We have successfully grown high density porous column TiO2 structures wherein the pore extend normal to the substrate, and extend directly from the top of the film to the bottom of the film. The method of the invention is depicted generally at 10 in
Preparation of a cold wall CVD chamber 16 includes maintaining both the precursor and the transport line at a temperature of between about 20° C. to 80° C. The substrate temperature is maintained between about 200° C. to 800° C.; and the pressure in the CVD chamber is maintained in the range of between about 1 torr. to standard atmosphere; The reaction gas is oxygen and the carrier gas is argon. Alternatively, other inert gases, such as nitrogen, may be used as the carrier gas. The cold wall CVD chamber has the first substrate placed therein, 18. The chamber is vacated to below 1 mtorr., and then oxygen or an oxygen and argon mixture is used to fill the chamber to the required growth pressure. The carrier gas flow and oxygen flow are in the range of between about 1 sccm to 1000 sccm.
The fabrication process for a photovoltaic cell follows the method of the invention, which provides fabrication techniques for a variety of photovoltaic cells, all of which use a porous column TiO2 film as a support structure for various photosensitive materials. Once the deposition parameters are set in the CVD chamber, a transparent conducting electrode is formed 20 on the first substrate. The transparent conducting electrode may be formed of indium-tin-oxide (ITO) or SnO2:F, deposited to a thickness of between about 10 nm to 1000 nm by CVD, PVD, spin-coating or electroplating. Next, a porous column TiO2 film is deposited by CVD 22 to a thickness of between about 100 nm to 50 μm.
Once the porous column TiO2 film is deposited, the stage is set for fabrication of a photovoltaic cell, which may be of the dye-sensitized solar cell (DSSC) type, having a liquid or solid-state electrolyte therein, or an ordered organic-inorganic heterojunction photovoltaic cell, as depicted by the three branches in
One form of the method of the invention includes sensitization 24 of the TiO2 film using cis-RuL2 (NCS)2, or other suitable dye sensitizers.
When a liquid electrolyte is used with the DSSC, a top electrode is formed 26 on a second substrate. The top electrode is then placed in contact with the sensitized porous column TiO2 film. The edge of the combined structure is sealed 30, and the space between the top and the bottom electrodes is filled 32 with a liquid electrolyte, such as lodolyte, an iodide-based redox electrolyte, to complete the cell.
When a solid-state electrolyte is used, such as spiro-MeOTAD, it may be deposited 34 on the sensitized porous column TiO2 film by spin coating, CVD, screen printing, or any other state-of-the-art technique. A top electrode is formed 36 on the solid state electrolyte to complete the photovoltaic cell.
Alternatively, for an ordered organic-inorganic heterostructure photovoltaic cell, after step 22, a light absorbing conjugated polymer, such as P3HT, is deposited 40 and a top electrode is formed 42 to complete the photovoltaic cell.
Referring now to
Thus, a method for fabricating a porous column TiO2 film photovoltaic cell has been disclosed. It will be appreciated that further variations and modifications thereof may be made within the scope of the invention as defined in the appended claims.