Claims
- 1. A soldering alloy consisting essentially of Sn, Ag, Bi, and Cu, wherein said alloy contains 77 to 92 weight % of Sn, 2.0 to 4.0 weight % of Ag, 5 to 18 weight % of Bi and 0.1 to 0.75 weight % of Cu.
- 2. A cream solder prepared by adding a flux to the soldering alloy of claim 1.
- 3. A soldering method comprising:providing a soldering alloy consisting essentially of Sn, Ag, Bi and Cu, wherein said alloy contains 77 to 92 weight % of Sn, 2.0 to 4.0 weight % of Ag, 5 to 18 weight % of Bi and 0.1 to 0.75 weight % of Cu, and quenching said soldering alloy to solidify same and finely disperse intermetallic compounds, thereby increasing the mechanical strength of said soldering alloy.
- 4. A soldering method comprising:providing a soldering alloy consisting essentially of Sn, Ag, Bi, and In, wherein said alloy contains 76 to 92 weight % of Sn, 2.0 to 4.0 weight % of Ag, 5 to 18 weight % of Bi and 0.5 to 1.5 weight % of In, and quenching said soldering alloy at a quenching rate of about 10° C./second to solidify said soldering alloy and finely to disperse intermetallic compounds, thereby increasing the mechanical strength of said soldering alloy.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8-23547 |
Feb 1996 |
JP |
|
REFERENCE TO RELATED APPLICATIONS
This application is a contiuation-in-part of application Ser. No. 08/792,128 filed Jan. 31, 1997, now U.S. Pat. No. 5,918,795.
US Referenced Citations (28)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0144998 |
Jun 1985 |
EP |
0787559 |
Jun 1997 |
EP |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08/792128 |
Jan 1997 |
US |
Child |
09/252787 |
|
US |