encapsulant layer formed of a material including silicon is high.
To sum up, the encapsulant layer formed of a material including silicon has light transmittance higher than that of the polymer protective layer and the EVA bonding layer in every wavelength. Thus, since the encapsulant layer increases an amount of light incident to the solar cell, relative to the polymer protective layer and the EVA bonding layer, a solar cell module having efficiency higher than that of the related art may be realized.
Hereinafter a method for manufacturing the solar cell module described above will be described.
Referring to
Referring to
The electrode connection part 860 includes a first electrode connection part 861 to a fifth electrode connection part 865. The first electrode connection part 861 to the fifth electrode connection part 865 are disposed to be spaced apart from each other. The number of the electrode connection parts 861, 862, 863, 864, and 865 may be varied depending on a design of a solar cell module.
In
Referring back to
Referring to
The unit grid assemblies 840′ and 840″ may be bonded to the PCB 810 by an adhesive.
The unit grid assemblies 840′ and 840″ may be formed of the same material as that of the PCB 810. For example, the unit grid assemblies 840′ and 840″ and the PCB 810 may be formed of a glass epoxy called an FR4 (frame retardant). Also, the unit grid assemblies 840′ and 840″ and the PCB 810 may be formed of at least one of various materials such as ceramics, a metal, and the like.
Referring to
Since a hole is formed in the unit grid, the first surface of the PCB 810 on which a solar cell is to be mounted is partially exposed through the unit grid. The region exposed through the unit grid may be referred to as an exposed region of the PCB 810.
Referring back to
Referring to
Referring back to
Referring to
However, in the solar cell module, the primer layer 880 is not essential, and thus, step S140 of forming a primer layer is not essential in the method of manufacturing a solar cell module. Thus, step S140 of forming a primer layer may be omitted and step S150 of dispensing an encapsulant layer material may be performed immediately after step S130 of mounting a solar cell.
Referring back to
The liquid encapsulant layer material 830′ includes silicon and may additionally include a curing agent, a sunscreen, and an adhesive. For example, referring to
Referring to
When the liquid encapsulant layer material 830′ has viscosity of 10 Pa·s or less, the liquid encapsulant layer material 830′ may flow to an outer side of the PCB 810. However, the dam layer 840 previously formed on the PCB 810 blocks flow of the liquid encapsulant layer material 830′. Thus, flowing of the liquid encapsulant layer material 830′ to the outside of the PCB 810 is prevented by the dam layer 840.
Referring to
Referring back to
Referring to
Referring back to
As described above, the solar cell modules 500, 600, and 700 of the second embodiment do not include dam layers 240, 340, and 440 (please refer to
Referring to
Referring to
The electrode connection part 960 includes a first electrode connection part 961 to a fifth electrode connection part 965. The first electrode connection part 961 to the fifth electrode connection part 965 are disposed to be spaced apart from each other. The number of the electrode connection parts 961, 962, 963, 964, and 965 may be varied depending on a design of a solar cell module.
In
Referring back to
Referring to
Referring back to
Referring to
However, in the solar cell module, the primer layer 980 is not essential, and thus, step S240 of forming a primer layer is not essential in the method of manufacturing a solar cell module. Thus, step S240 of forming a primer layer may be omitted and step S250 of dispensing an encapsulant layer material may be performed immediately after step S230 of mounting a solar cell.
Referring back to
The liquid encapsulant layer material 930′ includes silicon and may additionally include a curing agent, a sunscreen, and an adhesive. Referring to
The liquid encapsulant layer material 930′ includes silicon and may further include a curing agent, a sunscreen, and an adhesive. Referring to
Referring to
Since the encapsulant layer material 930′ has sufficiently high viscosity, step S120 (please refer to
Referring to
Referring back to
The solar cell modules 100, 200, 300, 400, 500, 600, 700, 800, and 900 described above may be used to supply electric power to an electronic device. Hereinafter, a method for manufacturing an electronic device having a solar cell module will be described.
First, a solar cell module having an encapsulant layer formed of a material including silicon is manufactured (S1100). The method for manufacturing a solar cell module may be referred to the above descriptions related to
Next, the solar cell module is mounted on a main PCB of an electronic device through a surface mount technology (SMT) of mounting a component on a main PCB of an electronic device by applying heat in a furnace (S1200). A temperature of heat applied to the solar cell module through the SMT is about 200° C. to 250° C., and the SMT is performed through an automation process.
Automation equipment mounts the solar cell modules 100, 200, 300, 400, 500, 600, 700, 800, and 900 and various element or various circuits on the main PCB, and when heat is applied, while the solar cell modules 100, 200, 300, 400, 500, 600, 700, 800, and 900 and various element or various circuits mounted on the main PCB are passing through the furnace, the solar cell module and various element or various circuits are bonded to the main PCB.
The solar cell module of the present disclosure has an encapsulant layer formed of a material including silicon, and silicon has sufficient heat resistance even at a temperature of a process to which the SMT is applied. Thus, although the solar cell module is mounted on the main PCB through the high temperature SMT, the encapsulant layer is not melted or deformed.
Hereinafter, a sensor module will be described as an example of a solar cell module. The sensor module described hereinafter includes a solar cell and operates using electric power produced by the solar cell.
The sensor module 1000 includes a PCB 1010, a solar cell 1020, a circuit component 1300, a sensor part 1400, and a battery 1500.
The PCB 1010 has a first surface and a second surface facing in mutually opposite directions. The first surface is illustrated in
The PCB 1010 has an electrode connection part 1060 on the first surface. Electrode connection parts 1062, 1063, and 1064 are disposed to be spaced apart from each other and connect the solar cells 1021, 1022, 1023, and 1024 mounted on the first surface of the PCB 1010 in series.
The PCB 1010 has a circuit wiring 1011 on the second surface. The circuit wiring 1011 electrically connects electronic components mounted on the PCB 1010, and the electronic components refer to various sensors of the sensor part 1400, the circuit component 1300, and the battery 1500.
The electrode connection part 1060 and the circuit wiring 1011 may be electronically connected by a wiring formed within the PCB 1010. A structure of a through hole or via hole may be formed within the PCB 1010, and a wiring disposed in the through hole or via hole may be connected to the electrode connection part 1060 and the circuit wiring 1011.
The solar cell 1020 is mounted on the first surface of the PCB 1010 and electrically connected to the electrode connection part 1060. In
The solar cell 1020 produces electric power required for driving the circuit component 1300 and the sensor part 1400 using light. Since the sensor module 1000 is driven using electric power produced by the solar cell 1020, the sensor module 1000 may be continuously driven even without a separate power cable.
Reference numeral 1030 denotes an encapsulant layer, and 1040 denotes a dam layer. The encapsulant layer and the dam layer are the same as those described above, so description thereof are omitted.
Referring to
The sensor part 1400 is an example of an electric element driven by electric power generated by the solar cell. Since the electric element has a solar cell module, the solar cell module may operate as the sensor module 1000. In the present disclosure, types of the electric element are not limited to the sensor part 1400 and various element may be provided according to a design of the solar cell module. This is not limited to the embodiment described herein.
The sensor part 1400 senses a change in a measurement target. The measurement target refers to a physical amount such as a concentration of a material, light or ultrasonic wave, temperature, humidity, and the like, for example.
The sensor part 1400 may be mounted on the first surface and/or the second surface. A mounting position of the sensor part 1400 may be varied depending on whether the sensor part 1400 is required to be exposed to light or an external environment. The sensor module 1000 is covered by a case 2800 (please refer to
For example, a temperature sensor is configured to sense a temperature through contact with air, a humidity sensor is configured to sense humidity through contact with moisture included in the air, and a gas sensor is configured to contact a gas in the air to sense the presence and absence of a gas and a concentration of the gas. Thus, the temperature sensor, the humidity sensor, and the gas sensor is not required to be exposed to light or an external environment. When a vent hole is provided in the case, air may flow through the vent hole so as to be in contact with the temperature sensor, the humidity sensor, and the gas sensor mounted on the second surface.
Since the sensor module 1000 includes the battery 1500 coupled to the second surface of the PCB 1010, electric power produced by the solar cell 1020 may be stored in the battery 1050. Light may not exist depending on an environment, and thus, without the battery 1500, the sensor module 1000 may operate only when light is present. However, since the sensor module 1000 includes the battery 1500, electric power produced by the solar cell 1020 when light is present may be stored in the battery 1500 and may be used to drive the sensor module 1000 when light is not present.
In the sensor module 1000 described above, the first surface of the PCB 1010 is used to mount the solar cell 1020 and the second surface is used to mount the circuit component 1300, the sensor part 1400, and the battery 1500.
In particular, the sensor module 1000 of the present disclosure may be formed by applying an automation process employing a high temperature SMT. Here, opposing surfaces of the PCB 1010 may be utilized to mount components of the sensor module 1000, while applying the automation process based on the high temperature SMT, because the encapsulant layer 1030 has sufficient heat resistance during the automation process using the high temperature SMT.
The sensor module 1000 of the present disclosure has the encapsulant layer 1030 formed of a material including silicon, and the encapsulant layer 1030 has sufficient heat resistance even in a process using the SMT having a high temperature (maximum of about 250° C. Thus, although the circuit component 1300, the sensor part 1400, and the like, are mounted on the second surface through the process using the high temperature SMT in a state in which the solar cell 1020 and the encapsulant layer 1030 are placed on the first surface of the PCB 1010, the encapsulant layer 1030 is not melted or deformed.
Also, in the sensor module 1000 of the present disclosure, since the solar cell 1020 is mounted on the PCB 1010 and the encapsulant layer 1030 is formed without thermo-compression bonding of lamination, it is possible to first form the solar cell 1020 and the encapsulant layer 1030 on the first surface of the PCB 1010 and subsequently mount the circuit component 1300 on the second surface through the SMT.
That is, in the present disclosure, since the encapsulant layer 1030 is not melted or deformed and since mounting of the solar cell 1020 and forming of the encapsulant layer are conducted without thermo-compression bonding, the process of forming the solar cell 1020 and the encapsulant layer 1030 and a high temperature process of mounting the circuit component 1300, and the like, may be freely changed.
In the solar cell module described above with reference to
A PCB 2010 has a multi-layer structure. For example, a plurality of insulating layers may be sequentially stacked to form the multi-layer structure of the PCB 2010. Multilayer refers to that circuit wirings 2011 provided in the PCB 2010 form layers and connected three-dimensionally, and the number of layers may be a natural number of 2 or greater.
The circuit wirings 2011 include an inner layer wiring 2011a and an outer layer wiring 2011b. The circuit wiring 2011 illustrated in
When the PCB 2010 having the multilayer structure is used in the sensor module 2000, high density component mounting and a reduction in a wiring distance may be realized. Thus, the PCB 2010 having a multi-layer structure is appropriate for miniaturization of the sensor module 2000.
A solar cell 2020 mounted on a first surface and a circuit component 2300 mounted on a second surface may be electrically connected by the outer layer wiring 2011b, the inner layer wiring 2011a penetrating through the multilayer structure, and the electrode connection parts 2061, 2062, and 2064.
The case 2800 covers the PCB 2010 to protect the other components of the sensor module 2000. The case 2800 is configured to protect the other part excluding the front surface of the PCB 2010. Vent holes 2801 and 2802 described above are formed on the case 2800.
Coupling parts 2810 and 2820 having a latch structure may be provided on the case 2800. When both ends of the PCB 2010 are inserted into recesses of the coupling parts 2810 and 2820, the PCB 2010 may be fixated to the coupling parts 2810 and 2820.
The coupling parts 2810 and 2820 serves to make the PCB 2010 spaced apart and farther than electronic component such as the circuit components 2301 and 2302 from a bottom surface of the case such that the electronic component such as the circuit components 2301 and 2302 mounted on the second surface of the PCB 2010 are not in contact with the bottom surface of the case 2800. Accordingly, when the PCB 2010 is fixated by the coupling parts 2810 and 2820, electronic component such as the circuit components 2301 and 2302 are not in contact with the bottom surface of the case 2800.
The window 2900 is disposed to face a front side of the solar cell 2020 to protect the solar cell 2020. The window 2900 is formed of a transparent material to allow light to be supplied to the solar cell 2020.
When the PCB 2010 with the solar cell 2020 and the circuit components 2301 and 2302 mounted on opposing surfaces thereof is inserted into a space formed by the case 2800 and the window 2900 is coupled to the case 2800 to protect the front side of the solar cell 2020, the sensor module 2000 of a single product is formed.
In
A sensor module 3000 of the second embodiment is different from the first embodiment in that the sensor module 300 includes a sensor part 3400 mounted on a first surface. Thus, the same descriptions as those of the sensor module 2000 of the first embodiment will be omitted.
The sensor module 3000 includes a PCB 3010, a solar cell 3020, a circuit component 3300, a sensor part 3400, and a battery 3500.
The sensor part 3400 may be mounted on a first surface and/or a second surface. A mounting position of the sensor part 3400 may be varied depending on whether it is required to be exposed to light or an external environment as mentioned above.
An infrared sensor is configured to sense the presence or absence of an object or measure a distance to the object using infrared ray. An ultrasonic sensor is configured to sense the presence or absence of an object or measure a distance to the object using ultrasonic waves. An illumination sensor is configured to measure brightness of light. Thus, the infrared sensor, the ultrasonic sensor, and the illumination sensor are required to be exposed to light or an external environment, and if not, the infrared sensor, the ultrasonic sensor, and the illumination sensor may lose the function thereof as sensors.
In
A PCB 4010 has a multi-layer structure. For example, a plurality of insulating layers may be sequentially stacked to form the multi-layer structure of the PCB 4010.
In
Vent holes 4801 and 4802 may be selectively formed on the case 4800. For example, when the sensor part 4400 includes sensors which are required to be exposed to light or an external environment, like an infrared sensor, an ultrasonic sensor, and an illumination sensor, the vent hole 4801 and 4802 may be omitted. However, in cases where the sensor part 4400 includes sensor which are not required to be exposed to light or an external environment, like a temperature sensor, a humidity sensor, and a gas sensor, the vent holes 4801 and 4802 is required to be provided in the case 4800 for operations of the sensors.
A size of a recess provided at a left coupling part 4801 corresponds to the sum of thicknesses of the PCB 4010 and a dam layer 4040, and a size of a recess formed at a right coupling part 4802 corresponds to a thickness of the PCB 4010. This because the dam layer 4040 is not present at a right end portion of the PCB 4010.
In
Hereinafter, a method for manufacturing an electronic device having a solar cell module as an example of a sensor module will be described.
Referring to
Referring to
Referring back to
Referring to
Referring back to
Referring to
This may be compared with a solar cell module having an outermost layer including an EVA encapsulant layer and a polymer protective layer. Thus, 1) a case in which a solar cell, an EVA encapsulant layer, and a polymer protective layer (hereinafter, referred to as a “solar cell”, etc.) are first stacked on the PCB and a circuit component is subsequently mounted, and 2) a case in which the circuit component is first mounted on the PCB and the solar cell, or the like, is sequentially mounted will be separately described.
In the first case, when the solar cell, or the like, is first mounted on the PCB, the EVA encapsulant layer and the polymer protective layer of the solar cell may be molted or deformed during a subsequent process of mounting a circuit component. The circuit component is mounted on the PCB through the high temperature SMT, and here, the EVA encapsulant layer and the polymer protective layer are melted or deformed at a temperature of the SMT.
In the second case, when the circuit component is first mounted on the PCB, it is difficult to mount a solar cell, or the like. The solar cell, the EVA encapsulant layer, and the polymer protective layer have a multilayer structure, and these form the multilayer structure through a process of lamination. Lamination refers to a process of forming a multilayer structure by compressing the structure on both sides by applying heat, and if a circuit component is mounted on the PCB, the PCB is not flat, making it impossible to perform compression
In
The method of manufacturing a sensor module illustrated in
Referring to
Order of mounting the circuit component 4300 and the solar cell 4020 on the PCB 4010 may be interchanged, and, in the present disclosure, although the SMT is applied, the encapsulant layer 4030 is not melted or deformed.
In
According to the present disclosure having the configuration described above, since the solar cell module includes the encapsulant layer formed of a material including silicon, the solar cell module has sufficient heat resistance even during the process employing the SMT. Thus, although the solar cell module is mounted on the PCB through the process of employing the high temperature SMT together with the circuit component, the encapsulant layer is prevented from being melted or deformed.
Also, since the encapsulant layer has light transmittance higher than that of the multilayer structure of the polymer protective layer and the EVA encapsulant layer in every light wavelength region, an amount of light incident to the solar cell may be enhanced and efficiency of the solar cell may be improved.
Also, since the present disclosure provides the method of forming the encapsulant layer 1) using an encapsulant layer material having low viscosity with respect to a dam layer or 2) using an encapsulant layer material having high viscosity without a dam layer, the solar cell module applicable to the high temperature SMT may be manufactured using the method. Also, the solar cell module manufactured thusly may be mounted on a main PCB of an electronic device such as a sensor module through the SMT without a problem of melting or deformation.
Also, when an encapsulant layer is formed of a material including silicon, a base for utilizing both surfaces of the PCB to mount the solar cell and the circuit component, respectively, is prepared. Accordingly, the solar cell, or the like, may be mounted on the first surface of the PCB and the circuit component may be mounted on the second surface to form an integrated sensor module.
This effect may not be anticipated in a solar cell module having a polymer protective layer and an EVA encapsulant layer and is an advantageous effect obtained as the polymer protective layer and the EVA encapsulant layer are replaced with the silicon encapsulant layer of the present disclosure.
The solar cell module 5100 refers to a module having a solar cell 5130 to produce electric power from light. A module refers to a constituent unit of a machine or a system and represents an independent unit formed by assembling several electronic components or mechanical components to have a specific function. Thus, the solar cell module may be understood as indicating an independent unit having a solar cell and having a function of producing electric power from light. In particular, the solar cell module 5100 may be utilized for the purpose of a sensor.
The solar cell module 5100 includes cases 5191 and 5192, a window 5180, and components accommodated within the cases 5191 and 5192.
The cases 5191 and 5192 are configured to accommodate the other remaining components of the solar cell module 5100 therein. The cases 5191 and 5192 are configured to protect regions other than a front side of the solar cell module 5100. Referring to
Components accommodated within the cases 5191 and 5192 include a first PCB 5110, a solar cell 5130, and a sensor part 5160 illustrated in
The cases 5191 and 5192 may include a first case 5191 and a second case 5192 which can be coupled to each other.
The first case 5191 may be configured to surround the circumference of the window 5180. The first case 5191 may be formed of an opaque material and may be provided in a region not visually blocking the solar cell 5130. Edges of the first case 5191 may be configured to be coupled to the second case 5192.
The second case 5192 may form a side wall and a bottom of the solar cell module 5100. The second case 5192 may be configured to accommodate the other remaining components of the solar cell module 5100. A vent hole 5192a may be provided in the second case 5192. The vent hole 5192a serves for sensors not required to be exposed to light or an external environment. The vent hole 5192a will be described later.
When the internal components of the solar cell module 5100 are required to be maintained and repaired, the first case 5191 and the second case 5192 may be separated from each other to expose the internal components.
The window 5180 is coupled to the cases 5191 and 5192 to cover the solar cell 5130 accommodated within the cases 5191 and 5192. For example, a circumference of the window 5180 may be coupled to the first case 5191. The window 5180 is disposed to face a front side of the solar cell 5130 to protect the solar cell 5130. The window 5180 is formed of a transparent material to allow light to be provided to the solar cell 5130.
The other remaining components of the solar cell module 5100 are accommodated within a spaced formed by the window 5180 and the cases 5191 and 5192. In
The solar cell 5130 is mounted on the first PCB 5110 and is disposed to be visually exposed through the window 5180. The reason why the solar cell 5130 is disposed to be visually exposed through the window 5130 is to allow the solar cell 5130 to receive light.
The number of solar cells 5130 mounted on the first PCB 5110 may be determined according to a design of the solar cell module 5100. In
Similar to the solar cell 5130, the sensor part 5160 may also be installed on the first PCB 5110 and disposed to be visually exposed through the window 5180. The sensor part 5160 may be required to be exposed to light or an external environment depending on a type of a sensor provided in the sensor unit 5160, and
For example, the infrared sensor is configured to sense the presence or absence of an object or measure a distance to the object using infrared ray. An ultrasonic sensor is configured to sense the presence or absence of an object or measure a distance to the object using ultrasonic waves. An illumination sensor is configured to measure brightness of light. Thus, the infrared sensor, the ultrasonic sensor, and the illumination sensor are required to be exposed to light or an external environment, and if not, the infrared sensor, the ultrasonic sensor, and the illumination sensor may lose the function thereof as sensors.
Thus, the sensor part 5160 illustrated in
Hereinafter, internal components of the solar cell module 5100 which is simplified and has a reduced size, compared with the related art will be described.
The solar cell module 5100 includes the first PCB 5110, a second PCB 5120, the solar cell 5130, an electric element 5140, and the sensor part 5160.
The first PCB 5110 has a first surface 5111 and a second surface 5112 facing in the mutually opposite directions. The first surface 5111 may be referred to as an upper surface or a front surface, and the second surface 5112 may be referred to as a lower surface or a rear surface. The surface exposed through the window 5180 described above with reference to
An electrode connection part 5114 is provided on the first PCB 5110. The electrode connection part 5114 is exposed to the first surface 5111 and electrically connected to solar cell 5130 mounted on the first surface 5111. However, some (5113 and 5115) (please refer to
The second PCB 5120 is disposed to be spaced apart from the first PCB 5110 and face the second surface 5112 of the first PCB 5110. In relation to
Like the first PCB 5110, the second PCB 5120 has a first surface 5121 and a second surface 5122 facing in mutually opposite directions. The first surface 5111 may be referred to as an upper surface or a front surface and the second surface 5112 may be referred to as a lower surface or a rear surface.
A circuit wiring 5123 is formed on the second PCB 5120. The circuit wiring 5123 is electrically connected to an electric element 5140 mounted on the second PCB 5120 and electrically connects various elements and various circuits 5141 and 5142 belonging to the electric element 5140.
The solar cell 5130 is mounted on the first surface 5111 of the first PCB 5110. Since the first surface 5111 of the first PCB 5110 is disposed to face the window 5180 described above with reference to
As the solar cell 5130 is visually exposed through the window 5180, light may be incident to the solar cell 5130 through the transparent window 5180. The solar cell 5130 is configured to produce electric power required for driving the solar cell module 5100 using the light.
The electric element 5140 is mounted on the first PCB or the second PCB 5120. The electric element 5140 is driven with electric power produced by the solar cell 5130. Since the electrode connection part 5114 and the circuit wiring 5123 are electrically connected by a connection part 5150 as described hereinafter, electric power produced by the solar cell 5130 may be used for driving the electric element 5140.
The electronic element 5140 includes various elements and various circuits 5141 and 5142 for driving and controlling the solar cell module 5100. The electric element 5140 includes various element and various components for driving and controlling the sensor module 1000. For example the electric element 5140 may include a driving circuit, a charging circuit, a maximum power point tracking (MPPT) algorithm circuit, a DC-to-DC (boost or buck) converter, a communication unit implementing Internet of things of the solar cell module 5100, a power source of the sensor part 5160, a battery charging circuit, and the like. In
The battery 5170 may be installed in the first PCB 5110 or the second PCB 5120. The battery 5170 stores electric power produced by the solar cell 5130. Electric power produced by the solar cell 5130 may be converted into electric power which can be stored in the battery 5170 by a power conversion circuit and subsequently stored in the battery 5170.
Also, the electric power stored in the battery 5170 may be used for driving the solar cell module 5100, and in particular, when light is not present, the solar cell module 5100 may be driven using electric power stored in the battery 5170.
The connection part 5150 is connected to the first PCB 5110 and the second PCB 5120. The connection part 5150 is configured to electrically connect the electrode connection part 5114 provided in the first PCB 5110 and the circuit wiring 5123 provided in the second PCB 5120. Since the electrode connection part 5114 of the first PCB 5110 is electrically connected to the solar cell 5130 and the circuit wiring 5123 of the second PCB 5120 is electrically connected to the electric element 5140, the solar cell 5130 and the electric element 5140 are resultantly electrically connected to each other by the connection part 5150.
In
In general, a PCB is formed as an insulator such as phenol or an epoxy and thus, the PCB is not flexible and bendable. In contrast, the FPC is flexible and bendable, and thus, a difference in level between the first PCB 5110 and the second PCB 5120 may be freely set. Accordingly, a structure of coupling parts 5192b and 5192c (please refer to
Since the solar cell 5130 mounted on the first PCB 5110 and the electric element 5140 mounted on the second PCB 5120 are electrically connected by the connection part 5150, electric power produced by the solar cell 5130 may be controlled by the electric element 5140. Thus, the solar cell 5130 and the electric element 5140 may be mounted on different PCBs.
In order to produce sufficient electric power, a larger number of the solar cells 5130 may be provided, and in order to receive light, a plurality of solar cells 5130 are required to be disposed on one surface (surface on which light is directly shed) of the PCB. In addition, in order to drive the solar cell module 5100, the electric element 5140 is required to be mounted on the PCB. In the related art, since a solar cell and an electric element are mounted on the same PCB, the single PCB should be divided into a region for mounting the solar cell and a region for mounting the electric element. In the related art structure, in order to increase the number of solar cells, an area of a solar cell module is inevitably increased.
In contrast, according to the structure of the present disclosure, the first surface of the first PCB may entirely be utilized for mounting the solar cell 5130. The first surface 5111 of the first PCB 5110 may not need to be divided into a mounting region of the solar cell 5130 and a mounting region of the electric element 5140. The sensor part 5160 may be inevitably mounted on the first surface 5111 of the first PCB 5110, but it may also be possible for the sensor part 5160 to be mounted on the second PCB 5120 depending on a type of a sensor belonging to the sensor part 5160.
Instead, the second PCB 5120 is utilized as a mounting region of the electric element 5140. In addition, since the second PCB 5120 is disposed at a level different from that of the first PCB 5110 to overlap the first PCB 5110, rather than being disposed to be coplanar with the first PCB 5110, an area occupied by the solar cell module 5100 may be reduced, relative to the related art.
Also, since the structure of the present disclosure does not require a complicated cable connection between components, the structure of the solar cell module 5100 may be simplified. In particular, the structure in which components are connected by a cable causes a difficulty of maintenance, and thus, the structure of the present disclosure facilitates maintenance of the solar cell module 5100.
Also, when the area occupied by the solar cell module 5100 is reduced, limitations in an installation place of the solar cell module 5100 may be mostly resolved. The solar cell module 5100 having the solar cell 5130 is limited in direction because it is required to be disposed to face a light incident direction to receive light and limited in size because it should be installed in a narrow space according to circumstances. However, when the area occupied by the solar cell module 5100 is reduced by the structure of the present disclosure, the limitation in size may be resolved, and thus, the limitation in an installation place may also be resolved.
Electrode connection parts 5113, 5114, and 5115 are formed on a first surface 5111 of the first PCB 5110. The solar cells 5131 and 5132 have two electrodes 5131a and 5131b and 5132a and 5153b, respectively, and the electrodes 5131a and 5131b and 5132a and 5132b are electrically connected to the electrode connection parts 5113, 5114, and 5115. Accordingly, the solar cells 5131 and 5132 are connected in series.
The encapsulant layer and/or the protective layer 5135 are configured to cover the solar cell. The encapsulant layer and/or the protective layer 5135 may be formed of various materials. For example, the polymer protective layer may be bonded to the solar cell by an EVA encapsulant layer or a PC (polycarbonate) encapsulant layer. Also, in this case, the polymer protective layer corresponds to an outermost layer protecting the solar cell.
In another example, the encapsulant layer may be formed of a material including silicon. Silicon advantageously has high heat resistance, relative to an EVA encapsulant layer. Since silicon may form an outermost layer of the solar cell module, a separate protective layer is not required.
A circuit wiring 5123 is formed on the second PCB 5120, and the circuit wiring 5123 may be exposed to the first surface 5121 of the second PCB 5120. The electric element 5140 and the battery 5170 is mounted on the first surface 5121 of the second PCB 5120 and electrically connected to the circuit wiring 5123.
In
Coupling parts 5192b and 5192c may be provided on the cases 5192. Referring to
The first PCB 5110 and the second PCB 5120 may be fixated to different levels by the coupling parts 5192b and 5192c and may face each other. In the present disclosure, a structure for fixating the first PCB 5110 and the second PCB 5120 is not limited and any structure may be used as long as it can fixate the first PCB 5110 and the second PCB 5120 are fixated at different levels.
In
First, referring to
Next, referring to
The silicon encapsulant layer is formed by dispensing a liquid encapsulant layer material 5135′ to the solar cell and applying heat Q to thermally cure the liquid encapsulant layer material 5135′. If the liquid encapsulant layer material 5135′ does not include an adhesive, a primer layer providing adhesive strength may be formed between the solar cell 5130 and the encapsulant layer 5135.
At least some of electric elements, in addition to the solar cell 5130, may be mounted on the first PCB 5110, and types and number of electric elements may be varied depending on a design. An electric element mounted on the first PCB 5110 may be mounted on the first surface 5111 or the second surface 5112 of the first PCB 5110. A configuration in which an electric element is mounted on the first PCB 5110 is illustrated in
In particular, since the silicon encapsulant layer 5135 has high heat resistance as mentioned above, in cases where an electric element is intended to be mounted on the first PCB 5135, an automation process employing a high temperature SMT may be used. The automation process employing the high temperature SMT refers to a process of bonding a PCB and an electric element by applying heat in a furnace. Forming the silicon encapsulant layer 5135 on the first PCB 5110 and mounting an electric element may be interchanged in order.
Thereafter, as illustrated in
First, referring to
Next, referring to
The encapsulant layer 5135 may be formed of EVA or PC as described above, and the protective layer 5136 may be formed of a polymer. During the lamination process, as the encapsulant layer 5135 are melted and thermally cured, the protective layer 5136 is bonded to the solar cell 5130.
As described above, at least some of electric elements, in addition to the solar cell 5130, may be mounted on the first PCB 5110, and types and number of the electric elements mounted on the first PCB 5110 may be varied depending on a design. An electric element mounted on the first PCB 5110 may be mounted on the first surface 5111 of the second surface 5112 of the first PCB 5110. A configuration in which an electric element is mounted on the first PCB 5110 is illustrated in
Next, referring to
Hereinafter, other embodiments of the solar cell module will be described and a redundant description will be omitted.
In
A circuit wiring 5216 is formed on the second surface 5212 of the first PCB 5210, and an electric element 5240 and a battery 5270 are mounted on the second surface 5212 and electrically connected to the circuit wiring 5216. The electric element 5240 has a concept of including various elements and various circuits 5241 and 5242, and thus, at least one of the electric elements 5240 mounted on the second surface 5212 may be a power conversion circuit. Electric power produced by the solar cell is converted to be appropriately stored in a battery 5270 by the power conversion circuit and subsequently stored in the battery 5270.
A sensor part 5260 is mounted on the first surface 5221 or the second surface 5222 of the second PCB 5220. A mounting position of the sensor part 5260 may be varied depending on whether the sensor part 5260 is required to be exposed to light or an external environment as described above.
A temperature sensor is configured to sense a temperature through contact with air, a humidity sensor is configured to sense humidity through contact with moisture included in the air, and a gas sensor is configured to contact a gas in the air to sense the presence and absence of a gas and a concentration of the gas. Thus, the temperature sensor, the humidity sensor, and the gas sensor is not required to be exposed to light or an external environment. When the vent hole 5192a (please refer to
When the sensor part 5260 includes at least one of the temperature sensor, the humidity sensor, and the gas sensor, the sensor part 5260 is preferably mounted on the second PCB 5220 to protect the corresponding sensor. Also, when the sensor part 5260 is mounted on the second PCB 5220, the first surface 5221 of the first PCB 5210 may be entirely utilized to dispose the solar cells.
A communication unit realizing Internet of things may be mounted on the first PCB or the second PCB. If a multi-stage structure of the solar cell module interferes with signal transmission and reception of the communication unit, the communication unit is preferably mounted on the first PCB. The reason is because, when the communication unit is mounted on the first PCB, a factor interfering with signal transmission and reception may be eliminated.
In
In
The connection part 5350 may be formed by connectors 5351, 5352, and 5353, and the first PCB 5310 and the second PCB 5320 are electrically connected by the connectors 5351, 5352, and 5353. An element such as a socket, or the like, capable of connecting the connectors 5351, 5352, and 5353 to the first PCB 5310 and the second PCB 5320 is provided, and when both ends of the connectors 5351, 5352, and 5353 are connected to the element, the first PCB 5310 and the second PCB 5320 may be electrically connected.
The connectors 5351, 5352, and 5353 may be provided in plurality. In
The connectors 5351, 5352, and 5353 may be configured to support the second surface 5312 of the first PCB 5310. As illustrated in
A battery 5370 may be mounted on the second surface 5312 of the first PCB 5310, and thus, both surfaces 5311 and 5312 of the first PCB 5310 may be utilized for mounting a component, and similarly, both surfaces 5321 and 5322 of the second PCB 5320 may also be utilized for mounting a component. In
The second PCB 5320 may be fixated to the cases 5191 and 5192 (please refer to
In a state in which the second PCB 5320 is fixated to the cases 5191 and 5192, when the connectors 5351, 5352, and 5353 are connected to the second PCB 5320 and the first PCB 5310 is installed on the connectors 5351, 5352, and 5353, component mounting of the solar cell module 5300 within the cases 5191 and 5192 is completed.
In this manner, when the both surfaces 5311 and 5312 of the first PCB 5310 and both surfaces 5321 and 5322 of the second PCB 5320 are utilized for mounting components of the solar cell module 5300, a size of the solar cell module 5300 may be further reduced.
According to the present disclosure having the configuration as described above, since the first PCB is utilized for stacking the solar cells and the second PCB is utilized for mounting the other remaining circuit components, a larger light receiving area may be secured, compared with a configuration in which the solar cells and circuit components are all mounted on a single PCB.
Also, in the present disclosure, since the first PCB and the second PCB are disposed at different levels to face each other, an area occupied by the solar cell module may be reduced, relative to the related art.
Also, in the present disclosure, since the size of the solar cell module is reduced, a limitation in an installation place of the solar cell module may be resolved.
The solar cell module, the electronic device having the same, and the method for manufacturing the solar cell module and the electronic device described above are not limited to the configurations and methods of the embodiments of the present disclosure described above and the entirety or a portion of the embodiments may be selectively combined to form various modifications.
The foregoing embodiments and advantages are merely by example and are not to be considered as limiting the present disclosure. The present teachings can be readily applied to other types of apparatuses. This description is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. The features, structures, methods, and other characteristics of the example embodiments described herein may be combined in various ways to obtain additional and/or alternative example embodiments.
As the present features may be embodied in several forms without departing from the characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, unless otherwise specified, but rather should be considered broadly within its scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalents of such metes and bounds are therefore intended to be embraced by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2016-0081134 | Jun 2016 | KR | national |
| 10-2016-0081135 | Jun 2016 | KR | national |
| 10-2016-0086336 | Jul 2016 | KR | national |
