Claims
- 1. In an apparatus for providing a solder layer on a surface of a soldering material by dipping the soldering material in a bath of molten solder while applying ultrasonic vibration to the molten solder bath, the improvement which comprises a vessel for the bath of molten solder, a tip for imparting ultrasonic vibration to the bath of molten solder in the bath, and a dummy block for concentrating the ultrasonic vibration between the tip for imparting the ultrasonic vibration and a side wall of the vessel, wherein the dummy block concentrator and at least part of the tip are composed of a metal selected from the group consisting of tantalum, niobrium, molybdenum, tungsten and an alloy thereof having at least one of those metals as the main component.
- 2. The apparatus of claim 1, wherein the vessel is composed of a metal selected from the group consisting of tantalum, tungsten, molybdenum, and an alloy thereof having at least one of these metals as the main component.
- 3. The apparatus according to claim 2, wherein a coated silicon layer is formed on the inner surface of the vessel.
Parent Case Info
This is a division of application Ser. No. 689,527 filed May 24, 1976, now U.S. Pat. No. 4,042,725.
US Referenced Citations (6)
Number |
Name |
Date |
Kind |
2970933 |
Barera et al. |
Feb 1961 |
|
3287158 |
Whitfield |
Nov 1966 |
|
3313914 |
Roberts, Jr. et al. |
Apr 1967 |
|
3401026 |
Walker et al. |
Sep 1968 |
|
3554512 |
Elliott et al. |
Jan 1971 |
|
3617348 |
Kelley et al. |
Nov 1971 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
689527 |
May 1976 |
|