Solderless hearing assistance device assembly and method

Abstract
Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
Description
TECHNICAL FIELD

This document relates generally to hearing assistance systems and more particularly to methods and apparatus for solderless assembly for hearing assistance devices.


BACKGROUND

Hearing assistance devices, such as hearing aids, include, but are not limited to, devices for use in the ear, in the ear canal, completely in the canal, and behind the ear. Such devices have been developed to ameliorate the effects of hearing losses in individuals. Hearing deficiencies can range from deafness to hearing losses where the individual has impairment responding to different frequencies of sound or to being able to differentiate sounds occurring simultaneously.


The hearing aid in its most elementary form usually provides for auditory correction through the amplification and filtering of sound. Hearing aids typically include an enclosure or housing, a microphone, hearing assistance device electronics including processing electronics, and a speaker or receiver. Existing hearing aid circuits and bodies are hand assembled, use individual wires for interconnects, and use a messy and time-consuming soldering process.


Accordingly, there is a need in the art for methods and apparatus for improved assembly for hearing assistance devices.


SUMMARY

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing, such as a laser-direct structuring (LDS) housing, and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments.


One aspect of the present subject matter includes a hearing assistance device. According to various embodiments, the hearing assistance device includes a MID housing and a flexible circuit module having conductive surface traces, the flexible circuit module configured to be inserted into the MID housing. One or more hearing assistance electronic modules are configured to connect to the MID housing using direct compression without the use of wires or solder, in various embodiments.


This Summary is an overview of some of the teachings of the present application and not intended to be an exclusive or exhaustive treatment of the present subject matter. Further details about the present subject matter are found in the detailed description and appended claims. The scope of the present invention is defined by the appended claims and their legal equivalents.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 shows a block diagram of a hearing assistance device, according to various embodiments of the present subject matter.



FIGS. 2A-2B illustrate views of a flexible circuit module for a hearing assistance device, according to various embodiments of the present subject matter.



FIGS. 3A-3C illustrate views of a MID housing including conductive surface traces for a hearing assistance device, according to various embodiments of the present subject matter.



FIGS. 4-5 illustrate views of a MID housing including a microphone connection for a hearing assistance device, according to various embodiments of the present subject matter.



FIGS. 6-7 illustrate views of a MID housing including programming connections for a hearing assistance device, according to various embodiments of the present subject matter.



FIGS. 8-10 illustrate views of a MID housing including receiver connections for a hearing assistance device, according to various embodiments of the present subject matter.





DETAILED DESCRIPTION

The following detailed description of the present subject matter refers to subject matter in the accompanying drawings which show, by way of illustration, specific aspects and embodiments in which the present subject matter may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present subject matter. References to “an”, “one”, or “various” embodiments in this disclosure are not necessarily to the same embodiment, and such references contemplate more than one embodiment. The following detailed description is demonstrative and not to be taken in a limiting sense. The scope of the present subject matter is defined by the appended claims, along with the full scope of legal equivalents to which such claims are entitled.


The present detailed description will discuss hearing assistance devices using the example of hearing aids. Hearing aids are only one type of hearing assistance device. Other hearing assistance devices include, but are not limited to, those in this document. It is understood that their use in the description is intended to demonstrate the present subject matter, but not in a limited or exclusive or exhaustive sense. Hearing aids typically include an enclosure or housing, a microphone, hearing assistance device electronics including processing electronics, and a speaker or receiver. Existing hearing aid circuits and bodies are hand assembled, use individual wires for interconnects, and use a messy and time-consuming soldering process.


Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device. According to various embodiments, the hearing assistance device includes a MID housing, such as a LDS housing and a flexible circuit module having conductive surface traces, the flexible circuit module configured to be inserted into the MID housing. One or more hearing assistance electronic modules are configured to connect to the flexible circuit module using direct compression without the use of wires or solder, in various embodiments. The present subject matter uses molded interconnect device (MID) technology that combines injection-molded thermoplastic parts with integrated electronic circuit traces using selective metallization. One type of MID technology is LDS. In LDS, thermoplastic parts are doped with a metal-plastic additive that can be activated using a laser. The present subject matter contemplates any and all types of MID technology for implementation of the solderless hearing assistance device system.



FIG. 1 shows a block diagram of a hearing assistance device 100 according to one embodiment of the present subject matter. In this exemplary embodiment the hearing assistance device 100 includes hearing assistance electronics such as a processor 110 and at least one power supply 112. In one embodiment, the processor 110 is a digital signal processor (DSP). In one embodiment, the processor 110 is a microprocessor. In one embodiment, the processor 110 is a microcontroller. In one embodiment, the processor 110 is a combination of components. It is understood that in various embodiments, the processor 110 can be realized in a configuration of hardware or firmware, or a combination of both. In various embodiments, the processor 110 is programmed to provide different processing functions depending on the signals sensed from the microphone 130. In hearing aid embodiments, microphone 130 is configured to provide signals to the processor 110 which are processed and played to the wearer with speaker 140 (also known as a “receiver” in the hearing aid art).


Other inputs may be used in combination with the microphone. For example, signals from a number of different signal sources can be detected using the teachings provided herein, such as audio information from a FM radio receiver, signals from a BLUETOOTH or other wireless receiver, signals from a magnetic induction source, signals from a wired audio connection, signals from a cellular phone, or signals from any other signal source.


The present subject matter overcomes several problems encountered in assembling hearing assistance devices and their subcomponents. One of these problems is the time consuming, messy process of hand assembly and soldering. Another problem overcome by the present subject matter is the lengthy design time of each hearing aid circuit. Finally, the overall cost of materials, such as high density flex, is reduced by the present subject matter.


Currently, the assembly of flexible circuits into hearing aids can be complicated. Once the flexible circuit is inserted into the spine, each limb of the circuit must be bent down and connected to another component. The connection is currently made by direct soldering, such as to a battery contact, or a wire must be soldered to the flexible circuit pad and then run to a second component, such as a push button or microphone. Currently the primary method of soldering wire connections is hand soldering, and this process alone contributes significantly to the time required to make a custom hearing assistance product. In addition, the use of heat in the soldering process can cause component and circuit damage both during assembly and repair. Thus, the current method of using wires and soldering for hearing assistance device component interconnects consumes labor, time, additional parts (wires and additional subassemblies), additional parts cost, additional connection points and increased system volume. It also provides a difficult and messy repair process. Furthermore, the wires must be placed over the spine, taking up valuable space, and can be pulled or broken during the process.


Previous solutions to the hand soldering and assembly steps include attempts to reduce the number of wires necessary in standard hearing aid designs, specifically by replacing them with additional flexible circuit limbs. The addition of more limbs leads to even more complex and abstractly shaped circuits. This leads to fewer circuits per panel and consequently a larger numbers of costly circuit panels. The past solutions to reduce the time and effort related to designing flexible circuits have focused on designing a common flexible circuit board between products. A common flexible circuit board is difficult to accomplish due to the diverse hearing aid design shapes, electrical requirements and location of connection points. Previously, when a common design has been successfully developed it has required the removal of a circuit limb for each hearing aid design. This results in wasted flexible circuit material as well as wasted space per panel. There are also efforts made to redesign current product flexible circuit designs in order to fit more circuits per panel. These attempts result in only a few more circuits fitting onto the panel and the cost savings is minimal. This also results in even more circuit design time spent per hearing aid design.


The present subject matter provides a hearing aid circuit and body that can be assembled without the need for solder or conductive epoxy. The present subject matter is unique in that it provides a method of assembling a hearing aid circuit to the spine and other components without the need of solder or conductive epoxy by utilizing a high density flexible circuit without wires in combination with a low density MID spine or housing, in various embodiments. Various embodiments of the present subject matter include a solderless microphone connection, solderless DSP module connection, solderless integration of a receiver jack, and solderless integrated programming interface. The present subject matter improves upon previous solutions because it does not require the addition of more wires or flexible circuit limbs. In various embodiments, the method of the present subject matter leads to higher yields of hearing aid components since they are not subjected to soldering temperatures. Additionally, the design time and effort associated with developing new hearing aids is reduced, making assembly and repair substantially easier and quicker, and eliminating the need for circuit limbs leading to more circuits per panel.


According to various embodiments, the present subject matter includes four types of solderless assembly connection. The connections are made via direct compression where the MID conductors form a connection with the flex without intermediary materials such as solder or conductive epoxy. The drawings illustrate a custom hearing aid application, but one of skill in the art would understand that the present subject matter is equally applicable to other types of hearing aids, such as those with a standard spine.



FIGS. 2A-2B illustrate views of a flexible circuit module for a hearing assistance device, according to various embodiments of the present subject matter. A DSP module 200 includes an integrated flex connection area 202 having exposed traces. The exposed traces include Nickel Gold plating, in an embodiment. Other types of traces can be used without departing from the scope of the present subject matter. The traces are locate on the edges of the module, in various embodiments. An elastomeric material 204 is located between the flex and the module sides in various embodiments, providing pressure to ensure proper connections.



FIGS. 3A-3C illustrate views of a MID housing 300 including conductive surface traces for a hearing assistance device, according to various embodiments of the present subject matter. The electrical connection with the flex connection area 302 is made with plastic fingers with traces 306 that have been processed using LDS or other three-dimensional (3D) molded interconnect device (MID) technologies to provide both the connection point as well as interconnection to other components, according to various embodiments. The elastomeric material 204 located between the flex and the module sides provides pressure to ensure proper connections, in various embodiments.



FIGS. 4-5 illustrate views of a MID housing 300 including a microphone connection for a hearing assistance device, according to various embodiments of the present subject matter. In various embodiments, a connection to a microphone 410 is made directly to the microphone pads. An LDS or other 3D MID technology is used to create metallized contacts 406 that can also function as interconnects to other components, in various embodiments. According to various embodiments, the contacts 406 are integral to the polymer contact fingers which provide one side of the connection. A retention band 412 of irradiated polymer (heat shrink) is applied over the microphone and fingers and heat applied to provide compression, in an embodiment. In another embodiment, the retention is provided using a metal clip 514. Other retention mechanisms are possible without departing from the scope of the present subject matter.



FIGS. 6-7 illustrate views of a MID housing including programming connections for a hearing assistance device, according to various embodiments of the present subject matter. In various embodiments, program connections are made using LDS or other 3D MID technologies to create metallized connection contacts 620 that can also function as interconnects to other components. The MID housing accepts a programming strip 622, in an embodiment. The connection contacts 620 are integral to the MID housing 300, in various embodiments. A battery drawer 730 has cam action that provides compression to ensure a proper connection, according to various embodiments. In conjunction with a stereolithography (SLA) shell with module retention features, any component can be replaced and sent to a central reprocessing point for recovery and possible reuse, all without component or shell damage.



FIGS. 8-10 illustrate views of a MID housing 300 including receiver connections for a hearing assistance device, according to various embodiments of the present subject matter. To acoustically isolate a microphone and a receiver, no rigid connections are made to the receiver, in various embodiments. Flexible wires can be used and twisted to afford electromagnetic interference (EMI) protection as well, in various embodiments. According to various embodiments, LDS is used to provide a receptacle (via) 802. In various embodiments, the receptacle 802 is lasered at the same time as a traces pattern. In one embodiment, the receptacle 802 and custom plug 904 are smaller than currently available receiver connections. In order to provide compression in the connection, twisted wire interconnect (TWI) pins 1006 are used with a custom mold to create a jack/connector, in various embodiments. The TWI plug includes wires 1002 to the receiver and a molded grip 1004, in various embodiments. Other direct insertion mechanisms are possible without departing from the scope of the present subject matter.


The present subject matter can be used for standard fit as well as custom hearing aids, in various embodiments. Modules can be used in place of or in combination with flexible circuits, according to various embodiments. Benefits of the present subject matter include substantial assembly time and cost savings. Furthermore, the use of a common flexible circuit board for a variety of spine designs leads to less design time required for each hearing aid circuit style. The elimination of soldered wires as well as flexible circuit limbs leads to smaller hearing aids, in various embodiments.


Various embodiments of the present subject matter support wireless communications with a hearing assistance device. In various embodiments the wireless communications can include standard or nonstandard communications. Some examples of standard wireless communications include link protocols including, but not limited to, Bluetooth™, IEEE 802.11 (wireless LANs), 802.15 (WPANs), 802.16 (WiMAX), cellular protocols including, but not limited to CDMA and GSM, ZigBee, and ultra-wideband (UWB) technologies. Such protocols support radio frequency communications and some support infrared communications. Although the present system is demonstrated as a radio system, it is possible that other forms of wireless communications can be used such as ultrasonic, optical, infrared, and others. It is understood that the standards which can be used include past and present standards. It is also contemplated that future versions of these standards and new future standards may be employed without departing from the scope of the present subject matter.


The wireless communications support a connection from other devices. Such connections include, but are not limited to, one or more mono or stereo connections or digital connections having link protocols including, but not limited to 802.3 (Ethernet), 802.4, 802.5, USB, SPI, PCM, ATM, Fibre-channel, Firewire or 1394, InfiniBand, or a native streaming interface. In various embodiments, such connections include all past and present link protocols. It is also contemplated that future versions of these protocols and new future standards may be employed without departing from the scope of the present subject matter.


It is understood that variations in communications protocols, antenna configurations, and combinations of components may be employed without departing from the scope of the present subject matter. Hearing assistance devices typically include an enclosure or housing, a microphone, hearing assistance device electronics including processing electronics, and a speaker or receiver. It is understood that in various embodiments the receiver is optional. Antenna configurations may vary and may be included within an enclosure for the electronics or be external to an enclosure for the electronics. Thus, the examples set forth herein are intended to be demonstrative and not a limiting or exhaustive depiction of variations.


It is further understood that any hearing assistance device may be used without departing from the scope and the devices depicted in the figures are intended to demonstrate the subject matter, but not in a limited, exhaustive, or exclusive sense. It is also understood that the present subject matter can be used with a device designed for use in the right ear or the left ear or both ears of the user.


It is understood that the hearing aids referenced in this patent application include a processor. The processor may be a digital signal processor (DSP), microprocessor, microcontroller, other digital logic, a separate analog and separate digital chip, or combinations thereof. The processing of signals referenced in this application can be performed using the processor. Processing may be done in the digital domain, the analog domain, or combinations thereof. Processing may be done using subband processing techniques. Processing may be done with frequency domain or time domain approaches. Some processing may involve both frequency and time domain aspects. For brevity, in some examples drawings may omit certain blocks that perform frequency synthesis, frequency analysis, analog-to-digital conversion, digital-to-analog conversion, amplification, audio decoding, and certain types of filtering and processing. In various embodiments the processor is adapted to perform instructions stored in memory which may or may not be explicitly shown. Various types of memory may be used, including volatile and nonvolatile forms of memory. In various embodiments, instructions are performed by the processor to perform a number of signal processing tasks. In such embodiments, analog components are in communication with the processor to perform signal tasks, such as microphone reception, or receiver sound embodiments (i.e., in applications where such transducers are used). In various embodiments, different realizations of the block diagrams, circuits, and processes set forth herein may occur without departing from the scope of the present subject matter.


The present subject matter is demonstrated for hearing assistance devices, including hearing aids, including but not limited to, behind-the-ear (BTE), in-the-ear (ITE), in-the-canal (ITC), receiver-in-canal (RIC), completely-in-the-canal (CIC) or invisible-in-canal (IIC) type hearing aids. It is understood that behind-the-ear type hearing aids may include devices that reside substantially behind the ear or over the ear. Such devices may include hearing aids with receivers associated with the electronics portion of the behind-the-ear device, or hearing aids of the type having receivers in the ear canal of the user, including but not limited to receiver-in-canal (RIC) or receiver-in-the-ear (RITE) designs. The present subject matter can also be used in hearing assistance devices generally, such as cochlear implant type hearing devices and such as deep insertion devices having a transducer, such as a receiver or microphone, whether custom fitted, standard, open fitted or occlusive fitted. It is understood that other hearing assistance devices not expressly stated herein may be used in conjunction with the present subject matter.


In addition, the present subject matter can be used in other settings in addition to hearing assistance. Examples include, but are not limited to, telephone applications where noise-corrupted speech is introduced, and streaming audio for ear pieces or headphones.


This application is intended to cover adaptations or variations of the present subject matter. It is to be understood that the above description is intended to be illustrative, and not restrictive. The scope of the present subject matter should be determined with reference to the appended claims, along with the full scope of legal equivalents to which such claims are entitled.

Claims
  • 1. A method of manufacturing a hearing assistance device, the method comprising: providing a molded interconnect device (MID) housing using laser-direct structuring (LDS), wherein the MID housing includes a thermoplastic shell including plastic fingers with integrated circuit traces configured to receive a flexible circuit module;inserting the flexible circuit module having conductive surface traces into the MID housing, the flexible circuit module configured for a replaceable connection and including electronics for hearing assistance; andconnecting the flexible circuit module to the MID housing using direct compression of the integrated circuit traces to the conductive circuit traces without the use of wires or solder; and wherein using a retention band includes using a heat shrink band of irradiated polymer to secure the flexible circuit module to the plastic fingers, and heat is applied to provide compression.
  • 2. The method of claim 1, wherein connecting the flexible circuit module includes connecting a processing module.
  • 3. The method of claim 2, wherein the processing module includes an integrated flex connection on an edge of the processing module, the integrated flex connection including exposed traces.
  • 4. The method of claim 1, wherein connecting flexible circuit module includes connecting a microphone module.
  • 5. The method of claim 4, wherein a microphone enclosure is configured to provide compression for the connection.
  • 6. The method of claim 1, wherein using the retention band includes using a metal clip.
  • 7. The method of claim 1, wherein connecting the flexible circuit module includes making a program connection using cam pressure from a battery drawer.
  • 8. The method of claim 7, wherein the flexible circuit module includes a microphone, and wherein the microphone is replaceable via the battery door.
  • 9. The method of claim 1, wherein providing the molded interconnect device (MID) housing includes providing a laser-direct structuring (LDS) housing.
  • 10. The method of claim 1, wherein connecting the flexible circuit module includes connecting a receiver module using the MID receptacle connection.
  • 11. A hearing assistance device, comprising a molded interconnect device (MID) housing including laser-direct structuring (LDS), wherein the MID housing includes a thermoplastic shell including plastic fingers with integrated circuit traces; and a flexible circuit module having conductive surface traces, the flexible circuit module configured to be replaceably inserted into the MID housing, wherein the flexible circuit module is configured to connect to the MID housing using direct compression of the integrated circuit traces to the conductive surface traces and using a retention band includes using a heat shrink band of irradiated polymer to secure the flexible circuit module to the plastic fingers, and heat is applied to provide compression without the use of wires or solder; and wherein the flexible circuit module includes electronics for hearing assistance.
  • 12. The device of claim 11, wherein the hearing assistance device includes a hearing aid.
  • 13. The device of claim 12, wherein the hearing aid includes an in-the-ear (ITE) hearing aid.
  • 14. The device of claim 12, wherein the hearing aid includes a behind-the-ear (BTE) hearing aid.
  • 15. The device of claim 12, wherein the hearing aid includes an in-the-canal (ITC) hearing aid.
  • 16. The device of claim 12, wherein the hearing aid includes a receiver-in-canal (RIC) hearing aid.
  • 17. The device of claim 12, wherein the hearing aid includes a completely-in-the-canal (CIC) hearing aid.
  • 18. The device of claim 12, wherein the hearing aid includes a receiver-in-the-ear (RITE) hearing aid.
  • 19. The device of claim 12, wherein the hearing aid includes an invisible-in-canal (IIC) hearing aid.
  • 20. The device of claim 11, wherein the molded interconnect device (MID) housing includes a laser-direct structuring (LDS) housing.
US Referenced Citations (95)
Number Name Date Kind
2327320 Shapiro Aug 1943 A
2424422 Tresise et al. Jul 1947 A
3728509 Shimojo Apr 1973 A
3812300 Brander et al. May 1974 A
4017834 Cuttill et al. Apr 1977 A
4116517 Selvin et al. Sep 1978 A
4310213 Fetterolf, Sr. et al. Jan 1982 A
4564955 Birch et al. Jan 1986 A
4571464 Segero Feb 1986 A
4729166 Lee et al. Mar 1988 A
5049813 Van Loan Sep 1991 A
5606621 Reiter et al. Feb 1997 A
5687242 Iburg Nov 1997 A
5708720 Meyer Jan 1998 A
5755743 Volz et al. May 1998 A
5802183 Scheller et al. Sep 1998 A
5824968 Packard et al. Oct 1998 A
5825894 Shennib Oct 1998 A
5987146 Pluvinage et al. Nov 1999 A
6031923 Gnecco et al. Feb 2000 A
6167138 Shennib Dec 2000 A
6456720 Brimhall Sep 2002 B1
6766030 Chojar Jul 2004 B1
6876074 Kim Apr 2005 B2
7016512 Feeley et al. Mar 2006 B1
7110562 Feeley et al. Sep 2006 B1
7139404 Feeley et al. Nov 2006 B2
7142682 Mullenborn et al. Nov 2006 B2
7151839 Niederdrank Dec 2006 B2
7256747 Victorian et al. Aug 2007 B2
7260233 Svendsen et al. Aug 2007 B2
7263194 Niederdrank et al. Aug 2007 B2
7320832 Palumbo et al. Jan 2008 B2
7354354 Palumbo et al. Apr 2008 B2
7400738 Niederdrank et al. Jul 2008 B2
7446720 Victorian et al. Nov 2008 B2
7471182 Kumano et al. Dec 2008 B2
7593538 Polinske Sep 2009 B2
7777681 Platz Aug 2010 B2
7971337 Kral et al. Jul 2011 B2
8098863 Ho et al. Jan 2012 B2
8254608 De Finis et al. Aug 2012 B2
8295517 Gottschalk et al. Oct 2012 B2
8385573 Higgins Feb 2013 B2
8494195 Higgins Jul 2013 B2
8605913 Schwerdtner Dec 2013 B2
8638965 Higgins et al. Jan 2014 B2
8705785 Link et al. Apr 2014 B2
20020131614 Jakob et al. Sep 2002 A1
20030178247 Saltykov Sep 2003 A1
20030200820 Takad et al. Oct 2003 A1
20040010181 Feeley et al. Jan 2004 A1
20040114776 Crawford et al. Jun 2004 A1
20040120540 Mullenborn Jun 2004 A1
20040240693 Rosenthal Dec 2004 A1
20050008178 Joergensen et al. Jan 2005 A1
20050111685 Gabathuler May 2005 A1
20060097376 Leurs et al. May 2006 A1
20060159298 Von Dombrowski et al. Jul 2006 A1
20070009130 Feeley et al. Jan 2007 A1
20070036374 Bauman et al. Feb 2007 A1
20070121979 Zhu et al. May 2007 A1
20070188289 Kumano et al. Aug 2007 A1
20070248234 Ho et al. Oct 2007 A1
20080003736 Arai et al. Jan 2008 A1
20080026220 Bi et al. Jan 2008 A9
20080160828 Dangelmaier et al. Jul 2008 A1
20080187157 Higgins Aug 2008 A1
20080199971 Tondra Aug 2008 A1
20080260193 Westermann et al. Oct 2008 A1
20090074218 Higgins Mar 2009 A1
20090075083 Bi et al. Mar 2009 A1
20090196444 Solum Aug 2009 A1
20090245558 Spaulding Oct 2009 A1
20090262964 Havenith et al. Oct 2009 A1
20100034410 Link Feb 2010 A1
20100074461 Polinske Mar 2010 A1
20100124346 Higgins May 2010 A1
20100158291 Polinske et al. Jun 2010 A1
20100158293 Polinske et al. Jun 2010 A1
20100158295 Polinske et al. Jun 2010 A1
20110051966 De Finis Mar 2011 A1
20110261984 Reber Oct 2011 A1
20120014549 Higgins et al. Jan 2012 A1
20120263328 Higgins Oct 2012 A1
20120268335 Zhang et al. Oct 2012 A1
20120268348 Zhang et al. Oct 2012 A1
20120303093 Wouters Nov 2012 A1
20130187594 Barth et al. Jul 2013 A1
20130195294 Gebert et al. Aug 2013 A1
20130230197 Higgins Sep 2013 A1
20130328524 Bartulec et al. Dec 2013 A1
20140153762 Shennib Jun 2014 A1
20140194561 Ganguly Jul 2014 A1
20150256952 Naumann Sep 2015 A1
Foreign Referenced Citations (39)
Number Date Country
3006235 Oct 1980 DE
3643124 Jul 1988 DE
4005476 Jul 1991 DE
9320391 Sep 1993 DE
4233813 Nov 1993 DE
29801567 May 1998 DE
0339877 Nov 1989 EP
0866637 Sep 1998 EP
1065863 Jan 2001 EP
1317163 Jun 2003 EP
1465457 Oct 2004 EP
1496530 Jan 2005 EP
2257080 Mar 2006 EP
1811808 Jul 2007 EP
1816893 Aug 2007 EP
2040343 Mar 2009 EP
2063694 May 2009 EP
2063694 May 2009 EP
2160047 Mar 2010 EP
2200348 Jun 2010 EP
2509341 Oct 2012 EP
2160047 Oct 2013 EP
2663097 Nov 2013 EP
2879407 Jun 2015 EP
1298089 Nov 1972 GB
1522549 Aug 1978 GB
1522549 Aug 1978 GB
2209967 Aug 1990 JP
2288116 Nov 1990 JP
09199662 Jul 1997 JP
WO-2004025990 Mar 2004 WO
WO-06094502 Sep 2006 WO
WO-2007148154 Dec 2007 WO
WO-2008092265 Aug 2008 WO
WO-2008097600 Aug 2008 WO
WO-2008097600 Aug 2008 WO
WO-2008116499 Oct 2008 WO
WO-2011101041 Aug 2011 WO
WO-2014064544 May 2014 WO
Non-Patent Literature Citations (99)
Entry
Doug Gries, Photonics Applied: Microelectronics Processing: Laser Direct Structuring Crates Low-Cost 3D Intergated Circuits, Oct. 1, 2010, Laser Focus World, www.laserfocusworld.com.
Housden et al., Moulded Interconnect Devices, Feb. 2002, Prime Faraday Technology Watch, pp. 1-30.
Doug Gries, Photonics Applied: Microelectronics Processing: Laser Direct Structuring creates Low-Cost 3D Integrated Circuits, Oct. 1, 201, Laser Focus World, www.laserfocusworld.com.
Gries, Photonics Applied: Microelectronics Processing: Lasser direct structuring creates low-cost 3D interated circuits, Oct. 1, 2010, www.lasserfocusworld.com, pp. 1-8.
“U.S. Appl. No. 11/857,439, Final Office Action dated Feb. 29, 2012”, 16 pgs.
“U.S. Appl. No. 11/857,439, Non Final Office Action dated Aug. 17, 2011”, 16 pgs.
“U.S. Appl. No. 11/857,439, Notice of Allowance dated May 30, 2012”, 9 pgs.
“U.S. Appl. No. 11/857,439, Notice of Allowance dated Sep. 19, 2012”, 9 pgs.
“U.S. Appl. No. 11/857,439, Response filed Apr. 30, 2012 to Final Office Action dated Feb. 29, 2012”, 9 pgs.
“U.S. Appl. No. 11/857,439, Response filed Jun. 13, 2011 to Restriction Requirement dated May 11, 2011”, 8 pgs.
“U.S. Appl. No. 11/857,439, Response filed Dec. 17, 2011 to Non Final Office Action dated Aug. 17, 2011”, 12 pgs.
“U.S. Appl. No. 11/857,439, Restriction Requirement dated May 11, 2011”, 6 pgs.
“U.S. Appl. No. 12/027,173, Final Office Action dated Dec. 8, 2011”, 12 pgs.
“U.S. Appl. No. 12/027,173, Non Final Office Action dated Jul. 11, 2011”, 10 pgs.
“U.S. Appl. No. 12/027,173, Non Final Office Action dated Jul. 27, 2012”, 11 pgs.
“U.S. Appl. No. 12/027,173, Notice of Allowance dated Mar. 19, 2013”, 8 pgs.
“U.S. Appl. No. 12/027,173, Response filed Jun. 8, 2012 to Final Office Action dated Dec. 8, 2011”, 7 pgs.
“U.S. Appl. No. 12/027,173, Response filed Nov. 14, 2011 to Non Final Office Action dated Jul. 11, 2011”, 8 pgs.
“U.S. Appl. No. 12/027,173, Response filed Dec. 26, 2012 to Non Final Office Action dated Jul. 27, 2012”, 8 pgs.
“U.S. Appl. No. 12/539,195, Advisory Action dated Apr. 23, 2013”, 3 pgs.
“U.S. Appl. No. 12/539,195, Final Office Action dated Feb. 11, 2013”, 15 pgs.
“U.S. Appl. No. 12/539,195, Non Final Office Action dated Jul. 20, 2012”, 13 pgs.
“U.S. Appl. No. 12/539,195, Non Final Office Action dated Aug. 2, 2013”, 14 pgs.
“U.S. Appl. No. 12/539,195, Notice of Allowance dated Nov. 29, 2013”, 12 pgs.
“U.S. Appl. No. 12/539,195, Response filed Apr. 11, 2013 to Final Office Action dated Feb. 11, 2013”, 7 pgs.
“U.S. Appl. No. 12/539,195, Response filed Nov. 4, 2013 to Non Final Office Action dated Aug. 2, 2013”, 7 pgs.
“U.S. Appl. No. 12/539,195, Response filed Dec. 20, 2012 to Non Final Office Action dated Jul. 20, 2012”, 7 pgs.
“U.S. Appl. No. 12/548,051, Final Office Action dated Apr. 19, 2012”, 12 pgs.
“U.S. Appl. No. 12/548,051, Non Final Office Action dated Jan. 24, 2013”, 12 pgs.
“U.S. Appl. No. 12/548,051, Non Final Office Action dated Oct. 12, 2011”, 11 pgs.
“U.S. Appl. No. 12/548,051, Notice of Allowance dated Jul. 31, 2013”, 14 pgs.
“U.S. Appl. No. 12/548,051, Response filed Jan. 12, 2012 to Non Final Office Action dated Oct. 12, 2011”, 9 pgs.
“U.S. Appl. No. 12/548,051, Response filed Apr. 24, 2013 to Non Final Office Action dated Jan. 24, 2013”, 8 pgs.
“U.S. Appl. No. 12/548,051, Response filed Sep. 19, 2012 to Final Office Action dated Apr. 19, 2012”, 8 pgs.
“U.S. Appl. No. 12/644,188, Advisory Action dated Jul. 25, 2013”, 3 pgs.
“U.S. Appl. No. 12/644,188, Final Office Action dated May 22, 2013”, 7 pgs.
“U.S. Appl. No. 12/644,188, Non Final Office Action dated Sep. 9, 2013”, 9 pgs.
“U.S. Appl. No. 12/644,188, Non Final Office Action dated Sep. 19, 2012”, 8 pgs.
“U.S. Appl. No. 12/644,188, Response filed Feb. 19, 2013 to Non Final Office Action dated Sep. 19, 2012”, 6 pgs.
“U.S. Appl. No. 12/644,188, Response filed Jul. 22, 2013 to Final Office Action dated May 22, 2013”, 6 pgs.
“U.S. Appl. No. 12/644,188, Response filed Dec. 9, 2013 to Non Final Office Action dated Sep. 9, 2013”, 6 pgs.
“U.S. Appl. No. 13/181,752, Final Office Action dated Jul. 11, 2013”, 7 pgs.
“U.S. Appl. No. 13/181,752, Non Final Office Action dated Mar. 5, 2013”, 7 pgs.
“U.S. Appl. No. 13/181,752, Notice of Allowance dated Sep. 25, 2013”, 9 pgs.
“U.S. Appl. No. 13/181,752, Response filed Jun. 5, 2013 to Non Final Office Action dated Mar. 5, 2013”, 8 pgs.
“U.S. Appl. No. 13/181,752, Response filed Sep. 11, 2013 to Final Office Action dated Jul. 11, 2013”, 8 pgs.
“U.S. Appl. No. 13/422,177, Final Office Action dated Feb. 27, 2014”, 12 pgs.
“U.S. Appl. No. 13/422,177, Non Final Office Action dated Sep. 26, 2013”, 10 pgs.
“U.S. Appl. No. 13/422,177, Response filed Dec. 20, 2013 to Non Final Office Action dated Sep. 26, 2013”, 8 pgs.
“U.S. Appl. No. 13/776,557, Non Final Office Action dated Oct. 22, 2013”, 6 pgs.
“U.S. Appl. No. 13/776,557, Response filed Jan. 22, 2014 to Non Final Office Action dated Oct. 22, 2013”, 6 pgs.
“European Application Serial No. 12167845.2, Extended EP Search Report mailed Sep. 12, 2012”, 6 pgs.
“European Application Serial No. 08253065.0, European Examination Notification mailed Oct. 11, 2011”, 7 pgs.
“European Application Serial No. 08253065.0, European Office Action dated Aug. 26, 2010”, 6 Pgs.
“European Application Serial No. 08253065.0, Extended Search Report dated Dec. 15, 2008”, 9 pgs.
“European Application Serial No. 08253065.0, Office Action dated Jul. 17, 2009”, 1 pg.
“European Application Serial No. 08253065.0, Response filed Jan. 26, 2010 to Office Action dated Jul. 17, 2009”, 9 pgs.
“European Application Serial No. 08253065.0, Response filed Feb. 8, 2012 to Examination Notification dated Oct. 11, 2011”, 15 pgs.
“European Application Serial No. 08253065.0, Response to Office Action filed Feb. 28, 2011 to European Office Action dated Aug. 26, 2010”, 17 pgs.
“European Application Serial No. 08725262.3, EPO Written Decision to Refuse dated Oct. 19, 2012”, 14 pgs.
“European Application Serial No. 08725262.3, Office Action dated Apr. 21, 2010”, 6 Pgs.
“European Application Serial No. 08725262.3, Office Action dated Aug. 5, 2011”, 5 pgs.
“European Application Serial No. 08725262.3, Response filed Feb. 13, 2012 to Office Action dated Aug. 5, 2011”, 11 pgs.
“European Application Serial No. 08725262.3, Response Filed Nov. 2, 2010 to Office Action dated Apr. 21, 201”, 14 pgs.
“European Application Serial No. 08725262.3, Summons to Attend Oral Proceedings dated Jun. 6, 2012”, 5 pgs.
“European Application Serial No. 09168844.0, European Search Report dated Apr. 19, 2010”, 3 Pgs.
“European Application Serial No. 09168844.0, Office Action dated Apr. 8, 2013”, 5 pgs.
“European Application Serial No. 09168844.0, Office Action dated Apr. 28, 2011”, 5 pgs.
“European Application Serial No. 09168844.0, Office Action dated May 14, 2012”, 2 pgs.
“European Application Serial No. 09168844.0, Office Action dated May 3, 2010”, 5 pgs.
“European Application Serial No. 09168844.0, Response filed Feb. 24, 2012 to Office Action dated Apr. 28, 2011”, 12 pgs.
“European Application Serial No. 09168844.0, Response filed Jul. 24, 2012 to Examination Notification Art. 94(3) dated May 14, 2012”, 10 pgs.
“European Application Serial No. 09168844.0, Response Filed Nov. 15, 2010 to Office Action dated May 3, 2010”, 8 pgs.
“European Application Serial No. 09250729.2, Extended Search Report dated Dec. 14, 2009”, 4 pgs.
“European Application Serial No. 12167845.2, Response filed Apr. 10, 2013 to Extended European Search Report dated Sep. 12, 2012”, 14 pgs.
“European Application Serial No. 09168844.0, Office Action dated Sep. 4, 2012”, 4 pgs.
“European Application Serial No. 09168844.0, Response filed Mar. 14, 2013 to Office Action dated Sep. 4, 2012”, 34 pgs.
“International Application Serial No. PCT/US2008/001609, International Preliminary Report on Patentability mailed Aug. 20, 2009”, 10 pgs.
“International Application Serial No. PCT/US2008/001609, Search Report dated Jun. 19, 2008”, 7 pgs.
“International Application Serial No. PCT/US2008/001609, Written Opinion dated Jun. 19, 2008”, 8 pgs.
“LPKF Laser & Electronics”, [Online]. Retrieved from the Internet: <URL: http://www.lpkf.com/—mediafiles/1276-three-dimensional-pcb-for-hearing-aid.pdf., (Accessed Mar. 18, 2015), 1 pg.
“R+D Microson Audiological Research”, [Online]. Retrieved from the Internet: <URL: http://www.microson.es/Profesionales/IDMicroson/TecnologiaMIDENG.aspx, (Accessed Apr. 30, 2013), 1 pg.
Buchoff, L S, “Advanced Non-Soldering Interconnection”, Electro International, 1991 (IEEE), XP 10305250A1, (1991), 248-251.
Tondra, Mark, “Flow Assay With Integrated Detector”, U.S. Appl. No. 60/887,609, filed Feb. 1, 2007, 28 pgs.
“European Application Serial No. 14194666.5, Extended European Search Report dated Apr. 17, 2015”, 9 pgs.
“European Application Serial No. 14194666.5, Response filed Dec. 8, 2015 to Extended European Search Report dated Apr. 17, 2015”, 17 pgs.
“U.S. Appl. No. 14/692,849, Non Final Office Action dated Jul. 29, 2016”, 18 pgs.
“U.S. Appl. No. 14/692,849, Response filed Oct. 31, 2016 to Non Final Office Action dated Jul. 29, 2016”, 8 pgs.
“European Application Serial No. 16166704.3, Extended European Search Report dated Jul. 29, 2016”, 11 pgs.
“Molded interconnect device—Wikipedia, the free encyclopedia”, XP055290225, [Online] retrieved from the internet: <https://enwikipedia.org/w/index.php?title=Molded—interconnect—device&oldid=646412742>, (Feb. 9, 2015), 3 pgs.
MacLeod, Peter et al., “A Review of Flexible Circuit Technology and its Applications”, PRIME Faraday Technology Watch, (2002), 1-59.
“European Application U.S. Appl. No. 14194666.5, Office Action mailed 06-14-17”, 5 pgs.
“European Application U.S. Appl. No. 16166704.3, Response filed 08-16-17 to Extended European Search Report mailed 07-29-16”, 10pgs.
“Application U.S. Appl. No. 14/692,849, Final Office Action mailed 02-01-17”, 18 pgs.
“Application U.S. Appl. No. 14/692,849, Response Filed 04/03/17 to Final Office Action mailed 02-01-17”, 9 pgs.
/Angelica M Mckinney/ Date C Ons Idered Oct. 18, 2017.
“U.S. Appl. No. 14/692,849, Notice of Allowability dated Nov. 2, 2017”, 2 pgs.
“U.S. Appl. No. 14/692,849, Notice of Allowance dated Oct. 17, 2017”, 11 pgs.
“European Application Serial No. 14194666.5, Response filed Nov. 30, 2017 to Office Action dated Jun. 14, 2017”, 8 pgs.
Related Publications (1)
Number Date Country
20150146899 A1 May 2015 US