Claims
- 1. A method for producing a solid electrolytic capacitor, comprising a step of loading a metal oxide on at least a part of the surface in the anode part of a capacitor element comprising a valve-acting metal substrate having thereon a solid electrolyte, the valve-acting metal substrate having a dielectric film obtained by the electrochemical forming, and a step of stacking and bonding two or more capacitor elements described above.
- 2. A method for producing a solid electrolytic capacitor, comprising a step of loading a metal oxide on at least a part of the surface in the anode part of a capacitor element comprising a valve-acting metal substrate having thereon a solid electrolyte, the valve-acting metal substrate having a dielectric film obtained by the electrochemical forming, and a step of subsequently stacking and bonding two or more capacitor elements described above.
- 3. A method for producing a solid electrolytic capacitor, comprising a step of loading a metal oxide on at least a part of the surface in the anode part of a capacitor elements comprising a valve-acting metal substrate having thereon a solid electrolyte, the valve-acting metal substrate having a dielectric film obtained by the electrochemical forming, and a step of stacking two or more capacitor elements described above, mounting these elements on a lead frame and then, bonding the elements to the lead frame.
- 4. The method for producing a solid electrolytic capacitor as claimed in any one of claim 1 to 3, wherein the electrochemical forming is performed at a voltage of less than 20 V.
- 5. The method for producing a solid electrolytic capacitor as claimed in any one of claim 1 to 3, wherein the valve-acting metal substrate is one member selected from the group consisting of aluminum, tantalum, titanium, niobium, and an alloy thereof.
- 6. The method for producing a solid electrolytic capacitor as claimed in any one of claim 1 to 5, wherein the valve-acting metal substrate is an electrochemically formed aluminum foil or plate.
- 7. The method for producing a solid electrolytic capacitor as claimed in claim 3, wherein the lead frame has a low-melting point metal plating (fusible metal plating) layer whose melting point is lower than that of the valve-acting metal having a thickness in the range of 0.1 to 100 μm on the surface and the anode part of the capacitor elements is mounted on this plating portion.
- 8. The method for producing a solid electrolytic capacitor as claimed in claim 7, wherein the lead frame is made of a copper or copper alloy based material.
- 9. The method for producing a solid electrolytic capacitor as claimed in claim 7, wherein the low-melting point metal plating is composed of a substrate nickel plating and a surface tin plating.
- 10. The method for producing a solid electrolytic capacitor as claimed in any one of claim 1 to 3, wherein the metal oxide is a metal oxide of the valve-acting metal constituting the valve-acting metal substrate, and is electrically insulating.
- 11. The method for producing a solid electrolytic capacitor as claimed in any one of claim 1 to 3, wherein the metal oxide is a material other than a metal oxide of the valve-acting metal constituting the valve-acting metal substrate, and is electrically insulating.
- 12. The method for producing a solid electrolytic capacitor as claimed in claim 10 or 11, wherein the metal oxide has an average primary particle size of 100 μm or less.
- 13. The method for producing a solid electrolytic capacitor as claimed in any one of claim 10 to 12, wherein the metal oxide is at least one member selected from the group consisting of alumina, zirconia, titania, zircon, magnesia.spinel, silicon dioxide, and a composite material thereof.
- 14. The method for producing a solid electrolytic capacitor as claimed in any one of claim 10 to 13, wherein the metal oxide forms a metal oxide layer having a thickness in the range of 0.1 to 500 μm on at least a part of the surface in the anode part of a capacitor element.
- 15. A single plate capacitor element having a metal oxide on at least a part of the surface in the anode part of a capacitor element comprising a valve-acting metal substrate having thereon a solid electrolyte, the valve-acting metal substrate having a dielectric film obtained by the electrochemical forming.
- 16. A solid electrolytic capacitor obtained by stacking two or more single plate capacitor elements as recited in claim 15.
- 17. A solid electrolytic capacitor obtained by the production method of a solid electrolytic capacitor as recited in any one of claim 1 to 14.
- 18. The solid electrolytic capacitor as claimed in claim 16 or 17, wherein the solid electrolyte comprises a π-electron conjugate polymer.
- 19. The solid electrolytic capacitor as claimed in claim 18, wherein the π-electron conjugate polymer is a polymer obtained from a heterocyclic 5-membered ring compound.
- 20. The solid electrolytic capacitor as claimed in claim 19, wherein the heterocyclic 5-membered ring compound is at least one member selected from the group consisting of pyrrole, thiophene, furan, isothianaphthene, 1,3-dihydroisothianaphthene and substitution derivatives thereof.
- 21. The solid electrolytic capacitor as claimed in claim 19, wherein the heterocyclic 5-membered ring compound is at least one member selected from the group consisting of 3,4-ethylenedioxythiophene and 1,3-dihydroisothianaphthene.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2001-251071 |
Aug 2001 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is an application filed pursuant to Section 111 (a) with a claim to priority to Provisional Application Serial No. 60/315,033 filed on Aug. 28, 2001 pursuant to 35 U.S.C. Section 119(e) (1) in accordance with 35 U.S.C. 111(b).
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP02/08406 |
8/21/2002 |
WO |
|