This application claims the priority benefit of Korean Patent Application No. 10-2013-0044370, filed on Apr. 22, 2013 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.
1. Field of the Invention
The present invention relates to a solar cell, and more particularly to a solar cell having an improved configuration.
2. Description of the Related Art
Recently, due to depletion of existing energy resources, such as oil and coal, interest in alternative sources of energy to replace the existing energy resources is increasing. Most of all, solar cells are popular next generation cells to convert sunlight into electrical energy using semiconductor devices.
Solar cells may be classified into silicon solar cells, compound solar cells, dye sensitized solar cells, thin film solar cells, and the like. These solar cells may be fabricated via formation of various layers and electrodes based on design. The design of various layers and electrodes may determine the efficiency of a solar cell. In one example, excessively increasing the area of an electrode may increase the amount of materials used and deteriorate the efficiency of a solar cell due to surface recombination. On the other hand, excessively reducing the area of an electrode may cause difficulty in sufficient collection of electric charge. Thus, there is a need to design an electrode having an area, a configuration, and the like to maximize solar cell efficiency.
Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a solar cell, which has excellent characteristics and a low defect rate.
In accordance with one embodiment of the present invention, the above and other objects can be accomplished by the provision of a solar cell including a semiconductor substrate, an emitter layer formed at the semiconductor substrate, the emitter layer being a conductive type different from that of the semiconductor substrate, a back surface field layer formed at the semiconductor substrate, the back surface field layer being the same conductive type as that of the semiconductor substrate, a first electrode electrically connected to the emitter layer, and a second electrode electrically connected to the back surface field layer, wherein the second electrode includes a plurality of finger electrodes arranged at a first pitch, wherein the back surface field layer includes a plurality of first portions corresponding to the respective finger electrodes, and wherein at least one connecting projection protrudes from any one of each finger electrode and each first portion.
The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. However, it will be understood that the present invention should not be limited to the embodiments and may be modified in various ways.
In the drawings, to clearly and briefly explain the present invention, illustration of elements having no connection with the description is omitted, and the same or extremely similar elements are designated by the same reference numerals throughout the specification. In addition, in the drawings, for more clear explanation, the dimensions of elements, such as thickness, width, and the like, are exaggerated or reduced, and thus the thickness, width, and the like of the present invention are not limited to the illustration of the drawings.
In the entire specification, when an element is referred to as “including” another element, the element should not be understood as excluding other elements so long as there is no special conflicting description, and the element may include at least one other element. In addition, it will be understood that, when an element such as a layer, film, region or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present. On the other hand, when an element such as a layer, film, region or substrate is referred to as being “directly on” another element, this means that there are no intervening elements therebetween.
Referring to
The semiconductor substrate 110 consists of an area where the dopant layers 20 and 30 are provided, and a base area 10 where the dopant layers 20 and 30 are not provided. The base area 10, for example, may be formed of silicon containing a first conductive dopant. The silicon may be single-crystal silicon or poly silicon, and the first conductive dopant may be an n-type dopant, for example. That is, the base area 10 may be formed of single-crystal silicon or poly silicon doped with a group-V element, such as phosphorous (P), arsenic (As), bismuth (Bi), antimony (Sb), or the like.
Through the use of the base area 10 containing the n-type dopant described above, the emitter layer 20 containing a p-type dopant is formed on a first surface (hereinafter referred to as “front surface”) of the semiconductor substrate 110, thereby forming a p-n junction therebetween. When light is emitted to the p-n junction, electron-hole pairs are generated, and the electrons generated by the photo-electric effect move to a second surface (hereinafter referred to as “back surface”) of the semiconductor substrate 110 to thereby be collected by the second electrode 34, and the holes move to the front surface of the semiconductor substrate 110 to thereby be collected by the first electrode 24. This results in generation of electrical energy. In this case, as the holes, which have mobility lower that of the electrons, move to the front surface of the semiconductor substrate 110 rather than the back surface of the semiconductor substrate 110, the conversion efficiency of the solar cell 100 may be enhanced. However, naturally, the present invention is not limited thereto and the base area 10 may contain a p-type dopant.
The front surface and/or the back surface of the semiconductor substrate 110 may be a textured surface provided with protrusions and recesses of various shapes (such as a pyramidal shape). The textured front and/or back surface of the semiconductor substrate 110, provided with the protrusions and recesses, may attain increased surface roughness, which may reduce reflectance of incident light to the front surface and the back surface of the semiconductor substrate 110. Consequently, the quantity of light reaching the p-n junction at an interface of the semiconductor substrate 110 and the emitter layer 20 may be increased, resulting in minimized light loss of the solar cell 100.
The emitter layer 20 containing a second conductive dopant may be formed on the front surface of the semiconductor substrate 110. In the present embodiment, the second conductive dopant of the emitter layer 20 may be a p-type dopant including a group-III element, such as boron (B), aluminum (Al), gallium (Ga), indium (In), or the like. In this case, according to the present embodiment, the emitter layer 20 may take the form of a homogeneous emitter having a uniform doping density. However, naturally, the present invention is not limited thereto, and the emitter layer 20 may take the form of a selective emitter. This will be described below in detail.
The emitter layer 20 may be formed by doping the semiconductor substrate 110 with the second conductive dopant using various doping methods. In one example, thermal diffusion, ion doping, laser doping, and other doping methods may be used.
The anti-reflection film 22 and the first electrode 24 are formed over the semiconductor substrate 110, more particularly, on the emitter layer 20 formed on the semiconductor substrate 110.
The anti-reflection film 22 may be formed over substantially the entire front surface of the semiconductor substrate 110 except for a portion where the first electrode 24 is formed. The anti-reflection film 22 serves to reduce reflectance of incident light to the front surface of the semiconductor substrate 110 and to passivate defects present in a surface or a bulk of the emitter layer 20.
Through reduction in the reflectance of incident light to the front surface of the semiconductor substrate 110, the quantity of light reaching the p-n junction at the interface of the semiconductor substrate 110 and the emitter layer 20 may be increased. As such, short-circuit current Isc of the solar cell 100 may be increased. In addition, passivation of defects present in the emitter layer 20 may remove a recombination site of a minority carrier, which may increase the open-circuit voltage Voc of the solar cell 100. As such, the anti-reflection film 22 may increase the open-circuit voltage and the short-circuit current of the solar cell 100, thereby enhancing the efficiency of the solar cell 100.
The anti-reflection film 22 may be formed of one or more of various materials. In one example, the anti-reflection film 22 may have a single film structure or a multi-layer film structure formed of at least one material selected from a group consisting of silicon nitride, silicon nitride containing hydrogen, silicon oxide, silicon oxide nitride, aluminum oxide, hafnium oxide, MgF2, ZnS, TiO2, and CeO2. However, naturally, the present invention is not limited thereto, and the anti-reflection film 22 may be formed of one or more of various other materials. In addition, an additional front passivation film (not shown) may be interposed between the semiconductor substrate 110 and the anti-reflection film 22. This falls within the scope of the present invention. The anti-reflection film 22 may be formed using various methods, such as vacuum deposition, chemical vapor deposition, spin coating, screen printing, spray coating, or the like.
The first electrode 24 is electrically connected to the emitter layer 20 through an opening perforated in the anti-reflection film 22 (i.e. the first electrode 24 penetrating the anti-reflection film 22). The first electrode 24 may be formed of one or more of various materials and may have any one shape among various shapes. This will again be described below.
The back surface field layer 30 is formed on the back surface of the semiconductor substrate 110 and contains the first conductive dopant at a higher doping density than that of the semiconductor substrate 110. In the present embodiment, the back surface field layer 30 may contain an n-type dopant including a group-V element, such as phosphorous (P), arsenic (As), bismuth (Bi), antimony (Sb), or the like.
In this case, according to the present embodiment, the back surface field layer 30 includes a plurality of first portions 30a in the form of local portions adjoining to the second electrode 34 (for example, in contact with the second electrode 34). That is, the back surface field layer 30 defines a local back surface field to prevent, for example, damage to the semiconductor substrate 110 during formation of the back surface field layer 30. However, naturally, the present invention is not limited to the above description, and the back surface field layer 30 may define a selective back surface field. This will again be described below in more detail. Various other alternative embodiments are possible.
The back surface field layer 30 may be formed by doping the semiconductor substrate 110 with the first conductive dopant using various doping methods. In one example, thermal diffusion, ion doping, laser doping, and other doping methods may be used. In the present embodiment, the back surface field layer 30 is formed via implementation of an additional doping process using an n-type dopant (such as a process separate from formation of the second electrode 34). For reference, assuming that the back surface field layer 30 is a p-type, the back surface field layer 30 may be formed as the second electrode 34 is formed of, for example, aluminum, and is subjected to thermal treatment for diffusion of aluminum (i.e. the back surface field layer 30 being formed during formation of the second electrode 34).
In addition, the passivation film 32 and the second electrode 34 may be disposed at the back surface of the semiconductor substrate 110.
The passivation film 32 may be formed over substantially the entire back surface of the semiconductor substrate 110 except for a portion where the second electrode 34 is formed. The passivation film 32 serves to passivate defects present in the back surface of the semiconductor substrate 110, thereby removing a recombination site of a minority carrier. This may increase the open-circuit voltage of the solar cell 100.
The passivation film 32 may be formed of a transparent insulator material to permit transmission of light. Thus, as light may also be introduced into the back surface of the semiconductor substrate 110 through the passivation film 32, the efficiency of the solar cell 100 may be enhanced. That is, the solar cell 100 of the present embodiment is a double-sided light receiving type solar cell to permit introduction of light through both surfaces thereof.
In one example, the passivation film 32 have a single film structure or a multi-layer film structure formed of at least one material selected from a group consisting of silicon nitride, silicon nitride containing hydrogen, silicon oxide, silicon oxide nitride, aluminum oxide, hafnium oxide, MgF2, ZnS, TiO2, and CeO2. However, naturally, the present invention is not limited to the above description, and the passivation film 32 may be formed of one or more of various other materials. The passivation film 32 may be formed using various methods, such as vacuum deposition, chemical vapor deposition, spin coating, screen printing, spray coating, or the like.
The second electrode 34 is electrically connected to the back surface field layer 30 through an opening perforated in the passivation film 32 (i.e. the second electrode 34 penetrating the passivation film 32). The second electrode 34 may be formed in any one shape among various shapes.
The first electrode 24 described above may be formed by perforating an opening in the anti-reflection film 22 and performing plating, deposition, or the like in the opening. Likewise, the second electrode 34 described above may be formed by perforating an opening in the passivation film 32 and performing plating, deposition, or the like in the opening. Alternatively, the first and second electrodes 24 and 34 having the above described shape may be formed by applying paste for formation of the first and second electrodes respectively to the anti-reflection film 22 and the passivation film 32 via, for example, screen printing, and thereafter performing fire-through, laser firing contact, or the like on the applied paste. In this case, an additional process of perforating the opening is unnecessary. In this context, in a case in which the back surface field layer 30 is formed separately from the second electrode 34 as described above, precise alignment between the back surface field layer 30 and the second electrode 34 is necessary to provide the solar cell 100 with improved characteristics and a lower defect rate.
The first electrode 24 and the second electrode 34 according to the present embodiment may have various planar shapes that permit double-sided light reception. First, a configuration of the first electrode 24 will be described in detail with reference to
Referring to
When viewing in cross section, both the finger electrodes 24a and the bus bar electrodes 24b may penetrate the anti-reflection film 22. Alternatively, the finger electrodes 24a may penetrate the anti-reflection film 22, and the bus bar electrodes 24b may be formed on the anti-reflection film 22.
Referring to
Referring to (a) of
Now, the connecting projections 34c will be described in more detail with reference to
As described above, the connecting projections 34c serve to assist connection between the finger electrodes 34a and the back surface field layer 30. In a case in which the connecting projections 34c have a large size, the second electrode 34 has an increased area, thus exhibiting increased recombination and greater shading loss, which may deteriorate characteristics of the solar cell 100. For this reason, it is desirable to provide the connecting projections 34c with the minimum size to achieve connection between the finger electrodes 34a and the back surface field layer 30.
In one example, the width W12 of each connecting projection 34c may be equal to or less than the width W11 of each finger electrode 34a. In one example, a ratio W12/W11 of the width W12 of the connecting projection 34c to the width W11 of the finger electrode 34a may be within a range of 0.3 to 1.0. When the ratio W12/W11 is below 0.3, the width W12 of the connecting projection 34c is too small to achieve efficient connection between the second electrode 34 and the back surface field layer 30. When the ratio W12/W11 exceeds 1.0, the width W12 of the connecting projection 34c may deteriorate characteristics of the solar cell 100. However, the present invention is not limited thereto, and concrete values of the widths W11 and W12 and the ratio thereof may vary according to the size of the solar cell 100, the kind of the solar cell 100, and the like.
In addition, the ratio W12/W21 of the width W12 of each connecting projection 34C to the width W21 of each first portion 30a, for example, may be within a range of 0.2 to 1.5. The ratio W12/W21 is determined in consideration of alignment characteristics, the areas of the back surface field layer 30 and the second electrode 34, and the like, but the present invention is not limited thereto. Accordingly, naturally, the above ratio may have different numerical values.
The protruding length D1 of the connecting projection 34c may be less than the first pitch P1 between the finger electrodes 34a. In this case, the ratio D1/P1 of the protruding length D1 of the connecting projection 34c to the first pitch P1 between the finger electrodes 34a may be 0.6 or less. When the ratio D1/P1 exceeds 0.6, the connecting projections 34c of the neighboring finger electrodes 34a may be connected to each other, and the connecting projections 34c may have an excessively long length, causing deterioration in the characteristics of the solar cell 100. In one example, the ratio D1/P1 of the protruding length D1 of the connecting projection 34c to the first pitch P1 between the finger electrodes 34a may be within a range of 0.05 to 0.3. When the ratio D1/P1 is below 0.05, the protruding length D1 of the connecting projection 34c is too small to sufficiently deal with an alignment error. When the ratio D1/P1 exceeds 0.3, the protruding length D1 of the connecting projection 34c may be unnecessarily increased. However, the present invention is not limited thereto, and concrete values of the above dimensions D1 and P1 and the ratio thereof may vary according to the size of the solar cell 100, the kind of the solar cell 100, and the like.
A plurality of connecting projections 34c may be formed at each finger electrode 34a at a constant second pitch P12. This may ensure effective connection between the corresponding finger electrode 34a and the back surface field layer 30 under the occurrence of a process error, for example. Explaining this in more detail, a process error may occur due to a vertical or horizontal shift, or may occur due to rotation. In this case, when a horizontal shift occurs by a given distance, the finger electrode 34a and the back surface field layer 30 may be connected to each other even through provision of a single connecting projection 34c. However, when problematic alignment in terms of a rotation direction occurs, providing a plurality of connecting projections 34c may be necessary to achieve more reliable connection between the finger electrode 34a and the back surface field layer 30. That is, in the present embodiment, a plurality of connecting projections 34c may be provided to deal with various kinds of alignment errors.
In this case, the second pitch P12 may be greater than the width W11 of the finger electrode 34a. When the second pitch P12 is less than the width W11 of the finger electrode 34a, the connecting projections 34c are densely arranged to increase the area of the second electrode 34, which may deteriorate characteristics of the solar cell 100.
More specifically, the ratio P12/P1 of the second pitch P12 between the connecting projections 34c to the first pitch P1 between the finger electrodes 34a may be 0.5 or more (for example, within a range of 0.5 to 3.0). In addition, when the ratio is below 0.5, the connecting projections 34c increase the area of the entire second electrode 34, causing deterioration in the characteristics of the solar cell 100. When the ratio exceeds 3.0, effective connection between the second electrode 34 and the back surface field layer 30 cannot be accomplished under the occurrence of various types of alignment errors.
Here, the second pitch P12 may be within a range of 0.5 mm to 2.0 mm. When the second pitch P12 is below 0.5 mm, the characteristics of the solar cell 100 may be deteriorated. When the second pitch P12 exceeds 2.0 mm, effective connection between the second electrode 34 and the back surface field layer 30 may be impossible under the occurrence of various types of alignment errors. However, the aforementioned numerical values may vary according to the size of the solar cell 100, the kind of the solar cell 100, and the like.
Among the plurality of connecting projections 34c, any one connecting projection 34c proximate to the edge of the solar cell 100 (or the edge of the semiconductor substrate 110) may be spaced apart from the edge of the solar cell 100. Since the back surface field layer 30 may not be formed at the edge of the solar cell 100 by reason of, for example, isolation, eliminating the connecting projection 34c at this portion may minimize the number of the connecting projections 34c. In one example, a distance L1 between the corresponding connecting projection 34c and the edge of the solar cell 100 may be within a range of 0.2 mm to 1.0 mm. However, naturally, the present invention is not limited thereto and various other alternative embodiments are possible.
In addition, among the plurality of connecting projections 34c, any one connecting projection 34c proximate to each bus bar electrode 34b may be spaced apart from the bus bar electrode 34b. This serves to provide the bus bar electrode 34b with a relatively large width so as to compensate for an alignment error near the bus bar electrode 34b. In this way, as a result of the connecting projection 34c and the bus bar electrode 34b being spaced apart from each other, the number of the connecting projections 34c may be minimized. In one example, the distance L2 between the corresponding connecting projection 34c and the bus bar electrode 34b may be within a range of 0.1 mm to 1.0 mm. However, naturally, the present invention is not limited thereto and various other alternative embodiments are possible.
In addition,
In this context, as exemplarily shown in (a) of
In addition, as exemplarily shown in
In addition,
In the present embodiment, through provision of the connecting projections 34c, effective connection between the second electrode 34 and the back surface field layer 30 and consequently, a lower defect rate of the solar cell 100 may be accomplished. This may considerably enhance the reliability and productivity of the solar cell 100. In this context, according to the present embodiment, dimensions associated with the connecting projections 34c, such as the width W12, the protruding length D1, the second pitch P12, and the distances L1 and L2 from the edge of the solar cell 100 and the bus bar electrode 34b, may be defined to maintain the area of the second electrode 34 at a small value and to ensure more effective connection between the second electrode 34 and the back surface field layer 30. In this way, the solar cell 100 may achieve a high level of characteristics and a considerably reduced defect rate.
In particular, in the present embodiment, the back surface field layer 30 is an n-type and is formed separately from the second electrode 34, thus easily dealing with an alignment error. However, naturally, the present invention is not limited thereto, and may be applied even when the base region 10 is a p-type. In addition, as a result of the first electrode 24, which is greatly associated with characteristics of the solar cell 100 due to, for example, shading loss, being not provided with the connecting projections 34c and only the second electrode 34 located at the back surface being provided with the connecting projections 34c, the maximized use of light introduced into the front surface may be accomplished. However, the present invention is not limited thereto, and the connecting projections may also be formed at the front surface.
Hereinafter, a solar cell in accordance with another embodiment of the present invention will be described in more detail with reference to
Referring to
In this case, the connecting projections 30c may be formed using a process of forming the first portion 30a. That is, the first portion 30a and the connecting projections 30c may be doped simultaneously with doping of a first conductive dopant via various doping methods, such as ion implantation, thermal diffusion, or the like. Thereby, the connecting projections 30c may be easily formed by simply changing a mask used in a doping process without an additional process. In addition, providing the back surface field layer 30 with the connecting projections 30c may assist the solar cell 100 in maintaining more excellent characteristics. That is, when the area of the entire finger electrodes 34a deviates from a relatively low specific criterion, sudden recombination of electrons and holes occurs, causing considerable deterioration in the characteristics of the solar cell 100. That is, characteristics of the solar cell 100 may vary sensitive to increase in the area of the finger electrodes 34a. On the other hand, since the back surface field layer 30 has a high criterion in association with recombination, the characteristics of the solar cell 100 do not greatly vary based on the area of the entire back surface field layer 30.
The connecting projections 30c formed at each of the finger electrodes 34a may have a size suitable to enable connection between the finger electrode 34a and the back surface field layer 30. Unnecessarily increasing the size of the connecting projections 30c may increase doping time, surface recombination, and other problems. Thus, the connecting projections 30c preferably have a minimum size to enable connection between the finger electrode 34a and the back surface field layer 30.
In one example, the width W22 of each connecting projection 30c may be equal to or less than the width W21 of the first portion 30a. In one example, the ratio W22/W21 of the width W22 of the connecting projection 30c to the width W21 of the first portion 30a may be within a range of 0.1 to 1.0. When the ratio W22/W21 is below 0.1, the width W22 of the connecting projection 30c is too small to achieve effective connection between the second electrode 34 and the back surface field layer 33. When the ratio W22/S21 exceeds 1.0, the width W22 of the connecting projection 30c is increased, causing deterioration in the characteristics of the solar cell 100. In this case, a lower limit of the ratio W22/W21 is 0.1, which is lower than 0.3. in the case in which the connecting projections 34c are formed at the finger electrode 34a. This is because the area of the entire back surface field layer 30 has less effect on the characteristics of the solar cell 100 than the area of the entire finger electrodes 34a, and therefore the width W21 of the first portion 30a may be greater than the width W11 of each finger electrode 34a of the second electrode 34. However, the present invention is not limited thereto, and concrete values of the widths W21 and W22 and the ratio thereof may vary according to the size of the solar cell 100, the kind of the solar cell 100, and the like.
The protruding length D2 of the connecting projection 30c may be less than the first pitch P2 between the first portions 30a (generally, equal to the first pitch P1 between the finger electrodes 34a). In this case, the ratio D2/P2 of the protruding length D2 of the connecting projection 30c to the first pitch P2 between the first portions 30a may be 0.6 or less. When the ratio D2/P2 exceeds 0.6, the connecting projections 30c of the neighboring first portions 30a may be connected to each other, and the connecting projections 30c may have an excessively long length, causing deterioration in the characteristics of the solar cell 100. In one example, the ratio D2/P2 of the protruding length D2 of the connecting projection 30c to the first pitch P2 between the first portions 30a may be within a range of 0.1 to 0.6. When the ratio D2/P2 is below 0.1, the protruding length D2 of the connecting projection 30c is too small to sufficiently deal with an alignment error. When the ratio D1/P2 exceeds 0.6, the protruding length D2 of the connecting projection 30c may be unnecessarily increased. In this case, the ratio D2/P2 may have a greater value than that in the case in which the connecting projections 34c are formed at the finger electrode 34a. This is because the area of the entire back surface field layer 30 has less effect on the characteristics of the solar cell 100 than the area of the entire finger electrodes 34a, and therefore the allowable protruding length D2 is relatively long. However, the present invention is not limited thereto, and concrete values of the above dimensions D2 and P2 and the ratio thereof may vary according to the size of the solar cell 100, the kind of the solar cell 100, and the like.
The connecting projections 30c may be spaced apart from one another by a constant second pitch P22. In this case, the second pitch P22 may be greater than the width W21 of the first portion 30a. When the second pitch P22 is less than the width W21 of the first portion 30a, the connecting projections 30c are densely arranged, which may deteriorate characteristics of the solar cell 100.
More specifically, the ratio P22/P2 of the second pitch P22 between the connecting projections 30c to the first pitch P2 between the first portions 30a may be 0.5 or more (for example, within a range of 0.5 to 3.0). In addition, when the ratio is below 0.5, the connecting projections 30c may cause deterioration in the characteristics of the solar cell 100. When the ratio exceeds 3.0, effective connection between the second electrode 34 and the back surface field layer 30 cannot be accomplished under the occurrence of various types of alignment errors.
Here, the second pitch P22 may be within a range of 0.5 mm to 2.0 mm. When the second pitch P22 is below 0.5 mm, the characteristics of the solar cell 100 may be deteriorated. When the second pitch P22 exceeds 2.0 mm, effective connection between the second electrode 34 and the back surface field layer 30 may be impossible under the occurrence of various types of alignment errors. However, the aforementioned numerical values may vary according to the size of the solar cell 100, the kind of the solar cell 100, and the like.
Among the plurality of connecting projections 30c, any one connecting projection 30c proximate to the edge of the solar cell 100 (or the edge of the semiconductor substrate 110) may be spaced apart from the edge of the solar cell 100. Since the back surface field layer 30 may not be formed at the edge of the solar cell 100 by reason of, for example, isolation, eliminating the connecting projection 30c at this portion may minimize the number of the connecting projections 30c. In one example, a distance between the corresponding connecting projection 30c and the edge of the solar cell 100 may be within a range of 0.2 mm to 1.0 mm. However, naturally, the present invention is not limited thereto and various other alternative embodiments are possible.
In addition, among the plurality of connecting projections 30c, any one connecting projection 30c proximate to each bus bar electrode 34b may be spaced apart from the bus bar electrode 34b. This serves to provide the bus bar electrode 34b with a relatively large width so as to compensate for an alignment error near the bus bar electrode 34b. In this way, as a result of the connecting projection 30c and the bus bar electrode 34b being spaced apart from each other, the number of the connecting projections 30c may be minimized. In one example, the distance between the corresponding connecting projection 30c and the bus bar electrode 34b may be within a range of 0.1 mm to 1.0 mm. However, naturally, the present invention is not limited thereto and various other alternative embodiments are possible.
Referring to
In
In this case, dimensions associated with the first connecting projections 34c, such as the width, the protruding length, the first pitch, and the distances from the edge of the solar cell 100 and the bus bar electrode 34b, may correspond respectively to the width W12, the protruding length D1, the second pitch P21, and the distances from the edge of the solar cell 100 and the bus bar electrode 34b with regard to the connecting projections 34c described above with reference to
As described above, since the area of the entire first portion 30a has less effect on the characteristics of the solar cell 100 than the area of the finger electrode 34a, the width of the first portion 30a may be less than the width of the finger electrode 34a. This configuration may be advantageous to efficiently deal with an alignment error and to maintain excellent characteristics of the solar cell 100.
All of the alternative embodiments of
Referring to
Accordingly, in the present embodiment, as a result of providing the second portion 30b, corresponding to a region between the neighboring portions of the second electrode 34, with a higher resistance, recombination of electrons and holes may be prevented. This may result in increased current density of the solar cell 100. In addition, as a result of providing the first portions 30a, adjoining to the second electrode 34 (more particularly, adjoining to the plurality of finger electrodes 34a of the second electrode 34), with a lower resistance, the back surface field layer 30 may achieve reduced contact resistance with the second electrode 34. That is, the back surface field layer 30 of the present embodiment may maximize the efficiency of the solar cell 100 owing to a selective configuration thereof.
In addition, the emitter layer 20 may include a first portion 20a adjoining to the first electrode 34, and a second portion 20b where at least the first electrode 24 is not located. The first portion 20a has a greater dopant density than that of the second portion 20b, and thus has a less resistance than that of the second portion 20b. The second portion 20b has a relatively low dopant density and thus has a relatively high resistance.
In this way, the present embodiment may realize a shallow emitter by providing a light receiving region between the neighboring portions of the first electrode 24 with the second portion 20b having a relatively high resistance. In this way, current density of the solar cell 100 may be increased. In addition, the emitter layer 20 may achieve reduced contact resistance with the first electrode 24 as a result of providing the first portion 20a, adjoining to the first electrode 24, with a relatively low resistance. That is, the emitter layer 20 of the present embodiment in the form of a selective emitter may maximize the efficiency of the solar cell 100.
Although the present embodiment describes that both the emitter layer 20 and the back surface field layer 30 have a selective configuration, the present invention is not limited thereto. Any one of the emitter layer 20 and the back surface field layer 30 may have a selective configuration.
As is apparent from the above description, in a solar cell according to the embodiments of the present invention, connecting projections are formed at any one of a second electrode and a back surface field layer, which may ensure effective connection between the second electrode and the back surface field layer, resulting in a reduced defect rate of the solar cell. As a result, the solar cell may achieve enhanced reliability and considerably enhanced productivity. In this case, according to the embodiments, with regard to the connecting projection, for example, a width, a protruding length, a pitch, and distances from the edge of the solar cell and a bus bar electrode are defined to maintain the area of the second electrode at a small value and to achieve more effective connection between the second electrode and the back surface field layer. In this way, the solar cell may maintain a high level of characteristics and a considerably reduced defect rate.
The above described features, configurations, effects, and the like are included in at least one of the embodiments of the present invention, and should not be limited to only one embodiment. In addition, the features, configurations, effects, and the like as illustrated in each embodiment may be implemented with regard to other embodiments as they are combined with one another or modified by those skilled in the art. Thus, content related to these combinations and modifications should be construed as including in the scope and spirit of the invention as disclosed in the accompanying claims.
Number | Date | Country | Kind |
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10-2013-0044370 | Apr 2013 | KR | national |