Claims
- 1. Buffing equipment for polishing a metal surface comprising a buff and a solid buffing compound applied to the buff, the solid buffing compound comprising a mixture of polishing powder and a bonding agent substantially made of a water soluble surface active agent, wherein said bonding agent is water soluble and has a melting point of 40.degree. to 80.degree. C.
- 2. Buffing equipment for polishing a metal surface comprising a buff and a solid buffing compound applied to the buff, the solid buffing compound comprising a mixture of polishing powder and a bonding agent substantially made of polyalkylene glycol which is an intermediate of a water soluble surface active agent, wherein said bonding agent is water soluble and has a melting point of 40.degree. to 80.degree. C.
- 3. Buffing equipment for polishing a metal surface comprising a buff and a solid buffing compound applied to the buff, the solid buffing compound comprising a mixture of polishing powder and a bonding agent substantially made of a water soluble surface active agent and polyalkylene glycol which is an intermediate of said water soluble surface active agent, wherein said bonding agent is water soluble and has a melting point of 40.degree. to 80.degree. C.
Priority Claims (2)
Number |
Date |
Country |
Kind |
4-257116 |
Aug 1992 |
JPX |
|
5-105084 |
Apr 1993 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 08/381,813, filed as PCT/JP93/01120 filed on Aug. 9, 1993, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (6)
Number |
Date |
Country |
103 718 A2 |
Mar 1984 |
EPX |
3829220 A1 |
Nov 1989 |
DEX |
48-41389 |
Jun 1973 |
JPX |
62-297062 |
Dec 1987 |
JPX |
2-269791 |
Nov 1990 |
JPX |
834079 |
|
SUX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
381813 |
Feb 1995 |
|