This application claims priority of Taiwanese application no. 101109895, filed on Mar. 22, 2012, which is hereby incorporated by reference in its entirety.
This invention relates to a solar cell, more particularly to a crystalline silicon solar cell having a local back surface field structure.
Referring to
The silicon substrate 11 and the emitter layer 12 are formed with a p-n junction therebetween. The dielectric layer 13 is formed on a rear surface 111 of the silicon substrate 11 and is formed with a plurality of spaced-apart circular through holes 131. The local back surface field structures 14 are formed under the rear surface 111 of the silicon substrate 11 corresponding in position to the through holes 131. The local back surface field structures 14 have a doping concentration larger than that of the silicon substrate 11. The back electrode 15 is formed by screen printing aluminum paste on the dielectric layer 13, followed by firing the aluminum paste at high temperature (about 700° C. to 800° C.). A portion of the aluminum paste flows into the through holes 131 and thus, the rear electrode 15 has a surface layer portion 151 that is laminated on the dielectric layer 13, and a plurality of contact portions 152 respectively extending into the through holes 131 to contact the silicon substrate 11. During firing process, the aluminum in the aluminum paste would be mixed with the silicon of the silicon substrate 11 so as to form the local back surface field structures 14 made of Al—Si alloy in the silicon substrate 11. The local back surface field structures 14 improve carrier collection efficiency and photoelectric conversion efficiency.
In practice, at the high firing temperature, silicon of the silicon substrate 11 has high diffusibility in aluminum of the aluminum paste. Since, in the conventional solar cell, the back electrode 15 is formed into a continuous large area, the same cannot provide confinement to silicon diffusibility. It is thus not favorable to the formation of the local back surface field structures 14 since silicon flows outwardly from the silicon substrate 11 into the back electrode 15 and the local back surface field structures 14 has less amount of silicon. If outflow of silicon becomes more severe, a cavity 10 might be formed between the rear surface 111 of the silicon substrate 11 and the back electrode 15 (see
Referring to
However, in the configuration shown in
Therefore, an object of the present invention is to provide a solar cell that can overcome cavity problem and inferior conductivity associated with the prior art.
Accordingly, a solar cell of this invention includes:
a substrate having a front surface and a back surface opposite to the front surface;
an emitter layer formed in the substrate under the front surface;
a dielectric layer disposed on the back surface and having at least two through holes to expose the back surface;
at least two first electrode layers formed on the dielectric layer and respectively filling in the through holes to contact the substrate;
at least one second electrode layer entirely formed on the dielectric layer and disposed between the first electrode layers; and
at least one third electrode layer filled in a space which is substantially defined by the second electrode layer and one of the first electrode layers so that the at least one third electrode layer interconnects the second electrode layer and the one of the first electrode layers.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments of the invention, with reference to the accompanying drawings, in which:
Before the present invention is described in greater detail, it should be noted herein that like elements are denoted by the same reference numerals throughout the disclosure.
Referring to
The substrate 2 has a front surface 22 and a back surface 21 opposite to the front surface 22. The front surface 22 is a light incident surface and can be roughened to improve light incidence efficiency. The emitter layer 23 is formed in the substrate 2 under the front surface 22. A p-n junction is formed between the emitter layer 23 and the substrate 2. In this embodiment, the substrate 2 is a p-type silicon substrate and the emitter layer 23 is made of a n-type semiconductor material. However, the conductivity types of the substrate 2 and the emitter layer 23 can be interchanged as long as the p-n junction is formed therebetween.
Besides, the emitter layer 23 may be formed with an anti-reflection layer (not shown) made of a material such as silicon nitride (SiNx) for reducing reflection of incident light and surface recombination velocity (SRV) of carriers, and raising light transmittance. In this embodiment, the solar cell is further formed with a front electrode (not shown) for outputting electric power. Since the front electrode and the anti-reflection layer are well known to a skilled artisan, detailed descriptions thereof are omitted herein for the sake of brevity.
The dielectric layer 3 is a passivation layer and is disposed on the back surface 21 of the substrate 2 for compensating surface defects of the substrate 2 so as to reduce carrier combination velocity on the back surface 21 and raise photoelectric conversion efficiency of the solar cell. The dielectric layer 3 is made of a material selected from the group consisting of oxides, nitrides, and the combinations thereof.
In this embodiment, the dielectric layer 3 is formed with at least two spaced-apart circular through holes 31 to expose the substrate 2. It should be noted that the shape of the through holes 31 can vary and is not limited by the disclosure in this embodiment.
The substrate 2 further includes two local back surface field structures 4 that are formed in the substrate 2 underneath the back surface 21 and respectively exposed from the through holes 31. In this embodiment, the back surface field structures 4 are made of p-type semiconductor material of aluminum-silicon alloy, and have a doping concentration higher than that of the substrate 2. By virtue of the electric field of the back surface field structures 4, electrons movement in the substrate 2 toward the back surface 21 can be prevented and electrons are collected in the emitter layer 23, thereby improving carrier collection and photoelectric conversion efficiencies of the solar cell.
The first electrode layers 52 are formed on the dielectric layer 3 and respectively extend into the through holes 31 to contact the back surface field structures 4. The second electrode layer 511 is entirely formed on the dielectric layer 3. The third electrode layers 512 are disposed in the spaces 6 to interconnect the first electrode layers 52 and the second electrode layer 511.
In this embodiment, each of the spaces 6 and a respective one of the first electrode layers 52 are disposed in concentric relation substantially. That is, each of the first electrode layers 52 is surrounded by a respective one of the spaces 6 and is isolated from the second electrode layer 511 by the respective one of the spaces 6. Two of the third electrode layers 512 are formed in each of the spaces 6 to interconnect the second electrode layer 511 and a respective one of the first electrode layers 52. The materials for the first electrode layers 52 and the second electrode layer 511 can be the same or different. The third electrode layers 512 are made of a material different from or the same with that of the first electrode layers 52. Examples of the material for the third electrode layers 512 include aluminum, silver, zinc oxide, and nickel. Preferably, when the third electrode layers 512 are made of a material different from that of the first electrode layers 52, the material for the third electrode layers 512 has lower diffusibility for silicon than that of the first electrode layers 52. In this embodiment, the first electrode layers 52 and the second electrode layer 511 are made of aluminum and are formed by screen-printing aluminum paste, and the third electrode layers 512 are made of silver by another screen-printing and are filled in a part of the spaces 6.
The surface area of the dielectric layer 3 which is occupied by the first, second and third electrode layers 52, 511, 512 is greater than the area of the spaces 6.
The back surface field structures 4 are formed by mixing aluminum in the aluminum paste and silicon of the substrate 2 during forming the first, second, and third electrode layers 52, 511, 512 by firing process.
In this embodiment, since each of the third electrode layers 512 has a small area, diffusion of the silicon from the substrate 2 to the second electrode layer 511 through the first electrode layers 52 and the third electrode layers 512 can be limited. Moreover, silicon concentration in the third electrode layers 512 is easily saturated and thus silicon diffusion would be limited. Accordingly, enough silicon would be confined near the back surface 21 and mixed with aluminum so as to form superior back surface field structures 4. Without forming the cavities in the solar cell, photoelectric conversion efficiency and electrical conductivity can be improved.
Referring to
It should be noted that, the number of each of the elements, e.g., the first electrode layers 52, the third electrode layers 512, the through holes 31, the spaces 6, and the local back surface field structures 4, can vary based on actual requirements and should not be limited to the disclosure in this embodiment. For example, a solar cell of this invention can include a plurality of the first electrode layers 52, the third electrode layers 512, the through holes 31, the spaces 6, and the local back surface field structures 4 (see
Referring to
Referring to
Referring to
Referring to
Referring to
In view of the above, when each of the spaces 6 is partly filled with the third electrode layer(s) 512 (as shown in the first to fifth preferred embodiments), the first electrode layers 52 can be made of a material the same with or different from that of the third electrode layer(s) 512. On the other hand, when each of the spaces 6 is completely filled with the third electrode layer 512 as shown in the sixth preferred embodiment, the material of the third electrode layers 512 is required to be different from that of the first electrode layers 52 and should have relatively low diffusibility for silicon so as to block diffusion of the silicon from the substrate 2 to the second electrode layer 511.
In this embodiment, the through holes 31 and the spaces 6 are in the form of a slot. The second electrode layer 511 and the first electrode layers 52 are made of aluminum. The third electrode layers 512 are made of silver.
Referring to
Referring to
It should be noted that, in each of the preferred embodiments of this invention, the number of each of the elements included in the solar cell can vary based on actual requirements. The rules of material selection for the first, second, and third electrode layers 52, 511, 512 in the seventh to ninth preferred embodiments are the same with those in the first to sixth preferred embodiments. Moreover, the solar cell in the seventh, eighth, or ninth embodiment may further include a busbar (not shown).
The conventional solar cells shown in
Referring to Table 1, the solar cell of the ninth preferred embodiment has a series resistance much smaller than that of Comparative Examples 2, and has a cavity percentage much lower than that of Comparative Examples 1. In this embodiment, a trade-off between the series resistance and the cavity percentage is reached, thereby simultaneously improving electrical conductivity and photoelectric conversion efficiency of the solar cell.
While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretations and equivalent arrangements.
Number | Date | Country | Kind |
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101109895 | Mar 2012 | TW | national |