Solder

Information

  • Patent Grant
  • D848232
  • Patent Number
    D848,232
  • Date Filed
    Friday, September 29, 2017
    6 years ago
  • Date Issued
    Tuesday, May 14, 2019
    5 years ago
  • Inventors
    • Tsai; Jung-Fa
  • Original Assignees
  • Examiners
    • Hyder; Philip S
    Agents
    • Kamrath; Alan D.
    • Kamrath IP Lawfirm, P.A.
  • US Classifications
    Field of Search
    • US
    • D08 291
    • D08 292
    • D08 30
    • D15 144
    • D15 1441
    • D15 1442
    • D24 144
    • CPC
    • B23K3/021
    • B23K3/022
    • B23K3/023
    • B23K3/033
    • B23K3/046
    • B23K3/0338
  • International Classifications
    • 0805
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a solder showing my new design;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a left view thereof;



FIG. 5 is a right view thereof;



FIG. 6 is a top view thereof; and,



FIG. 7 is a bottom view thereof.


The broken lines depict portions of the solder in which the design is embodied that are not considered part of the claimed design.


Claims
  • The ornamental design for solder, as shown and described.
US Referenced Citations (19)
Number Name Date Kind
4552124 Nakajima Nov 1985 A
D300297 Arehart Mar 1989 S
4966128 Wang Oct 1990 A
D330998 Watmore Nov 1992 S
5490496 Lin Feb 1996 A
5915955 Lin Jun 1999 A
5928536 Lee Jul 1999 A
6513697 Sines Feb 2003 B1
6874671 Hirano Apr 2005 B2
6989511 Tsai Jan 2006 B1
D577974 Miller Oct 2008 S
D659496 Mochizuki May 2012 S
D739696 Miyazaki Sep 2015 S
D743766 Tsai Nov 2015 S
9314863 Teraoka Apr 2016 B2
D810532 Tsai Feb 2018 S
D813628 Tsai Mar 2018 S
20030146264 Miyazaki Aug 2003 A1
20060108345 Shigekawa May 2006 A1