Patent Application
20130180694
The present invention relates to a fluid channel for a heat exchanger according to the preamble of claim 1.
In the construction of heat exchangers, in particular heat exchangers for motor vehicles, the demands made in respect of the smallest possible residues of fluxes from a soldering operation are becoming ever higher. More recent findings suggest that circulating engine coolant, for example, can be damaged if the concentrations of flux constituents in the coolant become too high.
EP 0 781 623 B1 describes a process for producing an aluminum heat exchanger, in which welded flat tubes are used. In this case, the coolant-conducting interior of the flat tubes is soldered without flux, wherein beads which are formed in are joined to an opposing tube wall to form supporting walls or else inner parts inserted into the tube are soldered without flux. The outer wall of the flat tubes is coated in a conventional way with flux, which cannot pass into the interior of the tube on account of the welding of the tube wall which takes place before assembly.
It is an object of the invention to specify a fluid channel for a heat exchanger which subjects a fluid-conducting space to the smallest possible flux loading.
For a fluid channel mentioned in the introduction, this object is achieved according to the invention by the characterizing features of claim 1. Owing to the path which is open between the solder joints before the soldering operation, the fluid channel can be designed with considerably greater flexibility compared to the prior art.
Furthermore, it is advantageously possible, for example for the production of flat tubes, to dispense with a weld seam provided before the soldering operation. Owing to the soldering of the soldering region and counterpart by means of flux, at best a small amount of flux passes into the interior of the fluid channel and thus into later contact with the conducted fluid. At the same time, the flux-free soldering of the structure arranged in the interior of the fluid channel allows for a desired construction of the fluid channel, e.g. with mechanical reinforcements, partition walls and/or turbulence-generating means.
Within the context of the invention, a fluid channel is to be understood as meaning any fluid-conducting structure based on aluminum, in particular folded flat tubes or fluid-conducting chambers in heat exchangers of a stacked plate design. The soldering of the soldering region of the metal sheet, which takes place by means of flux, has the particularly expedient effect of closing off the fluid channel in a fluid-tight manner, where the favorable and procedurally reliable properties of soldering with flux are particularly advantageous. The counterpart may be, for example, a further part of the fluid channel, for example a flat tube half in the case of multi-part flat tubes. It may also be another portion of the metal sheet, for example in the case of flat tubes which are folded in a single piece and have only one closing fold.
Within the context of the invention, a flux means any additive suitable for the brazing of aluminum. The following are used inter alia as flux: potassium aluminum fluorides (trade name Nocolok) and mixtures of cesium fluoride and/or lithium fluoride and/or zinc fluoride with potassium aluminum fluorides. Furthermore, use is made of potassium silicon fluorides and silicon powder, also as mixtures with the fluxes mentioned above. The use of fluxes sold under the trade name NOCOLOK has preferably become prevalent as the technology primarily used for the tightly sealed soldering of folds in the case of aluminum folded tubes for heat exchangers. The flux is applied as a powder, suspension, paste or the like, melts shortly before the solder, cleans the surfaces which are to be soldered and produces a metallically bright, oxide-free aluminum surface, which the liquid solder requires in order to be able to wet and bind.
In a particularly preferred embodiment of the invention, a capillary gap is formed between the soldering region and the counterpart at least during the soldering operation, wherein the capillary gap comprises a contact surface and a flushing channel. It is preferable, but not necessary, for the counterpart additionally to be a further soldering region of the metal sheet; by way of example, the soldering regions may be various portions of the same surface. This makes it possible overall to effect transportation of molten flux through the capillary gap and collection and/or discharge through the flushing channel over the course of the soldering operation. Tests have shown that such an arrangement is particularly well suited to making soldering with flux possible even in the presence of magnesium-containing aluminum alloys. In general, it is assumed according to the prior art that, in the case of magnesium-containing alloys, a proportion of magnesium diffuses out over the course of heating and, together with the flux, forms crystals which are harmful to the soldering operation, e.g. magnesium fluoride crystals. One possible, not necessarily correct explanation of the surprisingly good function of the preferred embodiment would be the flushing away of such crystals by the flowing flux, that is out of the capillary gap into the flushing channel.
Within the context of the present invention, a magnesium-free alloy is understood as meaning a magnesium content of less than 0.03% in the aluminum alloy. Here, all percentages indicated in relation to alloys are to be understood as % by weight.
It is generally advantageous that the core region of the metal sheet has a magnesium content of at least approximately 0.03%, particularly preferably between approximately 0.1% and approximately 0.3%. It is generally preferable that the magnesium content of the core region is not more than approximately 1.0%. The mechanical properties can thereby be improved. If the core region has no further coatings, e.g. protective platings, this magnesium content additionally improves or makes possible the flux-free soldering of the structure to the surface of the metal sheet.
In a preferred embodiment, the metal sheet has at least one unilateral solder plating, wherein the solder plating has, with particular preference but not necessarily, a magnesium content of less than approximately 2.5%. This upper limit of the magnesium content is adequate for flux-free soldering and affords a sufficient limit in respect of a negative effect on the neighboring flux-containing soldering by magnesium evaporating out. In a particularly optimized embodiment, the magnesium content of the solder plating is between approximately 0.03% and approximately 0.8%.
In an alternative or supplementary embodiment, the structure is in the form of a turbulator made of an aluminum alloy which is inserted into the fluid channel. The turbulator may have, for example, any known form of inner fin, for instance a corrugated fin, a web fin or the like. The flux-free soldering thereof is particularly expedient, since the occurrence of isolated disruptions to the soldering, for example given unfavorable deviations in the process parameters, can be better tolerated than, for instance, in the case of fluid-tight soldering of the soldering region to the counterpart. In a particularly advantageous development, the material of the turbulator does not contain any magnesium (or the magnesium content is <0.03%), wherein the metal sheet contains magnesium for soldering to the turbulator without flux. This takes into consideration the fact that turbulators usually have a large surface, through which, under unfavorable circumstances, even in the case of small magnesium contents, so much magnesium could evaporate out overall that the neighboring flux-containing soldering might be disrupted. In an alternative embodiment thereto, it is provided that the material of the turbulator contains no more than 0.7% magnesium and/or contains a solder plating having a magnesium content of between 0.03% and 0.8%. Tests have shown that even such magnesium concentrations in the core material and/or in a possible solder plating of the turbulator are regularly harmless.
In a generally preferred embodiment of the invention, the fluid channel is in the form of a flat tube having a fold which runs in the longitudinal direction of the tube, wherein the fold is in the form of a soldering region of the metal sheet. Within the context of the invention, a fold which runs in the longitudinal direction of the tube is understood as meaning any interface which can be soldered areally. By way of example, the fold can run on a broad side of the flat tube or on a narrow side. Particularly in the latter case, the fold may be shaped as a clip closure of the tube. If the fold runs on a broad side and the flat tube is provided with webs, it is expedient to provide the solder joints of the fold and of the adjacent webs on opposing sides of the flat tube.
It is very generally preferable for the fold of a flat tube according to the invention which has been soldered with wetting by flux to be at a minimum distance of 2 mm, particularly preferably of 4 mm, from the closest flux-free solder joint, in order to ensure a sufficient safety distance.
In a possible configuration of the invention, the structure can be in the form of at least one web which is shaped from the metal sheet and lies against the surface of the metal sheet. It is preferable, but not necessary, that a multi-chamber flat tube can be formed by the web. It is self-evident that both single-chamber and multi-chamber flat tubes with or without inserted turbulators can be provided.
In a preferred detail design of the invention, it is provided that the soldering region of the metal sheet has a fold portion which can be soldered areally with wetting by flux and also an adjoining edgefold bent through more than 90°. The edgefold provides an edge with defined rounding for abutment against a surface and/or for forming, for example, a flushing channel which directly adjoins the fold portion. Depending on the materials used, it may be provided with particular preference that the following applies for a length L of the edgefold and a thickness D of the metal sheet:
L>2*D;
wherein, particularly for the case of an edgefold bent through 180°, the following further applies: L<(B−2.5*D), with a width B of the flat tube. Overall, this ensures that a cut edge on the end face of the metal sheet or of the edgefold is positioned at a sufficient minimum distance from a solder joint wetted with flux or a flux-conducting region (e.g. a flushing channel). It is thereby feasible that, for example, core material exposed at the cut edge of the metal sheet, which possibly has a high magnesium content, does not disrupt the soldering process by magnesium evaporating out and reacting with the flux.
It is generally advantageous that the flux is applied areally and in excess to at least part of an opposing surface of the metal sheet before the soldering operation. Particularly if the edge of the metal sheet or the counterpart is suitably shaped, the flux does not flow or flows only to a small extent into the inner region of the fluid channel, in which flux-free soldering takes place. It is particularly preferable that the flux is applied by means of a process from the group consisting of a thermal spraying process and paintflux process. In thermal spraying processes, the flux is introduced into a high-energy, hot gas stream with air-stream powder conveying. The flux melts in part or completely and is thus applied to the surface. Known processes are, inter alia, plasma spraying processes, laser-induced spraying processes and hot-gas spraying processes. A paintflux process is understood as meaning in particular, but not exclusively, a process according to the document EP 1 287 941 A1.
The flux loading, irrespective of the application process, is advantageously 3 to 40 g/m2, preferably 5-20 g/m2 and particularly preferably 7-14 g/m2.
Further advantages and features of the invention become apparent from the exemplary embodiments described hereinbelow and also from the dependent claims.
A plurality of preferred exemplary embodiments of the invention will be described and explained in further detail with reference to the accompanying drawings hereinbelow.
The fluid channel shown in
Core Region/Base Material of the Metal Sheet:
In the present case, the flat tube is in the form of a multi-chamber flat tube having two folded webs 4 and a fold 5 for closing the tube along a longitudinal direction.
In the present case, the fold 5 is arranged on a broad side of the flat tube. It comprises a first fold portion 5a and a second fold portion 5b, which are each formed by bending opposing edge regions of the metal sheet 1 through 90°. A respective edgefold 6 adjoins the fold portions 5a, 5b through 180°. In the region of the edgefolds 6, the fold portions 5a, 5b lie against an abutment region 7 of the inner sheet metal surface 3 or inner side of the flat tube. Alongside the abutment region 7, each of the fold portions 5a, 5b forms a soldering region or a counterpart within the context of the invention.
The fold portions 5a, 5b lying against one another by way of a contact surface between them form a capillary gap 8. A flushing channel 9 is shaped at the fold between the soldering region 7 and the edgefolds 6, into which flushing channel the capillary gap 8 issues and which has a greater diameter than the capillary gap 8.
The webs 4 have a height which corresponds to the inside diameter of the flat tube, and lie against the surface 3 on the inside of the metal sheet 1 in an abutment region 10. The abutment region 10 is located on that side of the flat tube which lies opposite the soldering region 7, and therefore there is a particularly large distance between the abutment region 10 and the abutment region 7.
The webs 4 form a structure arranged in the interior of the fluid channel within the context of the invention, which lies against the inner surface 3 of the metal sheet in the abutment region 10 in order to form a first, flux-free solder joint there.
The fold 5 forms, with the fold portions 5a, 6a thereof and also the abutment region 7, a second solder joint, which is wetted with flux in a soldering operation. To this end, in the first exemplary embodiment, the entire outer broad side of the flat tube is provided with flux 11 on the side of the fold 5. The flux 11 is NOCOLOK (trade name), which has been applied by means of a paintflux process.
The fold which is open before the soldering creates an open path between the two solder joints. In particular, it is possible in geometrical terms for molten flux to flow from the second solder joint directly to the first solder joint, but in actual fact this is prevented according to the invention.
A fin or other structure of a stack of components which overall form a heat exchanger may be positioned on the outer side (not shown). The thus preassembled structure is placed in a soldering furnace and heated. In this case, both the first, flux-free solder joint and the second solder joint wetted with flux are soldered at the same time in the same soldering operation.
At an appropriate temperature, firstly the flux applied on the outside liquefies and flows into the capillary gap 8. In the present example, the flux is present in excess. After it has flowed through the gap 8 driven by a capillary action, the flux collects in the flushing channel 9. Depending on the detail design, it may also be provided in addition, but not necessarily, that the flux is discharged from the flushing channel by way of formations at the end of the flat tube (not shown).
On account of the flushing channel with a separating action, in the present case there is no wetting of the flux-free, first solder joint 4, 10. There, on account of the materials selected, flux-free soldering is effected, such that the web 4 is soldered as the structure to the opposing surface of the metal sheet. As a result of this, mechanical consolidation of the fluid channel is achieved and a plurality of separated chambers are formed.
The exemplary embodiments shown in
In the example shown in
In the example shown in
In the example shown in
In each of the examples shown in
The example shown in
The following relationship therefore preferably applies for a metal sheet thickness D, a length of the edgefold L and a tube width B:
L>2*D.
The edgefold here can be bent through any angle of significantly greater than 90° (see for instance
If the edgefold amounts to 180°, the following relationship should wherever possible also be observed, in order to prevent the end edge and the opposing side of the metal sheet from being too close (see
L<B−2.5*D.
In general, it is to be ensured expediently that the end edges of the edgefolds 6 also do not make contact with the walls of the fold portions 5a, 6a. It is preferable here to observe a safety distance of at least approximately the metal sheet thickness D. It is advantageous if the distance between a region provided with flux (coated with flux) and a region not provided with flux (not coated with flux), which are each also soldered, is approximately 2 to 4 mm, or 3 to 5.
It is also advantageous if the web 4 or the webs 4 lie against the opposing inner side of the tube wall.
Overall, this particularly effectively prevents magnesium from evaporating or diffusing towards undesirable regions or flux from flowing into the region of the end edges of the edgefolds 6.
In the example shown in
Flux can be applied in a manner analogous to the preceding examples to the outer face of the tube or in a targeted manner to one or both of the faces of the bends 12, 13 which are soldered to one another.
Analogously to the preceding examples, the flat tube has at least two webs 4 soldered without flux in the interior thereof, such that it is constructed in the manner of a multi-chamber flat tube.
The following alloys are preferred for a turbulator:
In a very preferred configuration, the turbulator is free from magnesium (<0.03% magnesium content). This avoids evaporation of magnesium which is undesirably high on account of the often large surface of turbulators. In such a configuration, the magnesium desired for the flux-free soldering is provided entirely by the metal sheet material and/or a solder plating of the metal sheet. In principle, the turbulator may also have a solder plating.
The following generally holds true: the combination of flux-free web soldering on the inner side of the tube or flux-free soldering of the inner turbulator to the inner side of the tube and flux-containing fold soldering requires suitable materials for the base material of the tube and solder plating, or, in the case of an inner turbulator, for the base material of the turbulator and turbulator solder plating.
The following variants of plated and unplated joining partners are preferred:
The following material concepts for the flux-free inner soldering are preferred:
It is self-evident that the individual features of the various exemplary embodiments can be combined with one another, depending on requirements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2010 031 468.4 | Jul 2010 | DE | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/EP11/61839 | 7/12/2011 | WO | 00 | 3/28/2013 |
