There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present inventions relate to, among other things, a solar cell to convert energy from light (for example, the sun) into electricity. In another aspect, the present inventions relate to a cell array having a plurality of solar cells wherein each cell converts energy from light (for example, the sun) into electricity. In yet another embodiment, the present inventions relate to a die or device having a solar cell array portion and an integrated circuit portion wherein the solar cell array portion includes a plurality of cells to convert energy from light into electricity.
In addition, the present inventions also relate to method of control and manufacturing such cell, cell array and die having a cell array portion and an integrated circuit portion.
In another aspect, the present inventions are directed to a light sensor comprised of one or more of the solar and/or sub-cells described and/or illustrated herein. Moreover the light sensor may be a discrete device and/or embedded or integrated with one or more solar cells or solar cell arrays; in addition thereto, or in lieu thereof, the light sensor may be embedded or integrated with circuitry.
There are many inventions described and illustrated herein. The present inventions are neither limited to any single aspect nor embodiment thereof, nor to any combinations and/or permutations of such aspects and/or embodiments. Moreover, each of the aspects of the present inventions, and/or embodiments thereof, may be employed alone or in combination with one or more of the other aspects of the present inventions and/or embodiments thereof. For the sake of brevity, many of those permutations and combinations will not be discussed separately herein.
Importantly, this Summary may not be reflective of or correlate to the inventions protected by the claims in this or continuation/divisional applications hereof. Even where this Summary is reflective of or correlates to the inventions protected by the claims hereof, this Summary may not be exhaustive of the scope of the present inventions.
In a first aspect, the present inventions are directed to a solar cell disposed in a substrate, the solar cell comprising first and second sub-cells, each disposed in the substrate and each including: a conductor disposed in the substrate, wherein the conductor is adapted to receive a predetermined voltage, a collection region disposed in the substrate, and an insulating layer disposed on the associated conductor and (i) between the associated conductor and the associated collection region and (ii) between the associated conductor and the substrate. The ratio of the depth of the conductor of the first sub-cell within the substrate to the width of the conductor of the first sub-cell within the substrate is greater than or equal to 10:1; and a length between the first sub-cell and the second sub-cell is greater than the sum of the widths of depletion/inversion layers formed in relation to the first and second sub-cells during operation.
In one embodiment of this aspect of the present inventions, the collection region of the first sub-cell is disposed substantially around and on the associated insulating layer, and the collection region of the second sub-cell is disposed substantially around and on the associated insulating layer. In another embodiment, the collection region of the first and second sub-cells each includes a plurality of sub-regions disposed around and on the associated insulating layer. In yet another embodiment, the insulating regions of the first and second sub-cells may surround the associated conductor and each collection region of the first and second sub-cells is juxtaposed the associated insulating layer.
In one preferred embodiment, the ratio of the depth of the conductor of the first sub-cell within the substrate to the width of the conductor of the first sub-cell within the substrate is greater than or equal to 25:1. Indeed, in a more preferred embodiment. The ratio of the depth of the conductor of the first sub-cell within the substrate to the width of the conductor of the first sub-cell within the substrate is greater than or equal to 50:1.
Notably, the solar cell may include an anti-reflective material disposed on an exposed surface of the substrate.
The collection regions of each of the sub-cells may include a plurality of sub-regions disposed around and on the associated insulating layer wherein the plurality of sub-regions of the collection region of the first sub-cell are laterally offset in relation to the plurality of sub-regions of the collection region of the second sub-cell.
In a second aspect, the present inventions are directed to a solar cell disposed in a semiconductor substrate, the solar cell comprising: a first sub-cell, disposed in the semiconductor substrate, including a first conductor disposed in the semiconductor substrate, wherein the first conductor is adapted to receive a first predetermined voltage, a first collection region disposed in the semiconductor substrate, and a first insulating layer disposed on the first conductor and (i) between the first conductor and the first collection region and (ii) between the first conductor and the semiconductor substrate, wherein the first collection region is juxtaposed the first insulating layer. The present invention of this aspect further includes a second sub-cell, disposed in the semiconductor substrate and separated from the first sub-cell by a predetermined length. The second sub-cell includes a second conductor disposed in the semiconductor substrate, wherein the second conductor is adapted to receive a second predetermined voltage, a second collection region disposed in the semiconductor substrate, and a second insulating layer disposed (i) between the second conductor and the second collection region and (ii) between the second conductor and the semiconductor substrate, wherein the second collection region is juxtaposed the second insulating layer. The present invention of this aspect also includes a ratio of a depth of the conductor of the first sub-cell within the semiconductor substrate to a width of the conductor of the first sub-cell within the semiconductor substrate is greater than or equal to 10:1.
Notably, in one preferred embodiment, the ratio of the depth of the conductor of the first sub-cell within the substrate to the width of the conductor of the first sub-cell within the substrate is greater than or equal to 25:1. Indeed, in a more preferred embodiment, the ratio is greater than or equal to 50:1.
The first and second conductors may be metal, metal compound and/or one or more semiconductors doped with one or more impurities. The first and second collection regions may be regions of the semiconductor substrate that are doped with one or more impurities. The first and second insulating layers may include silicon oxide, silicon nitride and/or combination thereof.
In one embodiment of this aspect of the present inventions, the collection region of the first sub-cell is disposed substantially around and on the associated insulating layer, and the collection region of the second sub-cell is disposed substantially around and on the associated insulating layer. In another embodiment, the collection region of the first and second sub-cells each includes a plurality of sub-regions disposed around and on the associated insulating layer. In yet another embodiment, the insulating regions of the first and second sub-cells may surround the associated conductor and each collection region of the first and second sub-cells is juxtaposed the associated insulating layer.
In a third aspect, the present inventions are directed to a solar cell system comprising a solar cell including a first sub-cell, disposed in the semiconductor substrate, including a first conductor disposed in the semiconductor substrate, wherein the first conductor is adapted to receive a first predetermined voltage, a first collection region disposed in the semiconductor substrate and a first insulating layer disposed (i) on and surrounding the first conductor within the semiconductor substrate to insulate the first conductor from the semiconductor substrate and (ii) between the first conductor and the first collection region to insulate the first conductor from the first collection region. The solar cell further includes a second sub-cell, disposed in the semiconductor substrate and separated from the first sub-cell by a predetermined length, the second sub-cell includes a second conductor disposed in the semiconductor substrate, wherein the second conductor is adapted to receive a second predetermined voltage, a second collection region disposed in the semiconductor substrate and a second insulating layer disposed (i) on and surrounding the second conductor within the semiconductor substrate to insulate the second conductor from the semiconductor substrate and (ii) between the second conductor and the second collection region to insulate the second conductor from the second collection region. The ratio of a depth of the conductor of the first sub-cell within the semiconductor substrate to a width of the conductor of the first sub-cell within the semiconductor substrate and the ratio of a depth of the conductor of the second sub-cell within the semiconductor substrate to a width of the conductor of the second sub-cell within the semiconductor substrate are each greater than or equal to 10:1.
The solar cell system may include a voltage generator, coupled to the first and second conductors, to generate the first and second predetermined voltages. In one embodiment, the first predetermined voltage is positive and the second predetermined voltage is negative.
Notably, in one preferred embodiment, the ratio of the depth of the conductor of the first sub-cell within the substrate to the width of the conductor of the first sub-cell within the substrate is greater than or equal to 25:1. Indeed, in a more preferred embodiment, the ratio is greater than or equal to 50:1.
As stated herein, there are many inventions, and aspects of the inventions, described and illustrated herein. This Summary is not exhaustive of the scope of the present inventions. Indeed, this Summary may not be reflective of or correlate to the inventions protected by the claims in this or continuation/divisional applications hereof.
Moreover, this Summary is not intended to be limiting of the inventions or the claims (whether the currently presented claims or claims of a divisional/continuation application) and should not be interpreted in that manner. While certain embodiments have been described and/or outlined in this Summary, it should be understood that the present inventions are not limited to such embodiments, description and/or outline, nor are the claims limited in such a manner (which should also not be interpreted as being limited by this Summary).
Indeed, many other aspects, inventions and embodiments, which may be different from and/or similar to, the aspects, inventions and embodiments presented in this Summary, will be apparent from the description, illustrations and claims hereof. In addition, although various features, attributes and advantages have been described in this Summary and/or are apparent in light thereof, it should be understood that such features, attributes and advantages are not required in any of the embodiments of the present inventions and, indeed, need not be present/incorporated in any of the embodiments of the present inventions.
In the course of the detailed description to follow, reference will be made to the attached drawings. These drawings show different aspects of the present inventions and, where appropriate, reference numerals illustrating like structures, components, materials and/or elements in different figures are labeled similarly. It is understood that various combinations of the structures, components, and/or elements, other than those specifically shown, are contemplated and are within the scope of the present inventions.
Moreover, there are many inventions described and illustrated herein. The present inventions are neither limited to any single aspect nor embodiment thereof, nor to any combinations and/or permutations of such aspects and/or embodiments. Moreover, each of the aspects of the present inventions, and/or embodiments thereof, may be employed alone or in combination with one or more of the other aspects of the present inventions and/or embodiments thereof. For the sake of brevity, certain permutations and combinations are not discussed and/or illustrated separately herein.
Again, there are many inventions described and illustrated herein. The present inventions are neither limited to any single aspect nor embodiment thereof, nor to any combinations and/or permutations of such aspects and/or embodiments. Each of the aspects of the present inventions, and/or embodiments thereof, may be employed alone or in combination with one or more of the other aspects of the present inventions and/or embodiments thereof. For the sake of brevity, many of those combinations and permutations are not discussed separately herein.
There are many inventions described and illustrated herein. In one aspect, the present inventions are directed to a solar cell and/or solar cell array, and method of fabricating and operating such a solar cell and/or solar cell array. With reference to
Notably, the substrate may be one or more materials from the Group IV semiconductor including silicon (for example, bulk-silicon substrate), germanium, and silicon carbide or semiconductor-on-insulator substrate (for example, a silicon-on-insulator). The substrate may be an intrinsic material or a material having impurities, for example, n-type or p-type materials. In one embodiment the substrate is p-type silicon having N=1014 cm−3.
The solar cell also includes one or more electron and hole collection regions which, in one embodiment, are semiconductor regions that are doped with impurities (illustrated as n+ and p+ regions). In this illustrated embodiment, an n-type semiconductor material which provides or forms an n+ region that is juxtaposed the dielectric material of the first sub-cell. Similarly, a p-type semiconductor material which provides or forms a p+ region that is juxtaposed the dielectric material of the second sub-cell. The n-type semiconductor material may be formed from or by doping a semiconductor (for example, silicon) with an n-type impurity (for example, phosphorus or arsenic). The p-type semiconductor material may be formed from or by doping a semiconductor (for example, silicon) with a p-type impurity (for example, boron). Notably, the solar cell may be fabricated using any materials and/or techniques now known or later developed.
With continued reference to
Notably, the first and second voltages may be generated by voltage generator circuitry. (See, for example,
With reference to
In addition, with continued reference to
For example, in one embodiment, the depth to width ratio of a sub-cell is greater than 10:1, and preferably 25:1 and more preferably 50:1. Similarly, the depth to width ratio of the conductor of a sub-cell is greater than 10:1, and preferably 25:1 and more preferably 50:1. In addition, in one embodiment, the length (i.e., the distance between associated sub-cells) is equal to at least the sum of the widths of the depletion/inversion layer formed in relation to sub-cells during operation and, preferably 25% greater than the sum of the widths of the depletion/inversion layer formed in relation to sub-cells during operation, and more preferably 50% greater than the sum of the widths of the depletion/inversion layer formed in relation to sub-cells during operation.
The layout of each sub-cell may be substantially identical or may be different. That is, in one embodiment, each sub-cell may have substantially identical depths and widths; in another embodiment, one, some or all of the sub-cells may have a depth and width which is different from other sub-cells. Moreover, the length between associated sub-cells of a solar cell may be substantially identical among the solar cells, for example of an array of solar cells, or such length may be different.
The solar cell may include an anti-reflective material disposed over portions of the solar cell, solar cell array and/or die/device. (See, for example,
Briefly, the solar cell and solar cell array of the present inventions may be fabricated using standard and well-known manufacturing processes and techniques. Such processes and techniques may be implemented on well-known fabrication equipment. Moreover, where the die/device also includes integrated circuits (for example, CMOS transistors) or other active components, such circuits and other components may be integrated or fabricated into selected portions of the die/device (for example portions not occupied by the portions of the solar cells and solar cell array) using well-known manufacturing fabrication techniques and equipment.
With reference to
The inversion or accumulation layers may provide a low resistance path for the movement of electrons (e−) and holes (h+), generated within the substrate in response to the incident photons, to the collection regions (n+ region and the p+ region of the sub-cells, respectively) of the sub-cells. Where the substrate includes little to no impurities and/or little to no additional doping relative to conventional IC substrates, the carrier lifetime may be quite high. Moreover, any interface defects may be screened by the inversion or accumulation layers associated with the sub-cells.
With reference to
The solar cell may include more than two sub-cells. For example, in one embodiment, the solar cell includes three sub-cells. (See, for example,
The solar cell and solar cell array of the present inventions may be fabricated using standard and well-known manufacturing processes and techniques. Moreover, where the die/device also includes integrated circuits (for example, CMOS transistors) or other active components, such circuits and other components may be integrated or fabricated into selected portions of the die/device using standard fabrication techniques and/or the techniques employed to fabricate the solar cell and solar cell array. (See, for example,
With reference to
In operation, in response to incident photons from the one or more light sources (for example, the sun), electrons (e−) and holes (h+) are generated within the substrate. (See,
Notably, where the substrate includes little to no impurities and/or little to no additional doping relative to conventional IC substrates, the carrier lifetime may be quite high. Moreover, any interface defects may be screened by the inversion or accumulation layers associated with the sub-cells.
In one embodiment, the conductors of this embodiment are not coupled to the first voltage (e.g., V+) or second voltage (e.g., V−). In another embodiment, the conductors of the sub-cells are coupled to one of the voltages—as discussed above in connection with the embodiments of
Notably, the collection regions (illustrated as an n+ region of the first sub-cell and a P+ region of the second sub-cell) may be formed substantially around the conductor-dielectric structure (see, for example,
The solar cell may include more than two sub-cells. For example, in one embodiment, the solar cell includes three sub-cells. (See, for example,
As noted above, the solar cell and solar cell array of the present inventions may be fabricated using standard and well-known manufacturing processes and techniques. Moreover, where the die/device also includes integrated circuits (for example, CMOS transistors) or other active components, such circuits and other components may be integrated or fabricated into selected portions of the die/device using standard fabrication techniques and/or the techniques employed to fabricate the solar cell and solar cell array (which includes a plurality of solar cells). (See, for example,
As stated above, the solar cell, solar cell array and/or die/device (including the solar cell or solar cell array) may include an anti-reflective material disposed there over or thereon. In one embodiment, an anti-reflective material may be disposed on or over the backside of the die/wafer wherein the backside of the die/wafer is exposed to incident light (for example, solar light). (See, for example,
Notably, the die/device may also include integrated circuits (for example, CMOS transistors) or other active components. (See, “integrated circuit portion” of
In another embodiment, the conductors are arranged laterally. (See,
Briefly, the conductor may be a material that provides or facilitates a charge to form therein or thereon—for example, a metal (for example, aluminum or copper), metal compound and/or a doped semiconductor (for example, silicon doped with donor or acceptor impurities).
With continued reference to
Notably, the substrate may be one or more materials from the Group IV semiconductor including silicon (for example, bulk-silicon substrate), germanium, and silicon carbide or semiconductor-on-insulator substrate (for example, and silicon-on-insulator). The substrate may be an intrinsic material or a material having impurities, for example, n-type or p-type materials.
With reference to
The n+ region juxtaposed conductor 1 and the p+ region juxtaposed conductor 2 are electrically coupled to the output (Voutput) of the solar cell. (See, for example,
In one embodiment, conductor 1 and conductor 2 of the solar cell may consist of the same or different materials. Where conductor 1 consists of a material which is different from the material of conductor 2, the conductors of the sub-cells may include different (i) work functions and/or (ii) charges contained therein. The charges may be also embedded into the dielectrics of the first and second sub cells. In this way, one of the conductors of the solar cell will have a tendency to attract electrons (e−) and the other conductor will have a tendency to attract holes (h+).
In another aspect, the present inventions are directed to a light sensor comprised of one or more of the solar cells described and/or illustrated herein. For example, with reference to
Notably, the light sensor may implement any of the sub-cells, or features thereof, described and/or illustrated herein. For example, in another embodiment, with reference to
Notably, the measurement circuitry may be any circuitry now known or later developed to detect, determine and/or measure current; such circuitry may implement any technique now known or later developed to detect, determine and/or measure current output by the light sensor. For example, in one embodiment, a current type sensor (for example, current meter) detects the light when the current output from the light sensor exceeds a predetermined threshold. In addition thereto, or in lieu thereof, a current type sensor may detect the intensity of the light by measuring the maximum amplitude of the current output of the light sensor. Indeed, the current type sensor may measure the intensity over time by measuring and storing the amplitude of the current output of the light sensor over time.
There are many inventions described and illustrated herein. While certain embodiments, features, attributes and advantages of the inventions have been described and illustrated, it should be understood that many others, as well as different and/or similar embodiments, features, attributes and advantages of the present inventions, are apparent from the description and illustrations. As such, the above embodiments of the inventions are merely exemplary. They are not intended to be exhaustive or to limit the inventions to the precise forms, techniques, materials and/or configurations disclosed. Many modifications and variations are possible in light of this disclosure. It is to be understood that other embodiments may be utilized and operational changes may be made without departing from the scope of the present inventions. As such, the scope of the inventions is not limited solely to the description above because the description of the above embodiments has been presented for the purposes of illustration and description.
Importantly, the present inventions are neither limited to any single aspect nor embodiment, nor to any combinations and/or permutations of such aspects and/or embodiments. Moreover, each of the aspects of the present inventions, and/or embodiments thereof, may be employed alone or in combination with one or more of the other aspects and/or embodiments thereof. For the sake of brevity, many of those permutations and combinations will not be discussed and/or illustrated separately herein.
Notably, the solar cells of the present inventions may be implemented in any architecture as well as in conjunction with any type of integrated circuitry, whether now known or later developed; all such configurations are intended to fall within the scope of the present inventions. Further, any manufacturing technique, whether now known or later developed, may be employed to fabricate the solar cell, solar cell array (which includes a plurality of solar cells) and/or solar cell array-integrated circuit device embodiments of the present inventions; all such techniques are intended to fall within the scope of the present inventions.
Further, the collection regions (illustrated as n+ and p+ regions) in the embodiments described and/or illustrated herein may be a doped semiconductor (for example, silicon doped with donor or acceptor impurities—as the case may be). Alternatively, one or more (or all) of such collection regions may be comprised of a metal (for example, aluminum or copper) or metal compound. (See, for example,
It should be noted that the term “circuit” may mean, among other things, a single component or a multiplicity of components (whether in integrated circuit form or otherwise), which are active and/or passive, and which are coupled together to provide or perform a desired function. The term “circuitry” may mean, among other things, a circuit (whether integrated or otherwise), a group of such circuits, one or more processors, one or more state machines, one or more processors implementing software, one or more gate arrays, programmable gate arrays and/or field programmable gate arrays, or a combination of one or more circuits (whether integrated or otherwise), one or more state machines, one or more processors, one or more processors implementing software, one or more gate arrays, programmable gate arrays and/or field programmable gate arrays. The term “data” may mean, among other things, a current or voltage signal(s) whether in an analog or a digital form, which may be a single bit (or the like) or multiple bits (or the like).
It should be further noted that the solar cell structures, circuits and/or circuitry disclosed herein may be described using computer aided design tools and expressed (or represented), as data and/or instructions embodied in various computer-readable media, for example, in terms of their behavioral, register transfer, logic component, transistor, layout geometries, and/or other characteristics. Formats of files and other objects in which such circuit expressions may be implemented include, but are not limited to, formats supporting behavioral languages such as C, Verilog, and HLDL, formats supporting register level description languages like RTL, and formats supporting geometry description languages such as GDSII, GDSIII, GDSIV, CIF, MEBES and any other suitable formats and languages. Computer-readable media in which such formatted data and/or instructions may be embodied include, but are not limited to, non-volatile storage media in various forms (e.g., optical, magnetic or semiconductor storage media) and carrier waves that may be used to transfer such formatted data and/or instructions through wireless, optical, or wired signaling media or any combination thereof. Examples of transfers of such formatted data and/or instructions by carrier waves include, but are not limited to, transfers (uploads, downloads, e-mail, etc.) over the Internet and/or other computer networks via one or more data transfer protocols (e.g., HTTP, FTP, SMTP, etc.). The present inventions are also directed to such representation of the circuitry described herein, and/or techniques implemented thereby, and, as such, are intended to fall within the scope of the present inventions.
Indeed, when received within a computer system via one or more computer-readable media, such data and/or instruction-based expressions of the above described structures, circuits and/or circuitry may be processed by a processing entity (e.g., one or more processors) within the computer system in conjunction with execution of one or more other computer programs including, without limitation, net-list generation programs, place and route programs and the like, to generate a representation or image of a physical manifestation of such circuits. Such representation or image may thereafter be used in device fabrication, for example, by enabling generation of one or more masks that are used to form various components of the circuits in a device fabrication process.
Moreover, the various solar cell structures, circuits and/or circuitry, as well as techniques, disclosed herein may be represented via simulations and simulation instruction-based expressions using computer aided design, simulation and/or testing tools. The simulation of the solar cells and solar cell arrays of the present inventions, manufacturing processes to fabricate such cells and arrays, and/or techniques implemented thereby, may be implemented by a computer system wherein characteristics and operations of such circuitry, and techniques implemented thereby, are simulated, imitated, replicated, analyzed and/or predicted via a computer system. The present inventions are also directed to such simulations and testing of the inventive solar cells and solar cell arrays, efficiencies thereof, and/or techniques implemented thereby, and, as such, are intended to fall within the scope of the present inventions. The computer-readable media and data corresponding to such simulations and/or testing tools are also intended to fall within the scope of the present inventions.
This non-provisional application claims priority to U.S. Provisional Application No. 61/387,501, entitled “Solar Cells and Solar Cell Arrays”, filed Sep. 29, 2010; the contents of this U.S. Provisional Patent Application are incorporated by reference herein in their entirety.
Number | Date | Country | |
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61387501 | Sep 2010 | US |