Notice of Reasons for Rejection dated Jun. 25, 2019 in Japanese Patent Application No. 2019-000790, 1 page. |
Japanese Office Action dated Apr. 7. 2020 in Japanese Design Application No. 2019-000790 (with unedited computer generated English translation), 8 pages. |
Japanese Office Action dated Dec. 3, 2019 in Patent Application No. 2019-000790. |
Creative Materials, “124-08 NB Electrically Conductive Epoxy Adhesive”, www.creativematerials.c,om, Apr. 22, 2010, Revision: E, 1 page. |
Herrmann, W. et al. “Hot Spot Investigations on PV Modules—New Concepts for a Test Standard and Consequences for Module Design with Respect to Bypass Diodes”, TUV Rheinland Sicherheit und Umweltschutz GmbH, 4 pages. |
Yang, et al., “Investigation of the Relationship between Reverse Current of Crystalline Silicon Solar Cells and Conduction of Bypass Diode”, Hindawi Publishing Corporation International Journal of Photoenergy, vol. 2012, Article ID 357218, 6 pages. |
Breitenstein, 0. et al., “Shunts due to laser scribing of solar cells evaluated by highly sensitive lock-in : hermography”, 11th International Photovoltaic Science and Engineering Conference (PVSEC-11), Sep. 20-24, 1999 Sapporo, Japan, 9 pages. |
Kyocera, News Releases 2009, “Kyocera Explains Innovations Used in Solar Panel for New Toyota Prius”, http://global.kyocera.com/new/2009/0902/fpri.htnnl, Dec. 21, 2014, 2 pages. |
Hermann, W. et al., “Hot Spot Investigations on PV Modules—New Concepts for a Test Standard and consequences for Module Design with Respect to Bypass Diodes,” TUV Rheinland Sicherheit and Umweltschutz GmbH, http://ieeexplore.ieee.org, Dec. 20, 2014, 6 pages. |
Viaki, et al., “Power Losses in Long String and Parallel-Connected Short Strings of Series-Connected Silicon-Based Photovoltaic Modules Due to Partial Shading Conditions”, IEEE Transactions on Energy Conversion, vol. 27, No. 1, Mar. 2012, pp. 173-183. |
Halavani, et al., “Results of Pressue-Only Cell Interconnections in High Voltage PV-Modules”, 29th European Photovoltaic Solar Energy Conference and Exhibition, Vienna University of Technology, pp. 64-68. |
Heimann, M., et al., “Ultrasonic Bonding of Aluminum Ribbons to Interconnect High-Efficiency Crystalline-Silicon Solar Cells”, Energy Procedia 27 (2012) pp. 670-675. |
Silvestre S., et al., “Study of bypass diodes configuration on PV modules”, Applied Energy 86 (2009) pp. 1632-1640. |
Scholten, “Silicone Encapsulation of c-Si Photovoltaic Modules”, Solar Novus Today, Feb. 10, 2014, 5 pages, lttp://www.solarnovus.com. |
3Mtm “Thermally Conductive Heat Spreading Tape, 9876B-05, 9876B-08, 9876-10, 9876-15”; Nov. 2012, pp. 1-4. |
STMicroelectronics, “How to choose a bypass diode for a silicon panel junction box”, Sep. 2011, pp. 1-24. |
Kray, D., et al., “Reducing AG Cost and Increasing Efficiency. Multicrystalline Silicon Solar Cells With Direct Plated .,1;ontacts Exceeding 17% Efficiency”, 26th EU PVSEC Proceedings, pp. 1199-1202. |
Viatula, J. Phys. Chem. Ref. Daa, vol. 8, No. 4, 1979. |
Japanese Office Action dated Dec. 17, 2019 in Patent Application No. 2019-000792. |
Japanese Office Action dated Dec. 17, 2019 in Patent Application No. 2019-000794. |
Notice of Reasons for Rejection dated Jul. 23, 2019, in Japanese Application No. 2019-000792, 2 pages. |
Office Action dated Feb. 1, 2016, corresponding to U.S. Appl. No. 14/565,820, 62 pages. |
R.A. Matula, “Electrical Resistivity of Copper, Gold, Palladium, and Silver” J. Phys. Chem. Ref. Data, vol. 8, No. 4, 1979. |
3M TM Thermally Conductive Heat Spreading Tape 98768-05 98768-08 9876-10 9876-15, pp. 1-4. |
D.W.K. Eikelboom, “Conductive Adhesives for Low-Stress Interconnection of Thin Back-Contact Solar Cells”, 29th IEEE Photovoltaic Specialists Conference, May 20-24, 2002, New Orleans, USA. |
Geoffrey R. Walker, “Cascaded DC-DC Converter Connection of Photovoltaic Modules”, IEEE Transactions on Dower Electronics, vol. 19. No. 4, Jul. 2004. |
F.C. Nix, Phys. Rev. 57, 744 (1940). |
“ST Microelectronics, How to choose a bypass diode for a silicon panel junction box”, AN3432, 24 pages. |
F.C. Nix et al., “The Thermal Expansion of Pure Metals: Copper, Gold, Aluminum, Nickel, and Iron”, Oct. 15, 2914, vol. 60, 9 pages. |
Goldberg, Lee H., “Active Bypass Diodes Improve Solar Panel Efficiency and Performance”, Digi-Key Corporation, ittp://www.digikey.com/en/articles/techzone/2012/dec/ctivebypassdiodesimprovesolarpanelefficiencyandperformance, Dec. 12, 2012, 8 pages. |
Hermann, W. et al., “Operational Behaviour of Commercial Solar Cells Under Reverse Biased Conditins”, TON./Rheinland Sicherheit und Umweltschutz GmbH, 3 pages. |
Creative Materials, “Product Announcement: Flexible Electrically Conductive Adhesive Family As Solder Replacements in Solar Cells”, hffp://www.creativematerials.com/news/pr-conductive-3dhesive-for-solar-cells.php, Feb. 9, 2015, 2 pages. |