1. Field of the Invention
The claimed invention relates to a solar cell, solar cell module, and solar cell system.
2. Description of Related Art
Solar cells are expected as a new power supply of less impact on the environment because they can convert sunlight into electricity. In recent years, uses of solar cells have been widely promoted in power generating systems for general households, solar cell systems at large-scale power plants and the like, and in applications for various products. In such a situation, research and development for higher performance further promote uses of solar cells.
A solar cell system consists of, for example, one or more solar cell modules. A solar cell module may be made of a single solar cell or multiple solar cells connected in series, depending on the purposes of a solar cell system or applied products.
In some cases, an electrode for a solar cell consists of a transparent conductive film and collecting electrodes on the transparent conductive film. Preferably, such a transparent conductive film has a low resistance and is capable of large output power. For a conventional solar cell having a transparent conductive film, a transparent conductive film made from indium oxide containing tin (ITO) is known. In order to obtain higher performance of a solar cell, it is desirable to further lower the resistance and increase the solar cell output power.
A transparent conductive film is used for a liquid crystal display and the like. For example, a transparent conductive film made from indium oxide containing cerium (Ce) as an additive is disclosed. (For instance, Japanese patent publication No. Hei8-260134)
However, when a transparent conductive film made from indium oxide containing cerium is used for a solar cell, it is difficult to obtain a good output power.
An embodiment provides a solar cell including a crystalline semiconductor substrate having one of a p-type and an n-type material, a p-type semiconductor layer formed on a first principal surface of the substrate, a first transparent conductive film comprising indium oxide containing hydrogen and cerium and formed on the p-type semiconductor layer, an n-type semiconductor layer formed on a second principal surface of the substrate, and a second transparent conductive film comprising indium oxide containing no cerium and formed on the n-type semiconductor layer.
Another embodiment provides a solar cell module including one or more solar cells, wherein the one or more solar cells comprise a crystalline semiconductor substrate including one of a p-type and an n-type material, a p-type semiconductor layer formed on a first principal surface of the substrate, a first transparent conductive film including indium oxide containing hydrogen and cerium and formed on the p-type semiconductor layer;
an n-type semiconductor layer formed on a second principal surface of the substrate, and a second transparent conductive film including indium oxide containing no cerium and formed on the n-type semiconductor layer.
Yet another embodiment provides a solar cell system including one or more solar cell modules, wherein the one or more solar cell modules include one or more solar cells, wherein the one or more solar cells include a crystalline semiconductor substrate comprising one of a p-type and an n-type material, a p-type semiconductor layer formed on a first principal surface of the substrate, a first transparent conductive film including indium oxide containing hydrogen and cerium and formed on the p-type semiconductor layer, an n-type semiconductor layer formed on a second principal surface of the substrate, and a second transparent conductive film including indium oxide containing no cerium and formed on the n-type semiconductor layer.
The embodiments can provide a solar cell, a solar cell module, and a solar cell system including a transparent conductive film that is capable of providing good power output.
a) is a top plan view of a solar cell according to an embodiment.
b) is a bottom plan view of the solar cell according to the embodiment.
a) is a cross-sectional view of the solar cell according to the embodiment, taken along lines A-A′ in
b) is an enlarged view of vicinities of surfaces of the solar cell.
Embodiments of the invention are explained with reference to the drawings. In the respective drawings referenced herein, the same constituents are designated by the same reference numerals and duplicate explanation concerning the same constituents is omitted. All of the drawings are provided to illustrate the respective examples only. No dimensional proportions in the drawings shall impose a restriction on the embodiments. For this reason, specific dimensions and the like should be interpreted with the following descriptions taken into consideration. In addition, the drawings include parts whose dimensional relationship and ratios are different from one drawing to another.
Prepositions, such as “on”, “over” and “above” may be defined with respect to a surface, for example a layer surface, regardless of that surface's orientation in space. The preposition “above” may be used in the specification and claims even if a layer is in contact with another layer. The preposition “on” may be used in the specification and claims when a layer is not in contact with another layer, for example, when there is an intervening layer between them.
A solar cell according to an embodiment is explained below by referring to
Solar cell 1 is, for example, a bifacial light-receiving type solar cell. Solar cell 1 has substrate 2 including an n-type monocrystalline silicon. Substrate 2 has a resistance of approximately 1 Ω·am and a thickness of approximately 200 μm. An upper surface of substrate 2 has a texture structure. Substrate 2 has substantially intrinsic i-type amorphous silicon layer 3 having a thickness of approximately 5 nm, p-type amorphous silicon layer 4 having a thickness of approximately 5 nm, and transparent conductive film 5 having a thickness of approximately 100 nm, in this order, on an approximately entire area of the upper surface of substrate 2. Upper surface side collecting electrode 6 is further disposed on transparent conductive film 5.
The rear surface of substrate 2 also has a texture structure. Substrate 2 has substantially intrinsic i-type amorphous silicon layer 3 having a thickness of approximately 5 nm, n-type amorphous silicon layer 8 having a thickness of approximately 5 nm, and transparent conductive film 9 having a thickness of approximately 100 nm, in this order, on an approximately entire area of a rear surface of substrate 2. Rear surface side collecting electrode 10 is further disposed on transparent conductive film 9. Solar cell 1 according to the embodiment has a so-called HIT structure having a photoelectric converter comprised of the above-identified configuration. As shown in
In the embodiment, a number of pyramidal shapes are irregularly formed in such a manner that pyramidal shapes cover substantially the entire area of the surfaces of substrate 2 with the texture structure. Each of the pyramidal shapes has an irregular height (or size) and may partially overlap with neighboring pyramidal shapes. Note that peaks and valley parts of each pyramidal shape may be somewhat rounded.
Upper surface side collecting electrode 6 contains silver (Ag) as an essential ingredient and has a thickness of approximately 20 to 60 μm. Upper surface side collecting electrode 6 includes finger electrodes 6a, 6a, . . . and two bus bar electrodes 6b and 6b. Finger electrodes 6a, 6a, . . . have multiple narrow straight line-shapes disposed parallel to each other at a predetermined interval to cover substantially the entire area of the surface of transparent conductive film 5. Bus bar electrodes 6b and 6b have strip-shapes disposed parallel to each other at a predetermined interval, and are connected to finger electrodes 6a. In the embodiment, each of finger electrode 6a, 6a, are disposed at approximately 2 mm intervals. Rear surface side collecting electrode 9 contains silver (Ag) as an essential ingredient and has a thickness of approximately 20 to 60 μm. Rear surface side collecting electrode 10 includes finger electrodes 10a, 10a, . . . and two bus bar electrodes 10b and 10b. Finger electrodes 10a, 10a, . . . have multiple narrow straight line-shapes disposed parallel to each other at a p redetermined interval to cover substantially the entire area of the surface of transparent conductive film 5. Bus bar electrodes 10b and 10b have strip-shapes disposed parallel to each other at a predetermined interval, and are connected to finger electrodes 10a. In the embodiment, each of finger electrode 10a, 10a, . . . are disposed at approximately 1 mm intervals.
In the embodiment, transparent conductive film 5 includes indium oxide as an essential ingredient and also contains hydrogen (H) and cerium (Ce). In other words, transparent conductive film 5 includes hydrogen (H), cerium (Ce), indium (In), and oxygen (0), and contains indium oxide(In2O3) doped with hydrogen (H) and cerium (Ce) as impurities.
Transparent conductive film 5 is formed by numerous pillar-like structures that contain substantially polycrystalline structures bristled up to fill the surface of p-type amorphous silicon layer 4. Further, transparent conductive film 5 has very little amorphous portions.
Hydrogen (H) content in transparent conductive film 5 is preferably in the order of 1021 atoms/cm3 or higher, and more preferably, in the order of 1021 atoms/cm3. Note that the amount of hydrogen content here is a value taken from transparent conductive film 5 at its intermediate region of the film in its thickness direction, and is approximately equivalent to an average content in transparent conductive film 5, except in the vicinities of its both surfaces. The concentration of hydrogen contained in transparent conductive film 5 is preferably greater in the substrate 2 side than in the upper side collecting electrode 6 side, except in the vicinities of both surfaces. And more preferably, the concentration increases gradually toward substrate 2 side.
Transparent conductive film 5 has X-ray diffraction peaks obtained in the orientation of the (400) and (440) planes. Here, the measurement is taken by measuring X-ray diffraction (XRD) from transparent conductive film 5 on the texture structure in solar cell 1. X-ray diffraction measurements as used herein refer to X-ray diffraction measurements taken from transparent conductive films on texture structures in the solar cell. (Note that X-ray diffraction measurements include measurements on texture structures that are formed before upper side collecting electrode 6 or rear side collecting electrode 10 and the like are formed.)
Transparent conductive film 5 in the orientation of the (400) plane has X-ray diffraction peaks when the 2θ-diffraction angle (θ: X-ray diffraction angle) is 35.31°-35.41°, preferably, 35.33°-35.40°, and more preferably, 35.36°-35.38°.
Transparent conductive film 5 in the orientation of the (400) plane has a half-width of X-ray diffraction peaks at 0.10°-0.30°, preferably, at 0.15°-0.25°, and more preferably, at 0.18°-0.20°.
Transparent conductive film 5 in the orientation of the (440) plane has X-ray diffraction peaks when the 28-diffraction angle (θ: X-ray diffraction angle) is 50.80°-50.96°, preferably, 50.85°-50.95°, and more preferably, 50.90°-50.91°.
Transparent conductive film 5 in the orientation of the (440) plane has a half-width of X-ray diffraction peaks at 0.10°-0.35°, preferably, at 0.15°-0.30°, and more preferably, at 0.17°-0.22°.
A cerium (Ce) content in transparent conductive film 5 is preferably between 1.0×1020 atoms/cm3 or more and 1.0×1021 atoms/cm3 or less, and more preferably between 2.5×1020 atoms/cm3 or more and 8.0×1020 atoms/cm3 or less, and further more preferably is between 4.0×1020 atoms/cm3 or more and 6.0×1020 atoms/cm3 or less, and still further more preferably is between 4.5×1020 atoms/cm3 or more, and 5.2×1020 atoms/cm3 or less.
In the embodiment, transparent conductive film 9 includes indium oxide as an essential ingredient and contains hydrogen (H) and tungsten (W). In other words, transparent conductive film 9 includes hydrogen (H), tungsten (W), indium (In), and oxygen (O), and contains indium oxide(In2O3) doped with hydrogen (H) and tungsten (W) as impurities.
Transparent conductive film 9 is formed by numerous pillar-like structures that contain substantially polycrystalline structures bristled up to fill the surface of n-type amorphous silicon layer 8. Further, transparent conductive film 9 contains a very little amount of amorphous portions.
Tungsten (W) content in transparent conductive film 9 is, for example, 2.0×1020 atoms/cm3, and hydrogen (H) content is preferably 1.0×1020 atoms/cm3 or higher, more preferably, in the order of 1020 atoms/cm3, for instance, 9.0×1020 atoms/cm3 . Note that the amount of hydrogen content here is a value taken from transparent conductive film 9 at its intermediate region in its thickness direction, and is approximately equivalent to an average content in transparent conductive film 5, except in in the vicinities of its both surfaces.
The concentration of hydrogen contained in transparent conductive film 9 is preferably greater in the substrate 2 side of the film than in the rear side collecting electrode 10 side of the film, except in the vicinities of both surfaces of transparent conductive film 9. And more preferably, the concentration increases gradually toward the substrate 2 side.
Hereinafter, a solar cell module having solar cells according to the embodiment is explained by referring to
As shown in
Each of L-shaped connecting members 32, 33 (i.e., connecting members to draw output power) is connected by solder to connecting members 25, 25, . . . of solar cells 1, 1 disposed at the both endmost positions in power drawing sides in each of outermost solar cell arrays 26, 26. L-shaped connecting members 32, 33 include copper flat wires and the like coated with a solder layer.
Note that an insulating member (not indicated in the figures), such as an insulating sheet like polyethylene terephthalate(PET), is disposed at a crossing part between L-shaped connecting members 30 and
L-shaped connecting members 32, and a crossing part between L-shaped connecting member 31 and L-shaped connecting member 33.
Although not shown in figures, each of the endmost portions of L-shaped connecting member 30, L-shaped connecting member 31, L-shaped connecting member 32, and L-shaped connecting member 33 is lead into terminal box 34 located at the center of the upper side of the rear surface of solar cell module 20, via a notch (not shown) in rear surface side cover 23. Between L-shaped connecting member 32 and L-shaped connecting member 30, and between L-shaped connecting member 30 and L-shaped connecting member 31, and between L-shaped connecting member 31 and L-shaped connecting member 33 are each connected with a bypass diode (not shown) in terminal box 34.
A solar cell system according to the embodiment is, for example, a solar cell system comprised of multiple solar cell modules 20 each fixed on a roof surface of a private residence with fixing screws.
Each of neighboring solar cell modules 20 are connected and laid out from a lower side (eave side) to an upper side (ridge side) in a terraced pattern (stair case pattern).
Hereinafter, a method of manufacturing a solar cell according to the embodiment is explained.
First, an n-type monocrystalline silicon substrate whose upper surface has an orientation of the (100) plane is washed so that impurities are removed. Then, upper and rear surfaces of the monocrystalline silicon substrate are etched anisotropically with an etching liquid containing an NaOH aqueous solution. In this way, substrate 1 having a texture structure formed on its upper and rear surfaces is prepared.
Next, i-type amorphous silicon layer 3 and p-type amorphous silicon layer 4 are formed in this order by using an RF plasma CVD method, for example, on the upper surface of n-type monocrystalline silicon substrate 2 where the texture structure is formed. The conditions for the RF plasma CVD method may be at a frequency of about 13.56 MHz, a formation temperature of approximately 100° C.-300° C., a reaction pressure of about 5 Pa-100 Pa, and an RF power of about 1 mW/cm2-500 mW/cm2. Further, i-type amorphous silicon layer 7 and n-type amorphous silicon layer 8 are formed in this order on the rear surface of substrate 2 where a texture structure is formed.
Next, transparent conductive film 5 including indium oxide containing hydrogen (H) and cerium (Ce) as impurities is formed on p-type amorphous silicon layer 4 by using the ion plating method in an atmosphere of Ar/O2 gas mixture and steam at a room temperature. As an ingredient for forming the film, a sintered body of In2O3 powder that contains a predetermined amount of cerium oxide (CeO2) powder as a dopant is used. In this case, the amount of cerium (Ce) contained in transparent conductive film 5 can be changed by using the sintered body where the content of cerium oxide (CeO2) powder is changed.
Then, transparent conductive film 9 including indium oxide containing hydrogen (H) and tungsten (W) as impurities is formed on n-type amorphous silicon layer 8 by using the ion plating method in an atmosphere of Ar/O2 gas mixture and steam at a room temperature. As an ingredient for forming the film, a sintered body of In2O3 powder that contains a predetermined amount of tungsten oxide (WO3) as a dopant is used.
Note that according to the manufacturing method of the embodiment, crystallization of transparent conductive films 5, 9 is preferably proceeded by annealing at approximately 200° C. for 1 hour. In the embodiment, the heating treatment for forming the electrodes described below combines with the annealing treatment. In such a case, and in other cases where the annealing process is combined, a separate annealing process may not be required.
Next, a silver paste prepared by kneading fine silver (Ag) powder into a thermosetting resin, such as an epoxy resin, is formed into a predetermined shape on a predetermined region on transparent conductive film 5 by using the screen printing method. Also, a silver paste prepared by kneading fine silver (Ag) powder into a thermosetting resin, such as an epoxy resin, is formed into a predetermined shape on a predetermined region on transparent conductive film 9 by the using the screen printing method. The respective silver pastes are cured by heating at approximately 200° C. for 1 hour. Thus, upper side collecting electrode 6 and rear side collecting electrode 10 are formed. As described above, solar cell 1 according to the embodiment is formed in this manner.
Next, one of solar cell 1 is connected to another solar cell 1 in neighboring solar cells 1, 1 by connecting members 25, 25, . . . that are disposed to face bus bar electrodes 6b, 6b of upper side collecting electrode 6 of one of solar cell 1, and also to face bus bar electrodes 10b, 10b of rear side collecting electrode 10 of another solar cell 1 via a solder or an adhesive agent containing a thermosetting resin. Then, by heating up and cooling down while a pressure is applied in this state, each connecting member 25, 25, . . . is fixed and connected on respective bus bars 6b, 10b, thus forming an array of solar cells 26. Note that in case the adhesive agent containing thermosetting resin is used, an adhesive agent including a thermosetting resin containing a conductive filler may be used.
Next, multiple solar cell arrays 26 are prepared. Then, after making an structural body where connecting members 29, 29, 29, and connecting members 30, 31, 32, 33 are attached, upper side cover 22, a sealing sheet that becomes a filling material, the structural body, a sealing sheet that becomes a filling material, and rear surface side cover 23, are layered in this order and pressed at approximately 150° C. for about 10 minutes in a vacuum. Thereafter, the filling materials are completely cured by heating at approximately 150° C. for 1 hour. Lastly, solar cell module 20 is completed by attaching terminal box 34 and frame 28.
In the embodiment, because transparent conductive film 5 contains hydrogen (H) within a range of a predetermined amount as well as indium oxide including cerium (Ce) within a predetermined amount range, transparent conductive film 5 has a low resistance and is capable of increasing the output power of solar cell 1.
Especially, because 2θ-diffraction angles (θ: x ray diffraction angle) at the X-ray diffraction peak as well as the half-width are both in preferable ranges in the orientation of the (400) plane in transparent conductive film 5, transparent conductive film 5 has a lower resistance and the output power of solar cell 1 can be even higher.
Further, because 2θ-diffraction angles (θ: x ray diffraction angle) at the X-ray diffraction peak as well as the half-width are both in preferable ranges in the orientation of the (440) plane in transparent conductive film 5, transparent conductive film 5 has a lower resistance and the output power of solar cell 1 can be even higher.
As described above, because transparent conductive film 5 has a low resistance, it is possible to improve the output power of solar cell 1 while reducing the area of upper surface side collecting electrode 6. As a result, the amount of materials used for upper surface side collecting electrode 6 can be reduced and thus can lower the manufacturing cost.
From the measurement results of electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), and X-ray diffraction (XRD), transparent conductive films 5, 9 according to the embodiment are found to include pillar-like structures that contain substantially polycrystalline structures, and a very little amount of amorphous portions. X-ray diffraction peaks in cerium oxide and tungsten oxide cannot be observed from the X-ray diffraction measurements of transparent conductive films 5, 9.
In addition, when the hydrogen (H) content is in the order of 1021 atoms/cm3, the cerium (Ce) content is desirably between 1.0×1020 atoms/cm3 or greater and 1.0×1021 atoms/cm3 or less, preferably between 2.5×1020 atoms/cm3 or greater and 8.0×1020 atoms/cm3 or less, more preferably between 4.0×1020 atoms/cm3 or greater and 6.0×1020 atoms/cm3 or less, and even more preferably between 4.5×1020 atoms/cm3 or greater and 5.2×1020 atoms/cm3 or less.
Although not shown in
Solar cells used in examples 1-3 are the same as that of the embodiment as used in
Note that the X-ray diffraction measurements are taken from the transparent conductive films formed on the texture structure on solar cell 1, before upper side collecting electrode 6 and rear side collecting electrode 10 are formed. Transparent conductive films used here are annealed at approximately 200° C. for 1 hour. Note that the measurements of 2θ are taken every 0.002°.
Note that the X-ray diffraction measurements are taken from the transparent conductive films on the texture structure on solar cell 1 before upper surface side collecting electrode 6 and rear side collecting electrode 10 are formed. Transparent conductive films used here are annealed at approximately 200° C. for 1 hour. Note that the measurements of 2 θ are taken every 0.002°.
The result indicates that shapes and sizes of crystalline particles and pillar-like structures in transparent conductive films that include indium oxide containing cerium and hydrogen in the order of 1021 atoms/cm3 are different from those in transparent conductive films that include indium oxide containing cerium but the hydrogen content is in the order of 1020 atoms/cm3 or less. It is not clear why transparent conductive film 5 exhibits a lower resistance and a higher solar cell output power when the transparent conductive film includes indium oxide containing cerium and hydrogen of the order of 1021 atoms/cm3. However, it is highly possible that the shapes and sizes of crystalline particles and pillar-like structures specified by the above-mentioned x-ray diffraction are greatly contributing to the superior characteristics.
In the experiment, transparent conductive film 5 in solar cell 1 in example 4 formed on p-type amorphous silicon layer 4 includes indium oxide containing 3.1×1021 atoms/cm3 of hydrogen (H) and 7.0×1020 atoms/cm3 of cerium (Ce). For the comparative example, a solar cell with a transparent conductive film that includes indium oxide containing no cerium but containing 3.4×1021 atoms/cm3 of hydrogen (H) and 2.0×1020 atoms/cm3 of tungsten (W) is used as a substitute for transparent conductive film 5. Note that a transparent conductive film on n-type amorphous silicon layer 8 used both in example 4 and the comparative example includes indium oxide containing hydrogen of 3.1×1021 atoms/cm3 and tungsten (W) of 6.0×1020 atoms/cm3.
For transparent conductive films on n-type amorphous silicon layer, a transparent conductive film that includes indium oxide containing a little amount of hydrogen in the order of 1020 atoms/cm3 and tungsten (W) may be preferable as mentioned above. However, a transparent conductive film that includes indium oxide containing a little amount of hydrogen in the order of 1020 atoms/cm3 and cerium (Ce) may be also used.
Also as shown in
In the instant case, because the transparent conductive film used on the p-type amorphous silicon layer contains a high content of hydrogen in the order of 1021 atoms/cm3, it is preferable to use the transparent conductive film including indium oxide containing tungsten (W) and a high content of hydrogen that is 1.0×1021 atoms/cm3 or more, and even more preferably in the order of 1021 atoms/cm3 on the n-type amorphous silicon layer, for a less complicated manufacturing procedure.
The above-mentioned solar cells according to the embodiment are explained referring to so-called HIT solar cells. However, the embodiment can be conveniently applied to various kinds of solar cells such as monocrystalline solar cells and polycrystalline solar cells. Also, the embodiment can be applied to bifacial light-receiving type solar cells and monofacial light-receiving type solar cells.
In the embodiments explained above, the embodiments have two upper surface side collecting electrodes and two rear surface side collecting electrodes; however, the number, the shape, etc. of the electrodes may be changed accordingly.
Upper surface side collecting electrode and/or rear surface side collecting electrode may have a busbarless structure, in which no bus bar is formed.
In the above-mentioned embodiment, the p-type silicon layer is disposed at a major incident light receiving side, however, an n-type silicon layer may be disposed instead. In such a case, it is preferable to change the pitch, etc. of the finger electrodes of the collecting electrodes.
Further, the solar cell module according to the embodiment is not limited to the above-embodiments. The module may not have a frame, for example. Also, the solar cell modules may be used for applied products.
The solar cell module according to the embodiment may be used for bifacial light-receiving type solar cell modules, and both the upper surface side cover and the rear surface side cover may be glass plates.
The solar cell system according to the embodiment is explained, for example, for residential households. However, the embodiment is not limited to this application, and layout methods of solar cell modules may be flexibly changed.
As described above, the embodiment can be used in the field of photovoltaic power generation and the like, because the embodiment can provide a solar cell that produces an excellent output power, and a solar cell module and a solar cell system containing the solar cells.
The invention includes other embodiments in addition to the above-described embodiments without departing from the spirit of the invention. The embodiments are to be considered in all respects as illustrative, and not restrictive. The scope of the invention is indicated by the appended claims rather than by the foregoing description. Hence, all configurations including the meaning and range within equivalent arrangements of the claims are intended to be embraced in the invention.
Number | Date | Country | Kind |
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2009-216298 | Sep 2009 | JP | national |
This application for the invention titled “SOLAR CELL, SOLAR CELL MODULE AND SOLAR CELL SYSTEM” is based upon and claims the benefit of priority under 35 USC 119 from prior International Application No. PCT/JP2010/066072, filed on Sep. 16, 2010, which claims the benefit of Japanese Patent Application No. 2009-216298, filed on Sep. 18, 2009; the entire contents of which are incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/JP2010/066072 | Sep 2010 | US |
Child | 13422181 | US |