Patent Application
20110121054
1. Field of the Invention
The present invention relates to the application of a metal plate member fixation device for joining a metal plate member to a shell and more particularly, to a solder material overflow preventive metal plate member fixation device installation method, which prevents overflow of the melted solder material during the bonding operation, assuring high installation quality.
2. Description of the Related Art
When fastening plate members together, a positioning screw formed of a knob, a ring and a screw nail is usually used. During installation, the screw nail and the ring are secured to the first plate member, and then the knob is rotated to drive the screw nail into the second plate member, and then a hand tool is used to fasten tight the screw nail, affixing the first and second plate members together. This plate member joining method can be used in a machine tool to join plate members together.
The power drive and speed-adjustment unit of a machine tool are generally provided inside the shell (housing). To facilitate repair of a machine tool or adjustment of the output speed of a machine tool, a detachable plate member is usually provided at the shell (housing) of the power drive or speed-adjustment unit. Screw bolts are commonly used to fasten the movable plate member to the housing. When unfastening screw bolts to dismount a movable plate member from the housing, the associating lock nuts may fall from the screw bolts. This movable plate member mounting and dismounting procedure is complicated, wasting much time and labor.
There is known a metal plate member fixation device comprised of a cap, a screw bolt, a spring member and a barrel for joining two metal plate members together. After fixation of the barrel of the metal plate member fixation device to a through hole on a first plate member, the screw bolt is threaded into a screw hole on a second plate member to secure the first plate member and the second plate member together. Because the barrel of the metal plate member fixation device is kept secured to the first plate member after removal of the first plate member from the second plate member, the metal plate member fixation device will not be missed by accident. Further, an automatic machine may be used to pick up the barrel and to insert the barrel into the mounting through hole on the first metal plate member for quick bonding of the barrel to the first metal plate member with a solder material through a reflow soldering process. After bonding of the barrel to the first metal plate member, the automatic machine is operated against to pick up the assembly of the cap, the screw bolt and the spring member and to couple the cap to the barrel.
The barrel may be prepared from stainless steel. Alternatively, the barrel may be prepared from any other metal material and processed through a surface treatment (electroplating or chemical plating). Due to the solder resistant surface characteristic of the barrel, a solder material must be used to facilitate bonding of the barrel to the first metal plate member. When bonding the barrel to the first metal plate member, the melted solder material may flow into the inside of the barrel subject to the siphon effect, clogging the opening of the barrel or causing deformation of the barrel. When an overflow of the solder material happens, the solder material may be not sufficiently filled in between the outside wall of the barrel and the peripheral wall of the mounting through hole of the first metal plate member, lowering the bonding strength between the barrel and the first metal plate member and installation quality.
Therefore, it is desirable to provide a metal plate member fixation device installation method that eliminates overflow of the solder material during the bonding operation.
The present invention has been accomplished under the circumstances in view. It is therefore an object of the present invention to provide a solder mask overflow preventive metal plate member fixation device installation method, which prevents overflow of the solder material during the bonding operation, assuring a high level of installation quality.
To achieve this and other objects of the present invention, a solder mask overflow preventive metal plate member fixation device installation method comprises the steps of preparing a barrel and inserting the barrel into a mounting through hole on a metal plate member to abut a bottom bonding surface of the barrel against a solder material at the metal plate member; press-fitting a solder mask insert into the barrel to keep the solder mask insert in flush with the bottom edge of the barrel for stopping a solder material from flowing into the barrel; bonding the barrel to the metal plate member through a soldering process; and removing the solder mask insert from the barrel after the soldering process.
In an alternate form of the present invention, a cap is fastened to the head of a lock screw and a spring member is sleeved onto the lock screw after bonding of the barrel to the metal plate member and fore removing of the solder mask insert from the barrel, and then the lock screw is inserted into the barrel to have the spring member be stopped between a part of the barrel and the head of the lock screw, and then the cap is coupled to the barrel. By means of moving the cap relative to the barrel, the lock screw is forced against the solder mask insert to push the solder mask insert out of the barrel.
Further, the solder mask can be processed through a surface treatment to provide an anti-skid surface layer for friction engagement with the inside wall of the barrel to prevent displacement of the solder mask insert relative to the barrel. Further, the anti-skid surface layer can be made having an embossed pattern, evenly distributed raised portions or fine teeth, evenly distributed ribs, intersected ribs or the like. Further, the solder mask insert can be shaped like a circular block or T-bar.
Referring to
According to the present invention, the barrel 1 comprises a top coupling flange 12, a bottom mounting unit 11 having a radially extended bottom bonding flange 111 and an axially extended bottom extension tube 113, a stepped axial hole 10;110 formed of a relatively wider upper axial hole section 10 and a relatively narrower lower axial hole section 110 and axially extending through top and bottom sides thereof and a step 12 extending around the inside wall between the relatively wider upper axial hole section 10 and the relatively narrower lower axial hole section 110. Further, the step 12 is a beveled step sloping downwards in direction from the relatively wider upper axial hole section 10 toward the relatively narrower lower axial hole section 110. The axially extended bottom extension tube 113 extends axially from the bottom end of the barrel 1. The bottom bonding flange 111 extends radially around the periphery of the bottom end of the barrel 1. The bottom bonding surface 112 of the radially extended bottom bonding flange 111 expends perpendicular to the periphery of the axially extended bottom extension tube 113. During installation, the axially extended bottom extension tube 113 is inserted into the mounting through hole 20 of the metal plate member 2, and the bottom bonding surface 112 of the radially extended bottom bonding flange 111 is stopped against the solder material 21 that is applied to the top surface of the metal plate member 2 around the mounting through hole 20. Thereafter, the solder mask insert 3 is press-fitted into the relatively narrower lower axial hole section 110 of the barrel 1 to force the periphery 32 of the solder mask insert 3 into friction engagement with the inside wall of the bottom extension tube 113 and to keep the bottom wall 31 of the solder mask insert 3 in flush with the bottom edge 114 of the bottom extension tube 113. Further, the bottom wall 31 of the solder mask insert 3 is kept in flush with the bottom edge 114 of the bottom extension tube 113, preventing any gaps in between the solder mask insert 3 and the bottom extension tube 113. The periphery 32 of the solder mask insert 3 is processed through a surface treatment, assuring positive friction engagement between the solder mask insert 3 and the inside wall of the bottom extension tube 113 after insertion of the solder mask insert 3 into the bottom extension tube 113. Therefore, the solder mask insert 3 supports the barrel 1 against deformation upon a severe temperature change and will not be moved axially relative to the barrel 1 during the soldering process. After insertion of the barrel 1 into the metal plate member 2 and insertion of the solder mask insert 3 into the barrel 1, the barrel 1 with the solder mask insert 3 and the metal plate member 2 are sent to a reflow oven for reflow soldering. When the solder material 21 is melted, the melted solder material 21 is evenly distributed over the bottom bonding surface 112 of the radially extended bottom bonding flange 111, the outside wall of the bottom extension tube 113 and the inside wall of the metal plate member 2 around the mounting through hole 21. During the reflow soldering operation, the solder mask insert 3 stops the melted solder material 21 from flowing into the inside of the relatively narrower lower axial hole section 110 of the barrel 1, preventing clogging of the relatively narrower lower axial hole section 110 of the barrel 1 by the solder material 21 and avoiding damage of the melted solder material 21 to the inside wall of the bottom extension tube 113. Thus, the barrel 1 can be positively bonded to the metal plate member 2. After the bonding operation, the metal plate member 2 and the bonded barrel 1 are removed from the reflow oven and cooled down, and then the solder mask insert 3 is removed from the relatively narrower lower axial hole section 110 of the barrel 1 directly. Alternatively, the solder mask insert 3 can be pushed out of the barrel 1 through the relatively wider upper axial hole section 10. By means of the use of the solder mask insert 3, the invention prevents flowing of the melted solder material 21 into the relatively narrower lower axial hole section 110 of the barrel 1 to damage the inside wall of the bottom extension tube 113.
Further, the periphery 32 of the solder mask insert 3 can be processed through a surface treatment to provide an anti-skid surface layer. The anti-skid surface layer can be made having an embossed pattern, evenly distributed raised portions or fine teeth, evenly distributed ribs, intersected ribs or the like to provide proper anti-skid function so that the solder mask insert 3 is prohibited from axial displacement relative to the bottom extension tube 113 after its insertion into the bottom extension tube 113. Further, press-fitting the solder mask insert 3 into the relatively narrower lower axial hole section 110 of the barrel 1 does not damage the inside wall of the bottom extension tube 113. Further, the outside wall of the solder mask insert 3 can be processed through a solder mask treatment, preventing adherence of the solder material 21 during the reflow soldering operation.
Referring to
According to this application example, the barrel 1 comprises a top coupling flange 12, a bottom mounting unit 11 having a radially extended bottom bonding flange 111 and an axially extended bottom extension tube 113, a stepped axial hole 10;110 formed of a relatively wider upper axial hole section 10 and a relatively narrower lower axial hole section 110 and axially extending through top and bottom sides thereof and a step 12 extending around the inside wall between the relatively wider upper axial hole section 10 and the relatively narrower lower axial hole section 110. Further, the step 12 is a beveled step sloping downwards in direction from the relatively wider upper axial hole section 10 toward the relatively narrower lower axial hole section 110. The axially extended bottom extension tube 113 extends axially from the bottom end of the barrel 1. The bottom bonding flange 111 extends radially around the periphery of the bottom end of the barrel 1. The bottom bonding surface 112 of the radially extended bottom bonding flange 111 expends perpendicular to the periphery of the axially extended bottom extension tube 113. During installation, the axially extended bottom extension tube 113 is inserted into the mounting through hole 20 of the metal plate member 2, and the bottom bonding surface 112 of the radially extended bottom bonding flange 111 is stopped against the solder material 21 that is applied to the top surface of the metal plate member 2 around the mounting through hole 20. Thereafter, the solder mask insert 3 is press-fitted into the relatively narrower lower axial hole section 110 of the barrel 1 to force the periphery 32 of the solder mask insert 3 into friction engagement with the inside wall of the bottom extension tube 113 and to keep the bottom wall 31 of the solder mask insert 3 in flush with the bottom edge 114 of the bottom extension tube 113. Further, the bottom wall 31 of the solder mask insert 3 is kept in flush with the bottom edge 114 of the bottom extension tube 113, preventing any gaps in between the solder mask insert 3 and the bottom extension tube 113. The periphery 32 of the solder mask insert 3 is processed through a surface treatment, assuring positive friction engagement between the solder mask insert 3 and the inside wall of the bottom extension tube 113 after insertion of the solder mask insert 3 into the bottom extension tube 113. Therefore, the solder mask insert 3 supports the barrel 1 against deformation upon a severe temperature change and will not be moved axially relative to the barrel 1 during the soldering process. After insertion of the barrel 1 into the metal plate member 2 and insertion of the solder mask insert 3 into the barrel 1, the barrel 1 with the solder mask insert 3 and the metal plate member 2 are sent to a reflow oven for reflow soldering. When the solder material 21 is melted, the melted solder material 21 is evenly distributed over the bottom bonding surface 112 of the radially extended bottom bonding flange 111, the outside wall of the bottom extension tube 113 and the inside wall of the metal plate member 2 around the mounting through hole 21. During the reflow soldering operation, the solder mask insert 3 stops the melted solder material 21 from flowing into the inside of the relatively narrower lower axial hole section 110 of the barrel 1, preventing clogging of the relatively narrower lower axial hole section 110 of the barrel 1 by the solder material 21 and avoiding damage of the melted solder material 21 to the inside wall of the bottom extension tube 113. Thus, the barrel 1 can be positively bonded to the metal plate member 2.
After the bonding operation, the metal plate member 2 and the bonded barrel 1 are removed from the reflow oven and cooled down. Thereafter, prepare a lock device 4, which comprises a lock screw 421 and a cap 41. The lock screw 421 has a head 423 and a shoulder 42 at its one end. The head 423 has an engagement portion 4231 located on the periphery. The cap 41 defines an open chamber 40. Further, the cap 41 has an annular retaining portion 411 disposed at the free end and spaced around the lock screw 421. The cap 41 is fixedly fastened to the engagement portion 4231 of the head 423 of the lock screw 421. Thereafter, sleeve the spring member 422 onto the lock screw 421, and then insert the lock screw 421 into the relatively wider upper axial hole section 10 of the barrel 1 to hold the spring member 422 between the shoulder 42 of the lock screw 421 and the step 12 of the barrel 1, and then axially slidably couple the annular retaining portion 411 of the cap 41 to the periphery of the barrel 1 at the metal plate member 2. After coupling of the cap 41 to the barrel 1, the spring member 422 pushes the lock screw 421 and the cap 41 axially outwardly relative to the barrel 1, causing the annular retaining portion 411 of the cap 41 to be stopped at the bottom side of the top coupling flange 101 of the barrel 1. Thereafter, move the cap 41 axially downwardly toward the metal plate member 2 relative to the barrel 1 to force the lock screw 421 against the solder mask insert 3 and to further push the solder mask insert 3 out of the barrel 1.
Further, the periphery 32 of the solder mask insert 3 can be processed through a surface treatment to provide an anti-skid surface layer. The anti-skid surface layer can be made having an embossed pattern, evenly distributed raised portions or fine teeth, evenly distributed ribs, intersected ribs or the like that provide proper anti-skid function so that the solder mask insert 3 is prohibited from axial displacement relative to the bottom extension tube 113 after its insertion into the bottom extension tube 113. Further, press-fitting the solder mask insert 3 into the relatively narrower lower axial hole section 110 of the barrel 1 does not damage the inside wall of the bottom extension tube 113. Further, the outside wall of the solder mask insert 3 can be processed through a solder mask treatment, preventing adherence of the solder material 21 during the reflow soldering operation. Further, the cap 41 can be made having a plurality of longitudinal crevices 412 cut through the annular retaining portion 411. Subject to the effect of the longitudinal crevices 412, the annular retaining portion 411 of the cap 41 can be conveniently coupled to the periphery of the barrel 1. Further, the lock screw 421 can be made having a tool groove 4232 located on the center of the top wall of the head 423 and exposed to the outside of the cap 41. Further, the tool groove 4232 of the lock screw 421 can be a Phillipes groove, keystone groove, asterisk groove or hex groove so that a corresponding screwdriver or wrench can be used to rotate the lock screw 421 into the workpiece with less effort.
Further, the barrel 1, the spring 422 and the lock device 4 of the lock screw 421 and the cap 41 constitute a metal plate member fixation device for detachably fixing the metal plate member 2 to a shell 5. After removal of the solder mask insert 3 from the barrel 1, the metal plate member 2 is attached to the shell 5 to aim the mounting through hole 20 of the metal plate member 2 at a mounting screw hole 50 on the shell 5, and then drive the lock screw 421 into the mounting screw hole 50 of the shell 5 to lock the metal plate member 2 to the shell 5.
Referring to
As stated above, a solder material overflow preventive metal plate member fixation device installation method in accordance with the invention is to press-fit a solder mask insert 3 into the relatively narrower lower axial hole section 110 of the barrel 1, forcing the periphery 32 of the solder mask insert 3 into friction engagement with the inside wall of the barrel 1 and keeping the bottom wall 31 of the solder mask insert 3 in flush with the bottom edge 114 of the bottom extension tube 113 of the barrel 1. When bonding the barrel 1 to the metal plate member 2 after insertion of the bottom extension tube 113 of the barrel 1 into the mounting through hole 20 of the metal plate member 2 and abutment of the bottom bonding surface 112 of the radially extended bottom bonding flange 111 of the barrel 1 against the solder material 21 at the metal plate member 2 around the mounting through hole 20, the solder mask insert 3 stops the melted solder material 21 from entering the relatively narrower lower axial hole section 110 of the barrel 1, avoiding deformation of the barrel 1 due to the effect of the high temperature of the melted solder material 21 and assuring a high level of installation quality.
In conclusion, the invention provides a solder material overflow preventive metal plate member fixation device installation method, which has the advantages and features as follows:
Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.
