Patent Application
20120291922
The present invention relates to a solder paste.
Conventionally, various solder pastes have been used for solder bonding of electronic circuit components and the like. Particularly, a flux included in a solder paste is used as a material for removing a metal oxide on the surface of solder and the surface of a circuit board and preventing reoxidation of a metal during soldering. In addition, the flux plays an important role for reducing the surface tension of solder and performing soldering in good condition.
Incidentally, attempts have been conventionally made to improve the reliability and soldering ability by adding an organic acid and the like in combination to a flux for a solder paste (hereinafter referred to simply as flux). However, there has not been found a flux that adequately meets market needs for the slumping resistance which, in recent years, has gradually received attention in association with miniaturization of electronic circuit components and the like. A flux poor in slumping resistance may cause frequent occurrence of solder balls in a chip component. Therefore, if the solder ball drops, the solder ball enters between leads of components with pitches narrowed in association with miniaturization of components, thus raising the possibility of causing a short-circuit failure. In addition, the aforementioned market needs can be particularly strict with on-vehicle electronic components.
For improvement of the above-mentioned slumping resistance, in other words “shear drop” by heating, a number of proposals have been made so far. Specifically, those include, for example, the following methods.
a) Method of incorporating a polyethylene glycol polypropylene glycol-polyethylene glycol block polymer into a solder paste composition containing a solder powder, a rosin resin, an activator and a solvent (see Patent Document 1).
b) Method of adding a fluorine compound such as a fluororesin compound or a fluorosurfactant in a flux of a solder paste in an amount of 0.05 to 10% by weight (see Patent Document 2).
c) Method of preparing a solder paste by mixing a solder powder comprising a spherical powder and amorphous powders of various shapes with a pasty flux, wherein the amorphous powders are mixed in an amount of 10 to 50% by weight based on the total solder powder (see Patent Document 3).
As described above, it is very difficult to develop a flux and a solder paste well applicable to electronic circuit components, miniaturization of which has been significantly progressed. For example, employment of methods (a) and (b) described in Patent Documents 1 and 2 mentioned above cannot provide adequate reliability because when a low-volatile polar substance is added, it remains even after solder is melted. Employment of the method (c) described in Patent Document 3 mentioned above leads to not only a reduction in flowability of a solder paste but also a degradation in transfer printing characteristics of details because amorphous powders are added.
In addition, for a flux of a solder paste composition that has been used so far, an organic acid, particularly a dibasic acid with a relatively low molecular weight (for example a molecular weight of 250 or less) from the viewpoint of activation power has been used as an activator (see Patent Document 4). However, for a lead-free solder paste which has been used in recent years, strong activation power is required as compared to a conventional tin-lead alloy-based solder paste, and therefore the above-mentioned dibasic acid must be used in a large amount. Thus, an organic acid metal salt produced by reaction of the dibasic acid with a metal oxide in soldering cannot be fully dissolved in a flux residue, resulting in spotted deposition of the organic acid metal salt on a substrate. The deposit becomes a cause of corrosion or insulation deterioration as the organic acid is easily dissociated by water.
Thus contemplated is a method for coping with the problem by reducing the content of a dibasic acid contained in the flux of the solder paste composition or replacing the dibasic acid with a monobasic acid. However, when such a method is carried out, activation power is reduced even though an improvement is provided in the respect of deposition of a metal salt. As a result, a soldering failure frequently occurs in association with the reduction in activation power.
The present invention solves the above technical problems to significantly contribute to realization of a solder paste well applicable to electronic circuit components, miniaturization of which has been significantly progressed in recent years, and practical application thereof. The inventors have conducted vigorous studies for obtaining a solder paste that realizes high reliability and good soldering ability with attention given particularly to improvement of the functionality of an activator and a base resin contained in a flux for a solder paste and a solder paste. As a result, it has been found that employment of a solder paste containing an activator comprising multiple kinds of dibasic acids, which molecular weight are in a specified range and one kind of monobasic acid and a specific resin additive leads to maintenance of high reliability and excellent soldering ability and further to an improvement in slumping resistance. In addition, the inventors have found that the solder paste also takes into consideration impacts on environment without increasing production costs. The present invention has been created by way of such a viewpoint and circumstances.
One solder paste of the present invention includes within a flux an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes, wherein the solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight. In addition, the solder paste has a viscosity at 80° C. of 400 Pa·s or greater.
The solder paste can realize high reliability and excellent soldering ability by having the activator described above. Inclusion of at least one selected from the group consisting of high-density polyethylenes and polypropylenes contributes to an increase in viscosity of the solder paste at high temperature (80° C.) conditions, so that the slumping resistance can be improved. In other words, “shear drop” by heating can be suppressed.
According to one solder paste of the present invention, the slumping resistance is improved. In other words, “shear drop” by heating can be suppressed.
An embodiment of the present invention will now be described.
As described above, the flux for a solder paste of this embodiment has an activator having a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less and a dibasic acid with a molecular weight of 300 or greater and 600 or less. The flux for a solder paste of this embodiment also includes at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes, and the amount of the resin additive to be added is 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight. In addition, the solder paste of this embodiment has a viscosity of 400 Pa·s or greater at 80° C. The high-density polyethylene in the present invention has a density of 942 kg/m3 or greater as defined in JIS K6922-1:1997. Similarly, the medium-density polyethylene has a density of 930 kg/m3 or greater and less than 942 kg/m3, and the low-density polyethylene has a density of 910 kg/m3 or greater and less than 930 kg/m3.
Here, the activator described above can contribute to an improvement in slumping resistance, in other words suppression of “shear drop” by heating. As described above, any one or both of the high-density polyethylene and the polypropylene contribute to an increase in viscosity of the flux and solder paste under, for example, a temperature of 80° C. at which a common flux for a solder paste starts to soften. Therefore, for example, “shear drop” by heating can be suppressed in a process commonly referred to as reflow in which a base electrode and an electronic component are soldered together by heating/melting solder. Thus, such a solder paste can be also applied to electronic circuit components, miniaturization of which has been significantly progressed, as the above-mentioned occurrence of a ball can be suppressed.
As a dibasic acid with a molecular weight of 250 or less, a dibasic acid with a molecular weight of 90 or greater is preferable. A representative example of the dibasic acid with a molecular weight of 250 or less can be selected from the group of malonic acid, succinic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, phthalic acid, hexahydrophthalic acid, aminosuccinic acid and diphenic acid. A representative example of the monobasic acid with a molecular weight of 150 or greater and 300 or less can be selected from the group of decanoic acid, stearic acid, oleic acid, anisic acid, benzoylbenzoic acid, dichlorobenzoic acid, dibromosalicylic acid, diphenyl acetic acid and cuminic acid. Further, a representative example of the dibasic acid with a molecular weight of 300 or greater and 600 or less can be selected from the group of Model Number: SL-20 (manufactured by Okamura Oil Mill Co., Ltd.), an esterification product of diethylene glycol and succinic anhydride, a (meth)acrylic acid adduct of an unsaturated fatty acid and a dimer of an unsaturated fatty acid. As an example of other activator that can be used, a hydrohalic acid salt of ethylamine, propylamine, diethylamine, triethylamine, diphenylguanidine, ethylenediamine, aniline or the like, lactic acid or citric acid.
The amounts of the above-mentioned dibasic acid with a molecular weight of 250 or less, monobasic acid with a molecular weight of 150 or greater and 300 or less and dibasic acid with a molecular weight of 300 or greater and 600 or less to be used are not particularly limited. However, it is preferable to have about 100 parts by weight or greater and 500 parts by weight or less of monobasic acid with a molecular weight of 150 or greater and 300 or less based on 100 parts by weight of the dibasic acid with a molecular weight of 250 or less from the viewpoint of maintenance of soldering ability and reliability. From the aforementioned viewpoint, it is further preferable to have about 150 parts by weight or greater and 350 parts by weight or less of monobasic acid with a molecular weight of 150 or greater and 300 or less, in particular, based on 100 parts by weight of the dibasic acid with a molecular weight of 250 or less. On the other hand, it is preferable from the aforementioned viewpoint to have about 80 parts by weight or greater and 400 parts by weight or less of dibasic acid with a molecular weight of 300 or greater and 600 or less based on 100 parts by weight of the dibasic acid with a molecular weight of 250 or less. From the aforementioned viewpoint, it is further preferable to have about 80 by weight or greater and 300 parts by weight or less of dibasic acid with a molecular weight of 300 or greater and 600 or less based on 100 parts by weight of the dibasic acid with a molecular weight of 250 or less.
The amount of any one or both of the high-density polyethylene and the polypropylene to be used may be 4% by weight or greater and 12% by weight or less when the total amount of flux is taken as 100% by weight. However, it is further preferable that any one or both of the high-density polyethylene and the polypropylene be present in an amount of about 5 parts by weight or greater and 9 parts by weight or less based on 100 parts by weight of the flux from the viewpoints of prevention of slump by heating and ease of adjustment of the viscosity of the solder paste.
Here, it is one preferred aspect that the high-density polyethylene for use in this embodiment meets at least one of the following requirements a) to d) for the particle size, particle size distribution or shape of particulate high-density polyethylenes within the flux for a solder paste.
a) The high-density polyethylenes have an average of the longest particle sizes of 0.001 μm or greater and 50 μm or less.
b) The number of high-density polyethylenes with a longest particle size of 60 μm or less within a randomly selected field of 1.5 mm×1.1 mm in the flux for a solder paste is 90% or greater of the total number of the high-density polyethylenes when observed at a 200× magnification by a light microscope.
c) The number of high-density polyethylenes with a longest particle size of 100 μm or greater within a randomly selected field of 3.1 mm×2.3 mm in the flux for a solder paste is 1% or less of the total number of the high-density polyethylenes when observed at a 100× magnification by a light microscope.
d) The high-density polyethylene has a polyhedron shape.
By meeting the requirements, for example, accuracy is increased with which the high-density polyethylene within the flux is placed on a miniaturized electrode or the like, and therefore applicability to electronic circuit components and the like is further improved.
Incidentally, it is one preferred aspect that the high-density polyethylene has a molar weight of viscosity of 1500 or greater and 4500 or less. If this range of molar weight of viscosity is met, the effect of suppression of “shear drop” during heating is further improved.
It is another preferred aspect that the high-density polyethylene has a melting point of 110° C. or higher and 130° C. or lower. If this range of melting point is met, the effect of suppression of “shear drop” during heating is further improved.
It is another preferred aspect that the high-density polyethylene has an acid value of 1 or less. If this range of acid value is met, reduction of insulation reliability by addition of the high-density polyethylene can be prevented.
In addition, it is another preferred aspect that the high-density polyethylene has a glass transition temperature of −50° C. or lower. If this range of glass transition temperature is met, deterioration of the clacking resistance of flux residues, which is required particularly for a paste for an on-vehicle electronic component, can be suppressed.
Next, it is one preferred aspect that the polypropylene for use in this embodiment meets at least one of requirements a) to d) for the particle size, particle size distribution or shape of particulate polypropylenes within the flux for a solder paste.
a) The polypropylene has an average of the longest particle sizes of 0.001 μm or greater and 50 μm or less.
b) The number of polypropylene with a longest particle size of 60 μm or less within a randomly selected field of 1.5 mm×1.1 mm in the flux for a solder paste is 90% or greater of the total number of the polypropylene when observed at a 200× magnification by a light microscope.
c) The number of polypropylene with a longest particle size of 100 μm or greater within a randomly selected field of 3.1 mm×2.3 mm in the flux for a solder paste is 1% or less of the total number of the polypropylene when observed at a 100× magnification by a light microscope.
d) The polypropylene has a polyhedron shape.
By meeting the requirements, for example, accuracy is increased with which the polypropylene within the flux is placed on a miniaturized electrode or the like, and therefore applicability to electronic circuit components and the like is further improved. It is more preferable to meet two or more of the requirements a) to d) at the same time, and it is further preferable to meet all the requirements at the same time.
Here, it is one preferred aspect that the polypropylene has a molar weight of viscosity of 5000 or greater and 20000 or less. If this range of molar weight of viscosity is met, the effect of suppression of “shear drop” during heating is further improved.
It is another preferred aspect that the polypropylene has a melting point of 130° C. or higher and 160° C. or lower. If this range of melting point is met, the effect of suppression of “shear drop” during heating is further improved.
It is another preferred aspect that the polypropylene has an acid value of 1 or less. If this range of acid value is met, reduction of insulation reliability by addition of the polypropylene can be prevented.
In addition, it is another preferred aspect that the polypropylene has a glass transition temperature of 0° C. or lower. If this range of glass transition temperature is met, deterioration of the clacking resistance of flux residues, which is required particularly for a paste for an on-vehicle electronic component, can be suppressed.
As described above, not only a flux for a solder paste including only one of the high-density polyethylene and the polypropylene, but also a flux for a solder paste including both thereof is one preferred aspect. If the solder paste including both the high-density polyethylene and the polypropylene meets the preferred ranges described above, the effects described above can be exhibited.
Incidentally, it is other preferred aspects that the solder pastes further include a waxy product having a melting point of 100° C. or higher and being obtained by dehydration reaction of a higher aliphatic monocarboxylic acid, a polycarboxylic acid and diamine. This waxy product can help the action of the high-density polyethylene or polypropylene described above.
Employment of this solder paste improves the activity of a dibasic acid with a molecular weight of 250 or less. Therefore, good soldering ability is ensured. A monobasic acid with a molecular weight of 150 or greater and 300 or less and a dibasic acid with a molecular weight of 300 or greater and 600 or less, which are used in combination, promote the activation effect. In addition, the monobasic acid and dibasic acid used in combination with the dibasic acid with a molecular weight of 250 or less can cause a metal salt of a low-molecular weight dibasic acid to be uniformly dispersed in residues of the flux and to be enclosed by a hydrophobic base resin such as a rosin or an acrylic resin. Here, the metal salt of a low-molecular weight dibasic acid is a metal salt which is generated during soldering and has low solubility in flux residues. Therefore, not only decomposition and ionization of an organic acid metal salt in residues by water can be considerably suppressed, but also ionization of a remaining organic acid can be suppressed. As a result, there is obtained a flux which can further suppress electric insulation failures and occurrence of corrosion. In addition, a solder paste including such a flux has good soldering ability as well as high reliability.
In addition, for a resin included in the flux of a solder paste in this embodiment, a resin excellent in flexibility as represented by an acrylic resin can be applied from the viewpoint of improvement of the clacking resistance of residues. However, it is further one preferred aspect that any one or both of a rosin that has been conventionally used and a derivative thereof are additionally added. When any one or both of a rosin and a derivative thereof are used, the amount of any one or both of a rosin and a derivative thereof to be used is not particularly limited. However, it is preferable that any one or both of a rosin and a derivative thereof be present in an amount of 10 parts by weight or greater and 50 parts by weight or less based on 100 parts by weight of the flux from the viewpoints of soldering ability, corrosion resistance, printing workability and the like. From the aforementioned viewpoints, it is further preferable that any one or both of a rosin and a derivative thereof be present in an amount of 15 parts by weight or greater and 30 parts by weight or less based on 100 parts by weight of the flux.
Representative examples of the rosins described above are normal gum rosins, tall oil rosins and wood rosins. Representative examples of the derivatives of the rosin are heat-treated resins, polymerized rosins, hydrogenated rosins, formylated rosins, rosin esters, rosin modified maleic acid resins, rosin modified phenolic resins, acrylic acid addition rosins, rosin modified alkyd resins or the like. Such rosins and derivatives thereof are used as binders for uniformly coating an activator on a metal.
Further, a representative example of the acrylic resin described above is a thermoplastic acrylic resin prepared by polymerizing a monomer having polymerizable unsaturated groups by radical polymerization. Here, representative examples of the monomer having polymerizable unsaturated groups are (meth)acrylic acid, various kinds of esters thereof, crotonic acid, itaconic acid, maleic acid (anhydride) and esters thereof, (meth)acrylonitrile, (meth)acrylamide, vinyl chloride and vinyl acetate. Representative radical polymerizations are a bulk polymerization process, a liquid polymerization process, a suspension polymerization process and an emulsion polymerization process using such as a peroxide as a catalyst, but other known polymerization processes can be applied. It is a further preferred aspect that the acrylic resin has a weight average molecular weight of 6000 or greater and 12000 or less and a number average molecular weight of 4000 or greater and 6000 or less for providing excellent cracking resistance and flexibility.
One preferred example of the solvent used in this embodiment is a polar solvent that easily dissolves components such as an activator and a resin to form a solution. Typically, an alcohol solvent is used and particularly, diethylene glycol monoethers are excellent in volatility and activator solubility. When the aforementioned solvent is used, the amount of the solvent to be used is not particularly limited. However, it is preferable that the solvent be present in an amount of 15 parts by weight or greater and 40 parts by weight or less based on 100 parts by weight of the flux from the viewpoints of printing workability and stability of a paste. However, when multiple solvents are used in combination, the total amount of those solvents preferably falls within the range described above. From the aforementioned viewpoints, it is further preferable that the solvent be present in an amount of 20 parts by weight or greater and 35 parts by weight or less.
In production of the solder paste of this embodiment, a solvent may be used as required. The type of the solvent is not particularly limited. However, employment of a solvent with a boiling point of 150° C. or higher is preferable in that the solvent is hard to be vaporized during production of the solder paste. Specific examples thereof include triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, diethylene glycol monobutyl acetate, dipropylene glycol, diethylene glycol-2-ethylhexyl ether, α-terpineol, benzyl alcohol, 2-hexyl decanol, butyl benzoate, diethyl adipate, diethyl phthalate, dodecane, tetradecene, dodecyl benzene, ethylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, hexylene glycol, 1,5-pentanediol, methyl carbitol and butyl carbitol. Preferably, examples of the solvent include triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether and diethylene glycol monobutyl acetate.
A method for producing a flux that is used for the solder paste of this embodiment will now be described.
First, the flux of this embodiment is obtained by dissolving or mixing the above-mentioned components by a known method. For example, first, the above-mentioned components are heated at once or sequentially to be dissolved and/or mixed, and are thereafter cooled. Subsequently, a physical impulsive force is applied through a mechanical grinding process, an impulsive deformation/fracture process or the like. The physical impulsive force may be applied to any one or both of the high-density polyethylene and the polypropylene before the dissolution process. The flux of this embodiment is obtained by mixing the components by the method described above. Specifically, a known device such as a kneading device, a vacuum mixer, a homo dispenser, a Three-One motor, a planetary mixer or the like can be used as a device for mixing the above-mentioned components. Here, the temperature for mixing the above-mentioned components is not particularly limited. However, it is one preferred aspect that the above-mentioned components are dissolved by heating at temperature lower than the boiling point of a solvent used in mixing.
A method for producing the solder paste of this embodiment will now be described.
First, the composition of a solder powder used for the solder paste of this embodiment is not particularly limited. Specifically, one example thereof includes a solder powder containing one or more selected from the group consisting of tin (Sn), copper (Cu), zinc (Zn), silver (Ag), antimony (Sb), lead (Pb), indium (In), bismuth (Bi), nickel (Ni), aluminum (Al), gold (Au) and germanium (Ge). Another example includes a solder powder containing one or more selected from the group consisting of a known tin/lead alloy, a tin/silver alloy, a tin/silver/copper alloy, tin/silver/bismuth/indium, a tin/copper alloy, tin/copper/nickel, a tin/zinc alloy, a tin/zinc/bismuth alloy, a tin/zinc/aluminum alloy, a tin/zinc/bismuth/aluminum alloy, a tin/zinc/bismuth/indium alloy, a tin/bismuth alloy and a tin/indium alloy.
The shape of the solder powder is preferably spherical or substantially spherical. The solder powder can be mixed with the flux as long as its particle size is a normal size. For example, when a spherical solder powder is employed, employment of a solder powder with a diameter of 5 μm or larger and 60 μm or smaller is preferable from the viewpoint of increasing the accuracy of mounting of microelectronic components. The composition ratio of components constituting the solder powder is not particularly limited. For example, one preferred example of the solder powder includes Sn 63/Pb 37, Sn 96.5/Ag 3.5, Sn 96/Ag 3.5/Cu 0.5, Sn 96.6/Ag 2.9/Cu 0.5, Sn 96.5/Ag 3.0/Cu 0.5, Sn 42/Bi 58, Sn 99.3/Cu 0.7, Sn 91/Zn 9, or Sn 89/Zn 8/Bi 3. The values described above refer to the weight ratio of each metal.
The solder paste of this embodiment can be produced by blending the flux and the solder powder by known means. Specifically, a known device such as a vacuum mixer, a kneading device, a planetary mixer or the like can be used as a device for blending the above-mentioned components. Here, the treatment temperature and conditions for blending are not particularly limited. However, it is preferable that the treatment be carried out at 5° C. or higher and 50° C. or lower from the viewpoints of absorption of water from an external environment, oxidation of solder metal particles, thermal degradation of the flux due to temperature rising and the like. The weight ratio of the flux and the solder powder is not particularly limited. However, it is preferable that the weight ratio of the flux be 5 or greater and 20 or less while the weight ratio of the solder powder be 80 or greater and 95 or less from the viewpoints of printing workability and stability of a paste.
One or more materials selected from the group consisting of an antioxidant, a delustering agent, a colorant, a defoaming agent, a dispersion stabilizer, a chelating agent and the like can be further appropriately blended in the solder paste of this embodiment as necessary within the range of not impairing the effect of this embodiment.
Incidentally, the molar weight of viscosity of the polyethylene or the polypropylene in this application is a molar weight of viscosity My measured by a method of viscosity using an improved Ubbelohde viscometer. A specific method for measurement of a molar weight of viscosity is as follows.
First, decalin is added to a measurement sample, and the mixture is dissolved with shaking at 140° C. for 30 minutes. The flow time (seconds) of the heated/dissolved sample solution at 135±0.2° C. is measured by a viscometer to thereby obtain an intrinsic viscosity ([η]). The molar weight of viscosity is then calculated by substituting the measured value for [η] in the following formula for each of the polyethylene and the polypropylene.
Molar weight of viscosity of polyethylene=2.51×104×1.235 [η] [Mathematical Formula 1]
Molar weight of viscosity of polypropylene=10×105×1.25 [η] [Mathematical Formula 2]
The above embodiments will be described further in detail below by way of examples.
In Examples 1 and 2 and Comparative Example 1, solder pastes containing high-density polyethylenes are produced by the production method disclosed in the above embodiment. Table 1 shows the compositions of the solder pastes of Examples 1 and 2 and Comparative Example 1 and their composition ratios. Here, the high-density polyethylenes used in solder pastes of Examples 1 and 2 and Comparative Example 1 have an average of the longest particle sizes of about 35 μm, a molar weight of viscosity of about 2000, a melting point of 120° C., an acid value of 0, a glass transition temperature of −120° C. and a density of 970 kg/m3.
An acrylic resin A contained in solder pastes of Examples 1 to 6 and Comparative Examples 1 to 3 has, as physical properties, a weight average molecular weight of about 9000, a number average molecular weight of 5000, an acid value of 0 and a glass transition temperature of −60° C. A polymerized rosin A contained in the solder pastes of Examples 1 to 6 and Comparative Examples 1 to 3 has a softening point of 140° C. and an acid value of 145. Solder powders of Example 1 and Comparative Example 1 have 96.5% by weight of tin, 3.0% by weight of silver and 0.5% by weight of copper. In addition, the solder powder of Example 1 has a particle size distribution of 25 μm or greater and 38 μm or less. Solder powders used in Examples 2 to 6 and Comparative Examples 1 to 3 are the same as in Example 1, and therefore descriptions of those solder pastes can be omitted.
Solder pastes of Examples 3 and 4 are produced in the same manner as in Example 1. Table 1 also shows the compositions of the solder pastes of Examples 3 and 4 and their composition ratios. The high-density polyethylene used for the solder paste of Example 3 has an average of the longest particle sizes of about 5 μm, and the high-density polyethylene used for the solder paste of Example 4 has an average of the longest particle sizes of about 45 μm. The physical properties of the high-density polyethylenes are the same as those in Example 1 except for the average of the longest particle sizes. Therefore, duplicate descriptions are omitted.
A solder paste of Example 5 is produced in the same manner as in Example 1. Table 1 also shows the composition of the solder paste of Example 5 and its composition ratio. The high-density polyethylene used in the solder paste of Example 5 has a molar weight of viscosity of about 4000, a melting point of 130° C., a glass transition temperature of −100° C. and a density of 980 kg/m3. The physical properties of the high-density polyethylene are same as those in Example 1 except for the molar weight of viscosity, the melting point, the glass transition temperature and the density. Therefore, duplicate descriptions are omitted.
A solder paste of Example 6 is produced in the same manner as in Example 1. Table 1 also shows the composition of the solder paste of Example 6 and its composition ratio. The solder paste of Example 6 contains 0.1% by weight of a waxy product (product name: Light Amide WH-255, manufactured by KYOEISHA CHEMICAL Co., LTD.) in addition to the composition in Example 5. The physical properties of the high-density polyethylene are all the same as those in Example 5. Therefore, duplicate descriptions are omitted.
Solder pastes of Comparative Examples 2 and 3 are produced in the same manner as in Example 1. Table 1 also shows the compositions of the solder pastes of Comparative Examples 2 and 3 and their composition ratios. The low-density polyethylene used in the solder paste of Comparative Example 2 has an average of the longest particle sizes of about 40 μm, a molar weight of viscosity of about 2500, a melting point of 105° C., an acid value of 0, and a glass transition temperature of −110° C. The low-density polyethylene used in the solder paste of Comparative Example 3 has an average of the longest particle sizes of about 38 μm, a molar weight of viscosity of about 4500, a melting point of 105° C., an acid value of 0, and a glass transition temperature of −100° C. The densities of low-density polyethylene A of Comparative Example 2 and low-density polyethylene B of Comparative Example 3 are both 920 kg/m3.
In Examples 7 and 8, solder pastes containing polypropylene A are produced by the production method disclosed in the above embodiment. Table 2 shows the compositions of the solder pastes of Examples 7 and 8 and their composition ratios. As comparative examples, compositions of Comparative Examples 4 to 6 and their composition ratios are shown in Table 1 Solder pastes of Comparative Examples 4 to 6 are also produced by the production method disclosed in the above embodiment. Here, the polypropylene A used in the solder pastes of Examples 7 and 8 has an average of the longest particle sizes of about 30 μm, a molar weight of viscosity of about 10000, a melting point of 145″C, an acid value of 0 and a glass transition temperature of −20° C. A hardened castor oil is mixed in the solder paste of Comparative Example 4 in place of polypropylenes A and B. In addition, medium-density polyethylene A with an average of the longest particle sizes of about 33 μm, a molar weight of viscosity of about 2700, a melting point of 110° C., an acid value of 30, a glass transition temperature of about −80° C. and a density of 930 kg/m3 is mixed in the solder paste of Comparative Example 5 in place of polypropylenes A and B. Further, the solder paste of Comparative Example 6 does not contain polypropylenes A and B, but contains 0.9% by weight of hexamethylenebis 12 hydroxystearic acid amide.
An acrylic resin B contained in solder pastes of Examples 7 to 13 and Comparative Examples 4 to 6 has, as physical properties, a weight average molecular weight of about 9000, a number average molecular weight of about 5000, an acid value of 3 and a glass transition temperature of −55° C. A hydrogenated rosin contained in the solder pastes of Examples 7 to 13 has a softening point of 81° C. and an acid value of 165. Solder powder of Example 7 is same as the solder paste of Example 1. Solder powders of Examples 8 to 13 and Comparative Examples 4 to 6 are the same as that in Example 11, and therefore descriptions of those solder powders are omitted.
The solder pastes of Examples 9 and 10 are also produced in the same manner as in Example 7. Table 2 also shows the compositions of the solder pastes of Examples 9 and 10 and their composition ratios. Polypropylene A used in the solder paste of Example 9 has an average of the longest particle sizes of about 8 μm, and polypropylene A used in the solder paste of Example 10 has an average of the longest particle sizes of about 42 μm. The physical properties of the polypropylene are all the same as those in Example 7 except for the average of the longest particle sizes. Therefore, duplicate descriptions are omitted.
A solder paste of Example 11 is also produced in the same manner as in Example 7. Table 2 also shows the composition of the solder paste of Example 11 and its composition ratio. Polypropylene B used in the solder paste of Example 11 has an average of the longest particle sizes of about 20 μm, a molar weight of viscosity of about 19000, a melting point of 147° C., an acid value of 0 and a glass transition temperature of −25° C.
A solder paste of Example 12 is also produced in the same manner as in Example 7. Table 2 also shows the composition of the solder paste of Example 12 and its composition ratio. The solder paste of Example 12 contains 0.1% by weight of a waxy product (product name: Light Amide WH-255 manufactured by KYOEISHA CHEMICAL Co., LTD.) in addition to the composition in Example 11. The physical properties of polypropylene B are all the same as those in Example 11. Therefore, duplicate descriptions can be omitted.
A solder paste of Example 13 is also produced in the same manner as in Example 7. Table 2 also shows the composition of the solder paste of Example 13 and its composition ratio. The solder paste of Example 13 contains 0.4% by weight of each of the high-density polyethylene A used in Example 1 and the polypropylene A used in Example 7.
As a result of analyzing the solder pastes of Examples 1 to 13 and the solder pastes of Comparative Examples 1 to 6, it was found that the solder pastes of Examples 1 to 13 each contributed to an improvement in slumping resistance as shown in Table 3. The solder pastes of Examples 1 to 13 each had a viscosity of 400 Pa·s or greater at 80° C. Since the solder paste had a high viscosity during heating, good results were obtained even in a slump test using a solder paste after continuous printing for 4 hours. Further, the solder pastes of Examples 1 to 13 described above also maintained high insulation resistance values. In table 3, the unit of the “slump” is mm and the unit of the “insulation resistance” value is Ω.
On the other hand, it was found that the solder paste of each of Comparative Examples 1, 4 and 6 at 80″C had a viscosity of 400 Pa·s or less, and its slump was inferior as compared to the examples described above. It was found that the solder paste of each of Comparative Examples 2, 3 and 5 at 80″C had a viscosity of 400 Pa·s or greater, but its insulation characteristic was inferior to that of the examples described above.
Measurements of the viscosity of the solder paste in this application were made using a viscoelasticity measuring device. The specific procedure is as follows:
(1) a solder paste as a sample is inserted, between a sample stage of a measuring device and a stainless parallel flat plate of a measurement jig with a diameter of 25 mm,
(2) the gap between the sample stage and the parallel flat plate is set to 1.0 mm, and
(3) distortion is created at a frequency of 5 Hz and a swing angle of 0.1% to measure the viscosity at 80° C.
The embodiment and the examples described above are not intended to limit the present invention. Modifications within the scope of the invention including other combinations of the embodiment and the examples described above also fall within the claims.
The solder paste of the present invention is very useful for solder bonding in various applications such as electronic circuit components.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-278209 | Dec 2009 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2010/071807 | 12/6/2010 | WO | 00 | 8/1/2012 |
